Jet flow and micro-channel mixed structure heat dissipation device packaged by using liquid metal

Abstract

The invention discloses a jet flow and microchannel mixed structure heat dissipation device packaged by liquid metal, which comprises a heat dissipation plate with a jet flow and microchannel mixed structure, and is characterized in that a sealing ring is arranged on one side, close to a chip to be cooled, of the heat dissipation plate; a pressing plate used for installing and fixing the heat dissipation plate to a circuit board where the heat dissipation chip is installed is arranged on the side, away from the heat dissipation chip, of the heat dissipation plate, the sealing ring is arranged between a substrate of the heat dissipation chip and the heat dissipation plate in a clamped mode so that a sealing cavity can be formed in the sealing ring, and the sealing cavity is filled with liquid metal. A chip wafer of a chip to be cooled is located in the sealing ring, the interior of the cooling plate is divided into two layers of flow channels, the flow channels are communicated through the jet flow nozzle, and cooling liquid in the cooling plate flows out from outlets in the two sides of the micro-channel after entering the micro-channel from the jet flow nozzle and flows out after being converged to the outlets. The invention aims to optimize the heat-conducting heat resistance and the convection heat resistance so as to enhance the heat dissipation of the chip and solve the problem that the heat dissipation performance of the existing chip heat dissipation device is insufficient.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a heat dissipation device with a jet and microchannel hybrid structure using liquid metal packaging. Background Art

[0002] With the increasing power consumption of chips such as processors and accelerators, chip heat dissipation has become a bottleneck for improving chip performance. If the chip temperature cannot be effectively controlled under high-power conditions, the chip performance will decline, the chip power consumption will further increase, and in severe cases, the chip will be directly burned. In the field of high-power chip heat dissipation, liquid cooling has begun to gradually replace traditional air cooling. However, as the demand for chip performance continues to increase, chip power consumption is still increasing. Liquid cooling technology is also being continuously optimized and upgraded to meet the heat dissipation needs of chips with higher power consumption. During the transmission process of chip heat, there are mainly two parts of thermal resistance, one is the thermal conductivity resistance on the solid side, and the other is the convection resistance on the fluid side. By optimizing the two parts of thermal resistance, enhanced chip heat dissipation can be achieved. However, how to optimize the two parts of thermal resistance, thermal conductivity resistance and convection resistance, to enhance chip heat dissipation is still a key technical problem that needs to be solved urgently. Summary of the invention

[0003] Technical problem to be solved by the present invention: In view of the above-mentioned problems of the prior art, a heat dissipation device with a jet and microchannel hybrid structure encapsulated by liquid metal is provided. The present invention aims to optimize the thermal resistance of the heat dissipation chip, namely the thermal conductivity thermal resistance and the convection thermal resistance, to enhance the heat dissipation of the chip and solve the problem of insufficient heat dissipation performance of the existing chip heat dissipation device.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: 10. The heat dissipation device as claimed in claim 9, wherein the bridge has two parts: one is to connect the heat dissipation plate and the other is to connect the heat dissipation plate to the heat dissipation plate, and the other is to connect the heat dissipation plate to the heat dissipation plate.

[0005] Optionally, the jet nozzle is in the shape of an elongated strip, a circle or a rectangle.

[0006] Optionally, the double-layer flow channel in the horizontal position includes an inlet side flow channel and an outlet side flow channel, the inlet side flow channel is connected to the liquid supply interface, the outlet side flow channel is connected to the liquid return interface, at least one end of the multiple microchannels is connected to the outlet side flow channel, the multiple microchannels are arranged in an array and a jet nozzle is provided at the bottom of each microchannel, and the inlet side flow channel is located below the jet nozzles of the multiple microchannels so that the liquid metal is depressurized after passing through the jet nozzle and enters the microchannel.

[0007] Optionally, the microchannel is a rectangular microchannel, a circular microchannel or a trapezoidal microchannel.

[0008] Optionally, the plurality of microchannels are arranged in an array on the same straight line.

[0009] Optionally, the axes of the liquid supply interface and the liquid return interface are on the same plane.

[0010] Optionally, the liquid metal filled in the sealed cavity accounts for 80% of the internal volume of the sealed cavity.

[0011] Optionally, a conformal coating is sprayed on the substrate, the heat sink is made of copper and is plated with a nickel layer, and the sealing ring is made of fluorocarbon rubber and is compressed by a pressing plate at a rate of 20% to 25%.

[0012] Optionally, the pressing plate is provided with a plurality of mounting bolts or positioning mounting holes for fixing the heat sink to the circuit board on which the heat sink chip is mounted.

[0013] In addition, the present invention also provides a high-performance computer, including a power supply and a mainboard, on which the mainboard is provided with the jet and microchannel hybrid structure heat dissipation device encapsulated by liquid metal.

[0014] Compared with the prior art, the present invention mainly has the following advantages: the present invention proposes a heat dissipation scheme for optimizing both the conductive thermal resistance and the convective thermal resistance of the heat dissipated chip, and proposes a scheme of sealing liquid metal to reduce thermal resistance on the solid side. Compared with traditional thermal conductive adhesives, its thermal conductivity can be increased by dozens of times, and it has good fluidity, which can optimize the conductive thermal resistance on the solid side; on the fluid side, a jet and microchannel hybrid structure is adopted, and it is integrated with the chip housing to reduce the convective thermal resistance on the fluid side. At the same time, the jet nozzle, the liquid metal interface and the chip wafer are aligned to minimize the thermal resistance of the heat transfer path by heat conduction and convection. At the same time, appropriate process parameters are used to ensure that the two can dissipate heat stably for a long time, thereby optimizing the conductive thermal resistance and the convective thermal resistance to enhance chip heat dissipation, and can maximize the potential of liquid cooling and improve the thermal design power consumption of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional exploded structure of the device according to an embodiment of the present invention.

[0016] Figure 2 Schematic diagram of the cross-sectional structure of the heat dissipation plate in the embodiment of the present invention.

[0017] Figure 3 It is a schematic diagram of a local enlarged structure of a microchannel array in an embodiment of the present invention.

[0018] Legend: 1. Heat sink; 11. Liquid supply interface; 12. Liquid return interface; 13. Microchannel; 14. Jet nozzle; 15. Inlet side flow channel; 16. Outlet side flow channel; 2. Chip to be cooled; 21. Substrate; 22. Chip wafer; 3. Sealing ring; 4. Press plate. DETAILED DESCRIPTION

[0019] In order to solve the material compatibility problems during liquid metal packaging and the problems of easy flow and conductivity of liquid metal, and at the same time solve the problems of jet and microchannel hybrid structure and chip integration design, the present invention realizes a jet and microchannel hybrid structure heat dissipation device using liquid metal packaging. The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0020] like Figure 1As shown, the heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation in this embodiment includes a heat sink 1 with a liquid supply interface 11, a liquid return interface 12 and a jet and microchannel hybrid structure. A sealing ring 3 is provided on the side of the heat sink 1 close to the heat dissipated chip 2, and a pressing plate 4 for fixing the heat sink 1 to the circuit board on which the heat dissipated chip 2 is installed is also provided on the side of the heat sink 1 away from the heat dissipated chip 2. The sealing ring 3 is clamped and arranged between the substrate 21 of the heat dissipated chip 2 and the heat sink 1 so that a sealed cavity is formed inside the sealing ring 3, and the sealed cavity is filled with liquid metal. The chip wafer 22 of the heat dissipated chip 2 is located inside the sealing ring 3. A double-layer flow channel in a horizontal position is provided inside the heat sink 1, wherein one layer of the flow channel is connected to the liquid supply interface 11, and the other layer of the flow channel is connected to the liquid return interface 12. The jet and microchannel hybrid structure includes a jet nozzle 14 provided between the double-layer flow channels for changing the direction of the fluid through multiple microchannels 13 in the vertical direction by 90° to form a jet effect, and the arrangement direction of the jet nozzle 14 is arranged perpendicular to the double-layer flow channel. The sealing ring 3 is clamped and arranged between the substrate 21 of the heat dissipated chip 2 and the heat dissipation plate 1 so that a sealed cavity is formed inside the sealing ring 3. The sealed cavity is filled with liquid metal. The liquid metal fully fills the gap in the sealed cavity to ensure the conduction efficiency. The chip wafer 22 of the heat dissipated chip 2 is located inside the sealing ring 3. The heat dissipation plate 1 fits with the substrate 21 in appearance and has a jet and microchannel mixed structure integrated inside. The heat dissipation plate 1 fits with the chip wafer 22 (heat source) through liquid metal. The sealing ring 3 is designed around the chip wafer 22 to prevent the liquid metal from leaking out. The design of the sealing ring 3 should be closely related to the amount of liquid metal used to prevent overflow or insufficient filling.

[0021] As an optional implementation, in this embodiment, the heat sink 1 is bonded and packaged with the substrate 21 of the heat dissipated chip 2 by means of sealant and fixed by a pressing plate 4 to prevent the heat sink 1 from falling off and enhance the heat exchange effect.

[0022] As an optional implementation, Figure 1 As shown, in this embodiment, the substrate 21 of the heat dissipated chip 2 is sprayed with a three-proof paint layer to prevent the devices on the substrate 21 from short-circuiting due to liquid metal.

[0023] In this embodiment, the pressing plate 4 is used to press the heat sink 1 and the chip wafer 22 of the heat dissipation chip 2. The pressing plate 4 is provided with a plurality of mounting bolts or positioning mounting holes for fixing the heat sink 1 to the circuit board on which the heat dissipation chip 2 is mounted. Figure 1 As shown, in this embodiment, the pressing plate 4 is provided with four positioning and mounting holes, which can be used to mount and fix the heat sink 1 to the circuit board on which the heat dissipation chip 2 is mounted so as to press the heat sink 1 and the chip wafer 22 of the heat dissipation chip 2. Figure 1It can be seen that in this embodiment, avoidance grooves are provided on both sides of the pressing plate 4 to facilitate the installation and removal of the liquid supply interface 11 and the liquid return interface 12.

[0024] like Figure 1 As shown, in this embodiment, a liquid supply interface 11 and a liquid return interface 12 are provided on the heat sink 1. The liquid supply interface 11 and the liquid return interface 12 are respectively connected with the jet and microchannel mixing structure inside the heat sink 1 to form a liquid cooling coolant channel. The liquid supply interface 11 is used for the liquid cooling coolant to flow in, and the liquid return interface 12 is used for the liquid cooling coolant to flow out. The liquid supply interface 11 and the liquid return interface 12 are respectively connected with the jet and microchannel mixing structure inside the heat sink 1 to form a liquid cooling coolant channel, so that the circulation of the liquid cooling coolant can be realized, so as to maximize the potential of liquid cooling and improve the thermal design power consumption of the chip. Among them, the liquid cooling coolant can be a fluid with good heat dissipation characteristics such as water, fluorinated liquid, water ethylene glycol solution, mineral oil or liquid metal as needed.

[0025] like Figure 2 and Figure 3 As shown, the double-layer flow channel in the horizontal position in this embodiment includes an inlet side flow channel 15 and an outlet side flow channel 16. The inlet side flow channel 15 is connected to the liquid supply interface 11, and the outlet side flow channel 16 is connected to the liquid return interface 12. At least one end of the multiple microchannels 13 is connected to the outlet side flow channel 16. The multiple microchannels 13 are arranged in an array and a jet nozzle 14 is provided at the bottom of each microchannel 13. The inlet side flow channel 15 is located at the lower part of the jet nozzle 14 of the multiple microchannels 13 so that the liquid metal is depressurized after passing through the jet nozzle 14 and enters the microchannel 13. The jet nozzle 14 can be a long strip, circular, rectangular or special-shaped nozzle, and the microchannel 13 can be a rectangular microchannel, a circular microchannel or a trapezoidal microchannel. The changes in layout or shape cannot be listed one by one and can be selected according to needs. As an optional embodiment, Figure 1 As shown, in this embodiment, the jet nozzle 14 is a long strip, that is, a slit nozzle, placed in the middle of the microchannel to ensure uniform flow distribution on both sides of the nozzle; in addition, the microchannel 13 in this embodiment is a rectangular microchannel. In addition, for the chip design of multiple chips (Chiplet), if there are multiple heat-generating chip chips 22 in the heat dissipation chip 2, the heat dissipation design can be enhanced through the differentiated design of the jet nozzle 14 and the microchannel 13. The jet and microchannel hybrid structure includes multiple microchannels to realize a multi-outlet design, which can reduce the flow rate of each outlet, reduce the pressure drop, and help reduce the system drive pump work.

[0026] See also Figure 2 and Figure 3In this embodiment, the inlet side flow channel 15 and the outlet side flow channel 16 are arranged in the horizontal direction, and the microchannel 13 of the jet and microchannel mixed structure is arranged in the vertical direction, so that the heat flow and the fluid velocity direction are closer to 180 degrees, with better heat dissipation effect. At the same time, the horizontal entry solution can reduce the height space occupied by the heat dissipation structure, which is beneficial to the server design. Figure 2 In this embodiment, the plurality of microchannels arranged in an array are arranged on the same straight line along the flow direction of the liquid-cooling coolant in the inlet side flow channel 15 .

[0027] As an optional implementation, the heat sink 1 in this embodiment is made of copper and is plated with a nickel layer. The liquid supply interface 11 and the liquid return interface 12 can be made of copper or stainless steel.

[0028] The working principle of the jet and microchannel hybrid structure heat dissipation device using liquid metal encapsulation in this embodiment is as follows: the liquid cooling liquid flows in from the liquid supply interface 11, passes through the inlet side flow channel 15, reaches the jet nozzle 14 of the jet and jet and microchannel hybrid structure in the jet and microchannel hybrid structure, and then is sprayed into the microchannel through the jet nozzle 14, and then flows out from both ends of the microchannel, enters the outlet side flow channel 16, and finally flows out into the return liquid interface 12. The heat generated by the chip wafer 22 is efficiently conducted to the heat sink 1 through the liquid metal, and is finally conducted out by the liquid cooling liquid circulation inside it. In summary, this embodiment uses a jet and microchannel hybrid structure heat dissipation device encapsulated by liquid metal to propose an optimized heat dissipation solution for both thermal conductivity and convection. On the solid side, it is proposed to adopt a liquid metal packaging process. Compared with traditional thermal conductive adhesives, its thermal conductivity can be increased by dozens of times, and at the same time it has good fluidity, which can optimize the thermal conductivity on the solid side. On the fluid side, a jet and microchannel hybrid structure is adopted, and it is integrated with the chip housing to reduce the convection thermal resistance on the fluid side. Through the two structures, the heat dissipation structure on the fluid side and the above-mentioned structure of the substrate and wafer inside the chip can ensure long-term and stable heat dissipation of the two, and the thermal conductivity and convection thermal resistance are optimized to enhance the heat dissipation of the chip, which can maximize the potential of liquid cooling and improve the thermal design power consumption of the chip. Compared with the existing liquid-cooled heat dissipation devices, the heat dissipation device of the jet and microchannel hybrid structure encapsulated by liquid metal in this embodiment has the following advantages: the jet and microchannel structure are coupled on the fluid side and integrated on the chip housing at the same time, which improves the heat exchange performance of the fluid while eliminating the thermal resistance generated by the interface material between the traditional liquid-cooled chip and the housing, and can also avoid the problem of poor heat dissipation performance caused by poor installation of the liquid cooling plate. On the chip, by encapsulating liquid metal, the traditional silicone grease encapsulation interface material is replaced, which can effectively improve the thermal conductivity and reduce the interface thermal resistance generated during packaging. At the same time, the design of sealing and spraying of three-proof paint can prevent short circuits caused by liquid metal, and has strong engineering applicability.

[0029] In addition, this embodiment also provides a high-performance computer, including a power supply and a mainboard, on which the mainboard is provided with the jet and microchannel hybrid structure heat dissipation device encapsulated by liquid metal.

[0030] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A heat dissipation device using a jet and microchannel hybrid structure encapsulated by liquid metal, characterized in that: The invention comprises a heat sink (1) having a liquid supply interface (11), a liquid return interface (12) and a jet and microchannel hybrid structure, wherein a sealing ring (3) is provided on a side of the heat sink (1) close to a heat dissipated chip (2), and a pressing plate (4) for fixing the heat sink (1) to a circuit board on which the heat dissipated chip (2) is installed is also provided on a side of the heat sink (1) away from the heat dissipated chip (2), wherein the sealing ring (3) is clamped and arranged between a substrate (21) of the heat dissipated chip (2) and the heat sink (1) so that a sealed cavity is formed inside the sealing ring (3), and the The sealed cavity is filled with liquid metal, the chip wafer (22) of the heat dissipated chip (2) is located inside the sealing ring (3), a double-layer flow channel is provided in a horizontal position inside the heat dissipation plate (1), one layer of the flow channel is connected to the liquid supply interface (11), and the other layer of the flow channel is connected to the liquid return interface (12), the jet and microchannel mixing structure includes a jet nozzle (14) provided between the double-layer flow channel for changing the direction of the fluid through the plurality of microchannels (13) by 90 degrees in the vertical direction to form a jet effect, and the arrangement direction of the jet nozzle (14) is arranged perpendicular to the double-layer flow channel.

2. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 1 is characterized in that: The jet nozzle (14) is in the shape of an elongated strip, a circle or a rectangle.

3. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 1, characterized in that: The horizontal double-layer flow channel comprises an inlet side flow channel (15) and an outlet side flow channel (16); the inlet side flow channel (15) is in communication with a liquid supply interface (11); the outlet side flow channel (16) is in communication with a liquid return interface (12); at least one end of the plurality of microchannels (13) is in communication with the outlet side flow channel (16); the plurality of microchannels (13) are arranged in an array and a jet nozzle (14) is provided at the bottom of each microchannel (13); the inlet side flow channel (15) is located below the jet nozzles (14) of the plurality of microchannels (13) so that liquid metal is depressurized after passing through the jet nozzles (14) and enters the microchannels (13).

4. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 3 is characterized in that: The microchannel (13) is a rectangular microchannel, a circular microchannel or a trapezoidal microchannel.

5. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 1, characterized in that: The multiple microchannels (13) are arranged in an array on the same straight line.

6. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 1, characterized in that: The axes of the liquid supply interface (11) and the liquid return interface (12) are on the same plane.

7. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 1, characterized in that: The liquid metal filled in the sealed cavity accounts for 80% of the internal volume of the sealed cavity.

8. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 1, characterized in that: The substrate (21) is sprayed with a three-proof paint layer, the heat sink (1) is made of copper and is plated with a nickel layer on the surface, and the sealing ring (3) is made of fluorocarbon rubber and is compressed by the pressing plate (4) to a compression amount of 20% to 25%.

9. The heat dissipation device of the jet and microchannel hybrid structure using liquid metal encapsulation according to claim 1, characterized in that: The pressing plate (4) is provided with a plurality of mounting bolts or positioning mounting holes for mounting and fixing the heat dissipation plate (1) to a circuit board on which the heat dissipation chip (2) is mounted.

10. A high performance computer, comprising a power supply and a motherboard, characterized in that: The mainboard is provided with a heat dissipation device with a jet and microchannel hybrid structure encapsulated by liquid metal as described in any one of claims 1 to 9.

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