Cold plate mounting and dismounting tool structure and using method thereof

Abstract

The invention discloses a cold plate mounting and dismounting tool structure and a using method thereof. The cold plate mounting and dismounting tool structure comprises a base and a main body, the main body is placed on the base, the main body is provided with a positioning block, a grabbing assembly and a spring pressing buckle, the main body is provided with a containing cavity used for containing an SDI card cold plate and a mounting cavity of a liquid cooling connector, the spring pressing buckle is used for fixing the SD card cold plate and the liquid cooling connector, and the grabbing assembly is used for fixing a CPU cold plate. The main body is fixed on the liquid cooling server case, the grabbing assembly grabs the CPU cold plate, the spring pressing buckle fixes the SDI card cold plate and the liquid cooling connector, after the whole set of cold plate is fixed on the main body, the main body is taken up, the whole set of cold plate is detached from the case, the main body is turned over and placed on the base so as to be coated with radiator silicone grease, and after a product is repaired, the main body is fixed on the base. And then the main body is fixed on the case, and the cold plates are loaded into the case one by one, so that the whole set of cold plates can be assembled and disassembled by one person, and the operation and maintenance efficiency of the server is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cold plate installation and disassembly, and in particular to a cold plate installation and disassembly tooling structure and a use method thereof. Background Art

[0002] With the continuous growth of data center computing needs and increasingly stringent energy efficiency requirements, the demand for liquid cooling radiators as an efficient heat dissipation solution has increased significantly. Traditional air cooling methods can no longer meet the high requirements of high-performance servers for heat dissipation performance and noise control. Therefore, cold plate liquid cooling servers have gradually become the mainstream of the market. This type of server achieves efficient and quiet heat dissipation by directly circulating coolant to key heat-generating components inside the server, such as the CPU.

[0003] However, with the evolution of technology and the deepening of application requirements, the design of cold plate liquid-cooled servers has also faced new challenges. Currently, not only do CPUs require cold plates for heat dissipation, but other high-performance components such as Serial Digital Interface (SDI) network cards, GPUs (graphics processing units), and memory modules are also beginning to adopt cold plate cooling technology to further optimize the overall system's thermal management efficiency. This trend has led to the need to integrate three or more cold plates within the server, significantly increasing system complexity and maintenance difficulties. This makes it impossible for a single person to complete the installation of a complete set of cold plates, affecting the efficiency of product repair and maintenance. Furthermore, if the cold plate falls into the chassis during installation, it can damage the product and pose a quality risk. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a cold plate installation and disassembly tooling structure and a method of using the same.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] In the first aspect, an embodiment of the present invention provides a cold plate installation and disassembly tooling structure, comprising: a base and a main body, the main body being placed on the base, the main body being provided with a positioning block, a grabbing assembly and a spring buckle, the main body being provided with a placement cavity for placing an SD I card cold plate and an installation cavity for a liquid cooling joint, the spring buckle being used to fix the SD I card cold plate and the liquid cooling joint, and the grabbing assembly being used to fix the CPU cold plate.

[0007] In a specific embodiment, the grabbing assembly includes a movable handle, a mounting end and a grabbing block, the mounting end is fixed to the main body, the movable handle is hinged to the mounting end, the grabbing block is transmission-connected to the movable handle, and the grabbing block is used to fix the CPU cold plate.

[0008] In a specific embodiment, the grab block is provided with a captive screw, and the captive screw is engaged with the CPU cold plate.

[0009] In a specific embodiment, there are two positioning blocks, which are respectively arranged on two sides of the bottom of the main body.

[0010] In a specific embodiment, a snap-fit ​​groove is provided at the bottom of the positioning block.

[0011] In a specific embodiment, the engaging groove is further provided with a limiting protrusion.

[0012] In a specific embodiment, the positioning block is further provided with a pull pin.

[0013] In a specific embodiment, the liquid cooling joint is connected to the SDI card cold plate and the CPU cold plate through a liquid pipe.

[0014] In a specific embodiment, the base is provided with a support column, and the main body is provided with a support hole corresponding to the support column.

[0015] The cold plate installation and disassembly tooling structure of the present invention has the following beneficial effects compared with the prior art: the main body is fixed on the liquid-cooled server chassis, the grabbing assembly grabs the CPU cold plate, the spring buckle fixes the SDI card cold plate and the liquid-cooling joint, and when the whole set of cold plates are fixed on the main body, the main body is picked up and the whole set of cold plates are removed from the liquid-cooled server chassis, and then the main body is turned over and placed on the base, and operations such as applying radiator silicone grease can be performed. When the product is returned for repair, the main body can be fixed on the chassis again, and the cold plates can be installed into the chassis one by one, so that a single person can complete the installation and disassembly of the whole set of cold plates, thereby improving the operation and maintenance efficiency of the server and reducing the risk of collision or damage to the product during the disassembly and assembly of the cold plates.

[0016] In a second aspect, an embodiment of the present invention provides a method for using a cold plate installation and removal tooling structure, comprising the following steps:

[0017] Place the main body on the chassis and pull the pin to fix the main body to the chassis;

[0018] Lift the movable handle to allow the grab block to move downward and fit into the CPU cold plate, then tighten the captive screws to lock the grab block to the CPU cold plate.

[0019] Loosen the screws between the CPU cold plate and the motherboard, and then press down the movable handle to separate the CPU cold plate from the motherboard;

[0020] Take out the SD I card cold plate and place it in the placement cavity, and turn the spring buckle to fix the SD I card cold plate;

[0021] Take out the liquid cooling connector and place it in the installation cavity, then turn the spring buckle to secure the liquid cooling connector.

[0022] Pull the pin to separate the main body from the chassis, then remove the main body and place it on the base to complete the removal of the SDI card cold plate and CPU cold plate.

[0023] The CPU cold plate assembly and disassembly tool structure of the present invention has the following advantages compared with the prior art: the main body is fixed to the liquid-cooled server chassis by a pull pin part, and then the movable handle is lifted to make the grab block move downward and fit with the CPU cold plate, and then the captive screw is tightened to lock the grab block and the CPU cold plate, and then the screws of the CPU cold plate and the motherboard are loosened, and then the movable handle is pressed down to separate the CPU cold plate from the motherboard, and the SDI card cold plate is taken out and placed in the placement cavity, and the spring pressure buckle is rotated to fix the SDI card cold plate, and then the liquid cooling connector is taken out and placed in the installation cavity, and the spring pressure buckle is rotated to fix the liquid cooling connector, and then the pull pin part is pulled to separate the main body from the chassis, and then the main body is taken out and placed on the base to complete the disassembly of the SD I card cold plate and the CPU cold plate. Conversely, the installation of the SDI card cold plate and the CPU cold plate can also be realized, and the installation and disassembly of the entire set of cold plates can be completed by one person, thereby improving the operation and maintenance efficiency of the server and reducing the risk of collision or damage to products during the disassembly of the cold plate.

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A three-dimensional schematic diagram of the cold plate installation and disassembly tooling structure provided by the present invention;

[0027] Figure 2 This is an exploded schematic diagram of the cold plate installation and disassembly tooling structure provided by the present invention;

[0028] Figure 3 A schematic structural diagram of the back side of the main body provided by the present invention;

[0029] Figure 4 A schematic diagram of an application scenario of the cold plate installation and removal tooling structure provided by the present invention in conjunction with a chassis;

[0030] Figure 5 A schematic flow chart of a method for using the cold plate installation and disassembly tooling structure provided by the present invention. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0035] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0036] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0037] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0038] See also Figures 1 to 4 The specific embodiment shown in the figure, the present invention discloses a cold plate installation and disassembly tooling structure, including: a base 10 and a main body 20, the main body 20 is placed on the base 10, the main body 20 is provided with a positioning block 30, a grab assembly 40 and a spring buckle 50, the main body 20 is provided with a placement cavity for placing an SDI card cold plate 70 and an installation cavity for a liquid cooling joint 80, the spring buckle 50 is used to fix the SDI card cold plate 70 and the liquid cooling joint 80, and the grab assembly 40 is used to fix the CPU cold plate (not shown in the figure).

[0039] Specifically, the main body 20 is fixed on the liquid-cooled server chassis, the grabbing component 40 grabs the CPU cold plate, and the spring buckle 50 fixes the SDI card cold plate 70 and the liquid-cooled connector 80. When the entire set of cold plates are fixed on the main body 20, pick up the main body 20 and remove the entire set of cold plates from the liquid-cooled server chassis. Then, the main body 20 is turned over and placed on the base 10, and operations such as applying radiator silicone grease can be performed. When the product is returned for repair, the main body 20 can be fixed on the chassis (i.e., the liquid-cooled server chassis) and the cold plates can be installed into the chassis one by one, so that a single person can complete the installation and disassembly of the entire set of cold plates, thereby improving the operation and maintenance efficiency of the server and reducing the risk of collision or damage to the product during the disassembly and assembly of the cold plates. Furthermore, the main body 20 of the tooling structure, particularly its positioning block 30, gripping assembly 40, and spring buckle 50, achieves secure fixation and convenient operation of the CPU cold plate, SDI card cold plate 70, and liquid cooling connector 80. This design allows a single operator to complete the installation and removal of the entire cold plate set, significantly simplifying the operational process and reducing manpower requirements. Furthermore, the spring buckle 50 is used to secure the SDI card cold plate 70 and liquid cooling connector 80, and when the main body 20 is flipped, the spring buckle 50 prevents the SDI card cold plate 70 and liquid cooling connector 80 from falling. In other words, the sophisticated design of the spring buckle 50 and gripping assembly 40 ensures that the cold plate remains secure during installation and removal, preventing the cold plate from falling into the chassis due to improper operation, thereby effectively reducing the risk of product damage.

[0040] In one embodiment, the grabbing assembly 40 includes a movable handle 41, a mounting end 42 and a grabbing block 43. The mounting end 42 is fixed to the main body 20, the movable handle 41 is hinged to the mounting end 42, and the grabbing block 43 is transmission-connected to the movable handle 41. The grabbing block 43 is used to fix the CPU cold plate.

[0041] Specifically, the mounting end 42 and the movable handle 41 are provided on the upper surface of the main body 20, and the grab block 43 is provided on the lower surface of the main body 20. The movable handle 41 is lifted to make the grab block 43 move downward and fit against the CPU cold plate to fix the CPU cold plate; conversely, when the movable handle 41 is pressed down, the grab block 43 moves upward and separates from the CPU cold plate.

[0042] More specifically, the movable handle 41 is used to move the grab block 43 up or down, and the position of the grab block 43 can be adjusted on the X-axis and Y-axis so that the grab block 43 is aligned with the screw holes of different CPU cold plates (AMD or Inter). The grab block 43 is fixed to the CPU cold plate by captive screws, and a silicone block is provided to absorb the height error between the grab block 43 and the CPU cold plate.

[0043] In one embodiment, the grab block 43 is provided with a captive screw, and the captive screw is engaged with the CPU cold plate.

[0044] Specifically, when the operator lifts the movable handle 41, the grab block 43 moves downward and fits tightly against the CPU cold plate. At this point, by tightening the captive screws, the grab block 43 can be locked to the CPU cold plate, ensuring the stability of the CPU cold plate. This design effectively prevents the CPU cold plate from loosening and falling. When the CPU cold plate needs to be removed, the operator only needs to loosen the captive screws first, then press the movable handle 41, and the grab block 43 will move upward and disengage from the CPU cold plate. This design makes the installation and removal of the CPU cold plate simple and quick, eliminating the need for complex tools or tedious operations, thereby improving work efficiency. In addition, through the precise design and transmission connection of the grab block 43, as well as the locking effect of the captive screws, this technology can avoid unnecessary physical damage to the CPU cold plate or motherboard during the installation and removal of the CPU cold plate. This design reduces the risk of hardware damage caused by improper operation and extends the service life of the server.

[0045] In one embodiment, there are two positioning blocks 30 , which are respectively disposed on two sides of the bottom of the main body 20 .

[0046] Specifically, when the main body 20 is placed on the side wall of the liquid-cooled server chassis, it is fixed by two positioning blocks 30, and the positioning blocks 30 are used to limit the X-axis degree of freedom. That is, the two positioning blocks 30 are respectively arranged on both sides of the bottom of the main body 20. When the main body 20 is placed on the side wall of the liquid-cooled server chassis, the two positioning blocks 30 can effectively fix the main body 20. This design ensures the stability of the main body 20 in the chassis and prevents the main body 20 from loosening or shifting. In addition, the main function of the positioning blocks 30 is to limit the degree of freedom of the main body 20 in the X-axis direction. In physics, the degree of freedom refers to the number of directions in which an object can move freely in space. By limiting the X-axis degree of freedom, it is ensured that the main body 20 can only move or adjust along a specific direction (such as the Y-axis or Z-axis) in the chassis, thereby avoiding unnecessary shaking or dislocation. In addition, since the positioning block 30 can accurately limit the position of the main body 20 in the X-axis direction, the operation and maintenance personnel can more accurately place the main body 20 in the predetermined position when installing it. This design improves the accuracy and efficiency of the installation and reduces the risk of failure or performance degradation due to improper installation.

[0047] In one embodiment, a snap-fit ​​groove 31 is provided at the bottom of the positioning block 30 .

[0048] Specifically, the snap-fitting connection between the snap-fitting slots 31 and the sidewalls of the liquid-cooled server chassis forms a secure mechanical connection. This connection effectively prevents the main body 20 from shaking or shifting within the chassis, ensuring its stability and reliability during operation. Furthermore, the snap-fitting connection between the snap-fitting slots 31 and the chassis sidewalls helps ensure precise alignment of the main body 20 during installation. Because the shape and dimensions of the snap-fitting slots 31 are precisely designed, they fit tightly with corresponding features on the chassis sidewalls, enabling highly precise installation.

[0049] In one embodiment, the engaging groove 31 is further provided with a limiting protrusion 32 .

[0050] Specifically, the limiting protrusion 32 cooperates with the limiting portion provided on the liquid-cooled server chassis to restrict the Y-axis degree of freedom. This means that the cooperation between the limiting protrusion 32 and the limiting portion effectively prevents the main body 20 from shaking or shifting in the Y-axis direction. This restriction ensures the stability of the main body 20 within the chassis. Furthermore, the cooperation between the limiting protrusion 32 and the limiting portion not only provides a secure connection but also ensures precise alignment of the main body 20 during installation, which helps avoid errors during installation.

[0051] In one embodiment, the positioning block 30 is further provided with a pull pin 60 .

[0052] Specifically, the liquid-cooled server chassis is provided with a pin hole corresponding to the pull pin 60, and the pull pin 60 cooperates with the pin hole to limit the Z-axis degree of freedom. That is to say, by cooperating with the pull pin 60 on the positioning block 30 and the pin hole on the chassis, the main body 20 can be fixed in the Z-axis direction, thereby combining with the restrictions of the X-axis and Y-axis to achieve comprehensive fixation in three-dimensional space. In addition, the close fit between the pull pin 60 and the pin hole helps prevent the main body 20 from shaking or shifting in the Z-axis direction, thereby improving stability. In addition, the design of the pull pin 60 generally makes the installation and disassembly process easier. The operation and maintenance personnel can complete the installation or disassembly of the main body 20 by simply inserting or pulling out the pull pin 60, without the need to use complex tools or perform tedious operations.

[0053] In one embodiment, the liquid cooling joint 80 is connected to the SD I card cold plate 70 and the CPU cold plate through a liquid pipe.

[0054] Specifically, the liquid cooling connector 80, a key component connecting the SD I card cold plate 70 and the CPU cold plate, circulates coolant through the two cold plates via a liquid pipe. The coolant flows through the cold plates, absorbs heat, and then removes it, thereby achieving efficient heat dissipation. This heat dissipation method is more efficient than traditional air cooling and can significantly reduce the operating temperature of the SD I card and CPU, thereby improving their stability and service life. In addition, through the connection of the liquid cooling connector 80, the SD I card cold plate 70 and the CPU cold plate can form a unified heat dissipation system. The coolant circulates in the system, helping to transfer heat from high-temperature areas (such as the CPU and SD I card) to low-temperature areas (such as the radiator or external cooling equipment), thereby achieving temperature balance throughout the entire system. This helps prevent local overheating and improves the overall performance and stability of the server. In addition, the liquid cooling system has higher energy efficiency than the traditional air cooling system. Due to the higher heat conduction efficiency of the coolant, the liquid cooling system can achieve the same heat dissipation effect with lower energy consumption, which helps reduce the operating cost of the server and reduce the impact on the environment.

[0055] In one embodiment, the base 10 is provided with a support column 11 , and the main body 20 is provided with a support hole 21 corresponding to the support column 11 .

[0056] Specifically, the main body 20 can be placed upright or inverted on the base 10. When placed inverted, the CPU cold plate faces upward, and thermal grease can be applied to the bottom of the CPU cold plate. That is, the cooperation between the support column 11 and the support hole 21 provides stable support for the main body 20. Whether placed upright or inverted, the main body 20 can be accurately positioned on the base 10 through the support column 11, avoiding hardware damage or performance degradation caused by shaking or displacement. In addition, the design allows the main body 20 to be placed on the base 10 in two different ways (upright or inverted), and this flexibility facilitates assembly and maintenance. For example, when placed inverted, the CPU cold plate faces upward, which makes it easier for operation and maintenance personnel to access the bottom of the CPU cold plate, thereby conveniently applying thermal grease or other maintenance work.

[0057] In this embodiment, two CPU cold plates and one SD I card cold plate 70 are included. The CPU cold plate is located on the lower surface of the main body 20, and the SD I card cold plate 70 is located on the upper surface of the main body 20. When the main body 20 is placed upright on the base 10, the SD I card cold plate 70 faces upward. When the main body 20 is placed upside down on the base 10, the CPU cold plate faces upward.

[0058] Specifically, the spring buckle 50 adopts the existing public technology, which will not be elaborated in detail here.

[0059] See also Figure 5 As shown, an embodiment of the present invention provides a cold storage refrigeration heat recovery control method, comprising the following steps:

[0060] S1, placing the main body 20 on the chassis and pulling the pin 60 to fix the main body 20 to the chassis;

[0061] Specifically, by pulling the pin 60, the main body 20 can be quickly fixed to the chassis; similarly, by pulling the pin 60 again, the main body 20 can be easily detached from the chassis. This design greatly simplifies the installation and disassembly operations and improves work efficiency.

[0062] S2, lift the movable handle 41 to move the grab block 43 downward and into contact with the CPU cold plate, and then tighten the captive screws to lock the grab block 43 to the CPU cold plate;

[0063] Specifically, lifting the movable handle 41 causes the gripping block 43 to move downward and engage with the CPU cold plate. By tightening the captive screws, the gripping block 43 and the CPU cold plate are locked. Similarly, lifting the movable handle 41 causes the gripping block 43 to move downward and engage with the motherboard. The screws securing the CPU cold plate to the motherboard are then tightened. The captive screws are then loosened, and the movable handle 41 is then pressed down to release the gripping block 43 from the CPU cold plate.

[0064] S3, loosen the screws between the CPU cold plate and the motherboard, and then press down the movable handle 41 to separate the CPU cold plate from the motherboard;

[0065] Specifically, after tightening the captive screws to lock the grab block 43 to the CPU cold plate, the screws between the CPU cold plate and the motherboard are loosened, and the movable handle 41 is pressed down to move the grab block 43 upward to drive the CPU cold plate away from the motherboard, that is, the CPU cold plate is lifted away from the motherboard.

[0066] S4, take out the SD I card cold plate 70 and place it in the placement cavity, and rotate the spring buckle 50 to fix the SD I card cold plate 70;

[0067] Specifically, loosen the screws securing the SD I card cold plate 70 to the chassis, remove the SDI card cold plate 70, and place it in the placement cavity. Then, rotate the spring buckle 50 to secure the SDI card cold plate 70. Similarly, rotate the spring buckle 50, remove the SDI card cold plate 70, place it in the chassis, and then tighten the screws to secure the SD I card cold plate 70 to the chassis.

[0068] S5, take out the liquid cooling connector 80 and place it in the installation cavity, and rotate the spring buckle 50 to fix the liquid cooling connector 80;

[0069] Specifically, loosen the screws securing the liquid cooling connector 80 to the chassis, remove the liquid cooling connector 80, and place it in the mounting cavity. Then, rotate the spring buckle 50 to secure the liquid cooling connector 80. Similarly, rotate the spring buckle 50, remove the liquid cooling connector 80, place it in the chassis, and then tighten the screws to secure the liquid cooling connector 80 to the chassis.

[0070] S6, pulling the pin 60 to separate the main body 20 from the chassis, then taking out the main body 20 and placing it on the base 10, to complete the disassembly of the SDI card cold plate 70 and the CPU cold plate.

[0071] Specifically, once the complete set of cold plates is secured to the main body 20, pull the pin 60 to detach the main body 20 from the chassis. The main body 20 is then removed and placed on the base 10, completing the removal of the SDI card cold plate 70 and the CPU cold plate. Once the product repair is complete, the main body 20 is secured to the chassis, and the complete set of cold plates is installed in order.

[0072] More specifically, the main body 20 is fixed to the liquid-cooled server chassis by pulling the pin 60, and then the movable handle 41 is lifted to make the grab block 43 move downward and fit into the CPU cold plate, and then the captive screws are tightened to lock the grab block 43 and the CPU cold plate, and then the screws between the CPU cold plate and the motherboard are loosened, and then the movable handle 41 is pressed down to separate the CPU cold plate from the motherboard, and the SDI card cold plate 70 is taken out and placed in the placement cavity, and the spring buckle 50 is rotated to fix the SDI card cold plate 70, and then the liquid-cooled connector is The head 80 is taken out and placed in the installation cavity, the spring buckle 50 is rotated to fix the liquid cooling connector 80, and then the pin 60 is pulled to separate the main body 20 from the chassis. The main body 20 is then taken out and placed on the base 10 to complete the disassembly of the SDI card cold plate 70 and the CPU cold plate. Conversely, the installation of the SDI card cold plate 70 and the CPU cold plate can also be achieved, so that a single person can complete the installation and disassembly of the entire set of cold plates, thereby improving the operation and maintenance efficiency of the server and reducing the risk of collision or damage to the product during the disassembly and assembly of the cold plate.

[0073] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A cold plate installation and disassembly tooling structure, characterized in that: include: A base and a main body, the main body is placed on the base, the main body is provided with a positioning block, a grab assembly and a spring buckle, the main body is provided with a placement cavity for placing an SDI card cold plate and an installation cavity for a liquid cooling joint, the spring buckle is used to fix the SDI card cold plate and the liquid cooling joint, and the grab assembly is used to fix the CPU cold plate.

2. The cold plate installation and disassembly tooling structure according to claim 1 is characterized in that: The grabbing assembly comprises a movable handle, a mounting end and a grabbing block, wherein the mounting end is fixed to the main body, the movable handle is hinged to the mounting end, the grabbing block is transmission-connected to the movable handle, and the grabbing block is used to fix the CPU cold plate.

3. The cold plate installation and disassembly tooling structure according to claim 2 is characterized in that: The grab block is provided with a captive screw, and the captive screw is matched with the CPU cold plate.

4. The cold plate installation and disassembly tooling structure according to claim 1, characterized in that: There are two positioning blocks, which are respectively arranged on two sides of the bottom of the main body.

5. The cold plate installation and removal tooling structure according to claim 4, characterized in that: A clamping groove is provided at the bottom of the positioning block.

6. The cold plate installation and removal tooling structure according to claim 5, characterized in that: The clamping groove is also provided with a limiting protrusion.

7. The cold plate installation and removal tooling structure according to claim 5, characterized in that: The positioning block is also provided with a pull pin.

8. The cold plate installation and removal tooling structure according to claim 1, characterized in that: The liquid cooling joint is connected to the SDI card cold plate and the CPU cold plate through a liquid pipe.

9. The cold plate installation and removal tooling structure according to claim 1, characterized in that: The base is provided with a supporting column, and the main body is provided with a supporting hole corresponding to the supporting column.

10. A method for using a cold plate installation and removal tooling structure, characterized in that: The following steps are involved: Place the main body on the chassis and pull the pin to fix the main body on the chassis; Lift the movable handle to make the grab block move downward and fit into the CPU cold plate, and then tighten the captive screws to lock the grab block and the CPU cold plate; Loosen the screws between the CPU cold plate and the motherboard, and then press down the movable handle to separate the CPU cold plate from the motherboard; Take out the SDI card cold plate and place it in the placement cavity, and turn the spring buckle to fix the SDI card cold plate; Take out the liquid cooling connector and place it in the installation cavity, and turn the spring buckle to fix the liquid cooling connector; Pull the pin to separate the main body from the chassis, then take out the main body and place it on the base to complete the disassembly of the SDI card cold plate and the CPU cold plate.

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