Wafer cutting or processing platform

Abstract

The invention relates to a wafer cutting or processing platform. The wafer cutting or processing platform sequentially comprises a scribing shaft assembly and a stepping shaft assembly from top to bottom, the scribing shaft assembly comprises an adsorption carrying table, a hollow motor, an upper shaft marble and an upper shaft motor; the stepping shaft assembly comprises a lower shaft marble, a lower shaft sliding plate and a lower shaft motor. The motion gravity center of the scribing shaft assembly is lowered, and the acceleration of the scribing shaft assembly and the equipment stability are improved.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor processing, and in particular to a wafer cutting or processing platform. Background Art

[0002] With the rapid development of semiconductor technology, the performance requirements of chips are getting higher and higher. Gold-backed wafers have important applications in fields such as semiconductor packaging. In the chip packaging process, in order to achieve better electrical connection and heat dissipation performance, the manufacturing accuracy and quality control of gold-backed wafers become crucial.

[0003] The common laser cutting platform is an XY high-precision cutting platform with a stepping axis superimposed on a dicing axis. The method of using a paraxial light effect plus a light source is used to capture the image and then cut. The back-gold wafer is a special wafer with a metal layer deposited on the back of the semiconductor wafer (the side where the chip circuit is not located). Since the circuit is on the back, the precise cutting position needs to be captured through the circuit on the back during the laser processing process, so the lower image and lower light source are needed.

[0004] The imaging components currently used are fixed on both sides of the marble beam base. The slide plate of the dicing axis is a hollow one-piece casting. The imaging component passes through the middle and is placed horizontally. After a reflection, it is placed directly below the upper axis processing point. The hollow parts lead to a higher overall center of gravity, which is not conducive to high-speed cutting and equipment stability.

[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a wafer cutting or processing platform to make it more valuable for industrial use. Summary of the invention

[0006] In order to solve any of the above technical problems, an object of the present invention is to provide a wafer cutting or processing platform.

[0007] To achieve the above object, the present invention adopts the following technical solution:

[0008] The wafer cutting or processing platform includes a dicing axis assembly and a stepping axis assembly from top to bottom;

[0009] The scribing shaft assembly includes an adsorption stage, a hollow motor, an upper shaft marble and an upper shaft motor. An upper shaft sinking cavity concave downward is opened in the middle of the upper shaft marble. Upper shaft motors are installed in the upper shaft marbles on both sides of the upper shaft sinking cavity. The two upper shaft motors synchronously drive the inner hollow motor to move in the left and right directions. An adsorption stage is installed on the top of the hollow motor.

[0010] The stepper shaft assembly includes a lower shaft marble, a lower shaft slide plate and a lower shaft motor. Two lower shaft motors are installed in parallel along the left and right directions on the lower shaft marble. The two lower shaft motors synchronously drive the upper lower shaft slide plate to move in the front and rear directions.

[0011] A lower shaft first sinking cavity recessed downward is provided in the lower shaft marble between the two lower shaft motors, and the lower shaft first sinking cavity is distributed along the front-to-back direction, a lower imaging assembly is installed in the lower shaft first sinking cavity, lower shaft through holes distributed along the front-to-back direction are provided on the lower shaft slide plate directly above the lower shaft first sinking cavity, and an upper shaft through hole is provided on the upper shaft marble directly above the lower shaft through hole.

[0012] As a further improvement of the present invention, an upper shaft guide rail distributed along the left and right directions is installed on the upper shaft marble inside the upper shaft motor, and the bottom of the hollow motor is connected to the upper shaft guide rail below through an upper shaft slider.

[0013] As a further improvement of the present invention, a lower shaft guide rail distributed along the front-to-back direction is installed on the lower shaft marble on one side of the lower shaft motor, and the bottom of the lower shaft slide plate is connected to the lower shaft guide rail below through a lower shaft slider.

[0014] As a further improvement of the present invention, a second sinking cavity of the lower shaft distributed along the front-to-back direction is opened on the lower shaft marble outside the lower shaft motor, and a tank chain distributed along the front-to-back direction is installed in the second sinking cavity of the lower shaft, and the bottom of the lower shaft slide plate is connected to the tank chain below through a tank chain bracket.

[0015] As a further improvement of the present invention, the lower imaging component can move freely along the front-rear direction on the lower shaft marble in the first sinking cavity of the lower shaft.

[0016] As a further improvement of the present invention, the lower imaging component includes a camera lens and a light source, the light source is located above the camera lens, and the camera lens can be fine-tuned in the vertical direction and the left-right direction.

[0017] By means of the above scheme, the present invention has at least the following advantages:

[0018] The present invention reduces the movement center of gravity of the dicing shaft assembly and improves the acceleration and equipment stability of the dicing shaft assembly.

[0019] The present invention changes the lower image component which has a long span and needs to be observed through one reflection into an internal lower component which is installed vertically, thereby improving the stability and operability and reducing the component cost.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a structural schematic diagram of a wafer cutting or processing platform of the present invention;

[0023] Figure 2 yes Figure 1 The main view;

[0024] Figure 3 yes Figure 1 A schematic diagram of the structure of the middle scribing shaft assembly;

[0025] Figure 4 yes Figure 1 Schematic diagram of the structure of the medium stepper shaft assembly.

[0026] The meanings of the various reference numerals in the figures are as follows.

[0027] Slicing axis assembly 1, stepping axis assembly 2, lower imaging assembly 3, adsorption stage 4, hollow motor 5, upper axis marble 6, upper axis guide rail 7, upper axis motor 8, lower axis marble 9, lower axis slide plate 10, lower axis motor 11, lower axis guide rail 12. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0030] like Figure 1 to Figure 4As shown, a wafer cutting or processing platform includes a dicing axis assembly 1 and a stepping axis assembly 2 from top to bottom.

[0031] 1. The dicing shaft assembly 1 includes an adsorption platform 4, a hollow motor 5, an upper shaft marble 6 and an upper shaft motor 8. An upper shaft sinking cavity recessed downward is provided in the middle of the upper shaft marble 6. Upper shaft motors 8 are installed in the upper shaft marble 6 on both sides of the upper shaft sinking cavity. The two upper shaft motors 8 synchronously drive the inner hollow motor 5 to move in the left and right directions. An adsorption platform 4 is installed on the top of the hollow motor 5.

[0032] An upper shaft guide rail 7 distributed along the left-right direction is installed on the upper shaft marble 6 inside the upper shaft motor 8, and the bottom of the hollow motor 5 is connected to the upper shaft guide rail 7 below through an upper shaft slider.

[0033] 2. The stepper shaft assembly 2 includes a lower shaft marble 9, a lower shaft slide plate 10 and a lower shaft motor 11. Two lower shaft motors 11 are installed in parallel along the left-right direction on the lower shaft marble 9. The two lower shaft motors 11 synchronously drive the upper lower shaft slide plate 10 to move in the front-back direction;

[0034] A lower shaft guide rail 12 distributed along the front-to-back direction is installed on the lower shaft marble 9 on one side of the lower shaft motor 11, and the bottom of the lower shaft slide plate 10 is connected to the lower shaft guide rail 12 below through a lower shaft slider.

[0035] A second lower shaft sinking cavity distributed along the front-to-back direction is also provided on the lower shaft marble 9 outside the lower shaft motor 11. A tank chain distributed along the front-to-back direction is installed in the second lower shaft sinking cavity. The bottom of the lower shaft slide plate 10 is connected to the tank chain below through a tank chain bracket.

[0036] 3. A lower shaft first sinking cavity recessed downward is provided in the lower shaft marble 9 between the two lower shaft motors 11, and the lower shaft first sinking cavity is distributed along the front-to-back direction. A lower imaging component 3 is installed in the lower shaft first sinking cavity, and lower shaft through holes distributed along the front-to-back direction are provided on the lower shaft slide plate 10 directly above the lower shaft first sinking cavity, and an upper shaft through hole is provided on the upper shaft marble 6 directly above the lower shaft through hole.

[0037] 4. The lower image component 3 can move freely along the front-to-back direction on the lower shaft marble 9 in the first sinking cavity of the lower shaft. The lower image component 3 can be moved and adjusted in the front-to-back direction by adjusting blocks distributed along the front-to-back direction.

[0038] The lower imaging component 3 includes a camera lens and a light source, the light source is located above the camera lens, and the camera lens can be fine-tuned in the vertical direction and the left-right direction. The camera lens can achieve fine-tuning in the vertical direction and the left-right direction through two one-dimensional platforms.

[0039] The present invention adopts a lower imaging component 3 with a longer working distance to cooperate with the platform, places the lower imaging component 3 below the scribing shaft component 1, and directly opens up the upper shaft marble 6.

[0040] After the working distance of the lower imaging component 3 is lengthened, it is still necessary to compress the thickness space of the slicing shaft component 1 as much as possible to realize long-distance image capture. The original standard hollow motor is changed to a sunken installation, and the non-standard hollow flange integrated sunken hollow motor 5 further lowers the work surface. Secondly, the motor avoids the lower imaging component 3 and adopts a vertical installation on both sides. The lower shaft marble 9 is thickened and raised to make room for the imaging component 3.

[0041] The working principle and working process of the present invention are as follows: the product is placed above the adsorption carrier 4 (transparent material such as quartz glass), the cutting path position is determined by observing the back circuit board through the lower imaging component 3, and the dicing axis component 1 and the stepping axis component 2 are linked to move the wafer as required in the plane movement in the left and right directions and the front and back directions to cooperate with the laser for cutting.

[0042] The present invention reduces the center of gravity of the dicing shaft assembly, improves the acceleration of the dicing shaft assembly and the stability of the equipment. The long-span lower image assembly that needs to be observed through one reflection is changed into a vertically installed internal lower assembly, which improves stability and operability and reduces assembly costs.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A wafer cutting or processing platform, comprising, from top to bottom, a dicing axis assembly (1) and a stepping axis assembly (2); characterized in that: The dicing shaft assembly (1) comprises an adsorption platform (4), a hollow motor (5), an upper shaft marble (6) and an upper shaft motor (8); an upper shaft sinking cavity recessed downward is provided in the middle of the upper shaft marble (6); upper shaft motors (8) are installed in the upper shaft marble (6) on both sides of the upper shaft sinking cavity; the two upper shaft motors (8) synchronously drive the inner hollow motor (5) to move in the left and right directions; and an adsorption platform (4) is installed on the top of the hollow motor (5); The stepping shaft assembly (2) comprises a lower shaft marble (9), a lower shaft slide plate (10) and a lower shaft motor (11), two lower shaft motors (11) are installed in parallel along the left-right direction on the lower shaft marble (9), and the two lower shaft motors (11) synchronously drive the upper lower shaft slide plate (10) to move in the front-back direction; A lower shaft first sinking cavity recessed downward is provided in the lower shaft marble (9) between the two lower shaft motors (11), and the lower shaft first sinking cavity is distributed along the front-to-back direction. A lower imaging component (3) is installed in the lower shaft first sinking cavity. A lower shaft through hole distributed along the front-to-back direction is provided on the lower shaft slide plate (10) directly above the lower shaft first sinking cavity, and an upper shaft through hole is provided on the upper shaft marble (6) directly above the lower shaft through hole.

2. The wafer cutting or processing platform according to claim 1, characterized in that: An upper shaft guide rail (7) distributed along the left-right direction is installed on the upper shaft marble (6) inside the upper shaft motor (8), and the bottom of the hollow motor (5) is connected to the upper shaft guide rail (7) below through an upper shaft slider.

3. The wafer cutting or processing platform according to claim 1, characterized in that: A lower shaft guide rail (12) distributed along the front-to-back direction is installed on the lower shaft marble (9) on one side of the lower shaft motor (11), and the bottom of the lower shaft slide plate (10) is connected to the lower shaft guide rail (12) below through a lower shaft slider.

4. The wafer cutting or processing platform according to claim 1, characterized in that: A lower shaft second sinking cavity distributed along the front-to-back direction is also provided on the lower shaft marble (9) outside the lower shaft motor (11), and a tank chain distributed along the front-to-back direction is installed in the lower shaft second sinking cavity, and the bottom of the lower shaft slide plate (10) is connected to the tank chain below through a tank chain bracket.

5. The wafer cutting or processing platform according to claim 1, characterized in that: The lower imaging component (3) can move freely along the front-rear direction on the lower shaft marble (9) in the first sinking cavity of the lower shaft.

6. The wafer cutting or processing platform according to claim 1, characterized in that: The lower imaging component (3) comprises a camera lens and a light source, wherein the light source is located above the camera lens, and the camera lens can be fine-tuned in the vertical direction and the left-right direction.

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