Evaporation mechanism and conductive film preparation method

Abstract

The invention discloses an evaporation mechanism and a conductive film preparation method, the evaporation mechanism comprises an evaporation main body and a second evaporation container, the evaporation main body comprises a heating body and a first evaporation container, an evaporation tank is arranged in the heating body, and the first evaporation container is arranged in the evaporation tank; the second evaporation container is installed on the evaporation body and located on one side of the first evaporation container. The problems that energy consumption generated by an evaporation source is large and the coating cost is high due to a separated evaporation mode of materials with different melting points are solved.

Description

Technical Field

[0001] The present application relates to the technical field of thin film processing, and in particular to an evaporation mechanism and a method for preparing a conductive film. Background Art

[0002] Conductive film is a polymer material with metal plated on the surface. It is widely used in lithium-ion batteries and is mainly used as a current collector in lithium-ion batteries. The coating on the conductive film can be obtained by thermal evaporation and / or magnetron sputtering. The thermal evaporation process is sensitive to the melting point of the material to be plated. For materials with higher melting points, the evaporation source needs to provide a higher thermal evaporation temperature to the material to be plated. For materials with lower melting points, the evaporation source provides a lower thermal evaporation temperature to the material to be plated to achieve thermal evaporation of the corresponding material to be plated. In the coating structure of some conductive films, the melting points of different coating structures or different materials in the same coating have certain differences. For example, the melting point of the copper layer is higher than the melting point of other functional film layers plated on the copper layer. When a conductive film has a coating structure formed by evaporation of materials to be plated with different melting points, due to the limitations of the current evaporation source structure, the materials to be plated with different melting points need to be heated and evaporated separately using corresponding heating sources (that is, the heating measures for the materials to be plated with different melting points are the same, and they are all directly heated by the heating electrodes). This method of separate evaporation of materials with different melting points results in a large energy consumption generated by the evaporation source and a high coating cost. Summary of the invention

[0003] The main purpose of the present application is to provide an evaporation mechanism and a conductive film preparation method to solve the problem mentioned in the background technology that the separate evaporation of materials with different melting points results in high energy consumption of the evaporation source and high coating cost.

[0004] According to one aspect of the present application, there is provided an evaporation mechanism, comprising:

[0005] An evaporation body, the evaporation body comprising a heating body and a first evaporation container, the heating body is provided with an evaporation tank, and the first evaporation container is provided in the evaporation tank;

[0006] A second evaporation container is installed on the evaporation body and is located at one side of the first evaporation container.

[0007] Furthermore, it also includes:

[0008] A temperature adjustment component is installed between the evaporation body and the second evaporation container, and is used to adjust the distance between the second evaporation container and the evaporation body and / or to separate the second evaporation container at least partially from the evaporation body.

[0009] Furthermore, the evaporation body further includes a heat preservation component, a first accommodation space is provided through the heat preservation component, the heating element is installed in the first accommodation space, and the temperature adjustment component includes:

[0010] A heat insulating component is arranged on the surface of the heat preservation component and is offset from the heat generating element, and the second evaporation container is arranged on the heat insulating component.

[0011] Furthermore, the thermal insulation component comprises:

[0012] A first thermal insulation gasket is laid on the surface of the thermal insulation component, and the second evaporation container is arranged on the surface of the first thermal insulation gasket away from the thermal insulation component.

[0013] Furthermore, the thermal insulation component also includes:

[0014] A third evaporation container is arranged on the surface of the heat preservation component, and the second evaporation container is placed in the third evaporation container.

[0015] Furthermore, the thermal insulation component also includes:

[0016] A second thermal insulation gasket, at least one of which is laid between the heat preservation component and the third evaporation container, and / or at least one of which is laid between the bottom of the third evaporation container and the second evaporation container.

[0017] Furthermore, the evaporation body further includes a heat preservation component, a first accommodation space is provided in the heat preservation component, the heating element is installed in the first accommodation space, and the temperature adjustment component further includes:

[0018] Driving parts;

[0019] A moving component is installed at one side of the evaporation body and is respectively connected to the driving component and the second evaporation container. The driving component drives the moving component to drive the second evaporation container to move back and forth in a direction close to or away from the evaporation body.

[0020] Furthermore, the moving part comprises:

[0021] A support base, the support base is installed at the bottom of the evaporation body;

[0022] A rotating shaft, the rotating shaft is mounted on the supporting seat and connected to the driving member, and the driving member drives the rotating shaft to rotate around its own axis;

[0023] Gears, the gears include at least two, and the at least two gears are respectively mounted on opposite ends of the rotating shaft;

[0024] Racks, the racks include at least two, the at least two racks are disposed on the support base and can move relative to the support base along their own length direction, and the at least two racks are meshed with at least two gears in a one-to-one correspondence;

[0025] A first connecting member is installed at an end of the rack away from the gear and connected to the second evaporation container.

[0026] Furthermore, the moving part also includes:

[0027] A mounting frame, the mounting frame being mounted on one side of the evaporation body;

[0028] A bidirectional screw rod, the bidirectional screw rod is mounted on the mounting frame and connected to the driving member, and the driving member drives the bidirectional screw rod to rotate around its own axis;

[0029] A moving block, the moving block includes at least two blocks, the at least two moving blocks are screwed to the bidirectional screw and can reciprocate towards or away from each other under the drive of the bidirectional screw;

[0030] Connecting rods, including at least two connecting rods, and the at least two connecting rods are rotatably connected to at least two moving blocks in a one-to-one correspondence;

[0031] A second connecting member, one end of at least two connecting rods away from the moving block is rotatably connected to the second connecting member respectively, and the second evaporation container is connected to the second connecting member.

[0032] Furthermore, it also includes:

[0033] A protective shell is provided with a fourth containing tank in the protective shell, and the evaporating body is located in the fourth containing tank, wherein a cooling channel is provided in a side wall of the protective shell close to the temperature adjustment component.

[0034] According to another aspect of the present application, a method for preparing a conductive film is provided. The method for preparing a conductive film is performed by the evaporation mechanism, and the method for preparing a conductive film comprises:

[0035] The substrate layer is transferred to the evaporation body of the evaporation mechanism, and the first metal target material in the first evaporation container is heated and evaporated by the heating element of the evaporation body, so that the metal particles evaporated from the first metal target material are deposited on the surface of the substrate layer to form a first metal layer. At the same time, the second evaporation container is heated by the heat radiation generated by the evaporation body, so that the metal particles evaporated from the second metal target material in the second evaporation container are deposited on the surface of the first metal layer to form a second metal layer, wherein the second metal target material includes a metal target material having a lower melting point than the first metal target material.

[0036] The evaporation mechanism provided by the present application includes an evaporation body and a second evaporation container. The heating body of the evaporation body is provided with an evaporation tank, and the first evaporation container is provided in the evaporation tank so that the heating body can heat the target material with a higher melting point placed in the first evaporation container. The second evaporation container is installed on the evaporation body and is located on one side of the first evaporation container. Thus, in the process of the heating body heating the first evaporation container, the residual heat (or the dissipated heat) generated by the evaporation body can be used to heat the target material with a lower melting point in the second evaporation container. In other words, the present application does not need to add a heating body for heating the second evaporation container. It only needs to install the second evaporation container on the evaporation body to heat the second evaporation container using the heat generated by the evaporation body, so as to achieve the heating and evaporation of the target material with a lower melting point, thereby reducing the energy consumption and coating cost generated by the evaporation mechanism. Moreover, since the evaporation mechanism can be used to sequentially plate at least two metal layers with different melting points on the surface of the substrate layer, the coating efficiency of the evaporation mechanism is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0038] Figure 1 A schematic diagram of the structure of an evaporation mechanism provided in one embodiment of the present invention;

[0039] Figure 2 A schematic diagram of the structure of the temperature adjustment component of the evaporation mechanism including a driving part and a moving part;

[0040] Figure 3 for Figure 2 Schematic diagram of the structure from another angle;

[0041] Figure 4 Another structural schematic diagram of the evaporation mechanism;

[0042] Figure 5 It is a structural schematic diagram of the evaporation mechanism when the moving parts include a bidirectional screw rod;

[0043] Figure 6 It is a schematic structural diagram of an evaporation mechanism including an electric cylinder.

[0044] The above drawings include the following reference numerals:

[0045] 10. Evaporation body; 11. Heating element; 111. Evaporation tank; 12. First evaporation container; 13. Insulation assembly; 131. Heat-conducting insulation body; 311. First accommodation space; 312. Second accommodation tank; 132. Insulation cotton; 20. Second evaporation container; 30. Temperature adjustment assembly; 31. Third evaporation container; 32. Second insulation pad; 33. Driving member; 34. Moving member; 41. Support seat; 42. Rotating shaft; 43. Gear; 44. Rack; 45. First connection Part; 451, first connecting block; 452, second connecting block; 46, mounting bracket; 47, bidirectional screw rod; 48, first moving block; 49, second moving block; 410, connecting rod; 411, second connecting part; 4111, third connecting block; 4112, avoidance groove; 4113, fourth connecting block; 412, electric cylinder; 413, guide rod; 35, temperature control part; 36, heat conducting part; 361, third accommodating groove; 362, avoidance port; 40, protective shell; 401, fourth accommodating groove. DETAILED DESCRIPTION

[0046] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0047] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0048] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0049] Since the existing evaporation source heats and evaporates the target materials with different melting points to plate the metal film layers with different melting points on the conductive film, the energy consumption is large and the coating cost is high. In order to solve the above problems, the first embodiment of the present invention provides an evaporation mechanism, see Figures 1 to 6 , the evaporation mechanism includes an evaporation body 10 and a second evaporation container 20. The evaporation body 10 includes a heating element 11 and a first evaporation container 12, the heating element 11 is provided with an evaporation tank 111, and the first evaporation container 12 is provided in the evaporation tank 111. The second evaporation container 20 is installed on the evaporation body 10 and is located on one side of the first evaporation container 12, so that the evaporation mechanism can use the heat generated by the evaporation body 10 to heat the second evaporation container 20. In this embodiment, the heat generated by the evaporation body 10 (i.e., the residual heat or dissipated heat generated by the evaporation body 10) includes not only the heat generated when the heating element 11 heats the first evaporation container 12, but also the heat generated when the first evaporation container 12 is heated and the heat generated by the metal particles evaporated from the first evaporation container 12.

[0050] Therefore, the evaporation mechanism does not need to add an additional heating element 11 for heating the second evaporation container 20, saving energy consumption generated by the evaporation mechanism. The heating element 11 in this embodiment is an electrode, so that the metal target in the first evaporation container 12 is heated by the electrode to achieve thermal evaporation of the metal target. The first evaporation container 12 and the second evaporation container 20 can both include a graphite crucible or a high-temperature resistant metal crucible, and the metal crucible can specifically include one of a tungsten crucible, a molybdenum crucible, a tantalum crucible, a zirconium crucible, and an alloy crucible of any two elements or more than two elements.

[0051] In some embodiments of the present invention, after the copper layer is plated on the substrate layer of the conductive film, a functional film layer with a melting point lower than that of the copper layer needs to be plated on the surface of the copper layer. For example, when the functional film layer includes an isolation layer with a melting point lower than that of the copper layer and used to prevent the copper layers on the two opposite sides of the conductive film from sticking to each other, the copper target material used for evaporating the copper layer can be placed in the first evaporation container 12, and the isolation target material (such as at least one of the zinc target material and the tin target material) used for evaporating the isolation layer can be placed in the second evaporation container 20. If effective deposition of the copper layer is to be achieved, the heating temperature of the copper target material in the first evaporation container 12 by the heating element 11 needs to be at least 1100°C or above. Therefore, the residual heat generated by the heating element 11 heating and evaporating the copper target material in the first evaporation container 12 can be used to heat and evaporate the isolation target material in the second evaporation container 20, so as to ensure that the isolation target material can be fully heated and evaporated, thereby reducing the energy consumption of the evaporation mechanism. For example, when the isolation target is a zinc target, since the melting point of zinc is relatively lower than that of copper (419.5°C), the temperature generated by the second evaporation container 20 in an environment of 1100°C or above is sufficient to achieve sufficient heating and evaporation of the zinc target. When the isolation target is a tin target, since the melting point of tin is relatively lower than that of copper (about 232°C), the residual heat generated by the heating element 11 is used to heat and evaporate the tin target in the second evaporation container 20, so that a tin layer can be plated on the surface of the copper layer, thereby reducing the energy consumption of the coating equipment.

[0052] It can be seen that the evaporation mechanism provided in this embodiment includes an evaporation body 10 and a second evaporation container 20. The heating element 11 of the evaporation body 10 is provided with an evaporation tank 111, and the first evaporation container 12 is provided in the evaporation tank 111, so that the heating element 11 can heat the target material with a higher melting point placed in the first evaporation container 12. The second evaporation container 20 is installed on the evaporation body 10 and is located on one side of the first evaporation container 12. Therefore, in the process of heating the first evaporation container 12 by the heating element 11, the residual heat (or the dissipated heat) generated by the evaporation body 10 can be used to heat the target material with a lower melting point in the second evaporation container 20. In other words, in this embodiment, there is no need to add a heating element 11 for heating the second evaporation container 20. It is only necessary to install the second evaporation container 20 on the evaporation body 10 to heat the second evaporation container 20 using the heat generated by the evaporation body 10, so as to achieve heating and evaporation of the target material with a lower melting point, thereby reducing the energy consumption and coating cost generated by the evaporation mechanism. Furthermore, since the evaporation mechanism can be used to sequentially plate at least two metal layers with different melting points on the surface of the substrate layer, the coating efficiency of the evaporation mechanism is improved.

[0053] Since the second evaporation container 20 can be placed with different low-melting-point metal targets, according to the different melting points of the metal targets, the heating temperature of some metal targets needs to be higher, while the temperature of some metal targets can be relatively lower. In this regard, in order to adjust the temperature generated by the second evaporation container 20 according to different metal targets, the evaporation mechanism in this embodiment also includes a temperature adjustment component 30. The temperature adjustment component 30 is installed between the evaporation body 10 and the second evaporation container 20, and the temperature adjustment component 30 is used to adjust the distance between the second evaporation container 20 and the evaporation body 10 and / or to separate the second evaporation container 20 from the evaporation body 10 at least partially.

[0054] When the temperature to be reached by the second evaporation container 20 is relatively high, the temperature adjustment component 30 can be used to adjust the distance between the second evaporation container 20 and the evaporation body 10 or even make the second evaporation container 20 directly contact the heating element 11, and / or the temperature adjustment component 30 can be used to increase the area of ​​the part of the second evaporation container 20 exposed to the heat radiation of the evaporation body 10, so as to increase the heat radiation generated by the evaporation body 10 received by the second evaporation container 20, thereby increasing the heating temperature generated by the second evaporation container 20. When the temperature to be reached by the second evaporation container 20 is relatively low, the temperature adjustment component 30 can be used to increase the distance between the second evaporation container 20 and the evaporation body 10 or even to isolate the second evaporation container 20 at least partially from the evaporation body 10, so as to reduce the heat radiation generated by the evaporation body 10 received by the second evaporation container 20, thereby reducing the heating temperature generated by the second evaporation container 20. The actual temperature adjustment mainly includes two aspects, namely, the heat insulation between the heat preservation component 13 and the second evaporation container 20 and the distance between the second evaporation container 20 and the heating element 11.

[0055] In order to reduce the heat loss of the evaporation body 10, the evaporation body 10 in this embodiment also includes a heat preservation component 13, and a first accommodating space 311 is provided in the heat preservation component 13. The heating element 11 is installed in the first accommodating space 311. Specifically, the heating element 11 is installed in the first accommodating space 311 of the heat preservation component 13. At this time, the first accommodating space 311 can be a through hole provided in the heat preservation component 13, and the total length of the heating element 11 along the axial direction of the through hole is greater than the hole depth of the through hole, so that the opposite ends of the heating element 11 along the axial direction of the first accommodating space 311 can be connected to the external power supply to achieve the purpose of current input and heating. On the other hand, when the heat preservation component 13 is a structure formed by splicing a plurality of heat preservation sheets, the first accommodating space 311 can be a groove provided in the middle area of ​​the heat preservation component 13 (which can be integrated with the heating element 11), and the end of the heat preservation component 13 is provided with an opening connected to the groove, so that the heating element 11 can be electrically connected to the external power supply through the corresponding opening. In summary, after ensuring that the heating element 11 is installed in the heat preservation component 13, an opening can be reserved on the heat preservation component 13 so that the heating element 11 can be connected to an external power source. This embodiment does not make a sole limitation on this. In this embodiment, the temperature adjustment component 30 includes a heat insulation component. The heat insulation component is arranged on the surface of the heat preservation component 13 offset from the heating element 11, and the second evaporation container 20 is arranged on the heat insulation component. In this embodiment, the second evaporation container 20 and the evaporation body 10 can be separated by the heat insulation component to adjust the temperature of the second evaporation container 20, and it can avoid the temperature generated by the second evaporation container 20 being too high to affect the effective evaporation of the low-melting-point metal target.

[0056] The heat insulation component in this embodiment may include a first heat insulation pad, which is laid on the surface of the heat preservation component 13, and the second evaporation container 20 is arranged on the surface of the first heat insulation pad away from the heat preservation component 13. That is to say, in this embodiment, the second evaporation container 20 can be separated from the evaporation body 10 by the first heat insulation pad, and because the second evaporation container 20 is located on the first heat insulation pad, when the temperature of the second evaporation container 20 needs to be lower, multiple first heat insulation pads can be placed between the bottom of the second evaporation container 20 and the evaporation body 10. When the temperature of the second evaporation container 20 needs to be higher, the number of first heat insulation pads placed between the bottom of the second evaporation container 20 and the evaporation body 10 can be reduced, so that the temperature increase operation of the second evaporation container 20 can be realized, and the energy consumption of the evaporation mechanism is reduced, and the operation is simple and convenient.

[0057] like Figure 1As shown, the heat insulation component in this embodiment further includes a third evaporation container 31, which is disposed on the surface of the heat preservation component 13. The volume of the third evaporation container 31 is greater than the volume of the second evaporation container 20, and the second evaporation container 20 is placed in the third evaporation container 31. Therefore, this embodiment can not only increase the distance between the second evaporation container 20 and the evaporation body 10 through the third evaporation container 31, but also separate the second evaporation container 20 from the evaporation body 10 except for the container opening, thereby achieving temperature adjustment of the second evaporation container 20.

[0058] The heat insulation component in this embodiment also includes a second heat insulation gasket 32. The second heat insulation gasket 32 ​​includes at least two pieces, at least one second heat insulation gasket 32 ​​is laid between the heat preservation component 13 and the third evaporation container 31, and / or, at least one second heat insulation gasket 32 ​​is laid between the bottom of the third evaporation container 31 and the second evaporation container 20. Therefore, in this embodiment, one or more second heat insulation gaskets 32 can be laid between the heat preservation component 13 and the third evaporation container 31 to further increase the distance between the second evaporation container 20 and the evaporation body 10, thereby reducing the temperature of the second evaporation container 20. When the temperature of the second evaporation container 20 needs to be lowered, one or more second heat insulation gaskets 32 can be laid between the second evaporation container 20 and the third evaporation container 31 to further increase the distance between the second evaporation container 20 and the evaporation body 10, thereby further reducing the temperature generated by the second evaporation container 20. On the basis of the above-mentioned arrangement, when the temperature of the second evaporation container 20 needs to be relatively high, the distance between the second evaporation container 20 and the evaporation body 10 can be reduced by reducing the number of the second thermal insulation gaskets 32, thereby reducing the thermal barrier between the second evaporation container 20 and the evaporation body 10, thereby increasing the temperature of the second evaporation container 20.

[0059] The first thermal insulation gasket and the second thermal insulation gasket 32 ​​in this embodiment can both include at least one high-temperature resistant ceramic sheet such as a boron nitride ceramic sheet, a silicon nitride ceramic sheet, an aluminum oxide ceramic sheet, a zirconium oxide ceramic sheet, etc., or can be a silicone resin thermal insulation gasket (which can achieve a temperature resistance of up to 800°C), and the thermal insulation gasket can have a porous structure. These thermal insulation gaskets have good high-temperature stability and high thermal conductivity, and are suitable for insulation and heat dissipation in high-temperature environments such as evaporation coating. Among them, the silicon nitride ceramic sheet has high thermal stability and can withstand high temperature and chemical erosion. When the silicon nitride ceramic sheet is arranged between the second evaporation container 20 and the evaporation body 10, the reliability and service life of the temperature regulating component 30 can be improved.

[0060] Of course, in this embodiment, the second evaporation container 20 can also be suspended above the evaporation body 10 by a support member, so as to adjust the temperature generated by the second evaporation container 20 by adjusting the distance between the second evaporation container 20 and the evaporation body 10. However, this method requires manual adjustment of the suspended height of the second evaporation container 20, which is inconvenient to operate, and the position of the second evaporation container 20 needs to be adjusted before the evaporation mechanism works or after cooling down.

[0061] To conveniently adjust the second evaporation container 20 and the evaporation body 10, as Figures 2 to 6 As shown, the temperature adjustment component 30 in this embodiment further includes a driving member 33 and a moving member 34. The moving member 34 is installed on one side of the evaporation body 10 and is connected to the driving member 33 and the second evaporation container 20 respectively. The driving member 33 drives the moving member 34 to drive the second evaporation container 20 to reciprocate in a direction close to or away from the evaporation body 10. Specifically, the moving member 34 can be driven by the driving member 33 along a first direction (such as Figure 2 The second evaporation container 20 is driven to move closer to or away from the evaporation body 10 by the moving component 34, so as to adjust the distance between the second evaporation container 20 and the evaporation body 10 along the first direction, thereby adjusting the amount of heat radiation received by the second evaporation container 20, and further adjusting the heating temperature reached by the second evaporation container 20 under the heat generated by the evaporation body 10. And / or, the moving component 34 in this embodiment can also move along the second direction (such as Figure 2 The second evaporation container 20 is driven to approach or move away from the evaporation body 10 in the direction indicated by the arrow Y shown in the figure, so as to adjust the temperature generated by the second evaporation container 20 by adjusting the spacing between the second evaporation container 20 and the evaporation body 10 along the first direction and / or the second direction. The adjustment method saves time and labor, does not require manual operation, and the operation time is not limited by the working time of the evaporation mechanism.

[0062] Therefore, in this embodiment, the driving member 33 drives the moving member 34 to adaptively adjust the distance between the second evaporation container 20 and the evaporation main body 10. The automatic adjustment of the distance between the second evaporation container 20 and the evaporation main body 10 can be achieved by simply starting the driving member 33. The operation is convenient, and the position of the second evaporation container 20 can be adjusted at any time according to the evaporation situation of the metal target material in the second evaporation container 20, ensuring that the second evaporation container 20 can effectively evaporate the metal target material, and improving the working efficiency of the evaporation mechanism.

[0063] Specifically, in this embodiment, when a heat insulating component is provided between the second evaporation container 20 and the heat preservation assembly 13, the heat insulating component in this embodiment may not be fixedly connected to the second evaporation container 20, that is, the second evaporation container 20 is movable relative to the heat insulating component. When the second evaporation container 20 is driven by the moving component 34 to a position far from the evaporation main body 10, the heat insulating component is still maintained on the evaporation main body 10 to block part of the heat radiation emitted by the evaporation main body 10, ensuring that the second evaporation container 20 receives less heat radiation after being away from the evaporation main body 10, so that the second evaporation container 20 can effectively evaporate the low melting point metal target after the temperature is effectively reduced.

[0064] This embodiment can also make the heat insulation component move with the second evaporation container 20, that is, directly and fixedly connect the heat insulation component to the second evaporation container 20. At this time, when the second evaporation container 20 is driven by the moving component 34 to be lifted to a higher space away from the heat preservation component 13 or the evaporation body 10 to achieve temperature adjustment, the heat insulation component (such as the first heat insulation gasket, the second heat insulation gasket 32, etc.) can also move with the second evaporation container 20 to a spatial position far away from the evaporation body 10, so that when the second evaporation container 20 is far away from the evaporation body 10, the second evaporation container 20 is directly insulated by the heat insulation component, so that the temperature of the second evaporation container 20 can reach a lower temperature faster, ensuring the effective evaporation of the low-melting-point metal target by the second evaporation container 20.

[0065] Therefore, the moving component 34 in this embodiment can adjust the distance between the first thermal insulation gasket, the second thermal insulation gasket 32 ​​and the heat preservation component 13, so as to cooperate with the change of the distance of the second evaporation container 20 to adjust the temperature in the second evaporation container 20 or the third evaporation container 31, so as to achieve evaporation of material with a lower temperature than that of the material to be evaporated in the first evaporation container 12.

[0066] The moving part 34 in this embodiment may include a transmission belt and at least two gears 43. For example, when the evaporation mechanism in this embodiment further includes a protective shell 40, a fourth accommodating groove 401 is provided in the protective shell 40, and the evaporation body 10 is located in the fourth accommodating groove 401. The at least two gears 43 may be rotatably connected to both sides of the height direction of the protective shell 40 through corresponding connecting shafts, and the transmission belt (or transmission chain) is sleeved on the at least two gears 43. The second evaporation container 20 is connected to the transmission belt, and the driving member (such as a motor) drives the gear 43 to rotate so that the transmission belt can drive the second evaporation container 20 to approach or move away from the evaporation body 10 in the vertical direction, so as to adjust the heating position of the second evaporation container 20.

[0067] like Figures 2 to 4As shown, the moving component 34 in this embodiment includes a support base 41, a rotating shaft 42, a gear 43, a rack 44 and a first connecting member 45. The support base 41 is installed at the bottom of the evaporation body 10. The rotating shaft 42 is installed on the support base 41 and connected to the driving member 33, and the driving member 33 drives the rotating shaft 42 to rotate around its own axis. The gear 43 includes at least two, and at least two gears 43 are respectively installed at opposite ends of the rotating shaft 42. The rack 44 includes at least two, and at least two racks 44 are arranged on the support base 41 and can move relative to the support base 41 along their own length direction. At least two racks 44 are meshed with at least two gears 43 in a one-to-one correspondence. The first connecting member 45 is installed at one end of the rack 44 away from the gear 43 and connected to the second evaporation container 20. When the driving member 33 drives the rotating shaft 42 to rotate, the gear 43 on the rotating shaft 42 drives the rack 44 to move relative to the supporting base 41 along its own length direction, and the first connecting member 45 drives the second evaporation container 20 to move along the length direction of the rack 44 to a position away from or close to the evaporation body 10. Therefore, in this embodiment, the driving member 33 drives the rotating shaft 42 to rotate, so that the rack 44 meshing with the gear 43 can drive the second evaporation container 20 to move relative to the evaporation body 10, so as to adjust the heating temperature of the second evaporation container 20, which is not only convenient to operate, but also has high adjustment efficiency.

[0068] In this embodiment, the rack 44 can be arranged obliquely in a direction away from the evaporation body 10 or can be arranged vertically in the first direction. When the rack 44 is arranged vertically, the moving direction of the rack 44 is the direction indicated by the arrow X. Thus, the second evaporation container 20 can be moved closer to or away from the evaporation body 10 in the first direction under the drive of the rack 44, which can ensure that the second evaporation container 20 can always be subjected to the heat radiation of the evaporation body 10 and adjust the temperature.

[0069] When the evaporation body 10 also includes a heat preservation component 13, the support seat 41 is installed at the bottom of the heat preservation component 13 to prevent the support seat 41 from directly contacting the heating element 11 and bringing higher requirements to the material selection of the moving part 34. The heat preservation component 13 can not only reduce the heat loss of the heating element 11, but also form a certain thermal barrier between the moving part 34 and the heating element 11 to improve the reliability and stability of the moving part 34 in a high-temperature working environment. Secondly, along the first direction, this embodiment makes the projected outer contour of the second evaporation container 20 located on the heat preservation component 13. When the temperature of the second evaporation container 20 needs to be higher, the second evaporation container 20 can be driven to the surface of the heat preservation component 13 by the moving part 34 to directly contact the heat preservation component 13, so as to ensure that the second evaporation container 20 can generate a higher heating temperature, and the second evaporation container 20 will not be too high due to direct contact with the heating element 11 or affect the evaporation effect of the first evaporation container 12.

[0070] The length of the second evaporation container 20 extends along the length direction of the rotating shaft 42. For example, when the second evaporation container 20 is a crucible, the crucible is a long trough structure. The long second evaporation container 20 is adapted to the width of the conductive film to be plated, so that the second evaporation container 20 can plate a metal film layer that meets the width requirement on the conductive film at one time. The first connecting member 45 in this embodiment includes a first connecting block 451 and a second connecting block 452. The first connecting block 451 includes at least two blocks, and at least two first connecting blocks 451 are fixedly connected to one end of at least two racks 44 away from the gear 43. The second connecting block 452 includes at least two blocks, and at least two second connecting blocks 452 are respectively installed at the opposite ends of the second evaporation container 20 along its own length direction and are detachably connected to the at least two first connecting blocks 451 in a one-to-one correspondence.

[0071] Thus, driven by the rack 44, the first connection block 451 can drive the second evaporation container 20 connected to the second connection block 452 to move in a direction close to or away from the evaporation body 10. Since the second connection block 452 is detachably connected to the first connection block 451, when the first evaporation container 12 needs to be replaced or removed, the second connection block 452 can be separated from the first connection block 451. Moreover, since the second connection blocks 452 are located at opposite ends of the length direction of the second evaporation container 20, the area of ​​the second evaporation container 20 receiving heat radiation can be larger, and the area of ​​the second evaporation container 20 contacting the moving part 34 can be smaller, thereby avoiding the moving part 34 from causing heat loss to the second evaporation container 20, and ensuring that the moving part 34 will not generate a high temperature and cause work failure.

[0072] Specifically, in this embodiment, a snap-fit ​​structure that is convenient for disassembly can be provided between the first connection block 451 and the second connection block 452. The snap-fit ​​structure includes a snap-fit ​​groove and a snap-fit ​​protrusion. The snap-fit ​​groove can be provided on at least one of the first connection block 451 and the second connection block 452. The snap-fit ​​protrusion is adapted to the snap-fit ​​groove and is provided on the other of the first connection block 451 and the second connection block 452. Therefore, in this embodiment, when it is necessary to connect the second evaporation container 20 with the moving part 34, it is only necessary to snap-fit ​​the snap-fit ​​groove and / or the snap-fit ​​protrusion on the second connection block 452 with the snap-fit ​​groove and / or the snap-fit ​​protrusion on the first connection block 451, so that the installation of the second evaporation container 20 can be realized, which is simple and convenient to operate and has high assembly efficiency.

[0073] See also Figure 5In another optional embodiment of the present invention, the moving component 34 in this embodiment also includes a mounting frame 46, a bidirectional screw rod 47, a moving block, a connecting rod 410 and a second connecting member 411. The mounting frame 46 is installed on one side of the evaporation body 10 (specifically, it can be one side of the insulation component 13). The bidirectional screw rod 47 is installed on the mounting frame 46 and connected to the driving member 33, and the driving member 33 drives the bidirectional screw rod 47 to rotate around its own axis. The moving block includes at least two blocks, at least two moving blocks are screwed on the bidirectional screw rod 47 and can reciprocate in the direction of approaching or moving away from each other under the drive of the bidirectional screw rod 47. The connecting rod 410 includes at least two, and at least two connecting rods 410 are rotatably connected to at least two moving blocks one by one. The ends of the at least two connecting rods 410 away from the moving blocks are rotatably connected to the second connecting member 411 respectively, and the second evaporation container 20 is connected to the second connecting member 411. If the moving block includes the first moving block 48 and the second moving block 49, and the driving member 33 includes a motor, during the process of the motor driving the bidirectional screw 47 to rotate in the forward direction, since the second connecting member 411 is rotatably connected to the connecting rod 410, if the first moving block 48 and the second moving block 49 move away from each other along the axial direction of the bidirectional screw 47, the second connecting member 411 will drive the second evaporation container 20 to move downward along the first direction to approach the evaporation body 10. If the first moving block 48 and the second moving block 49 move closer to each other along the axial direction of the bidirectional screw 47, the second connecting member 411 will drive the second evaporation container 20 to move upward along the first direction to move away from the evaporation body 10.

[0074] As can be seen from the above, in this embodiment, the second connection member 411 drives the second evaporation container 20 to move along the first direction by driving at least two moving blocks through the driving member 33, so as to adjust the distance between the second evaporation container 20 and the evaporation body 10. Therefore, when the temperature of the second evaporation container 20 needs to be higher, the second evaporation container 20 can be driven to move downward along the first direction to a position close to the evaporation body 10 or even in direct contact with the evaporation body 10. When the temperature of the second evaporation container 20 needs to be lowered, the second evaporation container 20 can be driven to move upward along the first direction to a position away from the evaporation body 10. The adjustment method is convenient and flexible. Only by starting the driving member 33 can the automatic adjustment of the distance between the second evaporation container 20 and the evaporation body 10 be achieved, and the operation is simple and convenient.

[0075] The second connecting member 411 in this embodiment includes a third connecting block 4111 and a fourth connecting block 4113. The third connecting block 4111 is rotatably connected to the connecting rod 410. The fourth connecting block 4113 includes at least two blocks. The at least two fourth connecting blocks 4113 are respectively arranged at opposite ends of the second evaporation container 20 along its own length direction. A avoidance groove 4112 is arranged on one side of the third connecting block 4111 close to the second evaporation container 20, so that the second evaporation container 20 is located in the avoidance groove 4112 and the fourth connecting block 4113 is respectively detachably connected to the third connecting block 4111. In this embodiment, a snap-fit ​​structure for easy disassembly can also be arranged between the third connecting block 4111 and the fourth connecting block 4113. The snap-fit ​​groove of the snap-fit ​​structure can be arranged on at least one of the third connecting block 4111 and the fourth connecting block 4113, and the snap-fit ​​protrusion is adapted to the snap-fit ​​groove and is arranged on the other of the third connecting block 4111 and the fourth connecting block 4113. Therefore, in this embodiment, when the second evaporation container 20 needs to be connected to the moving component 34, the second evaporation container 20 can be installed by simply engaging the engaging groove and / or the engaging protrusion on the fourth connecting block 4113 with the engaging groove and / or the engaging protrusion on the third connecting block 4111, thereby achieving simple and convenient operation and high assembly efficiency.

[0076] The moving part 34 is connected to the outer peripheral wall of the second evaporation container 20, and the projection of the second evaporation container 20 along the first direction is located on the evaporation body 10 (when the evaporation body 10 includes the heat preservation component 13, it is specifically located on the heat preservation component 13). In this embodiment, in order to achieve more accurate adjustment of the temperature of the second evaporation container 20, the temperature adjustment component 30 also includes a temperature control component 35, which is covered and arranged on the bottom surface of the second evaporation container 20 close to the heat preservation component 13 and can move with the second evaporation container 20, and the temperature control component 35 is used to heat or cool the second evaporation container 20.

[0077] Therefore, the present embodiment can make more precise active adjustment to the temperature of the second evaporation container 20 through the temperature control member 35 that can move with the second evaporation container 20. For example, when the second evaporation container 20 is already at a position far away from the evaporation body 10, but the temperature of the second evaporation container 20 is still high, in order to enable the second evaporation container 20 to achieve effective evaporation of the low-melting-point metal target, the present embodiment can cool down the second evaporation container 20 through the temperature control member 35. When the second evaporation container 20 is already at a position close to the evaporation body 10, but the temperature of the second evaporation container 20 is still low, in order to enable the second evaporation container 20 to achieve effective evaporation of the low-melting-point metal target, the present embodiment can actively heat the second evaporation container 20 through the temperature control member 35 to increase the temperature of the second evaporation container 20. Therefore, the present embodiment can compensate for the problem of inaccurate temperature adjustment caused by the limitation of the moving distance of the moving part 34 through the temperature control member 35. When the temperature control member 35 needs to be able to actively heat the second evaporation container 20, the temperature control member 35 can be a commonly used heater with active heating function. When the temperature control element 35 needs to cool down the second evaporation container 20 , a cooling channel can be provided in the temperature control element 35 , so that coolant is introduced into the cooling channel to remove the temperature of the second evaporation container 20 , thereby cooling down the second evaporation container 20 .

[0078] The evaporation mechanism in this embodiment also includes a protective shell 40, in which a fourth accommodating groove 401 is provided, and the evaporation body 10 is located in the fourth accommodating groove 401. Among them, a cooling channel is provided in the side wall of the protective shell 40 close to the temperature adjustment component 30. In this embodiment, cold water or cold air can be introduced into the cooling channel of the protective shell 40 to cool the temperature adjustment component 30 and improve the service life of the temperature adjustment component 30. In particular, when the temperature adjustment component 30 includes a driving member 33 and a moving part 34, the working reliability of the driving member 33 and the moving part 34 can be improved. In particular, in this embodiment, the driving member 33 can be arranged outside the protective shell 40 to prevent the driving member 33 from failing or even being damaged due to long-term operation at high temperature.

[0079] In addition, the temperature adjustment component 30 in this embodiment can also be an electric cylinder 412, a second connecting member 411 and a guide rod 413 fixedly installed on one side of the evaporation main body 10, and the second connecting member 411 is connected to the action end of the electric cylinder 412, so that the second connecting member 411 is driven by the electric cylinder 412 to move up and down in the first direction to make the second evaporation container 20 close to or away from the evaporation main body 10. At the same time, the guide rods 413 can be set at both opposite ends of the second connecting member 411, so that the second connecting member 411 can move relative to the guide rods 413 in the first direction. In the process of the second connecting member 411 being driven to move by the electric cylinder 412, the guide rods 413 can make the movement of the second connecting member 411 more stable.

[0080] Regardless of which structure the temperature adjustment component 30 in this embodiment is, the temperature of the second evaporation container 20 can be controlled to be less than or equal to 1000°C. The second evaporation container 20 can be effectively evaporated by the second evaporation container 20 without separately setting a heating element 11, which greatly reduces the energy consumption of the evaporation coating process of the evaporation mechanism and improves the evaporation efficiency of the evaporation mechanism. For example, in this embodiment, the temperature of the second evaporation container 20 can be adjusted to one of 1000°C, 900°C, 840°C, 825°C, 753°C, 720°C, 600°C, 560°C, 510°C, 500°C, 450°C, 430°C, 300°C, 290°C, 270°C, 240°C, 210°C, 190°C, 180°C, 140°C, 110°C, 100°C, etc. through the temperature adjustment component 30. Preferably, the second evaporation container 20 in this embodiment heats and evaporates the low-melting-point metal target material with a melting point lower than 600°C, so as to utilize the residual heat generated by the evaporation body 10 to efficiently evaporate the low-melting-point metal target material and reduce the energy consumption of the evaporation mechanism. In other words, in this embodiment, the temperature of the second evaporation container 20 is preferably controlled within a temperature range not higher than 600°C, such as 560°C, 510°C, 500°C, 450°C, 430°C, 300°C, 290°C, 270°C, 240°C, 210°C, 190°C, 180°C, 140°C, 110°C, 100°C, etc.

[0081] The second embodiment of the present invention provides a method for preparing a conductive film, which is performed by an evaporation mechanism. The structure of the evaporation mechanism is specifically described in the first embodiment of the present invention, and will not be described in detail in this embodiment. The method for preparing a conductive film includes:

[0082] The substrate layer is transferred to the evaporation main body 10 of the evaporation mechanism, and the first metal target material in the first evaporation container 12 is heated and evaporated by the heating element 11 of the evaporation main body 10, so that the metal particles evaporated from the first metal target material are deposited on the surface of the substrate layer to form a first metal layer. At the same time, the second evaporation container 20 is heated by the heat radiation generated by the evaporation main body 10, so that the metal particles evaporated from the second metal target material in the second evaporation container 20 are deposited on the surface of the first metal layer to form a second metal layer, wherein the second metal target material includes a metal target material with a melting point lower than that of the first metal target material. The heating element 11 includes an electrode, and both ends of the evaporation main body 10 in this embodiment can be extended as electrode chucks, and the electrode chucks connect the electrode to the circuit. After power is turned on, the heating element 11 is heated to increase the temperature, thereby increasing the temperature in the first evaporation container 12, so that the high melting point metal target material is heated, and the residual heat generated is used to heat and evaporate the metal target material with a lower melting point in the second evaporation container 20.

[0083] In this embodiment, the heat radiation generated by the evaporation body 10 includes not only the heat radiation generated when the heating element 11 heats the first evaporation container 12, but also the heat radiation generated when the first evaporation container 12 is heated and the heat radiation generated by the metal particles evaporated from the first evaporation container 12, etc. If the evaporation body 10 includes the heat preservation component 13, the heat radiation generated by the heat preservation component 13 is also included. When the temperature to be reached by the second evaporation container 20 is relatively low, the temperature adjustment component 30 can be used to increase the distance between the second evaporation container 20 and the evaporation body 10 or even to isolate the second evaporation container 20 from the evaporation body 10 at least partially, so as to reduce the heat radiation generated by the evaporation body 10 to the second evaporation container 20, thereby reducing the heating temperature generated by the second evaporation container 20.

[0084] Therefore, in this embodiment, the residual heat generated by the evaporation body 10 can be used to heat the target material with a lower melting point in the second evaporation container 20 during the process of the heating element 11 heating the first evaporation container 12. That is to say, in this embodiment, there is no need to add a heating element 11 for heating the second evaporation container 20. It is only necessary to install the second evaporation container 20 on the evaporation body 10 to heat the second evaporation container 20 using the heat generated by the evaporation body 10, so as to achieve heating and evaporation of the target material with a lower melting point, thereby reducing the energy consumption and coating cost generated by the evaporation mechanism. Moreover, since the evaporation mechanism can be used to sequentially plate at least two metal layers with different melting points on the surface of the substrate layer, the coating efficiency of the evaporation mechanism is improved.

[0085] The third embodiment of the present invention provides a conductive film, which is prepared by an evaporation mechanism. The structure of the evaporation mechanism is specifically referred to the content provided in the first embodiment of the present invention. Alternatively, the conductive film is prepared by a conductive film preparation method. The conductive film preparation method is specifically referred to the content provided in the second embodiment of the present invention. The conductive film in this embodiment includes a substrate layer, a first metal layer and a second metal layer. Along the thickness direction of the substrate layer, the substrate layer includes a first surface and a second surface. The first metal layer is arranged on at least one of the first surface and the second surface. The second metal layer is arranged on the surface of the first metal layer away from the substrate layer, wherein the second metal layer includes a film layer structure having a melting point lower than that of the first metal layer.

[0086] In this embodiment, during the process of heating the first evaporation container 12 by the heating element 11 of the evaporation mechanism, the metal target material with a higher melting point in the first evaporation container 12 can be deposited on the surface of the substrate layer to form a first metal layer. At the same time, during the process of transferring the substrate layer from the first evaporation container 12 to the second evaporation container 20, since the second evaporation container 20 can use the residual heat generated by the evaporation body 10 to heat the target material with a lower melting point, the metal particles heated by the second evaporation container 20 from the metal target material with a low melting point can be deposited on the surface of the first metal layer to form a second metal layer. In other words, in this embodiment, there is no need to add a heating element 11 for heating the second evaporation container 20. The second evaporation container 20 only needs to be installed on the evaporation body 10 to heat the second evaporation container 20 using the heat generated by the evaporation body 10, so as to achieve the deposition of the second metal layer on the surface of the first metal layer of the substrate layer, thereby reducing the energy consumption and coating cost generated by the evaporation mechanism and improving the production efficiency of the conductive film.

[0087] The fourth embodiment of the present invention further provides a pole piece, the pole piece includes a current collector, and the current collector includes a conductive film. The structure of the conductive film can be found in the content provided in the third embodiment of the present invention, and this embodiment will not be repeated here.

[0088] The fifth embodiment of the present invention further provides an energy storage device, which can be at least one of a blade battery, a cylindrical battery, etc., and includes a pole piece. The structure of the pole piece can refer to the content provided in the fourth embodiment of the present invention, and this embodiment will not be repeated here.

[0089] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0090] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0091] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An evaporation mechanism, characterized in that: include: An evaporation body (10), the evaporation body (10) comprising a heating element (11) and a first evaporation container (12), an evaporation tank (111) being arranged in the heating element (11), and the first evaporation container (12) being arranged in the evaporation tank (111); A second evaporation container (20), the second evaporation container (20) is installed on the evaporation body (10) and is located on one side of the first evaporation container (12).

2. The evaporation mechanism according to claim 1, characterized in that: Also includes: A temperature adjustment component (30) is installed between the evaporation body (10) and the second evaporation container (20), and the temperature adjustment component (30) is used to adjust the distance between the second evaporation container (20) and the evaporation body (10) and / or to separate the second evaporation container (20) at least partially from the evaporation body (10).

3. The evaporation mechanism according to claim 2, characterized in that: The evaporating body (10) further comprises a heat preservation component (13), a first accommodation space (311) is provided in the heat preservation component (13), the heating element (11) is installed in the first accommodation space (311), and the temperature adjustment component (30) comprises: A heat insulation component is provided on the surface of the heat preservation component (13) and is offset from the heating element (11); and the second evaporation container (20) is provided on the heat insulation component.

4. The evaporation mechanism according to claim 3, characterized in that: The thermal insulation component comprises: A first heat-insulating gasket is laid on a surface of the heat-insulating component (13), and the second evaporation container (20) is arranged on a surface of the first heat-insulating gasket that is away from the heat-insulating component (13).

5. The evaporation mechanism according to claim 3, characterized in that: The thermal insulation component also includes: A third evaporation container (31), wherein the third evaporation container (31) is arranged on the surface of the heat preservation component (13), and the second evaporation container (20) is placed in the third evaporation container (31).

6. The evaporation mechanism according to claim 5, characterized in that: The thermal insulation component also includes: A second thermal insulation gasket (32), at least one of the second thermal insulation gaskets (32) is laid between the heat preservation component (13) and the third evaporation container (31), and / or at least one of the second thermal insulation gaskets (32) is laid between the bottom of the third evaporation container (31) and the second evaporation container (20).

7. The evaporation mechanism according to any one of claims 2 to 6, characterized in that: The temperature adjustment component (30) further comprises: A driving member (33); A moving component (34) is installed on one side of the evaporation body (10) and is respectively connected to the driving component (33) and the second evaporation container (20); the driving component (33) drives the moving component (34) to drive the second evaporation container (20) to reciprocate in a direction approaching or moving away from the evaporation body (10).

8. The evaporation mechanism according to claim 7, characterized in that: The moving part (34) comprises: A support seat (41), the support seat (41) being installed at the bottom of the evaporation body (10); A rotating shaft (42), wherein the rotating shaft (42) is mounted on the supporting seat (41) and connected to the driving member (33), and the driving member (33) drives the rotating shaft (42) to rotate around its own axis; Gears (43), the gears (43) comprising at least two, and the at least two gears (43) are respectively mounted on opposite ends of the rotating shaft (42); Racks (44), the racks (44) comprising at least two, the at least two racks (44) being disposed through the support base (41) and being movable relative to the support base (41) along their own length direction, the at least two racks (44) being meshed with at least two gears (43) in a one-to-one correspondence; A first connecting member (45), the first connecting member (45) is installed at one end of the rack (44) away from the gear (43) and is connected to the second evaporation container (20).

9. The evaporation mechanism according to claim 7, characterized in that: The moving part (34) further comprises: A mounting frame (46), the mounting frame (46) being mounted on one side of the evaporation body (10); A bidirectional screw rod (47), the bidirectional screw rod (47) being mounted on the mounting frame (46) and connected to the driving member (33), the driving member (33) driving the bidirectional screw rod (47) to rotate around its own axis; Moving blocks, the moving blocks comprising at least two blocks, the at least two moving blocks being screwed onto the bidirectional screw rod (47) and being able to reciprocate towards or away from each other under the drive of the bidirectional screw rod (47); Connecting rods (410), the connecting rods (410) comprising at least two, the at least two connecting rods (410) being rotatably connected to at least two of the moving blocks in a one-to-one correspondence; A second connecting member (411), at least two ends of the connecting rods (410) away from the moving block are rotatably connected to the second connecting member (411), and the second evaporation container (20) is connected to the second connecting member (411).

10. The evaporation mechanism according to any one of claims 2 to 6 or 8 to 9, characterized in that: Also includes: A protective shell (40), wherein a fourth containing groove (401) is arranged in the protective shell (40), and the evaporating body (10) is located in the fourth containing groove (401), wherein a cooling channel is arranged in the side wall of the protective shell (40) close to the temperature regulating component (30).

11. A method for preparing a conductive film, characterized in that: The conductive film preparation method is performed by the evaporation mechanism according to any one of claims 1 to 10, and the conductive film preparation method comprises: The substrate layer is transferred to the evaporation body (10) of the evaporation mechanism, and a first metal target material in a first evaporation container (12) is heated and evaporated by a heating element (11) of the evaporation body (10), so that metal particles evaporated from the first metal target material are deposited on the surface of the substrate layer to form a first metal layer. At the same time, the second evaporation container (20) is heated by heat radiation generated by the evaporation body (10), so that metal particles evaporated from the second metal target material in the second evaporation container (20) are deposited on the surface of the first metal layer to form a second metal layer, wherein the second metal target material includes a metal target material having a lower melting point than the first metal target material.

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