Rapid ink supply device of printing machine

Abstract

The invention provides a rapid ink supply device for a printing machine. The rapid ink supply device integrates an ink box, a resistance wire heating system and a semiconductor refrigeration technology. Heating bubbles are generated in the ink box through heating of the resistance wire, and ink is pushed to be jetted to a printing medium in a tiny ink droplet mode. Meanwhile, by means of the negative pressure effect and meniscus tension after the heating bubbles are broken, rapid back suction and refilling of the ink are achieved. The semiconductor chilling plate adjusts the temperature of an ink outlet area through the Peltier effect, the ink temperature is reduced to enhance surface tension, and therefore the retraction speed of the negative pressure bubbles and the efficiency of refilling the ink outlet with the ink are increased. In addition, the hot end of the semiconductor chilling plate can promote ink to flow circularly, prevent precipitation, maintain the fluidity and uniformity of the ink and preheat the ink box, so that the problem of unsmooth ink supply in the initial stage of printing is solved. According to the device, efficient and stable ink droplet supply is achieved, and the printing quality and speed are remarkably improved.

Description

Technical Field

[0001] The invention relates to a fast ink supply device for a printing machine, belonging to the technical field of printing mechanisms, and realizing efficient and stable ink drop supply by ingeniously combining resistance wire heating and semiconductor refrigeration technology. Background Art

[0002] In the printing industry, as the requirements for printing speed and efficiency continue to increase, fast ink supply technology has become a key factor restricting the performance of printing machines. Although the traditional ink supply system has shown certain stability and reliability in various application scenarios, its ink supply speed often becomes a bottleneck when facing high-speed and continuous printing requirements, limiting the further improvement of printing efficiency.

[0003] In particular, in the inkjet technology based on the principle of thermal bubbles, although the method of generating bubbles by heating to drive the ink droplet ejection achieves relatively precise ink droplet control, the process of ink retraction and refilling after the formation and collapse of the heated bubbles becomes an important factor affecting the ink supply speed. In traditional technologies, this process often relies on the natural cooling of the ink and the recovery of the surface tension, resulting in a limited ink supply speed and unable to meet the demand for fast and continuous ink supply for high-speed printing.

[0004] Therefore, how to effectively speed up the shrinkage and refilling speed of ink after the heated bubble bursts becomes the key to improving the ink supply speed and printing efficiency of the printing press. Summary of the invention

[0005] The invention provides a fast ink supply device for a printing press, which realizes efficient and stable ink drop supply by ingeniously combining resistance wire heating and semiconductor refrigeration technology.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions: a fast ink supply device for a printing press, comprising an ink cartridge for storing ink, an ink filling port for filling ink into the ink cartridge, an ink filling valve at the ink filling port, a plurality of mounting grooves at the top of the inner wall of the ink cartridge, a resistance wire in each mounting groove, and ink outlet holes at the bottom of the ink cartridge at positions corresponding to the resistance wires; It also includes a semiconductor cooling sheet, which is attached to the bottom of the ink cartridge. The semiconductor cooling sheet is provided with a plurality of openings corresponding to the number, specifications and positions of the ink outlet holes, and the ink can drip out of the ink cartridge through the openings.

[0007] In some embodiments, a liquid level sensing mechanism is provided in the ink cartridge.

[0008] In some embodiments, the contact area between the ink cartridge and the semiconductor cooling sheet is formed by a thermally conductive silicone sheet.

[0009] In some embodiments, the heating rate of the resistance wire is 100° C. per microsecond.

[0010] In some embodiments, the ink outlet hole is in a trumpet-shaped structure that is larger at the top and smaller at the bottom.

[0011] In some embodiments, the semiconductor cooling chip is externally connected to a power supply device capable of switching the direction of current.

[0012] Compared with the prior art, the present invention has the following beneficial effects: The fast ink supply device for a printer provided by the present invention achieves multiple beneficial effects by cleverly combining resistance wire heating and semiconductor refrigeration technology. First, the resistance wire heating forms a heating bubble in the ink cartridge, which drives the ink to be accurately sprayed to the printing medium in the form of tiny ink droplets, thereby ensuring the clarity and accuracy of the printing. At the same time, the negative pressure effect and meniscus tension after the heating bubble bursts are utilized to achieve rapid reabsorption and refilling of the ink, thereby avoiding the problems of ink waste and ink supply interruption, and ensuring the stability of continuous ink supply. Secondly, the application of the semiconductor refrigeration sheet adjusts the temperature of the ink outlet area through the Peltier effect, reduces the ink temperature to enhance the surface tension, significantly improves the retraction speed of the negative pressure bubble and the efficiency of the ink refilling the ink outlet, and makes the ink supply process faster and more reliable. In addition, the hot end of the semiconductor refrigeration sheet can also promote the circulation of the ink in the ink cartridge, effectively prevent the ink from settling and sticking, maintain the fluidity and uniformity of the ink, and improve the printing quality and production efficiency. At the same time, the ink cartridge is preheated to solve the problem of poor ink supply in the initial stage of printing, and ensure that the printing operation can maintain a stable ink supply state from the beginning to the end. In summary, this device not only improves printing quality and speed, but also ensures the continuity and stability of printing jobs, greatly improving the overall performance of the printing press and user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a cross-sectional view of the present invention (when the resistance wire is not energized); Figure 2 is a cross-sectional view of the present invention (when the resistance wire is energized and heated bubbles are formed in the ink); Figure 3 is a cross-sectional view of the present invention (when the ink is heated and the bubbles are squeezed out of the ink cartridge); Figure 4 It is a cross-sectional view of the present invention (when the resistance wire is powered off, the heating bubbles disappear and the negative pressure bubbles are formed); Figure 5 It is a detailed structural diagram of the semiconductor refrigeration sheet of the present invention.

[0014] In the figure: 100, ink; 200, heating bubble; 300, negative pressure bubble; 1, ink cartridge; 2, ink filling port; 3, mounting slot; 4, resistance wire; 5, ink outlet hole; 6, semiconductor cooling plate; 7, opening. DETAILED DESCRIPTION

[0015] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0016] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0017] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0018] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] like Figure 1-5As shown, the present embodiment provides a fast ink supply device for a printing press, which comprises an ink cartridge 1 for storing ink 100, an ink replenishing port 2 for replenishing the ink 100 therein is provided on the ink cartridge 1, an ink replenishing valve is provided at the ink replenishing port 2, a plurality of mounting grooves 3 are provided on the top of the inner wall of the ink cartridge 1, a resistance wire 4 is provided in each mounting groove 3, the resistance wire 4 can generate heat after being energized, thereby forming heating bubbles 200 in the ink 100 around the resistance wire 4, and ink outlet holes 5 are provided through the bottom of the ink cartridge 1 at positions corresponding to each resistance wire 4, and the heating bubbles 200 expand toward the ink outlet holes 5 after being formed, thereby squeezing the ink 100 that was originally unable to flow out of the ink outlet holes 5 due to surface tension out of the ink cartridge 1, so that the ink 100 is dotted to the The heated bubble 200 drips outward to form a tiny ink droplet, which is ejected from the nozzle at a certain speed and direction under the pressure of the heated bubble 200 and falls on the printing medium. After expanding to a certain extent, the heated bubble 200 will gradually shrink and burst due to the cooling of the surrounding ink 100 and the effect of surface tension. In this process, the ink outlet hole 5 will form an upwardly concave negative pressure bubble 300 due to the vacancy formed by the completion of the dripping of the ink 100 and the negative pressure of the bursting of the heated bubble 200. At this time, the meniscus tension generated by the negative pressure bubble 300 will suck the ink 100 in the ink cartridge 1, shrink the negative pressure bubble 300, and make the ink 100 refill the ink outlet hole 5 to prepare for the next ink dripping. This cycle is repeated to achieve a continuous and stable supply of ink droplets.

[0020] The semiconductor cooling sheet 6 is also included. The semiconductor cooling sheet 6 is attached to the bottom of the ink cartridge 1. The semiconductor cooling sheet 6 is provided with a plurality of openings 7 corresponding to the number, specification and position of the ink outlet holes 5. The ink 100 can drip out of the ink cartridge 1 through the openings 7. The semiconductor cooling sheet 6 utilizes the Peltier effect. The Peltier effect refers to the cooling by the Peltier effect. When direct current passes through a thermocouple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, thereby achieving the purpose of cooling. Specifically, when current passes through a thermocouple pair composed of an N-type semiconductor and a P-type semiconductor, one end absorbs heat and becomes a cold end, while the other end releases heat and becomes a hot end. When the cold end is attached to the bottom of the ink cartridge 1, the temperature in the ink outlet hole 5 is reduced under the action of heat conduction, thereby increasing the surface tension of the ink 100 in the ink outlet hole 5. In this case, the retraction speed of the negative pressure bubble 300 can be significantly increased, thereby significantly increasing the speed at which the ink 100 refills the ink outlet hole 5. Specifically, the surface tension is a manifestation of the mutual attraction between the molecules on the surface of the ink 100, and it tends to shrink the surface of the ink 100 to the smallest area. When the negative pressure bubble 300 is formed, the surface of the ink 100 is stretched, and the surface tension stores potential energy. After the negative pressure bubble 300 expands to the maximum (that is, after the heated bubble 200 is completely ruptured), the surface tension will release This part of potential energy is released, causing the negative pressure bubble 300 to shrink. When the temperature of the ink 100 decreases and the surface tension increases, the interaction force between the surface molecules of the ink 100 is enhanced. This means that after the negative pressure bubble 300 is formed and the blowing stops, the potential energy stored in the surface tension is greater. Therefore, when the potential energy is released, the driving force for the shrinkage of the negative pressure bubble 300 is also greater, resulting in an accelerated shrinkage speed, thereby significantly improving the speed at which the ink 100 refills the ink outlet hole 5, thereby achieving subsequent faster ink supply. When the hot end is in contact with the bottom of the ink cartridge 1, the circulation of the ink 100 in the non-ink outlet area at the bottom of the ink cartridge 1 can be accelerated, and the thermal convection of the ink 100 can be promoted by increasing the local temperature, thereby effectively preventing the ink 100 from precipitating or becoming sticky due to long-term stillness in the ink cartridge 1, and maintaining the fluidity and uniformity of the ink 100. This heating effect can also preheat the ink cartridge 1 to a certain extent, reducing the problem of poor ink supply in the initial stage of printing due to the low temperature of the ink 100, and ensuring that the printing operation can maintain a stable ink 100 supply state from the beginning to the end.

[0021] In summary, the fast ink supply device for a printer provided by the present invention realizes efficient and stable ink droplet supply by cleverly combining the heating of the resistance wire 4 and the semiconductor refrigeration technology. The resistance wire 4 is heated to form a heating bubble 200 in the ink cartridge 1, which drives the ink 100 to be accurately sprayed to the printing medium in the form of tiny ink droplets. At the same time, the negative pressure effect and the meniscus tension after the heating bubble 200 burst are used to realize the rapid reabsorption and refilling of the ink 100, thereby ensuring the stability of continuous ink supply. The application of the semiconductor refrigeration sheet 6 adjusts the temperature of the ink outlet hole 5 area through the Peltier effect, reduces the temperature of the ink 100 to enhance the surface tension, significantly improves the retraction speed of the negative pressure bubble 300 and the efficiency of the ink 100 refilling the ink outlet hole 5, and makes the ink supply process faster. In addition, the hot end of the semiconductor refrigeration sheet 6 can also promote the circulation of the ink 100 in the ink cartridge 1, prevent the ink 100 from precipitating, maintain its fluidity and uniformity, and preheat the ink cartridge 1 at the same time, solving the problem of poor ink supply in the initial stage of printing. In summary, this device not only improves the printing quality and speed, but also ensures the continuity and stability of the printing job, greatly improving the overall performance of the printing press.

[0022] In some embodiments, a liquid level sensing mechanism is provided in the ink cartridge 1, and the liquid level sensing mechanism includes a float, a slide rail, a contact switch, and a controller electrically connected thereto. The float is designed to float up and down according to the height of the ink 100 liquid level in the ink cartridge 1, and its material is light and corrosion-resistant, ensuring that it can work stably in the ink 100; the slide rail is fixed to the inner wall of the ink cartridge 1, providing guidance for the up and down movement of the float, ensuring the stability of the float movement; the contact switch is set at a specific position of the slide rail, and when the float drops to a preset low liquid level with the liquid level, the contact switch will be triggered to send a low ink volume signal to the controller; after receiving the signal, the controller automatically starts the ink replenishment mechanism, and controls the valve at the ink replenishment port 2 to open, replenishing ink 100 into the ink cartridge 1, until the float rises to a preset high liquid level position, the contact switch is triggered again, and the controller closes the ink replenishment valve to stop replenishing ink. The introduction of the liquid level sensing mechanism realizes real-time monitoring and intelligent management of the amount of ink 100 in the ink cartridge 1. When the ink 100 is about to be exhausted, the system automatically replenishes the ink, thereby avoiding printing interruptions caused by insufficient ink 100 and improving the continuity and efficiency of the printing operation.

[0023] In some embodiments, the contact part between the ink cartridge 1 and the semiconductor cooling sheet 6 is composed of a thermally conductive silicone sheet. The thermally conductive silicone sheet has good thermal conductivity and a certain degree of flexibility, and can fit tightly between the bottom of the ink cartridge 1 and the semiconductor cooling sheet 6, effectively reducing the contact thermal resistance and ensuring that heat can be efficiently and evenly transferred. Specifically, first, the use of the thermally conductive silicone sheet significantly improves the heat conduction efficiency. Since the thermally conductive silicone sheet has excellent thermal conductivity, it can quickly transfer the cold or heat generated by the semiconductor cooling sheet 6 to the bottom of the ink cartridge 1, thereby achieving precise control of the temperature of the ink outlet 5 area. This efficient heat conduction helps to speed up the retraction speed of the negative pressure bubble 300, because the effect of lowering the temperature of the ink 100 to enhance the surface tension is more significant, thereby increasing the speed at which the ink 100 refills the ink outlet 5, making the ink supply process faster and more stable. Secondly, the flexibility of the thermally conductive silicone sheet ensures close contact with the bottom of the ink cartridge 1 and the semiconductor cooling sheet 6. Even when there are slight unevenness on the surface of the ink cartridge 1 or the semiconductor cooling sheet 6, the thermally conductive silicone sheet can fill these gaps through its elastic deformation, thereby avoiding the decrease in heat conduction efficiency caused by poor contact. This close contact ensures the continuity and uniformity of heat transfer, further improving the performance of the ink supply device. In addition, the thermally conductive silicone sheet also has good insulation performance and corrosion resistance. It can effectively isolate the electrical signal between the ink cartridge 1 and the semiconductor cooling sheet 6 to prevent safety hazards caused by electrical short circuits. At the same time, the corrosion resistance of the thermally conductive silicone sheet also ensures that it can maintain stable working performance in an environment where it is in long-term contact with the ink 100, extending the service life of the ink supply device.

[0024] In some embodiments, the heating rate of the resistance wire 4 is 100°C per microsecond, that is, Tc=100°C / us. First, the ultra-high heating rate enables the resistance wire 4 to generate enough heat almost instantly, which greatly shortens the time for the formation of the heating bubble 200. In a traditional ink supply device, due to the slow heating rate of the heating element, it often takes a long time to accumulate enough heat to form a stable heating bubble 200, which not only reduces the printing speed, but also may affect the ejection accuracy and consistency of the ink droplets. In the present invention, the resistance wire 4 is rapidly heated at a rate of 100°C per microsecond, and a strong thermal effect can be generated almost at the same time as the current passes, thereby quickly forming the heating bubble 200 in the ink 100, significantly improving the generation and ejection efficiency of the ink droplets. Secondly, the fast heating rate also helps to improve the ejection quality of the ink droplets. Since the formation of the heating bubble 200 is faster and more stable, the thermal force applied to the ink droplets during the ejection process is more uniform, which enables the shape, size and speed of the ink droplets to be better controlled. This high-precision ink drop control is essential for achieving high-quality printing results, especially in situations where fine patterns or text printing is required, ensuring the clarity and accuracy of the printed results.

[0025] In some embodiments, Figure 1-4 As shown, the ink outlet hole 5 is a trumpet-shaped structure with a large top and a small bottom. In the traditional straight-cylinder or other shaped ink outlet hole 5 design, in order to keep the ink 100 stable and leak-proof, it is often necessary to rely on a higher surface tension of the ink 100 to form sufficient blocking force. However, high surface tension may limit the fluidity of the ink 100, affect the smooth ejection of ink droplets, and even cause poor ink supply or reduced printing quality in some cases. In contrast, the trumpet-shaped ink outlet hole 5 structure in the present invention significantly reduces the dependence on the surface tension of the ink 100 through its unique shape design. Since the upper part of the ink outlet hole 5 is larger, even if the surface tension of the ink 100 is relatively low, the ink 100 can be kept stable under the action of gravity, and it is not easy to leak. At the same time, when the resistance wire 4 is heated to form a heated bubble 200, the ink 100 expands upward under the push of the bubble and flows out through the gradually narrowing lower part of the ink outlet hole 5. In this process, due to the special shape of the ink outlet hole 5, the extrusion and shear force on the ink 100 are more concentrated, so that even if the surface tension is small, the ink 100 can be effectively squeezed out and stable ink droplets can be formed. Therefore, the design of the trumpet-shaped ink outlet hole 5 not only improves the fluidity and jetting stability of the ink 100, but also reduces the requirement for the surface tension of the ink 100. This means that under the same printing conditions, the present invention can use ink 100 with lower surface tension, thereby broadening the selection range of the ink 100 and improving the flexibility and adaptability of printing. At the same time, since the dependence on surface tension is reduced, the fluctuation of printing quality caused by changes in the properties of the ink 100 (such as temperature, composition, etc.) is also reduced, further improving the stability and reliability of printing.

[0026] In some embodiments, the semiconductor refrigeration chip 6 is externally connected to a power supply device capable of switching the direction of the current. This design allows the position of the cold end and the hot end of the semiconductor refrigeration chip 6 to be swapped according to actual needs, thereby further improving the performance and flexibility of the ink supply device. First, by switching the direction of the current, the power supply device can change the position of the cold end and the hot end on the semiconductor refrigeration chip 6. In the standard ink supply process, the cold end is usually attached to the bottom of the ink cartridge 1 to reduce the temperature of the ink outlet hole 5 area, thereby enhancing the surface tension of the ink 100, increasing the retraction speed of the negative pressure bubble 300 and the efficiency of the ink 100 to refill the ink outlet hole 5. However, in certain specific circumstances, such as when the temperature of the ink 100 in the ink cartridge 1 is too low, resulting in poor ink supply, or when it is necessary to accelerate the circulation of the ink 100 in the ink cartridge 1 to prevent precipitation, the original hot end can be changed to a cold end, and the cold end can be changed to a hot end by switching the direction of the current. In this way, the hot end will fit with the bottom of the ink cartridge 1, and the thermal convection of the ink 100 will be promoted by increasing the local temperature, maintaining the fluidity and uniformity of the ink 100, and preheating the ink cartridge 1 at the same time, solving the ink supply problem caused by the low temperature of the ink 100. Secondly, the exchange of the positions of the cold end and the hot end provides higher flexibility and adaptability for the ink supply device. Under different printing tasks and environmental conditions, the ink supply effect can be optimized by adjusting the working state of the semiconductor cooling plate 6. For example, when printing high-quality images or when precise control of ink droplets is required, the cold end can be preferentially ensured to fit with the bottom of the ink cartridge 1 to enhance the surface tension of the ink 100; when a large amount of printing is performed or the ink cartridge 1 needs to be preheated quickly, the current direction can be switched to make the hot end fit with the bottom of the ink cartridge 1 to improve the fluidity of the ink 100 and the continuity of the ink supply.

[0027] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A fast ink supply device for a printing press, characterized in that: The ink cartridge (1) comprises an ink cartridge (1) for storing ink (100), the ink cartridge (1) being provided with an ink replenishing port (2) for replenishing the ink (100) therein, the ink replenishing port (2) being provided with an ink replenishing valve, a plurality of mounting grooves (3) being provided at the top of the inner wall of the ink cartridge (1), a resistance wire (4) being provided in each mounting groove (3), and ink outlet holes (5) being provided through the bottom of the ink cartridge (1) at positions corresponding to each resistance wire (4); It also includes a semiconductor cooling sheet (6), which is attached to the bottom of the ink cartridge (1), and has a plurality of openings (7) extending through the semiconductor cooling sheet (6) corresponding to the number, specifications and positions of the ink outlet holes (5), so that the ink (100) can drip out of the ink cartridge (1) through the openings (7).

2. A fast ink supply device for a printing press according to claim 1, characterized in that: A liquid level sensing mechanism is provided inside the ink cartridge (1).

3. A fast ink supply device for a printing press according to claim 1, characterized in that: The contact portion between the ink cartridge (1) and the semiconductor cooling sheet (6) is formed by a heat-conducting silicone sheet.

4. A fast ink supply device for a printing press according to claim 1, characterized in that: The heating rate of the resistance wire (4) is 100°C per microsecond.

5. The rapid ink supply device for a printing press according to claim 1, characterized in that: The ink outlet hole (5) is in a trumpet-shaped structure with a larger top and a smaller bottom.

6. A fast ink supply device for a printing press according to claim 1, characterized in that: The semiconductor cooling sheet (6) is externally connected to a power supply device capable of switching the direction of current.

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