Flat chip micro-explosion self-destruction device based on multi-sensor array

Abstract

The invention discloses a flat chip micro-explosion self-destruction device based on a multi-sensor array, the device is composed of a destruction switch, a sealing assembly, a signal acquisition unit, a main control unit, a micro-explosion unit and a power supply unit, the power supply unit supplies power to a low-power-consumption MCU, sensors and the micro-explosion unit, the destruction switch is connected with the main control unit, and the sealing assembly is connected with the micro-explosion unit. The manual control unit is used for manually controlling the micro-explosion unit to detonate and self-destroy when necessary; the sealing assembly is composed of a chip mainboard and a sealing upper plate, and the sealing upper plate is fixed to the chip mainboard through fixing screws arranged on the periphery of the sealing upper plate. According to the invention, the information perception and acquisition capability of the storage chip is improved, and the change of the surrounding environment of the storage chip is monitored in real time through the multi-sensor array, so that a security risk can be found and responded in time when the security risk occurs; the space design is optimized, so that the whole system is more flat, and the system is suitable for equipment or equipment with limited space; the adaptability of the device is improved, and flexible configuration can be carried out according to different application scenes and safety requirements.

Description

Technical Field

[0001] The present invention relates to the field of chip security protection, and in particular to a flat chip micro-explosion self-destruction device based on a multi-sensor array. Background Art

[0002] With the rapid development of science and technology, information has become the core asset of all walks of life. As the main carrier of information, the security of memory chips is of vital importance. However, once the memory chip loses control, the sensitive information stored in it may face the risk of leakage. At present, some patent applications for memory chip security protection have been proposed, such as "A memory chip anti-disassembly self-destruction sealing body security protection system and its working method" (application number 202010301673.6), which is mainly used as a memory chip security protection structure and is feasible; another example is "A memory chip self-destruction device and its working method" (application number 202010301642.0), which is feasible as a self-destruction device; another example is "A micro-explosion device for electronic chip destruction" (patent number 202010300806.8), which is a structure of a micro-explosion unit and is feasible. The above patents have formed a complete idea for the micro-explosion self-destruction of memory chips after losing control. To a certain extent, the security of memory chips has been improved, but there are still some shortcomings, such as limited information perception and acquisition capabilities, and large packaging volume.

[0003] Therefore, a flat chip micro-explosion self-destruction device based on a multi-sensor array with flattening and multiple information perception capabilities is designed to solve the above problems. Summary of the invention

[0004] The present invention provides a flat chip micro-explosion self-destruction device based on a multi-sensor array. The present invention realizes the safety protection of the storage chip, improves the information perception and acquisition capabilities of the storage chip, improves the space design, and increases the adaptability of the system. See the following description for details:

[0005] A flat chip micro-explosion self-destruction device based on a multi-sensor array includes a destruction switch, a sealing component, a signal acquisition unit, a main control unit, a micro-explosion unit and a power supply unit, wherein:

[0006] The destruction switch is connected to the main control unit and is used to manually control the micro-explosion unit to detonate and self-destruct when necessary;

[0007] The sealing assembly consists of a chip main board and a sealing upper plate, the sealing upper plate is fixed to the chip main board by 8 fixing screws arranged around it, a sealing rubber ring is provided between the chip main board and the sealing upper plate and coated with sealant, a metal safety shield is installed on the chip main board, the contact gap between the metal safety shield and the chip main board is filled with sealant and fixed to the chip main board by screws.

[0008] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the signal acquisition unit includes a micro-switch array, a temperature sensor array and a gyroscope, the micro-switch array is composed of 6 micro-switches, which are respectively arranged on the chip main board, at the left, middle and right positions below the sealed upper plate, and at the upper and lower ends; the temperature sensor array is composed of multiple temperature sensors, each temperature sensor is respectively arranged at a position below each micro-switch, to collect the ambient temperature of the chip main board in real time; the gyroscope is a degree of freedom gyroscope, which is arranged at the center position below the sealed upper plate.

[0009] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the main control unit includes a main controller and a low-power MCU, all sensor signals collected by the signal acquisition unit are connected to the low-power MCU, and the MCU performs information fusion processing on the data collected by the sensors;

[0010] The main controller is responsible for overall coordination and control, including but not limited to receiving sensor data processed by the low-power MCU, executing preset security policies, and sending control instructions to the micro-explosion unit to start the destruction program. The main controller is connected to the low-power MCU via a data line to achieve two-way communication;

[0011] The main controller is also responsible for monitoring the operating status of the flat chip micro-explosion self-destruction device based on the multi-sensor array, and when an abnormal situation is detected, it can take immediate action, including but not limited to activating an alarm mechanism, recording an event log, and sending an alarm message to an external management system;

[0012] The communication protocol between the main controller and the low-power MCU supports multiple standards, including but not limited to SPI, I2C or UART, to ensure the efficiency and reliability of data transmission;

[0013] The main controller can perform intelligent analysis based on the received sensor data to determine whether there is a risk of illegal operation, and adjust the safety level of the flat chip micro-explosion self-destruction device based on the multi-sensor array accordingly to improve the anti-attack capability of the flat chip micro-explosion self-destruction device based on the multi-sensor array;

[0014] The main controller has a remote configuration function, allowing the administrator to set parameters and update software of the main controller connected to the flat chip micro-explosion self-destruct device based on the multi-sensor array through the network, thereby maintaining the latest status and highest safety performance of the flat chip micro-explosion self-destruct device based on the multi-sensor array.

[0015] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the micro-explosion unit is arranged together with the onboard memory, and is driven and controlled by the low-power MCU.

[0016] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the power supply unit is composed of a lithium battery and a power supply circuit to supply power to the low-power MCU, sensor, and micro-explosion unit.

[0017] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the micro-switch array is used to realize all-round prying cover detection of the metal safety protective cover.

[0018] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the temperature sensor array is used to effectively prevent an attacker from deliberately causing the ambient temperature of the chip mainboard to deviate from the normal operating range, thereby bypassing the protective measures of the chip mainboard.

[0019] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the gyroscope is used to detect changes in the board's attitude.

[0020] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the flat chip micro-explosion self-destruction device based on a multi-sensor array can trigger the micro-explosion unit through the MCU drive, and physically destroy the storage chip storing important information, so that the sensitive information stored in it cannot be recovered.

[0021] The above-mentioned flat chip micro-explosion self-destruction device based on a multi-sensor array, wherein: the flat chip micro-explosion self-destruction device based on a multi-sensor array constructs a comprehensive and hierarchical protection system by comprehensively adopting environmental anomaly detection, posture change detection, disassembly detection, drilling detection, and prying cover detection to provide comprehensive safety protection for the equipment.

[0022] The beneficial effects of the technical solution provided by the present invention are:

[0023] 1. The information perception and acquisition capabilities of storage chips are improved. Through a multi-sensor array, changes in the environment around the storage chip are monitored in real time to ensure timely detection and response when security risks occur.

[0024] 2. The space design is optimized to make the whole system flatter and suitable for equipment or devices with limited space.

[0025] 3. The system's adaptability has been increased, and it can be flexibly configured according to different application scenarios and security requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic structural diagram of a flat chip micro-explosion self-destruction device based on a multi-sensor array provided by the present invention;

[0027] Figure 2 A schematic diagram of information trends of a flat chip micro-explosion self-destruction device based on a multi-sensor array provided by the present invention;

[0028] Figure 3 A schematic diagram of the working process of a flat chip micro-explosion self-destruction device based on a multi-sensor array provided by the present invention.

[0029] Figure Number:

[0030] 1. Destroy switch; 2. Fixing screws; 3. Micro switch array; 4. Temperature sensor array; 5. Main controller; 6. Gyroscope; 7. Onboard memory; 8. Micro explosion unit; 9. Low power MCU; 10. Power supply unit; 11. Chip motherboard; 12. Sealed upper plate. DETAILED DESCRIPTION

[0031] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention are described in further detail below.

[0032] This embodiment provides a flat chip micro-explosion self-destruction device based on a multi-sensor array, which can be applied to chip security protection systems or other systems related to storage chips; it can also be applied to the security protection of core chips in unmanned equipment such as drones and unmanned submarines. The system consists of a destruction switch 1, a sealing component, a signal acquisition unit, a main control unit, a micro-explosion unit 8, and a power supply unit 10. The power supply unit 10 supplies power to a low-power MCU 9, a sensor, and a micro-explosion unit. Its basic layout is as follows: Figure 1 shown.

[0033] The destruction switch 1 is connected to the main control unit and is used to manually control the micro-explosion unit 8 to detonate and self-destruct when necessary;

[0034] Among them, the sealing component is composed of a chip main board 11 and a sealing upper plate 12. The sealing upper plate 12 is fixed to the chip main board 11 by 8 fixing screws 2 arranged around it. A sealing rubber ring is provided between the chip main board 11 and the sealing upper plate 12 and coated with sealant. A metal safety shield is installed on the chip main board 11. The contact gap between the metal safety shield and the chip main board 11 is filled with sealant and fixed to the chip main board 11 by screws.

[0035] Among them, the signal acquisition unit includes a micro switch array 3, a temperature sensor array 4 and a gyroscope 6. The micro switch array 3 is composed of 6 micro switches, which are respectively arranged on the chip main board 11 and at the left, middle and right positions and the upper and lower positions below the sealing upper plate 12; the temperature sensor array 4 is composed of 6 temperature sensors, each temperature sensor is respectively arranged at a position below each micro switch to collect the ambient temperature of the chip main board 11 in real time; the gyroscope 6 is a 6-degree-of-freedom gyroscope, which is arranged at the center position below the sealing upper plate 12.

[0036] Among them, the main control unit includes a main controller 5 and a low-power MCU9. All sensor signals collected by the signal acquisition unit are connected to the low-power MCU9, and the MCU9 performs information fusion processing on the data collected by the sensor;

[0037] The main controller 5 is responsible for overall coordination and control, including but not limited to receiving sensor data processed by the low-power MCU 9, executing preset security policies, and sending control instructions to the micro-explosion unit 8 to start the destruction program. The main controller 5 is connected to the low-power MCU 9 via a data line to achieve two-way communication;

[0038] The main controller 5 is also responsible for monitoring the operating status of the flat chip micro-explosion self-destruction device based on the multi-sensor array, and when an abnormal situation is detected, it can take immediate action, including but not limited to activating an alarm mechanism, recording an event log, and sending an alarm message to an external management system;

[0039] The communication protocol between the main controller 5 and the low-power MCU 9 supports multiple standards, including but not limited to SPI, I2C or UART, to ensure the efficiency and reliability of data transmission;

[0040] The main controller 5 can perform intelligent analysis based on the received sensor data to determine whether there is a risk of illegal operation, and adjust the safety level of the flat chip micro-explosion self-destruction device based on the multi-sensor array accordingly to improve the anti-attack capability of the flat chip micro-explosion self-destruction device based on the multi-sensor array;

[0041] The main controller 5 has a remote configuration function, allowing the administrator to set parameters and update software of the main controller connected to the flat chip micro-explosion self-destruct device based on the multi-sensor array through the network, so as to maintain the latest status and highest safety performance of the flat chip micro-explosion self-destruct device based on the multi-sensor array.

[0042] The micro-explosion unit 8 is arranged together with the onboard memory 7 and is driven and controlled by a low-power MCU 9.

[0043] Specific structure and working principle of micro-explosion unit 8

[0044] Micro-explosion material selection:

[0045] The micro-explosion unit 8 uses micro-explosives as the main destructive medium. The explosives have the characteristics of high energy density and fast reaction speed, and can generate sufficient heat energy and shock waves in a short time to cause irreversible physical damage to the storage chip.

[0046] It is preferred to use a mixture of nano-aluminum powder and an oxidant, as such materials can react chemically quickly under certain conditions to produce a strong explosion effect.

[0047] Detonation Mechanism:

[0048] The micro-explosion unit 8 has a built-in micro-detonation device, which is directly controlled by the low-power MCU 9.

[0049] The detonation device can be a heating detonation method based on a heating wire, or an ignition method based on an electric spark. When the low-power MCU 9 receives a destruction instruction issued by the main controller 5, the detonation device will be activated immediately to trigger the explosion of the micro-explosive.

[0050] Package design:

[0051] The micro-explosion unit 8 adopts a flat design with an overall thickness of no more than 1 mm to adapt to the space limitations inside the compact device.

[0052] The packaging material is made of high-temperature resistant, high-strength composite material, which can not only protect the internal micro-explosives from the influence of the external environment, but also ensure that the shock wave generated by the explosion can be effectively transmitted to the storage chip.

[0053] Safety mechanism:

[0054] The micro-explosion unit 8 has multiple built-in safety mechanisms to prevent misoperation or accidental triggering.

[0055] Including but not limited to: physical isolation (setting an insulating layer between the detonator and the micro-explosive), logical interlocking (multiple conditions must be met at the same time to trigger detonation), time delay (there is a certain time interval from receiving the destruction command to the actual detonation), etc.

[0056] Workflow:

[0057] When the system detects illegal operations or other security threats, the low-power MCU 9 will receive a destruction instruction issued by the main controller 5 .

[0058] The low-power MCU9 verifies the validity of the destruction instruction and determines whether the detonation conditions are met through internal logic.

[0059] If the conditions are met, the low-power MCU9 will activate the detonation device, triggering the explosion of the micro-explosive to physically destroy the storage chip.

[0060] Micro-explosion unit 8: includes micro-explosives, detonation devices, packaging materials, etc.

[0061] Ignition device: can be a heating wire or an electric spark igniter.

[0062] Packaging material: high temperature resistant, high strength composite material.

[0063] Connection relationship

[0064] The low-power MCU 9 is connected to the main controller 5 via a data line to receive a destruction instruction.

[0065] The low-power MCU 9 is connected to the detonation device in the micro-explosion unit 8 through a control line to control the detonation process.

[0066] The design of the Micro Explosion Unit 8 fully considers the requirements of security, reliability and miniaturization. It can quickly physically destroy the storage chip when a security threat is detected to ensure the security of sensitive information. Through close cooperation with the main control unit, the Micro Explosion Unit 8 can provide effective security protection in a variety of application scenarios.

[0067] Destroy switch 1: including shell, button, indicator light, contact, fuse, current limiting resistor, ESD protection circuit, etc.

[0068] Contact: Gold finger or spring contact.

[0069] Indicator light: LED indicator light.

[0070] The destroy switch 1 is connected to the low-power MCU 9 via a data line to transmit a destroy command.

[0071] The low-power MCU 9 is connected to the detonation device in the micro-explosion unit 8 through a control line to control the detonation process.

[0072] Specific connection example

[0073] Physical Connection:

[0074] The output end of the destroy switch 1 is connected to the input end of the low power consumption MCU 9 through a data line.

[0075] Data cables usually include power lines, ground lines, and signal lines to ensure reliable signal transmission.

[0076] Electrical Connection:

[0077] The contact of the destroy switch 1 is connected to the input pin of the low power MCU 9.

[0078] The positive pole of the indicator light is connected to the power supply, and the negative pole is connected to the control pin of the low-power MCU9 through a current-limiting resistor.

[0079] Logical connection:

[0080] In the programming logic of the low-power MCU9, the input pin of the kill switch 1 is set as an interrupt pin, and when the button is detected to be pressed, the interrupt service program is triggered.

[0081] In the interrupt service program, the number of presses and the time interval are recorded. If the destruction conditions are met, a destruction command is sent to the micro-explosion unit 8.

[0082] Safety mechanism:

[0083] Double confirmation: The user is required to press the button twice in succession to trigger the destruction operation to avoid accidental operation.

[0084] Time delay: There needs to be a short time interval, such as 5 seconds, between the first press and the second press to further reduce the possibility of misoperation.

[0085] Password protection: Optional password input function, users need to enter the correct password to trigger the destruction operation.

[0086] Workflow:

[0087] The user presses the button of the destroy switch 1. When it is pressed for the first time, the system enters the ready state and the indicator light flashes.

[0088] If the user presses the button again within the specified time, the system confirms the destruction command and the indicator light stays on.

[0089] The destroy switch 1 sends a destroy command to the low-power MCU 9 through the data line.

[0090] After receiving the destruction command, the low-power MCU9 performs verification and logical judgment.

[0091] If the verification is successful, the low-power MCU 9 activates the detonation device of the micro-explosion unit 8 to physically destroy the storage chip.

[0092] The power supply unit 10 is composed of a lithium battery and a power supply circuit, and supplies power to the low-power MCU 9 , the sensor, and the micro-explosion unit 8 .

[0093] The micro switch array 3 is used to realize all-round prying detection of the metal safety protection cover.

[0094] The temperature sensor array 4 is used to effectively prevent an attacker from intentionally causing the ambient temperature of the chip mainboard 11 to deviate from the normal operating range, thereby bypassing the protective measures of the chip mainboard 11 .

[0095] The gyroscope 6 is used to detect changes in the board's attitude.

[0096] Among them, the flat chip micro-explosion self-destruction device based on a multi-sensor array can trigger the micro-explosion unit 8 through the MCU9 drive, and physically destroy the storage chip storing important information, making the sensitive information stored in it impossible to recover.

[0097] Among them, the flat chip micro-explosion self-destruction device based on a multi-sensor array constructs a comprehensive and hierarchical protection system by comprehensively adopting environmental anomaly detection, posture change detection, disassembly detection, drilling detection, and prying cover detection, providing comprehensive safety protection for the equipment.

[0098] In response to chip security requirements, different types of sensors are deployed on the device board, and the various data collected by the sensors are effectively integrated. The information flows as follows: Figure 2 As shown, a flat chip micro-explosion self-destruction device based on a multi-sensor array is formed. When the equipment is "illegally moved away from the monitoring point and illegally mechanically disassembled", the micro-explosion destruction module is triggered by the MCU to physically destroy the storage chip storing important information, making the sensitive information stored in it impossible to recover, thereby protecting the chip security.

[0099] In order to solve the problem of illegal removal detection, illegal mechanical disassembly, high and low temperature attacks and other physical attacks on equipment or devices equipped with storage chips, a comprehensive and hierarchical protection system is established by comprehensively adopting environmental anomaly detection, posture change detection, disassembly detection, drilling detection, and prying cover detection to provide comprehensive security protection for the equipment, such as Figure 3 shown.

[0100] Workflow:

[0101] S1. Initialization:

[0102] After the system is powered on, the low-power MCU 9 is initialized and the status of each sensor and the micro-explosion unit 8 is checked.

[0103] The main controller 5 is initialized and establishes a communication connection with the low-power MCU 9.

[0104] S2. Normal operation:

[0105] The signal acquisition unit (micro switch array 3, temperature sensor array 4, gyroscope 6) continuously collects environmental data.

[0106] The low-power MCU9 performs information fusion processing on the collected data to determine whether there is any abnormality.

[0107] The main controller 5 receives the data processed by the low-power MCU 9 and executes a preset security policy.

[0108] S3. Anomaly Detection:

[0109] The low power MCU9 detects any of the following abnormal conditions:

[0110] The micro switch array 3 detects that the metal safety shield has been pried open.

[0111] The temperature sensor array 4 detects that the ambient temperature is abnormal.

[0112] The gyroscope 6 detects the change of the board attitude.

[0113] The low power consumption MCU 9 reports the abnormal situation to the main controller 5 .

[0114] S4. Security Response:

[0115] The main controller 5 takes corresponding safety measures according to the severity of the abnormal situation:

[0116] Activate the alarm mechanism.

[0117] Record event logs.

[0118] Send alarm information to external management systems.

[0119] Send a destroy instruction to the low-power MCU9.

[0120] S5. Automatic destruction operation:

[0121] After receiving the destruction command, the low-power MCU9 performs verification and logical judgment.

[0122] If the verification is successful, the low-power MCU 9 activates the detonation device of the micro-explosion unit 8 .

[0123] The micro-explosive charge in the micro-explosion unit 8 explodes, physically destroying the storage chip to ensure that sensitive information cannot be recovered.

[0124] S6. Manual destruction:

[0125] The user presses the button of the destroy switch 1. When it is pressed for the first time, the system enters the ready state and the indicator light flashes.

[0126] If the user presses the button again within the specified time, the system confirms the destruction command and the indicator light stays on.

[0127] The destruction switch 1 sends the destruction command to the low-power MCU 9 through the data line. The low-power MCU 9 activates the detonation device of the micro-explosive unit 8. The micro-explosive in the micro-explosive unit 8 explodes to physically destroy the storage chip to ensure that sensitive information cannot be recovered.

[0128] S7. Safety mechanism

[0129] Double confirmation: The user is required to press the button twice in succession to trigger the destruction operation to avoid accidental operation.

[0130] Time delay: There needs to be a short time interval (such as 5 seconds) between the first press and the second press to further reduce the possibility of misoperation.

[0131] Password protection: Optional password input function, users need to enter the correct password to trigger the destruction operation.

[0132] In summary, the flat chip micro-explosion self-destruction device based on a multi-sensor array provides comprehensive security protection for the equipment by comprehensively adopting multi-level protection mechanisms such as environmental anomaly detection, posture change detection, disassembly detection, drilling detection, and prying cover detection. When the system detects illegal operations or other security threats, it can quickly physically destroy the storage chip to ensure the security of sensitive information.

[0133] The above is a detailed description of a flat chip micro-explosion self-destruction device based on a multi-sensor array provided by an embodiment of the present invention. The application example illustrates the principle and implementation method of the present invention. The description of the above embodiment is only used to help understand the method of the present invention and its core idea. At the same time, for technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. For example, the specific shape, size and related fixing screw positions of the chip mainboard and the sealing plate can be changed according to the specific situation. When there are multiple storage chips on the chip mainboard, the number of micro switch arrays, temperature sensor arrays and gyroscopes of its signal acquisition unit can be increased accordingly. The specific array position changes accordingly according to the chip mainboard structure, etc., which are also within the protection scope of the present invention.

[0134] Unless otherwise specified, the models of the components in the embodiments of the present invention are not limited, and any device that can perform the above functions may be used.

[0135] Those skilled in the art can understand that the accompanying drawing is only a schematic diagram of a preferred embodiment, and the serial numbers of the embodiments of the present invention are only for description and do not represent the advantages and disadvantages of the embodiments.

[0136] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A flat chip micro-explosion self-destruction device based on a multi-sensor array, characterized in that: It comprises a destruction switch (1), a sealing component, a signal acquisition unit, a main control unit, a micro-explosion unit (8) and a power supply unit (10), wherein: The destruction switch (1) is connected to the main control unit and is used to manually control the micro-explosion unit (8) to detonate and self-destruct when necessary; The sealing component is composed of a chip main board (11) and a sealing upper plate (12); the sealing upper plate (12) is fixed to the chip main board (11) by a plurality of fixing screws (2) arranged around it; a sealing rubber ring is provided between the chip main board (11) and the sealing upper plate (12) and is coated with sealing glue; a metal safety protection cover is installed on the chip main board (11); the contact gap between the metal safety protection cover and the chip main board (11) is filled with sealing glue and is fixed to the chip main board (11) by screws.

2. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 1 is characterized in that: The signal acquisition unit comprises a micro switch array (3), a temperature sensor array (4) and a gyroscope (6); the micro switch array (3) is composed of a plurality of micro switches, which are respectively arranged at three positions, namely, left, middle and right, and at the upper and lower ends, on the chip main board (11) and below the sealed upper plate (12); the temperature sensor array (4) is composed of six temperature sensors, each of which is respectively arranged at a position below each micro switch to collect the ambient temperature of the chip main board (11) in real time; and the gyroscope (6) is a 6-degree-of-freedom gyroscope, which is arranged at the center position below the sealed upper plate (12).

3. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 2 is characterized in that: The main control unit comprises a main controller (5) and a low-power MCU (9); all sensor signals collected by the signal acquisition unit are connected to the low-power MCU (9); and the MCU (6) performs information fusion processing on the data collected by the sensors; The main controller (5) is responsible for overall coordination and control, including but not limited to receiving sensor data processed by the low-power MCU (9), executing a preset security strategy, and sending a control instruction to the micro-explosion unit (8) to start a destruction program. The main controller (5) is connected to the low-power MCU (9) via a data line to achieve two-way communication. The main controller (5) is also responsible for monitoring the operating status of the flat chip micro-explosion self-destruction device based on the multi-sensor array, and when an abnormal situation is detected, it can immediately take action, including but not limited to activating an alarm mechanism, recording an event log, and sending an alarm message to an external management system; The communication protocol between the main controller (5) and the low-power MCU (9) supports multiple standards, including but not limited to SPI, I2C or UART, to ensure the efficiency and reliability of data transmission; The main controller (5) is capable of performing intelligent analysis based on the received sensor data to determine whether there is a risk of illegal operation, and accordingly adjusts the safety level of the flat chip micro-explosion self-destruction device based on the multi-sensor array to improve the anti-attack capability of the flat chip micro-explosion self-destruction device based on the multi-sensor array; The main controller (5) has a remote configuration function, allowing an administrator to set parameters and update software of the main controller connected to the flat chip micro-explosion self-destruction device based on the multi-sensor array through the network, thereby maintaining the latest status and highest safety performance of the flat chip micro-explosion self-destruction device based on the multi-sensor array.

4. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 3 is characterized in that: The micro-explosion unit (8) is arranged together with the onboard memory (7), and is driven and controlled by the low-power MCU (9).

5. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 4 is characterized in that: The power supply unit (10) is composed of a lithium battery and a power supply circuit, and supplies power to the low-power MCU (9), the sensor, and the micro-explosion unit (8).

6. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 5 is characterized in that: The micro switch array (3) is used to realize all-round prying detection of the metal safety protection cover.

7. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 6 is characterized in that: The temperature sensor array (4) is used to effectively prevent an attacker from intentionally causing the ambient temperature of the chip mainboard (11) to deviate from a normal operating range, thereby bypassing the protective measures of the chip mainboard (11).

8. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 7, characterized in that: The gyroscope (6) is used to detect changes in the board's attitude.

9. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to claim 8, characterized in that: The flat chip micro-explosion self-destruction device based on a multi-sensor array can drive and trigger the micro-explosion unit (8) through the MCU (6) to physically destroy the storage chip storing important information, so that the sensitive information stored in the chip cannot be restored.

10. The flat chip micro-explosion self-destruction device based on a multi-sensor array according to any one of claims 1 to 9, characterized in that: The flat chip micro-explosion self-destruction device based on a multi-sensor array constructs a comprehensive and hierarchical protection system by comprehensively adopting environmental anomaly detection, posture change detection, disassembly detection, drilling detection, and prying cover detection, thereby providing comprehensive safety protection for the equipment.

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