Silicon wafer separating device

Abstract

The invention discloses a silicon wafer separation device, which comprises a mounting frame, a silicon wafer positioning unit arranged on the mounting frame, and an air compression purging assembly linearly and slidably arranged on the mounting frame and externally connected with an air blowing device, and the central axis of stacked silicon wafers is parallel to the linear sliding direction of the air compression purging assembly. By adopting the silicon wafer separation device, the air compression purging assembly is used for performing air compression purging on the adhesion gaps of the stacked silicon wafers, so that vacuum among the silicon wafers is removed, compared with a traditional bare-handed separation means, the damage to the silicon wafers caused by human factors can be reduced, the potential risk of breakage during silicon wafer separation is effectively reduced, the silicon wafer separation efficiency is higher, and the production cost is reduced. The requirement for the skill level of an operator is low, operation is convenient, and practicability is higher.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, and in particular to a silicon wafer separation device. Background Art

[0002] Most silicon wafer cutting processes use a mixture of silicon carbide and polyethylene glycol solution, and then use copper-plated steel wire to drive the mortar to impact and form the cuts. The surface of the cut silicon wafer will have obvious wire marks and the surface is relatively rough. After peeling, washing and drying, the silicon wafers are stacked and packaged for products. Since the surface of the silicon wafers is relatively rough, it is not easy to generate a vacuum between the silicon wafers, so it is relatively easy to separate the silicon wafers later. Usually, the operator picks up a stack of silicon wafers and can perform routine separation operations with his bare hands.

[0003] With the continuous optimization of processing skills and the control of processing capacity and cost, the traditional copper-plated steel wire cutting is gradually replaced by diamond wire cutting. The surface of the products cut by diamond wire is much smoother than that of the products cut by traditional steel wire, which makes a vacuum between the silicon wafers after the silicon wafers are stacked. When the silicon wafers are separated later, it is difficult for the operator to perform conventional separation by hand, and the operation efficiency is low. The separation by hand can also cause cracks when the silicon wafers are separated due to differences in operating skills and control of movement strength, affecting the yield. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a silicon wafer separation device which is convenient for silicon wafer separation and has high working reliability.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions.

[0006] The present application provides a silicon wafer separation device, comprising:

[0007] An installation frame having a receiving cavity for receiving stacked silicon wafers;

[0008] The silicon wafer positioning unit is arranged on the mounting frame and is used to position the stacked silicon wafers in the accommodating cavity:

[0009] An air-compressed purge assembly is linearly slidably disposed on the mounting frame, is externally connected to an air blowing device and is capable of blowing air toward the stacked silicon wafers in the accommodating cavity;

[0010] The central axis of the stacked silicon wafers in the accommodating cavity is parallel to the linear sliding direction of the air pressure purge assembly, and the blowing direction of the air pressure purge assembly is specifically the radial direction of the stacked silicon wafers in the accommodating cavity.

[0011] It is further defined that the above-mentioned silicon wafer separation device, wherein the mounting frame includes a frame body and a slide groove, the accommodating cavity is provided through the frame body, and the slide groove is provided through the accommodating cavity between an inner wall of a side away from the ground and a corresponding side end surface of the frame body;

[0012] The compressed air purge assembly includes a jet body, a nozzle fixedly arranged on the jet body, and a delivery pipeline. The jet body is linearly slidably arranged on the mounting frame and is located on the side of the frame away from the ground. The nozzle passes through the slide groove and extends into the accommodating cavity. The delivery pipeline is connected to an external blowing device.

[0013] Wherein, the extending direction of the slide groove is parallel to the central axis of the stacked silicon wafers in the accommodating cavity.

[0014] It is further defined that in the above-mentioned silicon wafer separation device, the distance between the nozzle of the air pressure purge assembly and the outer circular surface of the stacked silicon wafers in the accommodating chamber is set to 5 cm, and the air pressure output by the air pressure purge assembly to the stacked silicon wafers in the accommodating chamber is specifically set to 0.1 MPa.

[0015] It is further defined that the above-mentioned silicon wafer separation device, wherein the mounting frame further comprises a guide rail fixedly arranged on an end surface of the frame body away from the ground;

[0016] Wherein, the compressed air purge assembly also includes a sliding block fixedly arranged on the jet body and slidably connected to the slide rail.

[0017] It is further defined that in the above-mentioned silicon wafer separation device, the guide rail is projected into a trapezoid on the reference plane, and the smaller end is fixedly connected to the frame;

[0018] The reference plane is specifically a vertical plane in the extension direction of the guide rail.

[0019] It is further defined that, in the above-mentioned silicon wafer separation device, in the linear sliding direction of the air pressure purge assembly, the length of the slide groove is greater than the length of the guide rail.

[0020] It is further defined that in the above-mentioned silicon wafer separation device, the silicon wafer positioning unit comprises:

[0021] A control component penetrates and is elastically slidably disposed between an inner wall of the accommodating cavity away from the ground and a corresponding side end surface of the frame;

[0022] The positioning component is fixedly arranged on the control component and is located in the accommodating cavity.

[0023] It is further defined that in the above-mentioned silicon wafer separation device, the control assembly includes at least one guide rod penetrating and slidably disposed between the inner wall of the accommodating cavity away from the ground and the corresponding side end surface of the frame;

[0024] The guide rod is provided with a pressure rod at one end away from the ground and located at the side of the mounting frame away from the ground, and a connecting plate located in the accommodating cavity is provided at the other end close to the ground, and the positioning assembly is fixedly arranged on the connecting plate;

[0025] An elastic member is sleeved on the guide rod, one end of which is fixedly connected to the end of the pressure rod close to the ground, and the other end is fixedly connected to the end surface of the frame body away from the ground;

[0026] When the pressure rod moves toward a side away from the installation frame, the elastic member has elastic potential energy to drive the pressure rod to move toward a side close to the ground.

[0027] It is further defined that in the above-mentioned silicon wafer separation device, the positioning assembly comprises two first fork members respectively hingedly arranged at two ends of the connecting plate;

[0028] Wherein, the first fork piece is in a "Y" shape, and two positioning rollers parallel to each other are rotatably arranged between the two first fork pieces, and the two positioning rollers are respectively located on the two bifurcated ends of the first fork piece.

[0029] It is further defined that in the above-mentioned silicon wafer separation device, the positioning assembly comprises two first fork members respectively hingedly arranged at two ends of the connecting plate;

[0030] The first fork piece is in a "Y" shape, and two parallel rotating shafts are rotatably arranged between the two first fork pieces, and the two rotating shafts are respectively located at the two bifurcated ends of the first fork piece, and two second fork pieces located between the two first fork pieces are respectively fixed at the two ends of the rotating shaft;

[0031] The second fork piece is in a "Y" shape, and two positioning rollers parallel to each other are rotatably arranged between the two second fork pieces at corresponding positions, and the two positioning rollers are respectively located on the two bifurcated ends of the second fork piece.

[0032] The present invention has at least the following beneficial effects:

[0033] 1. Use the air pressure purge assembly to purge the adhesion gaps of the stacked silicon wafers, thereby removing the vacuum between the silicon wafers. Compared with the traditional manual separation method, it can reduce human damage to the silicon wafers and effectively reduce the risk of breakage during silicon wafer separation. In addition, the silicon wafer separation efficiency is higher, the skill level requirements for operators are lower, the operation is convenient, and the practicality is stronger;

[0034] 2. Through the cross-section setting of the guide rail, when the air-compressed purge assembly is slidably arranged on the guide rail, the guide rail can limit the displacement of the air-compressed purge assembly in the non-sliding direction, thereby ensuring the sliding stability of the air-compressed purge assembly;

[0035] 3. Since the first fork piece can rotate relative to the connecting plate, when the positioning assembly abuts against the stacked silicon wafers in the accommodating cavity under the elastic force of the elastic piece, the two positioning rollers can automatically adjust their positions to abut against the outer circumference of the silicon wafers, thereby realizing the positioning of silicon wafers of different specifications, and at the same time, it can avoid the damage of the silicon wafer edge during the separation process, thereby improving the stability of silicon wafer separation;

[0036] 4. Since the first fork piece can rotate relative to the connecting plate, and the second fork piece can rotate relative to the first fork piece, when the positioning assembly moves toward the side close to the stacked silicon wafers, the positioning rollers on the two groups of second fork pieces can respectively abut the outer cylindrical surfaces of the stacked silicon wafers. When there is a position deviation between the silicon wafer and the positioning assembly, it can be ensured that at least one positioning roller on the two groups of second fork pieces abuts against the stacked silicon wafers, thereby ensuring the reliability of silicon wafer positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the structure of a silicon wafer separation device according to an embodiment of the present application;

[0038] Figure 2 This is a schematic diagram of the structure of a silicon wafer separation device according to an embodiment of the present application;

[0039] Figure 3 This is a schematic diagram of the structure explosion of the silicon wafer separation device according to an embodiment of the present application;

[0040] Figure 4 This is a schematic diagram of the structure of the "control component 200 and positioning component 300" in the silicon wafer separation device according to an embodiment of the present application;

[0041] Figure 5 It is a structural cross-sectional view of the "positioning component 300" part of the silicon wafer separation device according to an embodiment of the present application.

[0042] Reference numerals

[0043] Installation frame-100, frame-101, accommodating cavity-102, guide rail-103, guide hole-104, slide groove-110, control component-200, pressure rod-210, guide rod-220, connecting plate-230, positioning component-300, first fork-310, positioning roller-320, rotating shaft-330, second fork-340, air pressure purge component-400, jet body-410, nozzle-420, conveying pipeline-430, slider-440, elastic member-500 DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0045] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0046] The silicon wafer separation device provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0047] like Figures 1 to 5 As shown, an embodiment of the present application provides a silicon wafer separation device, including a mounting frame 100 , a silicon wafer positioning unit arranged on the mounting frame 100 , and an air pressure purge assembly 400 .

[0048] The mounting frame 100 is provided with a receiving cavity 102 for receiving stacked silicon wafers. The compressed air purge assembly 400 is linearly slidably disposed on the mounting frame 100 and is externally connected to an air blowing device.

[0049] Among them, the central axis of the stacked silicon wafers in the accommodating cavity 102 is parallel to the linear sliding direction of the air pressure purge assembly 400, the silicon wafer positioning unit is used to position the stacked silicon wafers in the accommodating cavity 102, the air pressure purge assembly 400 can blow air toward the stacked silicon wafers in the accommodating cavity 102, and the blowing direction of the air pressure purge assembly 400 is specifically the radial direction of the stacked silicon wafers in the accommodating cavity 102.

[0050] When in use, first take out the silicon wafer packaging box that needs to be separated, and then perform regular unpacking processing according to the unpacking requirements. After the unpacking is completed, the unpacked packaging box is directly placed in the accommodating cavity 102 of the installation frame 100, and the stacked silicon wafers in the accommodating cavity 102 are positioned by the silicon wafer positioning unit. Finally, the external blowing device is turned on, and the air pressure purge assembly 400 is used to blow air to the stacked silicon wafers. At the same time, the air pressure purge assembly 400 slides on the installation frame 100 along the central axis direction of the stacked silicon wafers, thereby realizing the separation between adjacent adhered silicon wafers.

[0051] In the embodiment of the present application, the above-mentioned silicon wafer separation device is adopted, and the air pressure purge assembly 400 is used to perform air pressure purge on the adhesion gaps of the stacked silicon wafers, thereby removing the vacuum between the silicon wafers. Compared with the traditional manual separation method, it can reduce human damage to the silicon wafers and effectively reduce the risk of breakage during silicon wafer separation. In addition, the silicon wafer separation efficiency is higher, the skill level requirements for the operator are lower, the operation is convenient, and the practicality is stronger.

[0052] In a preferred embodiment, Figures 1 to 3 As shown, the installation frame 100 includes a frame body 101 , and a receiving cavity 102 is disposed through the frame body 101 .

[0053] In a preferred embodiment, Figures 1 to 3 As shown, the installation frame 100 further includes a sliding groove 110 which is arranged between the inner wall of the accommodating cavity 102 on the side away from the ground and the corresponding side end surface of the frame body 101 .

[0054] The compressed air blowing assembly 400 includes a jet body 410, a nozzle 420 fixedly arranged on the jet body 410, and a delivery pipeline 430. The jet body 410 is linearly slidably arranged on the mounting frame 100 and is located on the side of the frame 101 away from the ground. The nozzle 420 penetrates the slide groove 110 and extends into the accommodating cavity 102. The delivery pipeline 430 is connected to an external blowing device.

[0055] The extending direction of the slide groove 110 is parallel to the central axis of the stacked silicon wafers in the accommodating cavity 102 .

[0056] In a preferred embodiment, the distance between the nozzle 420 and the outer circumferential surface of the stacked silicon wafers in the accommodating chamber 102 is set to 5 cm, and the air pressure output by the air pressure purge assembly 400 to the stacked silicon wafers in the accommodating chamber 102 is specifically set to 0.1 MPa.

[0057] It is understandable that the output air pressure range of the compressed air purge assembly 400 is not limited to the above one, as long as it can ensure that the airflow output by the compressed air purge assembly 400 can use its own tension to stretch the adhered silicon wafers without damaging the silicon wafers, it will not be elaborated here.

[0058] In a preferred embodiment, Figures 1 to 3 As shown, the installation frame 100 further includes a guide rail 103 fixedly disposed on an end surface of the frame body 101 away from the ground.

[0059] The compressed air purge assembly 400 further includes a slider 440 fixedly disposed on the jet body 410 .

[0060] The slider 440 is slidably disposed on the guide rail 103 .

[0061] It can be understood that the sliding direction of the slider 440 on the guide rail 103 is parallel to the central axis of the stacked silicon wafers in the accommodating cavity 102. By adjusting the position of the slider 440 on the guide rail 103, the air pressure purge assembly 400 can perform air pressure purge on silicon wafers adhered at different positions, thereby achieving the separation of the stacked silicon wafers.

[0062] It can be understood that the linear sliding structure of the compressed air purge component 400 on the mounting frame 100 is not limited to the above-mentioned one. For example, a sliding rod parallel to the linear sliding direction of the compressed air purge component 400 can be arranged on the frame 101, and the jet body 410 can be arranged to be slidably connected to the sliding rod. At this time, the compressed air purge component 400 can also realize compressed air purge of silicon wafers adhered at different positions, which will not be elaborated here.

[0063] In a preferred embodiment, Figures 1 to 3 As shown, the guide rail 103 is projected into a trapezoid on the reference plane, and the smaller end of the bottom is fixedly connected to the corresponding side end surface of the frame 101.

[0064] The reference plane is specifically a vertical plane in the extending direction of the guide rail 103 .

[0065] In the embodiment of the present application, the above-mentioned silicon wafer separation device is adopted. Through the cross-sectional setting of the guide rail 103, when the air pressure purge assembly 400 is slidably set on the guide rail 103, the guide rail 103 can limit the displacement of the air pressure purge assembly 400 in the non-sliding direction, thereby ensuring the sliding stability of the air pressure purge assembly 400.

[0066] In a preferred embodiment, in the linear sliding direction of the air pressure purge assembly 400 , the length of the slide slot 110 is greater than the length of the guide rail 103 .

[0067] It can be understood that since the length of the slide groove 110 is greater than the length of the guide rail 103, the compressed air purge assembly 400 can be directly inserted into the guide rail 103 at both ends of the guide rail 103. At the same time, the nozzle 420 is located in the slide groove 110 and will not interfere with the position of the frame 101, thereby realizing the detachable connection of the compressed air purge assembly 400 on the mounting frame 100, which is convenient for the overall layout, storage and transportation of the device.

[0068] In a preferred embodiment, Figures 1 to 5 As shown, the silicon wafer positioning unit includes a control component 200 that penetrates and elastically slides between the inner wall of the accommodating cavity 102 away from the ground and the corresponding side end surface of the frame 101, and also includes a positioning component 300 fixedly arranged on the control component 200 and located in the accommodating cavity 102.

[0069] In a preferred embodiment, Figures 1 to 3 As shown, the control assembly 200 includes at least one guide rod 220 penetrating through and slidably disposed between the inner wall of the accommodating cavity 102 away from the ground and the corresponding side end surface of the frame body 101 .

[0070] The guide rod 220 has a pressing rod 210 at one end away from the ground and a connecting plate 230 at the other end close to the ground. The positioning assembly 300 is fixedly arranged on the connecting plate 230 .

[0071] An elastic member 500 is sleeved on the guide rod 220 , one end of the elastic member 500 is fixedly connected to the end of the pressure rod 210 close to the ground, and the other end is fixedly connected to the end surface of the frame 101 away from the ground.

[0072] When the pressure rod 210 moves toward a side away from the installation frame 100 , the elastic member 500 has elastic potential energy to drive the pressure rod 210 to move toward a side close to the ground.

[0073] It can be understood that when the stacked silicon wafers are placed in the accommodating cavity 102, the operator can pull the pressure rod 210, thereby driving the positioning assembly 300 to move away from the ground. When the stacked silicon wafers are placed, the operator cancels the force on the pressure rod 210, and the pressure rod 210 is reset under the elastic force of the elastic member 500, thereby causing the positioning assembly 300 to move toward the side close to the ground to abut the silicon wafers, thereby achieving the positioning of the stacked silicon wafers.

[0074] In a preferred embodiment, Figures 1 to 3 As shown, at least one guide hole 104 is formed between the inner wall of the accommodating cavity 102 away from the ground and the corresponding side end surface of the frame body 101 .

[0075] The guide hole 104 and the guide rod 220 correspond in position, and the guide rod 220 is slidably disposed in the guide hole 104 at the corresponding position.

[0076] In a preferred embodiment, Figures 1 to 3 As shown, the positioning assembly 300 includes two first fork members 310 respectively hingedly disposed at two ends of the connecting plate 230 .

[0077] The first fork member 310 is in a “Y” shape, and two positioning rollers 320 parallel to each other are rotatably disposed between the two first fork members 310 . The two positioning rollers 320 are respectively located on the two bifurcated ends of the first fork member 310 .

[0078] In the embodiment of the present application, the above-mentioned silicon wafer separation device is adopted. Since the first fork member 310 can rotate relative to the connecting plate 230, when the positioning assembly 300 abuts against the stacked silicon wafers in the accommodating cavity 102 under the elastic force of the elastic member 500, the two positioning rollers 320 can automatically adjust their positions to abut against the outer cylindrical surface of the silicon wafer, thereby realizing the positioning of silicon wafers of different specifications, and at the same time, it can avoid the edge of the silicon wafer from being damaged during the separation process, thereby improving the stability of silicon wafer separation.

[0079] In a preferred embodiment, Figure 4 , Figure 5 As shown, the positioning assembly 300 includes two first fork members 310 respectively hingedly disposed at two ends of the connecting plate 230 .

[0080] The first fork member 310 is in a "Y" shape, and two parallel rotating shafts 330 are rotatably provided between the two first fork members 310. The two rotating shafts 330 are respectively located on the two branched ends of the first fork member 310, and two second fork members 340 located between the two first fork members 310 are fixedly provided at both ends of the rotating shaft 330.

[0081] The second fork member 340 is in a “Y” shape, and two positioning rollers 320 parallel to each other are rotatably arranged between two corresponding second fork members 340 . The two positioning rollers 320 are respectively located on two bifurcated ends of the second fork member 340 .

[0082] It should be noted that when the two forked ends of the first fork piece 310 are directly installed with the positioning rollers 320, if there is a position deviation between the silicon wafer and the first fork piece 310, it may cause only one positioning roller 320 on the first fork piece 310 to abut against the outer cylindrical surface of the silicon wafer, and a single positioning roller 320 abutting against the silicon wafer cannot achieve the limitation of the silicon wafer, resulting in collision damage to the edge of the silicon wafer when it is separated.

[0083] In the embodiment of the present application, the above-mentioned silicon wafer separation device is adopted. Since the first fork piece 310 can rotate relative to the connecting plate 230, and the second fork piece 340 can rotate relative to the first fork piece 310, when the positioning assembly 300 moves toward the side close to the stacked silicon wafers, the positioning rollers 320 on the two groups of second fork pieces 340 can respectively abut the outer cylindrical surfaces of the stacked silicon wafers. When there is a position deviation between the silicon wafer and the positioning assembly 300, it can be ensured that at least one positioning roller 320 on the two groups of second fork pieces 340 abuts against the stacked silicon wafers, thereby ensuring the reliability of silicon wafer positioning.

[0084] In a preferred embodiment, the first fork member 310 is elastically hingedly disposed on the connecting plate 230 , and / or the second fork member 340 is elastically hingedly disposed on the first fork member 310 .

[0085] In a preferred embodiment, the positioning roller 320 is covered with a buffer layer.

[0086] It is understandable that when the positioning roller 320 moves toward one side of the silicon wafer, it can abut against the outer cylindrical surface of the silicon wafer through the buffer layer, thereby reducing collision damage to the edge of the silicon wafer, further improving the reliability of silicon wafer separation, and ensuring the overall quality of silicon wafer processing.

[0087] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises one..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be noted that the scope of the method and device in the embodiment of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0088] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A silicon wafer separation device, characterized in that: include: An installation frame having a receiving cavity for receiving stacked silicon wafers; The silicon wafer positioning unit is arranged on the mounting frame and is used to position the stacked silicon wafers in the accommodating cavity: An air-compressed purge assembly is linearly slidably disposed on the mounting frame, is externally connected to an air blowing device and is capable of blowing air toward the stacked silicon wafers in the accommodating cavity; The central axis of the stacked silicon wafers in the accommodating cavity is parallel to the linear sliding direction of the air pressure purge assembly, and the blowing direction of the air pressure purge assembly is specifically the radial direction of the stacked silicon wafers in the accommodating cavity.

2. The silicon wafer separation device according to claim 1, characterized in that: The installation frame includes a frame body and a slide groove, the accommodating cavity is provided through the frame body, and the slide groove is provided through the inner wall of the accommodating cavity away from the ground and the corresponding side end surface of the frame body; The compressed air purge assembly includes a jet body, a nozzle fixedly arranged on the jet body, and a delivery pipeline. The jet body is linearly slidably arranged on the mounting frame and is located on the side of the frame away from the ground. The nozzle passes through the slide groove and extends into the accommodating cavity. The delivery pipeline is connected to an external blowing device. Wherein, the extending direction of the slide groove is parallel to the central axis of the stacked silicon wafers in the accommodating cavity.

3. The silicon wafer separation device according to claim 1 or 2, characterized in that: The distance between the nozzle of the air pressure purge assembly and the outer circumferential surface of the stacked silicon wafers in the accommodating chamber is set to 5 cm, and the air pressure output by the air pressure purge assembly to the stacked silicon wafers in the accommodating chamber is specifically set to 0.1 MPa.

4. The silicon wafer separation device according to claim 2, characterized in that: The installation frame also includes a guide rail fixedly arranged on the end surface of the frame body away from the ground; Wherein, the compressed air purge assembly also includes a sliding block fixedly arranged on the jet body and slidably connected to the slide rail.

5. The silicon wafer separation device according to claim 4, characterized in that: The guide rail is projected into a trapezoid on the reference plane, and the smaller end is fixedly connected to the frame; The reference plane is specifically a vertical plane in the extension direction of the guide rail.

6. The silicon wafer separation device according to claim 4 or 5, characterized in that: In the linear sliding direction of the air pressure purge assembly, the length of the slide groove is greater than the length of the guide rail.

7. The silicon wafer separation device according to claim 1 or 2, characterized in that: The silicon wafer positioning unit comprises: A control component penetrates and is elastically slidably disposed between an inner wall of the accommodating cavity away from the ground and a corresponding side end surface of the frame; The positioning component is fixedly arranged on the control component and is located in the accommodating cavity.

8. The silicon wafer separation device according to claim 7, characterized in that: The control assembly includes at least one guide rod penetrating and slidably disposed between the inner wall of the accommodating cavity away from the ground and the corresponding side end surface of the frame; The guide rod is provided with a pressure rod at one end away from the ground and located at the side of the mounting frame away from the ground, and a connecting plate located in the accommodating cavity is provided at the other end close to the ground, and the positioning assembly is fixedly arranged on the connecting plate; An elastic member is sleeved on the guide rod, one end of which is fixedly connected to the end of the pressure rod close to the ground, and the other end is fixedly connected to the end surface of the frame body away from the ground; When the pressure rod moves toward a side away from the installation frame, the elastic member has elastic potential energy to drive the pressure rod to move toward a side close to the ground.

9. The silicon wafer separation device according to claim 7, characterized in that: The positioning assembly comprises two first fork pieces respectively hingedly arranged at two ends of the connection plate; Wherein, the first fork piece is in a "Y" shape, and two positioning rollers parallel to each other are rotatably arranged between the two first fork pieces, and the two positioning rollers are respectively located on the two bifurcated ends of the first fork piece.

10. The silicon wafer separation device according to claim 7, characterized in that: The positioning assembly comprises two first fork pieces respectively hingedly arranged at two ends of the connection plate; The first fork piece is in a "Y" shape, and two parallel rotating shafts are rotatably arranged between the two first fork pieces, and the two rotating shafts are respectively located at the two bifurcated ends of the first fork piece, and two second fork pieces located between the two first fork pieces are respectively fixed at the two ends of the rotating shaft; Wherein, the second fork piece is in a "Y" shape, and two positioning rollers parallel to each other are rotatably arranged between the two second fork pieces at corresponding positions, and the two positioning rollers are respectively located on the two bifurcated ends of the second fork piece.

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