Hot pressing mechanism and hot pressing equipment

Abstract

The invention relates to the technical field of chip processing equipment, and provides a hot pressing mechanism which comprises a pressure chamber assembly and a pressure applying assembly. The pressure chamber assembly is provided with a plurality of pressure chambers and a plurality of upper covers, the upper covers are arranged above the pressure chambers, pressure heads of the pressure applying assembly are arranged in the pressure chambers, and pressure head connecting structures of the pressure applying assembly penetrate through the lower portions of the pressure chambers. And a pressure head of the pressure applying assembly moves up and down in the pressure cavity. According to the invention, the pressure head connecting structure and the sticking structure can be replaced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing equipment, and in particular to a hot pressing mechanism and hot pressing equipment. Background Art

[0002] At present, the hot pressing sintering methods of nanosilver or nanocopper used in chip hot pressing sintering are mostly one-piece pressing or split pressing (distributed on the same plane), where the workpiece to be processed is placed on the lower pressing platform, and the workpiece to be processed located between the two pressing heads is pressed together by moving the two pressing heads closer and farther away from each other. The existing hot pressing mechanism can only replace the pressing head connection structure, but it is not convenient to replace the sticking structure. Summary of the invention

[0004] The invention provides a hot pressing mechanism and hot pressing equipment, which are used to solve the problem that the pressure head and the sticking and suction structure of the crimping device in the prior art are inconvenient to disassemble and assemble.

[0005] A hot pressing mechanism includes a pressure chamber assembly and a pressure-applying assembly; the pressure chamber assembly is provided with a plurality of pressure chambers and a plurality of upper covers, the upper covers are arranged above the pressure chambers, the pressure head of the pressure-applying assembly is arranged inside the pressure chambers, the pressure head connecting structure of the pressure-applying assembly passes through the lower part of the pressure chamber, and the pressure head of the pressure-applying assembly moves up and down in the pressure chamber.

[0006] According to the hot pressing mechanism of the present invention, the pressure-applying assembly further includes a sticky suction structure and a heating plate; the pressure head and the pressure head connecting structure are connected via the sticky suction structure, the sticky suction structure is arranged in the lower groove of the pressure head, and the heating plate is arranged below the pressure head connecting structure.

[0007] According to the hot pressing mechanism of the present invention, the adhesive structure is circular, square or ring-shaped.

[0008] According to the hot pressing mechanism of the present invention, the outer diameter of the sticking and suction structure is smaller than the length of the connection between the pressure head connection structure and the sticking and suction structure.

[0009] According to the hot pressing mechanism of the present invention, it also includes a heat insulation plate, which is arranged above the heating plate and below the pressure head connection structure.

[0010] The hot pressing mechanism according to the present invention further comprises a sealing groove, and a plurality of sealing grooves are arranged on the upper part of the pressing head.

[0011] The hot pressing mechanism according to the present invention further comprises a through hole, and the side wall of the pressure chamber is provided with the through hole.

[0012] The hot pressing mechanism according to the present invention further comprises a high-pressure gas and / or high-pressure liquid medium mechanism, and the high-pressure gas and / or high-pressure liquid medium mechanism is filled into the pressure chamber through the through hole.

[0013] A hot pressing device comprises the hot pressing mechanism mentioned above.

[0014] The present invention has the following advantages: The pressure head connection structure can be adsorbed on the pressure head through the adhesive structure, and the pressure head connection structure is detachable. When a problem occurs to the pressure head connection structure, it can be directly disassembled and replaced.

[0015] By inflating through the through hole, the pressure in the pressure chamber can be detected in real time, and the pressure head moves in the sealed chamber to achieve adaptive crimping on uneven workpieces.

[0016] The cooling air is filled into the through hole to effectively dissipate the heat of the pressure head.

[0017] After the sticking and suction structure loses suction, since the maximum diameter of the sticking and suction structure is smaller than the diameter of the pressure head connection structure, the sticking and suction structure can be disassembled and replaced after the pressure head connection structure is disassembled.

[0018] The pressure chamber is an independent chamber, the pressure of each pressure head is independently controlled, and the pressure control accuracy of the pressure-applying component is high.

[0019] The sticky suction structure directly contacts and adsorbs with the pressure head connection structure, which has greater suction force and is more firmly adsorbed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the front view structure of the hot pressing mechanism; Figure 2 It is a three-dimensional structural schematic diagram of the hot pressing mechanism; Figure 3 It is a cross-sectional structural schematic diagram of the hot pressing mechanism; Figure 4 It is a schematic diagram of the three-dimensional structure of the pressure head; Figure 5 It is a schematic diagram of the three-dimensional structure of the sticky suction structure; Figure numerals: 1. upper cover; 2. pressure chamber assembly; 3. pressure-applying assembly; 21. pressure chamber frame; 22. through hole; 23. pressure chamber; 31. pressure head; 32. pressure head connecting structure; 33. heat insulation board; 34. heating plate; 35. adhesion structure; 36. sealing groove; 37. groove through hole. DETAILED DESCRIPTION

[0022] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0023] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0025] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0026] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or at least one embodiment or example in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0027] Combine the following Figure 1-5 A hot pressing mechanism according to an embodiment of the present invention is described, including a pressure chamber assembly 2 and a pressure assembly 3; the pressure chamber assembly 2 is provided with a plurality of pressure chambers 23 and a plurality of upper covers 1, that is, a pressure chamber 23 is provided on a pressure chamber frame 21. The upper cover 1 is provided above the pressure chamber 23, the pressure head 31 of the pressure assembly 3 is provided inside the pressure chamber 23, the pressure head connection structure 32 of the pressure assembly 3 passes through the lower part of the pressure chamber 23, and the pressure head 31 of the pressure assembly 3 moves up and down in the pressure chamber 23. At the beginning of crimping, the pressure is the same. When the workpiece is uneven, the pressure assembly 3 will move up and down for adaptive adjustment. The pressure chamber 23 is an independent chamber, and the force is evenly applied. The upper part of the pressure head 31 will not be high on one side or low on the other side, so that uneven pressing will not occur. The pressure chamber 23 can also be controlled by a connecting chamber.

[0028] In some embodiments, the pressure assembly 3 further includes a sticking structure 35 and a heating plate 34; the sticking structure 35 is preferably a magnet. The pressure head 31 and the pressure head connection structure 32 are connected by the sticking structure 35, and the sticking structure 35 is arranged in the lower groove of the pressure head 31. Preferably, the sticking structure 35 is detachably arranged in the lower groove of the pressure head 31, and a heating plate 34 is arranged below the pressure head connection structure 32. Since the sticking structure 35 is in a heated environment, it is easy to lose suction, and the adsorption mechanism 35 is easy to disassemble and replace. The sticking structure 35 directly contacts and adsorbs with the pressure head connection structure 32, and the suction force is greater and the suction is more firm. The sticking structure 35 is preferably a magnet. Multiple sticking structures 35 are provided. Preferably, there are 2. The sticking structure 35 is provided with a groove through hole 37, and the groove through hole 37 changes the direction of the magnetic force lines, so that the magnetic force lines are more concentrated in the vertical direction, thereby enhancing the adsorption force on the pressure head connection structure 32.

[0029] In some embodiments, the adsorption structure 35 is circular, square or ring-shaped.

[0030] In some embodiments, the outer diameter of the sticking structure 35 is smaller than the length of the connection between the pressure head connection structure 32 and the sticking structure 35. After the sticking structure 35 loses suction, since the maximum diameter of the sticking structure, i.e., the outer diameter, is smaller than the diameter of the pressure head connection structure 32, the sticking structure 35 can be removed and replaced after the pressure head connection structure 32 is disassembled.

[0031] In some embodiments, a heat insulation board 33 is further included. The heat insulation board 33 is disposed above the heating board 34 and below the pressure head connection structure 32. The heat insulation board 33 prevents the heat of the heating board 34 from being transferred to the pressure head connection structure 32.

[0032] In some embodiments, a sealing groove 36 is further included, and a plurality of sealing grooves 36 are disposed on the upper portion of the pressure head 31. A sealing ring is placed in the sealing groove 36.

[0033] In some embodiments, a through hole 22 is also included, and a through hole 22 is set on the side wall of the pressure chamber 23. Through the through hole inflation, the pressure in the pressure chamber can be detected in real time, and the pressure head 31 moves in the sealed chamber to achieve adaptive crimping on uneven workpieces. The pressure chamber 23 is an independent chamber, and the pressure of each pressure head 31 is independently controlled, and the pressure control accuracy of the pressure-applying component 3 is high.

[0034] In some embodiments, a high-pressure gas and / or high-pressure liquid medium mechanism is also included, and the high-pressure gas and / or high-pressure liquid medium mechanism is filled into the pressure chamber through the through hole 22.

[0035] A hot pressing device comprises the hot pressing mechanism mentioned above.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A hot pressing mechanism, characterized in that: It includes a pressure chamber assembly and a pressure-applying assembly; the pressure chamber assembly is provided with a plurality of pressure chambers and a plurality of upper covers, the upper covers are arranged above the pressure chambers, the pressure head of the pressure-applying assembly is arranged inside the pressure chambers, the pressure head connecting structure of the pressure-applying assembly passes through the lower part of the pressure chamber, and the pressure head of the pressure-applying assembly moves up and down in the pressure chamber.

2. The hot pressing mechanism according to claim 1, characterized in that: The pressure-applying assembly further includes a sticking structure and a heating plate; the pressure head and the pressure head connecting structure are connected via the sticking structure, the sticking structure is disposed in a lower groove of the pressure head, and the heating plate is disposed below the pressure head connecting structure.

3. The hot pressing mechanism according to claim 2, characterized in that: The sticking and absorbing structure is circular, square or ring-shaped.

4. The hot pressing mechanism according to claim 3, characterized in that: The outer diameter of the sticking and suction structure is smaller than the length of the connection between the pressure head connection structure and the sticking and suction structure.

5. The hot pressing mechanism according to claim 2, characterized in that: It also includes a heat insulation plate, which is arranged above the heating plate and below the pressure head connection structure.

6. The hot pressing mechanism according to claim 1, characterized in that: It also includes a sealing groove, and a plurality of sealing grooves are arranged on the upper part of the pressure head.

7. The hot pressing mechanism according to claim 1, characterized in that: It also includes a through hole, and the side wall of the pressure chamber is provided with the through hole.

8. The hot pressing mechanism according to claim 7, characterized in that: It also includes a high-pressure gas and / or high-pressure liquid medium mechanism, and the high-pressure gas and / or high-pressure liquid medium mechanism is filled into the pressure chamber through the through hole.

9. A hot pressing device, characterized in that: It comprises a hot pressing mechanism as described in any one of claims 1 to 8.

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