Conductive cooling semiconductor laser module and packaging method thereof

Abstract

The invention relates to a conduction cooling semiconductor laser module and a packaging method thereof, and belongs to the technical field of semiconductor lasers. The laser module comprises a bar array, an insulating heat conduction substrate, a heat dissipation heat sink, insulating substrates and conductive electrode plates, the insulating heat conduction substrate is arranged on the upper side of the heat dissipation heat sink, the bar array is arranged on the upper side of the insulating heat conduction substrate, the insulating substrates are arranged on the two sides of the heat dissipation heat sink respectively, and the conductive electrode plates are arranged on the insulating substrates. The other two sides of the heat dissipation heat sink are respectively provided with a conductive electrode plate communicated with the bar array. The packaging structure is reasonable in structural design, and compared with an existing packaging process, the packaging process is simplified, and the packaging quality is improved.

Description

Technical Field

[0001] The invention relates to a conduction-cooled semiconductor laser module and a packaging method thereof, belonging to the technical field of semiconductor lasers. Background Art

[0002] Semiconductor lasers have been widely used in distance measurement, mechanical processing, medical cosmetology, laser communication, etc. due to their advantages of small size, light weight and high power. With the further expansion of high-power semiconductor lasers in the market, higher requirements are placed on the packaging quality and standards of lasers.

[0003] The existing bar array packaging technology mainly uses a tungsten copper electrode, a ceramic substrate, and a heat sink combination package to dissipate heat from the chip. For example, the Chinese patent document CN115008052A discloses an electrical connection method for semiconductor laser bar array packaging, which uses two tungsten copper alloy blocks with contoured grooves, a bar bar, and a first solder sheet to package a small module, and arranges adjacent modules in sequence, and embeds solder in the matching grooves between the facing surfaces of the tungsten copper alloy blocks, so that the tungsten copper alloy blocks of adjacent modules are quickly aligned and spliced ​​by solder to complete welding. The packaging process is complex and the production and assembly efficiency is low, so the present invention is proposed. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a conduction-cooled semiconductor laser module with a reasonable structural design. Compared with the existing packaging process, the packaging process is simplified and the packaging quality is improved.

[0005] The present invention also provides a packaging method for the conduction-cooled semiconductor laser module.

[0006] The technical solution of the present invention is as follows:

[0007] A conduction-cooled semiconductor laser module comprises a bar array, an insulating heat-conducting substrate, a heat sink, an insulating substrate and a conductive electrode plate, wherein:

[0008] An insulating thermally conductive substrate is arranged on the upper side of the heat sink, a bar array is arranged on the upper side of the insulating thermally conductive substrate, insulating substrates are arranged on both sides of the heat sink, and conductive electrode plates connected to the bar array are arranged on the other two sides of the heat sink.

[0009] Preferably according to the present invention, the bar array includes heat dissipation electrodes, solder sheets and bar bars, and the bar bars are clamped between every two heat dissipation electrodes by the solder sheets to form an array unit. The lower outer side of the heat dissipation electrode is provided with an inclination angle, and several array units are tightly fitted to form the bar array. The inclination angles of the heat dissipation electrodes in the array unit form a conical limiting groove, and preformed solder is provided in the conical limiting groove. The preformed solder is consistent in shape with the conical groove, which is convenient for placement and improves packaging convenience.

[0010] According to the present invention, the heat dissipation electrode is preferably made of conductive materials such as tungsten copper or copper-diamond, which have a thermal expansion coefficient similar to that of the bar, and the bar solder sheet is made of solders such as gold-tin or gold-germanium with a higher melting temperature. The preform solder is made of soft solders such as indium silver, indium tin, etc. containing indium, or hard solders such as tin-silver-copper, etc., and the insulating thermal conductive substrate material is made of aluminum nitride, aluminum oxide, or beryllium oxide.

[0011] Preferably, according to the present invention, a plurality of capillary channels are provided on the surface of the heat dissipation electrode through capillary treatment, and the liquid solder can cover the welding surface of the heat dissipation electrode through the capillary effect, the solder layer is thinner and more uniform, and the contact area between the heat dissipation electrode and the bar solder sheet is increased, thereby enhancing the bonding strength of the solder alloy and improving the heat dissipation performance.

[0012] Preferably according to the present invention, metal layers are provided on the upper and lower sides of the insulating thermally conductive substrate, wherein the upper metal layer is evenly provided with partitions, the number of partitions is the same as the number of bars, the positions of the partitions correspond to the positions of the bars, and the partitions are located on the lower side of the bars.

[0013] According to the present invention, it is further preferred that the metal layer is a composite metal layer composed of Cu, TiW, Pt, Ni and Au arranged in sequence from bottom to top.

[0014] Preferably, according to the present invention, positioning ribs are provided at both ends of the insulating thermally conductive substrate, the positioning ribs on the upper side of the insulating thermally conductive substrate are used to limit the position of the bar array, and the positioning ribs on the lower side of the insulating thermally conductive substrate are used to limit the front and rear position of the insulating thermally conductive substrate on the heat sink.

[0015] Preferably, according to the present invention, bosses are respectively provided on both sides of the upper portion of the heat sink, for limiting the left and right positions of the insulating thermally conductive substrate on the heat sink.

[0016] The packaging method of the above-mentioned conduction-cooled semiconductor laser module comprises the following steps:

[0017] (1) The array units are stacked one by one on the array fixture, and a free force is applied to clamp them, and then heated to melt the solder sheet, and the array units are fixed;

[0018] (2) Place the array units with the cavity facing downward on the groove fixture in sequence, and combine the outer inclination angles of the heat dissipation electrodes of two adjacent array units into a conical limiting groove. Place the preformed solder in the conical limiting groove, and then place the insulating thermal conductive substrate. The metal layer of the insulating thermal conductive substrate separates the corresponding bar position;

[0019] (3) Solder is laid between the bosses on both sides of the heat sink, the groove fixture is turned over, the insulating thermally conductive substrate is installed on the heat sink, the positioning ribs at both ends of the insulating thermally conductive substrate are buckled with the heat sink, the position of the insulating thermally conductive substrate is fixed, and the groove fixture is above the bar array, and the fixing pressure is applied by the groove fixture's own gravity;

[0020] (4) Heating in a vacuum environment causes the preformed solder to melt into a liquid state. Due to the capillary effect, the liquid solder spreads along the capillary channels on the surface of the heat dissipation electrode to the upper side, the left side, and the right side, respectively, and covers the adjacent metal layers, thereby welding the adjacent array units and the array units to the insulating heat conductive substrate together;

[0021] (5) Weld the insulating substrate and the heat sink together, fix the conductive electrode plate and the heat sink with screws, press the conductive electrode on the upper side of the conductive electrode plate to complete the packaging.

[0022] Preferably, according to the present invention, the array fixture in step (1) is a C-shaped block, and a bolt is provided on one side of the C-shaped block, and the array unit in the C-shaped block is tightened by screwing in the bolt;

[0023] The groove fixture in step (2) is a rectangular plate with a rectangular groove arranged in the rectangular plate. A bolt is arranged on one side of the rectangular groove, and the array unit in the rectangular groove is tightened by screwing in the bolt.

[0024] The beneficial effects of the present invention are:

[0025] 1. The present invention provides a conduction-cooled semiconductor laser module with a reasonable structural design. Compared with the existing packaging process, it simplifies the packaging process and improves the packaging quality.

[0026] 2. The present invention adopts a clamp to cooperate with the welding of the array unit, the insulating heat-conducting substrate, etc., so the overall welding process is simplified and convenient, and the production and assembly efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of a semiconductor laser module of the present invention;

[0028] Figure 2 is a schematic diagram of a bar array of the present invention;

[0029] Figure 3 It is a partial enlarged schematic diagram of the bar array of the present invention;

[0030] Figure 4 It is a schematic diagram of assembling the groove clamp of the present invention;

[0031] Figure 5 It is a schematic diagram of the array unit structure of the present invention;

[0032] Figure 6It is a schematic diagram of the structure of the insulating heat-conducting substrate of the present invention;

[0033] Figure 7 It is a schematic diagram of the heat sink structure of the present invention;

[0034] Among them, 1. heat sink, 2. conductive electrode plate, 3. bar array, 4. insulating substrate, 5. insulating thermal conductive substrate, 6. heat dissipation electrode, 7. solder sheet, 8. bar, 9. preformed solder, 10. groove fixture. DETAILED DESCRIPTION

[0035] The present invention will be further described below by way of embodiments in conjunction with the accompanying drawings, but is not limited thereto.

[0036] Embodiment 1:

[0037] like Figure 1-7 As shown, this embodiment provides a conduction-cooled semiconductor laser module, including a bar array 3, an insulating thermally conductive substrate 5, a heat sink 1, an insulating substrate 4 and a conductive electrode plate 2, wherein:

[0038] An insulating thermally conductive substrate 5 is disposed on the upper side of the heat sink 1, a bar array 3 is disposed on the upper side of the insulating thermally conductive substrate 5, insulating substrates 4 are disposed on both sides of the heat sink 1, and conductive electrode plates 2 connected to the bar array 3 are disposed on the other two sides of the heat sink 1.

[0039] The bar array 3 includes a heat dissipation electrode 6, a solder sheet 7 and a bar 8. The bar 8 is sandwiched between every two heat dissipation electrodes 6 by the solder sheet 7 to form an array unit. The lower outer side of the heat dissipation electrode 6 is provided with an inclination angle. Several array units are closely fitted to form the bar array 3. The inclination angles of the heat dissipation electrodes in the array unit form a conical limiting groove. Preformed solder 9 is provided in the conical limiting groove. The preformed solder is consistent in shape with the conical groove, which is convenient for placement and improves packaging convenience.

[0040] The heat dissipation electrode 6 is made of tungsten copper, the solder sheet 7 is made of gold tin with a relatively high melting temperature, the preform solder 9 is made of indium silver solder containing indium, and the insulating heat conductive substrate 5 is made of aluminum nitride.

[0041] The surface of the heat dissipation electrode 6 is provided with a number of capillary channels through capillary treatment. The liquid solder can cover the welding surface of the heat dissipation electrode through the capillary effect. The solder layer is thinner and more uniform, and the contact area between the heat dissipation electrode and the bar solder sheet is increased, thereby enhancing the bonding strength of the solder alloy and improving the heat dissipation performance.

[0042] Metal layers are arranged on the upper and lower sides of the insulating thermally conductive substrate 5, wherein the upper metal layer is evenly provided with partitions, the number of partitions is the same as the number of bars, the positions of the partitions correspond to the positions of the bars, and the partitions are located on the lower side of the bars.

[0043] The metal layer is a composite metal layer composed of Cu, TiW, Pt, Ni and Au arranged in sequence from bottom to top.

[0044] Positioning ribs are provided at both ends of the insulating thermally conductive substrate 5. The positioning ribs on the upper side of the insulating thermally conductive substrate are used to limit the position of the bar array, and the positioning ribs on the lower side of the insulating thermally conductive substrate are used to limit the front and rear position of the insulating thermally conductive substrate on the heat sink.

[0045] Bosses are respectively arranged on both sides of the upper part of the heat sink 1 to limit the left and right positions of the insulating heat conductive substrate on the heat sink.

[0046] The packaging method of the above-mentioned conduction-cooled semiconductor laser module comprises the following steps:

[0047] (1) The array units are stacked one after another on an array fixture. The array fixture is a C-shaped block. A bolt is provided on one side of the C-shaped block. The array units in the C-shaped block are tightened by screwing in the bolt. Then, heating is applied to melt the solder sheet 7. The array units are fixed.

[0048] (2) Place the array units with the cavity surface facing downward on the groove fixture 10 in sequence. The groove fixture is a rectangular plate with a rectangular groove in it. A bolt is provided on one side of the rectangular groove. The array units in the rectangular groove are tightened by screwing in the bolt. The outer inclination angles of the heat dissipation electrodes of two adjacent array units are combined into a conical limiting groove. The preformed solder 9 is placed in the conical limiting groove, and then the insulating thermal conductive substrate 5 is placed. The metal layer of the insulating thermal conductive substrate separates the corresponding bar position;

[0049] (3) Solder is laid between the bosses on both sides of the heat sink 1, the groove fixture is turned over, the insulating thermally conductive substrate 5 is installed on the heat sink 1, and the positioning ribs at both ends of the insulating thermally conductive substrate 5 are buckled with the heat sink 1 to fix the position of the insulating thermally conductive substrate 5. The groove fixture 10 is above the bar array, and the fixing pressure is applied by the groove fixture's own gravity;

[0050] (4) Heating in a vacuum environment melts the preformed solder 9 into a liquid state. Due to the capillary effect, the liquid solder spreads along the capillary channels on the surface of the heat dissipation electrode to the upper side, the left side, and the right side, respectively, and covers the adjacent metal layers, thereby welding the adjacent array units and the array units and the insulating heat-conducting substrate 5 together;

[0051] (5) The insulating substrate and the heat sink are welded together, and the conductive electrode plate and the heat sink are fixed with screws. The upper side of the conductive electrode plate 2 is pressed tightly against the conductive heat sink electrode 6 to complete the packaging.

[0052] Embodiment 2:

[0053] A conduction-cooled semiconductor laser module, the structure of which is as described in Example 1, except that the heat dissipation electrode 6 is made of copper-diamond, the bar solder sheet is made of gold-germanium with a higher melting temperature, the preform solder 9 is made of tin-silver-copper solder, and the insulating heat-conducting substrate 5 is made of alumina.

[0054] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A conduction-cooled semiconductor laser module, characterized in that: It includes a bar array, an insulating thermally conductive substrate, a heat sink, an insulating substrate and a conductive electrode plate, wherein: An insulating thermally conductive substrate is arranged on the upper side of the heat sink, a bar array is arranged on the upper side of the insulating thermally conductive substrate, insulating substrates are arranged on both sides of the heat sink, and conductive electrode plates connected to the bar array are arranged on the other two sides of the heat sink.

2. The conduction-cooled semiconductor laser module according to claim 1, wherein: The bar array includes heat dissipation electrodes, solder sheets and bar bars. The bar bars are sandwiched between every two heat dissipation electrodes through solder sheets to form an array unit. An inclination angle is set at the lower outer side of the heat dissipation electrode. Several array units are tightly fitted to form a bar array. The inclination angle of the heat dissipation electrode in the array unit forms a conical limiting groove, and preformed solder is set in the conical limiting groove.

3. The conduction-cooled semiconductor laser module according to claim 2, wherein: The heat dissipation electrode is made of tungsten copper or copper-diamond, the bar solder sheet is made of gold-tin or gold-germanium solder, the preform solder is made of indium-containing indium silver, indium tin or tin-silver-copper solder, and the insulating thermal conductive substrate material is made of aluminum nitride, aluminum oxide or beryllium oxide.

4. The conduction-cooled semiconductor laser module according to claim 2, wherein: A plurality of capillary channels are arranged on the surface of the heat dissipation electrode.

5. The conduction-cooled semiconductor laser module according to claim 4, wherein: Metal layers are arranged on the upper and lower sides of the insulating thermally conductive substrate, wherein the upper metal layer is evenly provided with partitions, the number of partitions is the same as the number of bars, the positions of the partitions correspond to the positions of the bars, and the partitions are located on the lower side of the bars.

6. The conduction-cooled semiconductor laser module according to claim 5, wherein: The metal layer is a composite metal layer composed of Cu, TiW, Pt, Ni and Au arranged in sequence from bottom to top.

7. The conduction-cooled semiconductor laser module according to claim 5, wherein: Positioning ribs are provided at both ends of the insulating thermally conductive substrate. The positioning ribs on the upper side of the insulating thermally conductive substrate are used to limit the position of the bar array, and the positioning ribs on the lower side of the insulating thermally conductive substrate are used to limit the front and rear position of the insulating thermally conductive substrate on the heat sink.

8. The conduction-cooled semiconductor laser module according to claim 7, wherein: Bosses are respectively arranged on both sides of the upper part of the heat sink, which are used to limit the left and right positions of the insulating heat-conducting substrate on the heat sink.

9. The packaging method of a conduction-cooled semiconductor laser module according to claim 8, characterized in that: Here are the steps: (1) The array units are stacked one by one on the array fixture, and a free force is applied to clamp them, and then heated to melt the solder sheet, and the array units are fixed; (2) Place the array units with the cavity facing downward on the groove fixture in sequence, and combine the outer inclination angles of the heat dissipation electrodes of two adjacent array units into a conical limiting groove. Place the preformed solder in the conical limiting groove, and then place the insulating thermal conductive substrate. The metal layer of the insulating thermal conductive substrate separates the corresponding bar position; (3) Solder is laid between the bosses on both sides of the heat sink, the groove fixture is turned over, the insulating thermally conductive substrate is installed on the heat sink, the positioning ribs at both ends of the insulating thermally conductive substrate are buckled with the heat sink, the position of the insulating thermally conductive substrate is fixed, and the groove fixture is above the bar array, and the fixing pressure is applied by the groove fixture's own gravity; (4) Heating in a vacuum environment causes the preformed solder to melt into a liquid state. Due to the capillary effect, the liquid solder spreads along the capillary channels on the surface of the heat dissipation electrode to the upper side, the left side, and the right side, respectively, and covers the adjacent metal layers, thereby welding the adjacent array units and the array units to the insulating heat conductive substrate together; (5) Weld the insulating substrate and the heat sink together, fix the conductive electrode plate and the heat sink with screws, press the conductive electrode on the upper side of the conductive electrode plate to complete the packaging.

10. The packaging method of a conduction-cooled semiconductor laser module according to claim 9, characterized in that: The array fixture in step (1) is a C-shaped block, and a bolt is provided on one side of the C-shaped block, and the array unit in the C-shaped block is tightened by screwing in the bolt; The groove fixture in step (2) is a rectangular plate with a rectangular groove arranged in the rectangular plate. A bolt is arranged on one side of the rectangular groove, and the array unit in the rectangular groove is tightened by screwing in the bolt.

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