Automatic deburring device

Abstract

The automatic deburring device comprises a forming mold, a plurality of forming cavities are formed in the forming mold, a packaging groove is formed in the surface of the forming mold, and a plurality of sprue gates are formed in the surface of the inner wall of the packaging groove; in the injection molding process of the semiconductor, burrs formed on the outer side of the sprue gate can be cut off when the first cutter moves towards the interior of the sprue gate, the situation that burrs exist at the sprue gate position after the semiconductor is formed is avoided, the burrs rub a forming cavity in the semiconductor taking-out process, and the forming cavity is not damaged is avoided. The precision of a forming cavity can be influenced in the long-time production process, and a second cutter moves into a cutting groove to cut off residual glue in a packaging groove, so that the situation that the residual glue in the packaging groove cannot be removed in time after being solidified, movement of a packaging strip is blocked when the packaging strip is installed subsequently, and the packaging strip is prevented from being damaged is avoided. And the packaging strip and the packaging groove are rubbed, so that the matching of the packaging strip and the packaging groove is influenced, and the service life is shortened.

Description

Technical Field

[0001] The invention relates to the technical field of deburring, in particular to an automatic deburring device. Background Art

[0002] With the rapid development of semiconductor packaging technology, higher requirements are placed on packaging production efficiency and equipment utilization. MGP mold packaging injection molds are equipment used by most packaging and testing industries, and are also an indispensable part of the semiconductor packaging back-end process. However, due to the frequent use of molds, the mold cavity operates at high load for a long time, resulting in rapid wear and tear of the cavity and a short life span, which requires frequent replacement, thereby increasing the cost of use, affecting production efficiency, and quality cannot be well controlled. Therefore, improving equipment production efficiency and saving costs are the goals pursued by every company. Therefore, the development and optimization of gate burr devices can better improve production efficiency and reduce equipment use costs, which has become an urgent need for all semiconductor manufacturers.

[0003] In the process of semiconductor injection molding in the prior art, molten liquid needs to be injected into the molding cavity in the mold, and then the cavity needs to be encapsulated using a cavity bar. After the product in the mold is solidified and formed, there will be excess burrs at the position of the product cavity mouth. During the long-term injection molding production process, the burrs will cause the cavity bar to wear, thereby affecting the accuracy of semiconductor production after the mold is encapsulated using the cavity bar, increasing the cost of use and the scrap rate. Summary of the invention

[0004] The object of the present invention is to provide an automatic deburring device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic deburring device, comprising a molding mold, a plurality of molding cavities are provided inside the molding mold, a packaging groove is provided on the surface of the molding mold, a plurality of pouring gates are provided on the inner wall surface of the packaging groove, the pouring gate is connected to the molding cavity, a packaging strip is provided in the packaging groove, a first cutting mechanism is provided on the surface of the packaging strip, the first cutting mechanism is used to cut off burrs formed on the inner sides of the plurality of pouring gates, a second cutting mechanism is provided on the surface of the packaging strip, the second cutting mechanism is used to cut off burrs remaining inside the packaging groove, a discharge mechanism is provided in the packaging groove, the discharge mechanism is used to remove and discharge debris cleaned inside the packaging groove after production is completed, a positioning mechanism is provided on the surface of the discharge mechanism, the positioning mechanism is used to position the packaging strip when the packaging strip moves into the packaging groove, and a plurality of limiting mechanisms are provided on the surface of the molding mold, the limiting mechanism is used to limit the packaging strip after the packaging strip moves into the packaging groove.

[0006] As a further solution of the present invention, the first cutting mechanism includes a plurality of first cutters, and the plurality of first cutters are fixedly connected to the surface of the packaging strip on one side close to the pouring port.

[0007] As a further solution of the present invention, the second cutting mechanism includes a second cutter, which is fixedly connected to the surface of the packaging strip on one side close to the pouring port, and the second cutter is located in the middle of multiple first cutters, and a cutting groove is opened at the bottom of the inner wall of the packaging groove.

[0008] As a further solution of the present invention, the discharge mechanism includes two discharge ports, which are arranged on the front and rear inner wall surfaces of the groove, and the discharge ports pass through the forming mold. A sealing groove is arranged at the bottom of the inner wall of the groove, and a sealing plate is elastically and slidably connected in the sealing groove.

[0009] As a further solution of the present invention, the positioning mechanism includes two triangular positioning blocks, which are respectively fixedly connected to the side surfaces of the two sealing plates close to each other. Positioning grooves are provided on the surfaces of both ends of the packaging strip, and the inner side of the positioning groove is a slope.

[0010] As a further solution of the present invention, the limiting mechanism includes a rotating shaft, which is rotatably connected to the surface of the forming mold, and a fan-shaped limiting plate is fixedly connected to the surface of the rotating shaft. The bottom of the limiting plate is an inclined surface, and a toggle rod is fixedly connected to the surface of the limiting plate.

[0011] As a further solution of the present invention, a groove is provided on the inner wall surface of the packaging groove corresponding to the position of the rotating shaft, the rotating shaft passes through the forming mold and extends into the groove, the rotating shaft surface is fixedly connected with a plurality of clamping blocks arranged at equal angles, the rotating shaft surface is provided with a rotating ring, the rotating ring is located in the groove, the rotating ring is located below the clamping block, the rotating ring and the bottom of the inner wall of the groove are connected with a torsion spring, the inner side surface of the rotating ring is provided with a plurality of clamping grooves, the rotating ring surface is fixedly connected with a fan-shaped extrusion block, the side of the packaging strip is provided with an extrusion groove, the upper end of the extrusion groove is an inclined surface, the rotating ring surface is slidably connected with a lifting rod, the inner wall surface of the groove is provided with a first sliding groove, the lifting rod slides in the first sliding groove, the inner wall surface of the first sliding groove is provided with a second sliding groove, the second sliding groove is connected with the packaging groove, a guide plate is elastically slidably connected in the second sliding groove, the guide plate is close to the packaging strip The side is an inclined surface, the guide plate surface is provided with a guide groove, and the lifting rod slides in the guide groove.

[0012] As a further solution of the present invention, the bottoms of the plurality of clamping blocks are conical, and the upper inner walls of the plurality of clamping slots are inclined.

[0013] As a further solution of the present invention, a pressure strip is fixedly connected to the surface of the sealing plate, and the pressure strip is located below the second cutting knife. A clearance groove is provided at the bottom of the inner wall of the cutting groove corresponding to the position of the pressure strip.

[0014] As a further solution of the present invention, a blocking rod is fixedly connected to the surface of the packaging strip, and the blocking rod is used to block the limiting plate.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the process of semiconductor injection molding, the present invention uses the first cutter to move into the pouring gate to remove the burrs formed on the outside of the pouring gate, so as to avoid burrs at the pouring gate after the semiconductor is molded. The burrs will rub the molding cavity during the process of taking out the semiconductor, which will affect the accuracy of the molding cavity during a long production process. The second cutter is used to move into the cutting groove to remove the colloid remaining in the packaging groove, so as to avoid the colloid remaining in the packaging groove being unable to be removed in time after solidification, which will block the movement of the packaging strip when the packaging strip is installed later, and will rub the packaging strip and the packaging groove, affecting the coordination between the packaging strip and the packaging groove, thereby reducing the service life.

[0017] After the packaging strip is taken out, the guide plate is extended again, the rotating ring is disengaged from the clamping block and then returns to its original position under the action of the torsion spring, so that the packaging strip can be lifted cyclically during operation to improve production efficiency.

[0018] 3. In the process of injection molding of semiconductors of the present invention, when the rotating ring moves toward the clamping block, the cone at the end of the clamping block and the inclined surfaces on both sides of the inner wall of the slot can ensure that the clamping block moves into the slot, thereby ensuring the driving effect of the clamping block on the rotating ring, so that the extrusion block can lift the packaging strip, which is convenient for taking out the packaging strip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 for Figure 1Schematic diagram of the structure at A in the middle;

[0021] Figure 3 It is a schematic diagram of the overall structure of the present invention after being cut apart;

[0022] Figure 4 It is a structural schematic diagram of the forming mold in the present invention;

[0023] Figure 5 It is a schematic diagram of the structure of the packaging strip in the present invention;

[0024] Figure 6 for Figure 5 Schematic diagram of the structure at B in the middle;

[0025] Figure 7 It is a schematic diagram of the structure of the forming die of the present invention after being cut from the cutting position;

[0026] Figure 8 for Figure 7 Schematic diagram of the structure at C in the middle;

[0027] Fig. 9 It is a structural schematic diagram of the position relationship between the limiting plate and the packaging slot in the present invention;

[0028] Fig.10 for Fig. 9 Schematic diagram of the structure at D in the middle;

[0029] Fig.11 It is a structural schematic diagram of the connection relationship between the groove, the first slide groove and the second slide groove in the present invention;

[0030] Fig.12 for Fig.11 Schematic diagram of the structure at E in the middle;

[0031] Fig.13 It is a schematic diagram of the exploded structure of the rotating ring and the rotating shaft in the present invention.

[0032] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0033] Molding mold 1, molding cavity 2, packaging groove 3, pouring port 4, packaging strip 5, first cutter 6, second cutter 7, cutting groove 8, discharge port 9, sealing groove 10, sealing plate 11, positioning block 12, positioning groove 13, rotating shaft 14, limiting plate 15, toggle rod 16, groove 17, clamping block 18, rotating ring 19, torsion spring 20, clamping groove 21, extrusion block 22, extrusion groove 23, lifting rod 24, first slide groove 25, second slide groove 26, guide plate 27, guide groove 28, pressure strip 29, give way groove 30, blocking rod 31. DETAILED DESCRIPTION

[0034] See also Figure 1-Figure 13The present invention provides a technical solution: an automatic deburring device, comprising a molding die 1, wherein a plurality of molding cavities 2 are provided inside the molding die 1, a packaging groove 3 is provided on the surface of the molding die 1, a plurality of pouring ports 4 are provided on the inner wall surface of the packaging groove 3, the pouring ports 4 are connected with the molding cavity 2, a packaging strip 5 is provided in the packaging groove 3, a first cutting mechanism is provided on the surface of the packaging strip 5, the first cutting mechanism is used to cut off the burrs formed on the inner sides of the plurality of pouring ports 4, a second cutting mechanism is provided on the surface of the packaging strip 5, the second cutting mechanism is used to cut off the burrs remaining inside the packaging groove 3, a discharge mechanism is provided in the packaging groove 3, the discharge mechanism is used to remove and discharge the debris cleaned inside the packaging groove 3 after the production is completed, a positioning mechanism is provided on the surface of the discharge mechanism, the positioning mechanism is used to position the packaging strip 5 when the packaging strip 5 moves into the packaging groove 3, a plurality of limiting mechanisms are provided on the surface of the molding die 1, the limiting mechanism is used to limit the packaging strip 5 after the packaging strip 5 moves into the packaging groove 3;

[0035] The first cutting mechanism includes a plurality of first cutters 6, and the plurality of first cutters 6 are fixedly connected to the surface of the packaging strip 5 on one side close to the pouring port 4;

[0036] The second cutting mechanism includes a second cutter 7, which is fixedly connected to the surface of the packaging strip 5 on one side close to the pouring port 4, and is located in the middle of the plurality of first cutters 6. A cutting groove 8 is provided at the bottom of the inner wall of the packaging groove 3;

[0037] The discharge mechanism includes two discharge ports 9, which are provided on the front and rear inner wall surfaces of the groove 8. The discharge ports 9 penetrate the forming mold 1. A sealing groove 10 is provided at the bottom of the inner wall of the groove 8. A sealing plate 11 is elastically and slidably connected in the sealing groove 10.

[0038] The positioning mechanism includes two triangular positioning blocks 12, which are respectively fixedly connected to the surfaces of the two sealing plates 11 on one side close to each other. Positioning grooves 13 are provided on the surfaces of both ends of the packaging strip 5, and the inner side of the positioning groove 13 is an inclined surface;

[0039] The limiting mechanism includes a rotating shaft 14, which is rotatably connected to the surface of the molding die 1, and a fan-shaped limiting plate 15 is fixedly connected to the surface of the rotating shaft 14. The bottom of the limiting plate 15 is an inclined surface, and a toggle rod 16 is fixedly connected to the surface of the limiting plate 15.

[0040] In the process of injection molding of semiconductors, the molten liquid is injected into the molding cavity 2 through the pouring gate 4, and then the packaging strip 5 is moved into the packaging groove 3. The positioning groove 13 will cooperate with the positioning block 12, and the packaging strip 5 will move into the packaging groove 3 under the action of the positioning block 12 and the positioning groove 13. Then, after the packaging strip 5 moves into the packaging groove 3, the first cutter 6 will move to the pouring gate 4 position. When the first cutter 6 moves into the pouring gate 4, the burrs formed on the outside of the pouring gate 4 can be cut off to avoid burrs at the pouring gate 4 position after the semiconductor is molded. The burrs will rub the molding cavity 2 during the process of removing the semiconductor, which will affect the accuracy of the molding cavity 2 during a long production process. When the packaging strip 5 moves downward, the second cutter 7 will move into the cutting groove 8. The second cutter 7 moves into the cutting groove 8 to cut off the colloid remaining in the packaging groove 3 to avoid the colloid remaining in the packaging groove 3 from being unable to be removed in time after solidification. When the packaging strip 5 is installed later, the packaging strip 5 will be blocked from moving, and the packaging strip 5 and the packaging groove 3 will be rubbed. The cooperation between the packaging strip 5 and the packaging groove 3 is affected, and the service life is reduced. After the packaging strip 5 is installed, the limit plate 15 is rotated by the toggle rod 16, and the fiberboard will rotate around the rotation axis 14, and the limit plate 15 will move to the side close to the packaging strip 5. The packaging strip 5 will be pressed down to be flush with the surface of the molding mold 1 under the action of the bottom inclined surface of the limit plate 15, ensuring the accurate installation of the packaging strip 5. Then, when the packaging strip 5 needs to be removed, the limit plate 15 is moved out of the range of the packaging strip 5 by the toggle rod 16, and the packaging strip 5 is taken out, and then The burrs and debris removed from the packaging groove 3 are then cleaned into the cutting groove 8, and then the sealing plate 11 is pulled upward to expose the discharge port 9, and then the burrs and debris in the cutting groove 8 can be cleaned out of the cutting groove 8 through the discharge port 9. The discharge port 9 is located on the side of the cutting groove 8, and the burrs and debris in the packaging groove 3 and the cutting groove 8 can be removed. The debris at the corner position can also be cleaned and moved to the discharge port 9 position without any residue, thereby ensuring the subsequent use of the packaging strip 5, reducing the friction on the packaging strip 5, and improving the accuracy of the packaging strip 5.

[0041] In the process of injection molding of semiconductors, it is not convenient to take out the packaging strip 5 after it is moved into the packaging groove 3. As a further solution of the present invention, a groove 17 is provided on the inner wall surface of the packaging groove 3 corresponding to the position of the rotating shaft 14. The rotating shaft 14 penetrates the molding mold 1 and extends into the groove 17. A plurality of clamping blocks 18 arranged at equal angles are fixedly connected to the surface of the rotating shaft 14. A rotating ring 19 is provided on the surface of the rotating shaft 14. The rotating ring 19 is located in the groove 17. The rotating ring 19 is located below the clamping block 18. A torsion spring 20 is connected to the rotating ring 19 and the bottom of the inner wall of the groove 17. A plurality of clamping grooves 2 are provided on the inner surface of the rotating ring 19. 1. A fan-shaped extrusion block 22 is fixedly connected to the surface of the rotating ring 19, an extrusion groove 23 is provided on the side of the packaging strip 5, and the upper end of the extrusion groove 23 is an inclined surface. A lifting rod 24 is slidably connected to the surface of the rotating ring 19, and a first slide groove 25 is provided on the inner wall surface of the groove 17. The lifting rod 24 slides in the first slide groove 25. A second slide groove 26 is provided on the inner wall surface of the first slide groove 25. The second slide groove 26 is connected to the packaging slot 3. A guide plate 27 is elastically slidably connected in the second slide groove 26. The side of the guide plate 27 close to the packaging strip 5 is an inclined surface. A guide groove 28 is provided on the surface of the guide plate 27. The lifting rod 24 slides in the guide groove 28;

[0042] In the process of injection molding of semiconductors, when the packaging strip 5 is moved into the packaging groove 3, the packaging strip 5 will squeeze the guide plate 27, and the guide plate 27 will move into the second slide groove 26. The lifting rod 24 will move upward under the action of the guide groove 28, and the lifting rod 24 will drive the rotating ring 19 to move upward together. Then, when the limit block completely squeezes the packaging strip 5 down, the clamping block 18 will move into the clamping groove 21. Then, when the packaging strip 5 needs to be taken out, the rotating shaft 14 will drive the rotating ring 19 and the squeezing block 22 through the clamping block 18. By rotating, the extrusion block 22 will move into the extrusion groove 23, and then the extrusion block 22 will lift the packaging strip 5 upward by acting on the inclined surface on the upper side of the extrusion groove 23, so that the packaging strip 5 can be moved out of the packaging groove 3, thereby improving the removal efficiency and will not damage the packaging strip 5, thereby ensuring the use of the packaging strip 5. After the packaging strip is taken out, the guide plate 27 will be extended again, and the rotating ring 19 will first disengage from the clamping block 18 and then return to its original position under the action of the torsion spring 20. The packaging strip can be lifted cyclically during the working process, thereby improving production efficiency.

[0043] In the process of injection molding of semiconductors, the clamping block 18 and the clamping slot 21 cannot be accurately docked. As a further solution of the present invention, the bottoms of the multiple clamping blocks 18 are conical, and the upper inner walls of the multiple clamping slots 21 are inclined surfaces.

[0044] During the injection molding process of semiconductors, when the rotating ring 19 moves toward the clamping block 18, the cone at the end of the clamping block 18 and the inclined surfaces on both sides of the inner wall of the clamping groove 21 can ensure that the clamping block 18 moves into the clamping groove 21, thereby ensuring the driving effect of the clamping block 18 on the rotating ring 19, so that the extrusion block 22 can lift the packaging strip 5 to facilitate the removal of the packaging strip 5.

[0045] In the process of injection molding of semiconductors, after long-term use, the sealing plate 11 will have a gap between the bottom of the sealing plate 11 and the bottom of the groove 8. As a further solution of the present invention, a pressure strip 29 is fixedly connected to the surface of the sealing plate 11, and the pressure strip 29 is located below the second cutter 7. A clearance groove 30 is opened at the bottom of the inner wall of the groove 8 corresponding to the position of the pressure strip 29;

[0046] During the injection molding process of semiconductors, after the packaging strip 5 moves to the packaging groove 3, the two ends of the packaging strip 5 will fit with the sealing plate 11, and the bottom of the second cutter 7 will press the pressure strip 29 down into the clearance groove 30 to prevent the sealing plate 11 from moving during use, thereby ensuring that the sealing plate 11 is sealed to the discharge port 9.

[0047] In the process of injection molding of semiconductors, there is no limit on the rotation angle of the limit plate 15 when the limit plate 15 rotates, and the limit plate 15 cannot accurately limit the packaging strip 5 when it rotates. As a further solution of the present invention, a blocking rod 31 is fixedly connected to the surface of the packaging strip 5, and the blocking rod 31 is used to block the limit plate 15;

[0048] During the injection molding production of semiconductors, when the limit plate 15 rotates toward the side close to the packaging strip 5, the end of the limit plate 15 will be blocked by the blocking rod 31, so that the limit plate 15 can move to the same part above the surface of the packaging strip 5, ensuring that the extrusion effect of the limit plate 15 on the packaging strip 5 is the same when it rotates.

Claims

1. An automatic deburring device, comprising a forming die (1), characterized in that: The molding die (1) has a plurality of molding cavities (2) formed therein, a packaging groove (3) formed on the surface of the molding die (1), a plurality of pouring ports (4) formed on the inner wall surface of the packaging groove (3), the pouring ports (4) being connected to the molding cavities (2), a packaging strip (5) being provided in the packaging groove (3), a first cutting mechanism being provided on the surface of the packaging strip (5), the first cutting mechanism being used to cut off burrs formed on the inner sides of the plurality of pouring ports (4), a second cutting mechanism being provided on the surface of the packaging strip (5), the second cutting mechanism being used to cut off burrs formed on the inner sides of the plurality of pouring ports (4), The burrs remaining inside the packaging groove (3) are removed; a discharge mechanism is provided inside the packaging groove (3); the discharge mechanism is used to remove and discharge the debris cleaned inside the packaging groove (3) after production is completed; a positioning mechanism is provided on the surface of the discharge mechanism; the positioning mechanism is used to position the packaging strip (5) when the packaging strip (5) moves into the packaging groove (3); a plurality of limiting mechanisms are provided on the surface of the molding die (1); the limiting mechanisms are used to limit the packaging strip (5) after the packaging strip (5) moves into the packaging groove (3).

2. The automatic deburring device according to claim 1, characterized in that: The first cutting mechanism comprises a plurality of first cutters (6), and the plurality of first cutters (6) are all fixedly connected to the surface of one side of the packaging strip (5) close to the pouring port (4).

3. The automatic deburring device according to claim 2, characterized in that: The second cutting mechanism comprises a second cutter (7), the second cutter (7) being fixedly connected to a surface of the packaging strip (5) on one side close to the pouring port (4), the second cutter (7) being located in the middle of the plurality of first cutters (6), and a cutting groove (8) being provided at the bottom of the inner wall of the packaging groove (3).

4. The automatic deburring device according to claim 3, characterized in that: The discharge mechanism comprises two discharge ports (9), the two discharge ports (9) being arranged on the front and rear inner wall surfaces of the cut groove (8), the discharge ports (9) penetrating the forming mold (1), a sealing groove (10) being arranged at the bottom of the inner wall of the cut groove (8), and a sealing plate (11) being elastically slidably connected in the sealing groove (10).

5. The automatic deburring device according to claim 4, characterized in that: The positioning mechanism comprises two triangular positioning blocks (12), the two positioning blocks (12) being respectively fixedly connected to the surfaces of one side of the two sealing plates (11) close to each other, and positioning grooves (13) are provided on both end surfaces of the packaging strip (5), and the inner side of the positioning groove (13) is an inclined surface.

6. The automatic deburring device according to claim 1, characterized in that: The limiting mechanism comprises a rotating shaft (14), the rotating shaft (14) is rotatably connected to the surface of the forming mold (1), a fan-shaped limiting plate (15) is fixedly connected to the surface of the rotating shaft (14), the bottom of the limiting plate (15) is an inclined surface, and a toggle rod (16) is fixedly connected to the surface of the limiting plate (15).

7. The automatic deburring device according to claim 6, characterized in that: A groove (17) is provided on the inner wall surface of the packaging groove (3) corresponding to the position of the rotating shaft (14); the rotating shaft (14) penetrates the molding die (1) and extends into the groove (17); a plurality of clamping blocks (18) arranged at equal angles are fixedly connected to the surface of the rotating shaft (14); a rotating ring (19) is provided on the surface of the rotating shaft (14); the rotating ring (19) is located in the groove (17); the rotating ring (19) is located below the clamping blocks (18); a torsion spring (20) is connected between the rotating ring (19) and the bottom of the inner wall of the groove (17); a plurality of clamping grooves (21) are provided on the inner side surface of the rotating ring (19); a fan-shaped extrusion block (22) is fixedly connected to the surface of the rotating ring (19); An extrusion groove (23) is provided on the side of the packaging strip (5), and the upper end of the extrusion groove (23) is an inclined surface. The surface of the rotating ring (19) is slidably connected with a lifting rod (24). The inner wall surface of the groove (17) is provided with a first sliding groove (25), and the lifting rod (24) slides in the first sliding groove (25). The inner wall surface of the first sliding groove (25) is provided with a second sliding groove (26), and the second sliding groove (26) is connected to the packaging groove (3). A guide plate (27) is elastically slidably connected in the second sliding groove (26), and the guide plate (27) is an inclined surface on the side close to the packaging strip (5). A guide groove (28) is provided on the surface of the guide plate (27), and the lifting rod (24) slides in the guide groove (28).

8. The automatic deburring device according to claim 7, characterized in that: The bottoms of the plurality of clamping blocks (18) are conical, and the upper inner walls of the plurality of clamping slots (21) are inclined surfaces.

9. The automatic deburring device according to claim 4, characterized in that: A pressure strip (29) is fixedly connected to the surface of the sealing plate (11), and the pressure strip (29) is located below the second cutting knife (7). A clearance groove (30) is provided at the bottom of the inner wall of the cutting groove (8) corresponding to the position of the pressure strip (29).

10. The automatic deburring device according to claim 6, characterized in that: A blocking rod (31) is fixedly connected to the surface of the packaging strip (5), and the blocking rod (31) is used to block the limiting plate (15).

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