Grinding pad, grinding equipment and grinding method

Abstract

The invention provides a grinding pad, grinding equipment and a grinding method, the grinding pad is provided with a grinding surface, the grinding surface is provided with a first liquid guide groove in a spiral line shape, and the first liquid guide groove and the grinding pad are coaxially arranged. The grinding pad is applied to the grinding equipment and used for grinding a target object, during grinding, grinding liquid is provided for the grinding surface, the grinding pad is controlled to rotate, and under the same visual angle, the rotation direction of the grinding pad is opposite to the rotation direction, from inside to outside, of the first liquid guide groove; therefore, the grinding fluid on the grinding pad spirally moves in the direction away from the axis of the grinding pad along with autorotation of the grinding pad, and the movement direction of the grinding fluid is opposite to the autorotation direction of the grinding pad, so that the movement direction of the grinding fluid adapts to the extension direction of the first liquid guide groove; the flowing speed of the grinding liquid in the first liquid guide groove is increased, so that the grinding liquid can be quickly discharged out of the grinding pad, and the grinding quality and the grinding efficiency are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a polishing pad, a polishing device and a polishing method. Background Art

[0002] Chemical Mechanical Polishing (CMP) is a key step in achieving cutting-edge device performance in the semiconductor field. At present, the requirements for planarity and defects at technology nodes above 10nm are becoming more and more stringent, and chemical mechanical polishing technology is still the main means to solve this problem.

[0003] In chemical mechanical polishing, the polishing pad is in direct contact with the wafer surface, and it polishes the wafer through its internal structure and the polishing fluid attached to the surface. The flow of the polishing fluid on the polishing pad has an important impact on the polishing effect of the wafer. If the polishing fluid flows slowly on the surface of the polishing pad, on the one hand, it will cause the polishing fluid to accumulate and form crystals, causing damage to the wafer, and on the other hand, it will increase the loss of the polishing fluid and reduce the overall polishing efficiency. Summary of the invention

[0004] The object of the present invention is to provide a polishing pad, a polishing device and a polishing method, aiming to improve the polishing effect of a target object, reduce the loss of the polishing liquid and improve the overall polishing efficiency by increasing the circulation speed of the polishing liquid on the polishing pad.

[0005] To achieve the above object, the present invention provides a polishing pad, which has a polishing surface; a first spiral liquid guide groove is formed on the polishing surface, and the first liquid guide groove is coaxially arranged with the polishing pad.

[0006] Optionally, one end of the first liquid conducting groove close to the axis of the polishing pad is located on a positioning circle, and the positioning circle is coaxial with the polishing pad; an arc-shaped second liquid conducting groove is also provided on the polishing surface, one end of the second liquid conducting groove is located on the positioning circle, and the other end extends to the outermost circle of the first liquid conducting groove; the bending direction of the second liquid conducting groove is the same as that of the first liquid conducting groove.

[0007] Optionally, a ratio of a radius of curvature of the second liquid-conducting groove to a maximum distance from the first liquid-conducting groove to an axis of the polishing pad is greater than 0.75 and less than 2.

[0008] Optionally, there are multiple second liquid conducting grooves, and the multiple second liquid conducting grooves are arranged at intervals around the axis of the polishing pad.

[0009] Optionally, a width of the second liquid-conducting groove is greater than or equal to a width of the first liquid-conducting groove.

[0010] Optionally, the polishing pad is circular, and the radius of the polishing pad is greater than or equal to 36 cm and less than or equal to 40 cm; the maximum distance from the first liquid guide groove to the axis of the polishing pad is greater than or equal to 15 cm, and the difference between the maximum distance from the first liquid guide groove to the axis of the polishing pad and the radius of the polishing pad is less than 2 cm, the minimum distance from the first liquid guide groove to the axis of the polishing pad is less than or equal to 7.5 cm, and the number of turns of the first liquid guide groove spiral is greater than or equal to 30 and less than or equal to 200.

[0011] Optionally, the first liquid-conducting groove is an Archimedean spiral structure.

[0012] Optionally, one end of the first liquid guiding groove close to the axis of the grinding pad is located on a positioning circle, and the positioning circle is coaxial with the grinding pad; a third liquid guiding groove is further provided on the grinding surface, and the third liquid guiding groove is located at the positioning circle.

[0013] To achieve the above-mentioned purpose, the present invention also provides a grinding device, comprising: a grinding disc, a grinding pad as described in any of the preceding items, and a grinding head; the grinding pad is coaxially supported on the grinding disc, and the grinding surface is located on the side of the grinding pad away from the grinding disc; the grinding head is located on the side of the grinding surface away from the grinding disc and deviates from the axis of the grinding disc.

[0014] Optionally, a grinding liquid supply portion is further included, wherein the grinding liquid supply portion has an outlet end, and the outlet end is located on a side of the grinding surface away from the grinding disk and at the axis of the grinding disk.

[0015] Optionally, it also includes a driving unit and a control unit; the driving unit is connected to the grinding disc in a transmission manner; the control unit is connected to the driving unit in a communication manner and is configured to control the operation of the driving unit to drive the grinding disc and the grinding pad thereon to rotate along a preset direction; at the same viewing angle, the preset direction is opposite to the rotation direction of the first liquid guide groove from inside to outside.

[0016] To achieve the above-mentioned purpose, the present invention also provides a grinding method, which is performed based on the grinding equipment as described in any of the preceding items, including: placing the target object to be ground on the grinding surface of the grinding pad; pressing the grinding head against the target object; providing grinding liquid to the grinding pad, and controlling the grinding head and the grinding disk to rotate along a preset direction to grind the target object; at the same viewing angle, the preset direction is opposite to the rotation direction from inside to outside of the first liquid guide groove.

[0017] Compared with the prior art, the polishing pad, polishing equipment and polishing method of the present invention have the following advantages: the aforementioned polishing pad has a polishing surface; a first spiral liquid guide groove is provided on the polishing surface, and the first liquid guide groove is coaxially arranged with the polishing pad. The grinding pad is applied to a grinding device and is used to grind a target object. During grinding, a grinding liquid is provided to the grinding surface, and the self-rotation of the grinding pad is controlled. At the same viewing angle, the self-rotation direction of the grinding pad is opposite to the rotation direction of the first liquid guide groove from inside to outside, so that the grinding liquid on the grinding pad moves spirally along a direction away from the axis of the grinding pad under the combined action of inertia and centrifugal force as the grinding pad rotates, and the direction of movement of the grinding liquid is opposite to the self-rotation direction of the grinding pad, that is, the movement direction of the grinding liquid is consistent with the extension direction of the first liquid guide groove, which can increase the circulation speed of the grinding liquid in the first liquid guide groove, and then the grinding liquid can be quickly discharged from the grinding pad, thereby reducing the occurrence of accidents caused by the grinding liquid accumulating on the grinding pad to form crystals and then damaging the target object, improving the yield and reliability of the target object after grinding, and also reducing the loss of the grinding liquid and improving the grinding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to better understand the present invention and shall not constitute improper limitations of the present invention.

[0019] Figure 1 It is a schematic structural diagram of a polishing pad provided according to an embodiment of the present invention.

[0020] Figure 2 It is a schematic structural diagram of a polishing pad provided according to another embodiment of the present invention.

[0021] Figure 3 yes Figure 2 An enlarged schematic diagram of point A.

[0022] Figure 4 Schematic diagram of the structure of a polishing pad provided according to another embodiment of the present invention.

[0023] Figure 5 It is a schematic structural diagram of a grinding device provided according to an embodiment of the present invention.

[0024] Figure 6 1 is a schematic diagram of a partial structure of a grinding device provided according to an embodiment of the present invention, showing a grinding disc and a grinding pad.

[0025] [The reference numerals are explained as follows]: 100 - grinding device, 110 - grinding pad, 111 - grinding surface, 112 - first liquid guide groove, 113 - second liquid guide groove, 114 - third liquid guide groove, 120 - grinding disc, 130 - grinding head, 140 - grinding liquid supply part, 141 - outlet end, 200 - target object. DETAILED DESCRIPTION

[0026] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the present embodiment only illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the figure instead of being drawn according to the number, shape and size of the components in the actual implementation. The type, quantity and proportion of each component in the actual implementation can be a random change, and the component layout type may also be more complicated.

[0027] In addition, each embodiment of the following description has one or more technical features, but this does not mean that the user of the present invention must implement all the technical features in any embodiment at the same time, or can only implement part or all of the technical features in different embodiments separately. In other words, under the premise that implementation is possible, those skilled in the art can selectively implement part or all of the technical features in any embodiment according to the disclosure of the present invention and according to the design specifications or implementation requirements, or selectively implement a combination of part or all of the technical features in multiple embodiments, thereby increasing the flexibility of the implementation of the present invention.

[0028] As used in this specification, the singular forms "one", "an" and "the" include plural objects, and the plural form "multiple" includes more than two objects, unless the content clearly indicates otherwise. As used in this specification, the term "or" is usually used in the sense of including "and / or", unless the content clearly indicates otherwise, and the terms "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. Relational terms such as the terms "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly indicate the number of technical features indicated. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In order to make the purpose, advantages and features of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings. It should be noted that the drawings are all in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.

[0030] Figure 1 , Figure 2 and Figure 4 Schematic diagrams of the structures of the polishing pad 110 provided by different embodiments of the present invention are shown. Figure 1 , Figure 2 and Figure 4 As shown, the polishing pad 110 has a polishing surface 111 . A spiral first liquid guiding groove 112 is formed on the polishing surface 111 , and the first liquid guiding groove 112 is coaxially arranged with the polishing pad 110 .

[0031] The polishing pad 110 is used for Figure 5 The grinding device 100 is shown. Figure 5 In addition to the polishing pad 110, the polishing device 100 further includes a polishing disc 120 and a polishing head 130. The polishing pad 110 is coaxially supported on the polishing disc 120, and the polishing surface 111 is located on a side of the polishing pad 110 away from the polishing disc 120. The polishing head 130 is disposed on a side of the polishing surface 111 away from the polishing disc 120 and deviates from the axis of the polishing disc 120. The operation of polishing the target object 200 using the polishing device 100 includes the following steps S1, S2, and S3.

[0032] The step S1 includes placing the target object 200 on the grinding surface 111 .

[0033] The step S2 includes pressing the grinding head 130 against the target object 200 .

[0034] The step S3 includes providing abrasive liquid to the polishing pad 110, and controlling the polishing head 130 and the polishing disc 120 to rotate along a preset direction to polish the target object 200. In this step, when the polishing disc 120 and the polishing pad 110 are observed from the same viewing angle, the preset direction is opposite to the rotation direction of the first liquid guide groove 112 from inside to outside.

[0035] Here, “inside” and “outside” are a set of relative concepts defined based on the axis of the polishing pad 110. Although they are non-restrictive, “inside” is usually close to the axis of the polishing pad 110, and “outside” is far away from the axis of the polishing pad 110. Correspondingly, “from inside to outside” refers to the direction away from the polishing pad 110. “Observing the grinding wheel 120 and the polishing pad 110 from the same perspective” means, for example, observing the grinding wheel 120 and the polishing pad 110 from the perspective of the direction from the polishing pad 110 to the grinding wheel 120. It can be understood that when the grinding wheel 120 is horizontally arranged and the polishing pad 110 is supported on the upper surface of the grinding wheel 120, the perspective from the direction from the polishing pad 110 to the grinding wheel 120 is a top-down perspective. Figure 6 Taking the orientation shown as an example, the rotation direction of the first liquid guiding groove 112 from inside to outside is the counterclockwise direction (as shown by arrow S1), and the preset direction is the clockwise direction (as shown by arrow S2).

[0036] Thus, during the self-rotation of the grinding disc 120 and the grinding pad 110 along the preset direction, the grinding liquid on the grinding pad 110 moves in a spiral direction away from the axis of the grinding pad 110 under the combined action of inertia and centrifugal force, and the movement direction of the grinding liquid is opposite to the preset direction. Figure 6Taking the orientation shown as an example, when the grinding disc 120 and the grinding pad 110 rotate in the clockwise direction, the grinding liquid spirals away from the axis of the grinding pad 110 in the counterclockwise direction. In other words, the movement direction of the grinding liquid on the grinding pad 110 is the same as the extension direction of the first liquid guide groove 112, which can improve the circulation speed and circulation efficiency of the grinding liquid in the first liquid guide groove 112, and promote the grinding liquid to be quickly discharged from the grinding pad 110, thereby effectively reducing or even avoiding the problem that the grinding liquid accumulates on the grinding pad 110 and forms crystals, thereby damaging the target object 200, improving the yield and reliability of the target object 200 after grinding, and also reducing the loss of the grinding liquid and improving the grinding efficiency. The target object 200 is, for example, a wafer, or any other object that needs to perform a grinding operation, such as a quartz plate, ceramic, sapphire, etc., which is not limited in the embodiment of the present invention.

[0037] Optionally, the first liquid-conducting groove 112 is an Archimedean spiral structure, that is, the spacing between the spiral turns of the first liquid-conducting groove 112 is equal. This has the advantage of facilitating parameter control of the first liquid-conducting groove 112 and simplifying the preparation of the polishing pad 110.

[0038] The polishing pad 110 has any suitable shape, for example, the polishing pad 110 is a regular polygon, and preferably the polishing pad 110 is a circle. The relevant parameters of the first liquid-conducting groove 112, such as the maximum distance R2 from the first liquid-conducting groove 112 to the axis of the polishing pad 110, the minimum distance R3 from the first liquid-conducting groove 112 to the axis of the polishing pad 110, and the number of turns n of the spiral are related to the size of the polishing pad 110. For example, when the polishing pad 110 is circular, if the radius R1 of the polishing pad 110 is not less than 36 cm and not more than 40 cm, the maximum distance R2 from the first liquid-conducting groove 112 to the axis of the polishing pad 110 is not less than 15 cm, and the difference between the radius R1 of the polishing pad 110 and the maximum distance R2 from the first liquid-conducting groove 112 to the axis of the polishing pad 110 is not more than 2 cm, the minimum distance R3 from the first liquid-conducting groove 112 to the axis of the polishing pad 110 is not more than 7.5 cm, and the number of turns of the spiral of the first liquid-conducting groove 112 is not less than 30 turns and not more than 200 turns. When the maximum distance R2 from the first liquid-conducting groove 112 to the axis of the polishing pad 110, the minimum distance R3 from the first liquid-conducting groove 112 to the axis of the polishing pad 110, and the number of turns n of the spiral are appropriate, the circulation speed of the polishing liquid during the rotation of the polishing pad 110 can be further improved. It can be understood that when the first liquid-conducting groove 112 is an Archimedean spiral structure, the distance ΔL between two adjacent spiral turns is approximately equal to (R2-R3) / n.

[0039] The circle where one end of the first liquid-conducting groove 112 close to the axis of the polishing pad 110 is located and coaxial with the polishing pad 110 is defined as a positioning circle 01. Figures 2 to 4 , the grinding surface 111 is also provided with a second liquid-conducting groove 113, one end of the second liquid-conducting groove 113 is located on the positioning circle 01, and the other end extends to the outermost circle of the first liquid-conducting groove 112, thereby, the second liquid-conducting groove 113 intersects with all the spiral circles of the first liquid-conducting groove 112 at the position of the second liquid-conducting groove 113, and the end of the second liquid-conducting groove 113 away from the axis of the grinding pad 110 also constitutes the outlet of the grinding liquid. That is, the setting of the second liquid-conducting groove 113 plays the role of converging and discharging the grinding liquid in the multiple spiral circles of the first liquid-conducting groove 112, thereby improving the circulation speed and circulation efficiency of the grinding liquid on the grinding pad 110.

[0040] Preferably, the second liquid-conducting groove 113 is a curved arc structure, and the bending direction of the second liquid-conducting groove 113 is the same as the bending direction of the first liquid-conducting groove 112. That is, the extension direction of the second liquid-conducting groove 113 conforms to the flow direction of the polishing liquid, which can further accelerate the flow speed of the polishing liquid in the second liquid-conducting groove 113 and improve the circulation efficiency of the polishing liquid in the polishing pad 110.

[0041] It can be understood that the bending direction of the first liquid-conducting groove 112 is the spiral direction thereof, that is, when the rotation direction of the first liquid-conducting groove 112 from inside to outside is clockwise, the bending direction of the first liquid-conducting groove 112 from inside to outside is clockwise, and the bending direction of the second liquid-conducting groove 113 from inside to outside is also clockwise (e.g., Figure 2 As shown); when the first liquid-conducting groove 112 is turned counterclockwise from inside to outside, the first liquid-conducting groove 112 is bent counterclockwise from inside to outside, and the second liquid-conducting groove 113 is bent counterclockwise from inside to outside (as shown); Figure 4 as shown).

[0042] The number of the second liquid-conducting groove 113 may be one or more. When the number of the second liquid-conducting groove 113 is more than one, the plurality of second liquid-conducting grooves 113 are arranged at intervals around the circumference of the polishing pad 110, for example, at equal intervals.

[0043] The curvature of the second liquid conducting groove 113 should be appropriate. A curvature that is too large or too small is not conducive to the circulation of the polishing liquid. In practice, the ratio of the radius of curvature of the second liquid conducting groove 113 to the maximum distance from the first liquid conducting groove 112 to the axis of the polishing pad 110 is not less than 0.75 and not greater than 2. If the ratio of the radius of curvature of the second liquid conducting groove 113 to the maximum distance from the first liquid conducting groove 112 to the axis of the polishing pad 110 is too small, the curvature of the second liquid conducting groove 113 is too large, and the improvement of the circulation speed of the polishing liquid is not significant. If the ratio of the radius of curvature of the second liquid conducting groove 113 to the maximum distance from the first liquid conducting groove 112 to the axis of the polishing pad 110 is too large, the second liquid conducting groove 113 tends to be a linear structure, and the improvement of the circulation speed of the polishing liquid is also not significant. In addition, the width w2 of the second liquid conducting groove 113 (such as Figure 3 Specifically, the width w2 of the second liquid guiding groove 113 is not less than the width w1 of the first liquid guiding groove 112, and preferably w2 is larger than w1, so as to be sufficient to accommodate the grinding liquid gathered therein.

[0044] In addition, if Figure 4 As shown, a third liquid guide groove 114 may be further provided on the grinding surface 111, and the third liquid guide groove 114 is located at the positioning circle 01 (that is, the third liquid guide groove 114 coincides with the positioning circle 01). The advantage of providing the third liquid guide groove 114 is that the grinding pad 110 can accommodate more grinding liquid. Figure 1 and Figure 2 As shown, the third liquid guiding groove may not be provided on the grinding surface 111 , so there is no need to carve and form the third liquid guiding groove, thereby reducing the production process of the grinding pad 110 and reducing the production cost of the grinding pad 110 .

[0045] Furthermore, the embodiment of the present invention also provides a Figure 5 The grinding apparatus 100 is shown.

[0046] In practice, the projection of the grinding head 130 on the grinding pad 110 is located outside the positioning circle 01 and inside the edge of the grinding pad 110 .

[0047] Optionally, the grinding device 100 further includes a grinding liquid supply unit 140. The grinding liquid supply unit 140 has an outlet end 141, which is located on a side of the grinding surface 111 away from the grinding disc 120 and at the axis of the grinding disc 120, for example, coaxially arranged with the grinding disc 120 or substantially coaxially arranged with the grinding disc 120.

[0048] Optionally, the grinding device 100 may further include a driving unit and a control unit (not shown in the figure). The driving unit is in driving connection with the grinding disc 120, and the control unit is in communication connection with the driving unit and is configured to control the driving unit to operate so as to drive the grinding disc 120 to rotate along the preset direction, thereby driving the grinding pad 110 thereon to rotate along the preset direction.

[0049] Furthermore, an embodiment of the present invention further provides a grinding method performed based on the grinding device 100 , and the grinding method includes steps S1 to S3 as described above.

[0050] It is understandable that the polishing pad 110 is made of flexible material. During the polishing of the target object 200, the area of ​​the polishing surface 111 where the first liquid guide groove 112 and the second liquid guide groove 113 are not provided can be deformed under the squeezing of the target object 200 and promote the circulation of the polishing liquid.

[0051] Although the present invention is disclosed as above, it is not limited thereto. Those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A polishing pad, characterized in that: The grinding pad has a grinding surface; a first spiral liquid guide groove is formed on the grinding surface, and the first liquid guide groove is coaxially arranged with the grinding pad.

2. The polishing pad according to claim 1, characterized in that One end of the first liquid-conducting groove close to the axis of the polishing pad is located on a positioning circle, and the positioning circle is coaxial with the polishing pad; The grinding surface is also provided with an arc-shaped second liquid-conducting groove, one end of which is located on the positioning circle, and the other end of which extends to the outermost circle of the first liquid-conducting groove; The bending direction of the second liquid-conducting groove is the same as the bending direction of the first liquid-conducting groove.

3. The polishing pad according to claim 2, characterized in that The ratio of the curvature radius of the second liquid-conducting groove to the maximum distance from the first liquid-conducting groove to the axis of the polishing pad is greater than 0.75 and less than 2.

4. The polishing pad according to claim 2, characterized in that: There are multiple second liquid-conducting grooves, and the multiple second liquid-conducting grooves are arranged at intervals around the axis of the polishing pad.

5. The polishing pad according to claim 2, characterized in that: The width of the second liquid-conducting groove is greater than or equal to the width of the first liquid-conducting groove.

6. The polishing pad according to claim 1, wherein: The polishing pad is circular, and the radius of the polishing pad is greater than or equal to 36 cm and less than or equal to 40 cm; the maximum distance from the first liquid conducting groove to the axis of the polishing pad is greater than or equal to 15 cm, and the difference between the maximum distance from the first liquid conducting groove to the axis of the polishing pad and the radius of the polishing pad is less than 2 cm, the minimum distance from the first liquid conducting groove to the axis of the polishing pad is less than or equal to 7.5 cm, and the number of turns of the first liquid conducting groove spiral is greater than or equal to 30 and less than or equal to 200.

7. The polishing pad according to claim 1, characterized in that: The first liquid-conducting groove is an Archimedean spiral structure.

8. The polishing pad according to claim 1, wherein: One end of the first liquid-conducting groove close to the axis of the polishing pad is located on a positioning circle, and the positioning circle is coaxial with the polishing pad; A third liquid guiding groove is also arranged on the grinding surface, and the third liquid guiding groove is located at the positioning circle.

9. A grinding device, characterized in that: include: Grinding disc; The polishing pad according to any one of claims 1 to 8, wherein the polishing pad is coaxially supported on the polishing disc, and the polishing surface is located on a side of the polishing pad away from the polishing disc; and The grinding head is located on a side of the grinding surface away from the grinding disk and deviates from the axis of the grinding disk.

10. The grinding device according to claim 9, characterized in that The invention also comprises a grinding liquid supply part, wherein the grinding liquid supply part has an outlet end, and the outlet end is located at a side of the grinding surface away from the grinding disk and at the axis of the grinding disk.

11. The grinding device according to claim 9, characterized in that It also includes a driving unit and a control unit; the driving unit is in driving connection with the grinding disc; the control unit is in communication connection with the driving unit and is configured to control the driving unit to operate so as to drive the grinding disc and the grinding pad thereon to rotate along a preset direction; At the same viewing angle, the preset direction is opposite to the rotation direction of the first liquid-conducting groove from inside to outside.

12. A grinding method, performed based on the grinding device according to any one of claims 9 to 11, characterized in that: include: placing an object to be polished on the polishing surface of the polishing pad; Pressing the grinding head against the target object; Providing abrasive liquid to the abrasive pad, and controlling the abrasive head and the abrasive disc to rotate along a preset direction to abrade the target object; At the same viewing angle, the preset direction is opposite to the rotation direction of the first liquid-conducting groove from inside to outside.

Images