Electronic component and manufacturing method thereof

Abstract

The invention provides an electronic component and a manufacturing method thereof, the electronic component comprises a plurality of layers of laminated structures, each layer of laminated structure is provided with an insulating resin layer and a conductive layer, and the insulating resin layer is coated outside the conductive layer; the insulating resin layer is provided with a via hole, the via hole is filled with an electric conductor, and the electric conductor is communicated with the two adjacent conducting layers; the outer end face of the electronic component is provided with at least two external terminals, and each external terminal is electrically connected with at least one conductive layer. And at least one surface of the conductive layer is in contact with the insulating resin layer, and the roughness of the surface of the conductive layer in contact with the insulating resin layer is between 0.08 [mu] m and 0.11 [mu] m. The invention further provides a manufacturing method of the electronic component. The quality factor of the electronic component can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component manufacturing, and in particular to an electronic component and a method for manufacturing the electronic component. Background Art

[0002] Inductors are a common electronic component, widely used in various electronic devices. As electronic devices become smaller, the size of inductors is required to be smaller and smaller, which also puts high demands on the production process of inductors.

[0003] See also Figure 1 An existing multilayer chip inductor is roughly in the shape of a rectangular parallelepiped, and has a first cover plate 12 and a second cover plate 13 that are arranged opposite to each other. The first cover plate 12 and the second cover plate 13 are arranged parallel to each other. An identification layer 11 is arranged above the first cover plate 12, and the identification layer 11 includes a mark 38. The magnetic field direction of the multilayer chip inductor can be determined by identifying the position of the mark 38.

[0004] A plurality of insulating layers and a plurality of conductive layers are provided between the first cover plate 12 and the second cover plate 13, and the plurality of insulating layers and the plurality of conductive layers are alternately arranged between the first cover plate 12 and the second cover plate 13. From the second cover plate 13 to the first cover plate 12, the plurality of insulating layers sequentially include six insulating layers, namely insulating layers 20, 21, 22, 23, 24, and 25, and the insulating layers 20, 21, 22, 23, 24, and 25 are arranged parallel to each other and are parallel to the first cover plate 12 and the second cover plate 13.

[0005] A conductive layer is disposed on each insulating layer 20, 21, 22, 23, 24, 25. For example, a conductive layer 30 is formed on the insulating layer 20, a conductive layer 31 is formed on the insulating layer 21, a conductive layer 32 is formed on the insulating layer 22, a conductive layer 33 is formed on the insulating layer 23, a conductive layer 34 is formed on the insulating layer 24, and a conductive layer 35 is formed on the insulating layer 25. In addition, a via hole is disposed on the insulating layer between two adjacent conductive layers, and a conductor is filled in the via hole. The two adjacent conductive layers are electrically connected through the conductor, and the multiple conductive layers are connected to each other to form an inductor coil. Two external terminals are disposed on the outer end surface of the multilayer chip inductor, and each external terminal is connected to a conductive layer.

[0006] Some existing inductors are made using a yellow light forming process, which requires three processes of printing, exposure, and development to produce each stacked structure, so that each stacked structure has an insulating layer and a conductive layer. After making multiple stacked structures, the multiple stacked structures are stacked in a pre-set direction to form a semi-finished product of a certain thickness. Then, the inductor product is produced through processes such as cutting, debonding, sintering, chamfering, and electroplating.

[0007] However, when the inductor is manufactured by the traditional yellow light molding process, the shape of the inductor coil is greatly affected by the printing, sintering and other processes, resulting in a certain difference between the actual shape of the inductor coil and the designed shape, resulting in the Q value of the inductor product, that is, the quality factor, being too low, making it impossible to produce high-performance inductors using the traditional yellow light molding process. Summary of the invention

[0008] A first object of the present invention is to provide an electronic component having an improved quality factor of inductance.

[0009] A second object of the present invention is to provide a method for manufacturing the above-mentioned electronic component.

[0010] To achieve the first purpose of the present invention, the electronic component provided by the present invention includes a multi-layer stacked structure, each layer of the stacked structure has an insulating resin layer and a conductive layer, the insulating resin layer is coated on the outside of the conductive layer; a via is provided on the insulating resin layer, the via is filled with a conductor, and the conductor connects two adjacent conductive layers; at least two external terminals are provided on the outer end surface of the electronic component, each external terminal is electrically connected to at least one conductive layer; and at least one surface of the conductive layer is in contact with the insulating resin layer, and the roughness of the surface of the conductive layer in contact with the insulating resin layer is between 0.08 microns and 0.11 microns.

[0011] It can be seen from the above scheme that the present invention adopts the additive method to manufacture electronic components. No sintering process is required during the manufacturing process of the electronic components, which can avoid the problem of a large difference between the actual shape of the coil and the designed shape caused by the sintering process, thereby improving the quality factor of the electronic components and meeting the production requirements of high-performance inductors.

[0012] In addition, since the surface where the conductive layer contacts the insulating resin layer has a certain degree of roughness, when the insulating resin layer is covered on the outside of the conductive layer, the friction between the conductive layer and the insulating resin layer is relatively large, which enables the insulating resin layer to better fit the conductive layer and avoids the separation of the conductive layer and the insulating resin layer, thereby improving the quality of electronic components and the qualified rate of electronic component production.

[0013] In some embodiments, the conductive layer is a conductive metal layer, and the proportion of oxygen atoms in the conductive metal layer is less than 2% by mass.

[0014] It can be seen that by processing the conductive layer so that the proportion of oxygen atoms in the conductive metal layer is very small, for example, by removing the metal oxide layer to reduce the proportion of oxygen atoms in the conductive metal layer, the proportion of metal atoms in the coil is made higher, thereby improving the quality factor of the electronic component.

[0015] In some embodiments, the proportion of atoms of the first metal element in the conductive metal layer is greater than 60% by mass. Thus, since the proportion of metal atoms in the conductive metal layer is relatively large, it is possible to ensure that the electronic component has a higher quality factor.

[0016] In some embodiments, in the insulating resin layer located between two adjacent conductive layers, the insulating resin layer 2 microns away from the bottom of the conductive layer contains a first metal element and a second metal element, and the atomic proportion of the first metal element is between 30% and 45% by mass, and the atomic proportion of the second metal element is between 1% and 2%.

[0017] In some embodiments, in the insulating resin layer located between two adjacent conductive layers, in the insulating resin layer 4 microns away from the bottom of the conductive layer, the atomic proportion of the first metal element is between 8% and 20% by mass.

[0018] In some embodiments, in the insulating resin layer located between two adjacent conductive layers, in the insulating resin layer 6 microns away from the bottom of the conductive layer, the atomic proportion of the first metal element is between 35% and 45% by mass.

[0019] In some embodiments, at least one outer end surface of the electronic component is printed with a mark, and in the insulating resin layer at a distance of 4 microns from the mark, the atomic proportion of the second metal element is between 1% and 4% by mass.

[0020] It can be seen from this that the specific gravity of metal element atoms contained in the insulating resin layer at different positions away from the bottom of the conductive layer varies, so that the insulating resin layer can electrically insulate the two adjacent conductive layers, so that the current in the coil can only flow in a preset direction, meeting the production requirements of high-performance electronic components.

[0021] In some embodiments, the first metal element is copper, and the second metal element is titanium.

[0022] To achieve the second purpose of the present invention, the method for manufacturing an electronic component provided by the present invention includes manufacturing a multi-layer stacked structure. When manufacturing each layer of the stacked structure, first manufacture a substrate, and manufacture a conductive layer on the substrate, wherein the substrate is made of insulating resin; placing a blank formed with a conductive layer in a plasma cleaning device, and plasma cleaning the blank so that the surface roughness of the conductive layer is between 0.08 microns and 0.11 microns; covering the conductive layer with insulating resin to form an insulating resin layer, and manufacturing vias on the insulating resin layer, and filling the vias with conductors so that the conductors connect two adjacent conductive layers; after manufacturing a stacked structure with a preset number of layers, a semi-finished product is obtained, and an external terminal is formed by electroplating on the outer end surface of the semi-finished product.

[0023] As can be seen from the above scheme, the present invention adopts the additive method to manufacture electronic components, and the manufacturing process does not require a sintering process, which can avoid the situation where the actual shape of the coil is inconsistent with the designed shape due to sintering and other processes. In addition, since the blank is plasma cleaned after the conductive layer is formed, the surface roughness of the conductive layer is increased. When the insulating resin layer is subsequently formed, the friction between the conductive layer and the insulating resin can be increased, thereby improving the degree of adhesion between the conductive layer and the insulating resin layer, avoiding separation between the conductive layer and the insulating resin layer, improving the qualified rate of the product, and ensuring the performance stability of the electronic components.

[0024] In some embodiments, after the green body is plasma cleaned, the conductive layer is reduced using a reducing solution before the conductive layer is covered with insulating resin.

[0025] After the blank is plasma cleaned, the outer surface of the conductive layer is easily oxidized and forms an oxide layer. Since the conductive layer is usually made of conductive metal, once the conductive metal is oxidized, it will affect the thickness of the conductive metal and the specific gravity of the conductive metal elements, thereby affecting the quality factor of the electronic component. Using a reducing solution to reduce the blank can remove the oxide layer on the conductive layer, increase the atomic specific gravity of the conductive metal elements in the conductive layer, and thus improve the quality factor of the electronic component.

[0026] In some embodiments, the reducing solution includes one of the following: ethanol, dilute hydrochloric acid, or dilute sulfuric acid.

[0027] Since the above-mentioned reducing solution can chemically react with oxidized metals such as copper oxide, but will not chemically react with the insulating resin, it will not affect the insulating resin layer while reducing the oxide layer.

[0028] In some embodiments, using a reducing solution to perform a reduction treatment on the conductive layer includes: immersing the plasma-cleaned body in the reducing solution.

[0029] It can be seen that immersing the entire green body in the reducing solution can quickly reduce the oxide layer on the green body and improve the efficiency of the reducing treatment.

[0030] In some embodiments, making a layer of stacked structure includes: after making a substrate using an insulating resin film, sputtering a conductive material layer on the substrate, coating a photoresist on the conductive material layer, exposing and developing the conductive material layer coated with the photoresist to form a coil pattern on the substrate, electroplating the substrate with the coil pattern, and forming a conductive layer on the substrate.

[0031] It can be seen that the conductive material layer can be quickly laid on the substrate by sputtering the conductive material layer, and the conductive layer can be accurately formed on the substrate through the processes of exposure, development and electroplating. The process of forming the conductive layer is simple and the production efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the structural decomposition of an existing electronic component.

[0033] Figure 2 It is a schematic structural diagram of an electronic component embodiment of the present invention.

[0034] Figure 3 It is a schematic diagram of the first stage of an embodiment of the method for manufacturing an electronic component of the present invention.

[0035] Figure 4 It is a schematic diagram of the second stage of the embodiment of the method for manufacturing an electronic component of the present invention.

[0036] Figure 5 It is a schematic diagram of the third stage of the embodiment of the method for manufacturing an electronic component of the present invention.

[0037] Figure 6 It is a schematic diagram of the fourth stage of the embodiment of the method for manufacturing an electronic component of the present invention.

[0038] Figure 7 It is a structural schematic diagram of an electronic component embodiment of the present invention from another perspective.

[0039] Figure 8 It is a graph comparing the quality factors of the electronic component embodiment of the present invention and the traditional electronic component.

[0040] The present invention is described in detail below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0041] The electronic component of the present invention is a high-frequency inductor, which is a stacked high-frequency inductor and is manufactured by an additive process.

[0042] See also Figure 2 The electronic component has a multi-layer stacked structure, each of which has an insulating resin layer 46 and a conductive layer 42. The insulating resin layer 46 is made of insulating resin, for example, a photosensitive insulating resin that can react under yellow light and be easily cleaned. In addition, the insulating resin layer 46 is made of an electrically insulating material and can electrically isolate two adjacent conductive layers 42.

[0043] The conductive layer 42 is formed in the insulating resin layer 46. The conductive layer 42 is made of a conductive material, such as a conductive metal material, and the conductive metal material includes copper, etc. Each conductive layer 42 can be arranged in a surrounding manner, and two adjacent conductive layers 42 need to be electrically connected so that current can flow between the multiple conductive layers 42. Since the multiple conductive layers 42 form a surrounding structure, the current will form a magnetic field after flowing through the multiple conductive layers 42. It can be seen that the multiple conductive layers 42 can form a surrounding inductor coil.

[0044] Two external connection terminals 45 are formed on the outer end surface of the electronic component. Figure 2 As shown, two external terminals 45 are respectively arranged on both sides of the electronic component, and each external terminal 45 needs to be electrically connected to a conductive layer 42 , and current flows into the inductor from one of the external terminals 45 and flows out from the other external terminal 45 .

[0045] Combine the following Figures 3 to 6 A method for manufacturing an electronic component is introduced. When manufacturing an electronic component, a laminated structure of the electronic component needs to be manufactured. In this embodiment, the multi-layer laminated structure is manufactured layer by layer, that is, the first laminated structure is manufactured first, and then the second laminated structure is manufactured based on the first laminated structure, and so on.

[0046] See also Figure 3 When making the first layer of the laminated structure, first make a substrate 41. The substrate 41 is made of an insulating resin, which is a photosensitive insulating resin. When making the substrate 41, first make an insulating resin raw material to make an insulating resin film, and then use a vacuum laminating machine to press the insulating resin film onto a carrier to make a flat substrate 41. By controlling the vacuum laminating machine, the substrate 41 of suitable thickness can be made. Usually, the thickness of the substrate 41 is between a few microns and tens of microns. Then, a conductive metal material is sputtered on the substrate 41 to form a conductive material layer on the substrate 41. Usually, the conductive material layer is a metal material, such as copper. Next, spin-coat a photoresist on the conductive material layer, and the photoresist will be formed above the conductive material layer. Then, a coil pattern is formed through an exposure process and a development process. After exposure and development, the conductive material on the area corresponding to the coil pattern is removed to form grooves, and these grooves will form a coil pattern. Finally, a conductive coil is made through an electroplating process. Specifically, the substrate with the coil pattern is electroplated, and the grooves forming the coil pattern are electroplated and filled with conductive metal materials. These metal materials form a conductive layer 42, thereby forming a conductive layer 42 of a specific shape on the substrate 41, thereby forming a blank.

[0047] Then, after removing the photoresist and the excess sputtered conductive metal material, the blank is subjected to a plasma cleaning operation. Specifically, the blank is placed in a plasma cleaning device, and the plasma cleaning device blows out plasma gas, such as Figure 3 As shown by the arrow, after the plasma gas blows through the conductive layer 42, the surface of the conductive layer 42 will be cleaned, which can remove some impurities on the one hand and make the surface of the conductive layer 42 rough on the other hand. After plasma cleaning, the surface of the conductive layer 42 becomes uneven, and the surface roughness is between 0.08 microns and 0.11 microns. In actual production, the surface roughness of most conductive layers 42 is between 0.09 microns and 0.10 microns.

[0048] Since the plasma gas has an oxidizing effect on the conductive metal material, a metal oxide layer 50 will be formed on the surface of the conductive layer 42 after plasma cleaning. Figure 4 As shown, if the conductive layer 42 is made of copper, then after plasma cleaning, a layer of copper oxide will be formed on the surface of the conductive layer 42. Since the conductivity of the metal oxide layer 50 is far less than that of the conductive layer 42, the metal oxide layer 50 formed on the conductive layer 42 will affect the quality factor of the electronic component, resulting in a decrease in the performance of the electronic component.

[0049] In order to solve this problem, the present embodiment performs a reduction treatment on the blank after plasma cleaning, for example, immersing the blank in a reducing solution, and reducing the metal oxide layer 50 with the reducing solution. The reducing solution used in the present embodiment is one of ethanol, dilute hydrochloric acid or dilute sulfuric acid. Of course, in other embodiments, other reducing solutions can also be used, or the reducing solution can be a mixture, such as a mixture containing dilute hydrochloric acid and dilute sulfuric acid. The reducing solution can chemically react with the metal oxide layer 50, reducing the metal oxide layer 50 to form a conductive metal, thereby achieving the purpose of removing the metal oxide layer 50. In addition, the reducing solution cannot chemically react with the insulating resin, that is, the reducing solution cannot affect the substrate 41. The blank after the reduction treatment is as follows Figure 5 As shown, the metal oxide layer 50 on the conductive layer 42 is removed. It can be seen that the conductive layer 42 of this embodiment is a conductive metal layer. After the reduction treatment, the proportion of oxygen atoms in the conductive metal layer is less than 2% by weight, thereby ensuring that the content of oxides in the conductive metal layer is very low, which will not affect the conductive performance of the conductive layer 42 and improve the quality factor of the electronic component.

[0050] Finally, a vacuum laminator is used to press an insulating resin film 44 on the outside of the conductive layer 42. Figure 6As shown, the conductive layer 42 is wrapped by the insulating resin film 44. In addition, the insulating resin film 44 is also made of insulating resin, and the material of the insulating resin film 44 is the same as the material of the substrate 41. Since the surface of the insulating resin film 44 is relatively smooth, the surface roughness of the conductive layer 42 can be increased by plasma cleaning the conductive layer 42. When the insulating resin film 44 is formed, the bonding force between the conductive layer 42 and the insulating resin film 44 can be increased to avoid separation between the conductive layer 42 and the insulating resin film 42. On the one hand, the quality factor of the electronic components can be improved, and on the other hand, the production qualification rate of the electronic components can be improved. The insulating resin film 44 is also covered on the substrate 41 to form an insulating resin layer 46.

[0051] After one layer of stacked structure is completed, a via hole needs to be formed on the stacked structure, and a conductive material is filled in the via hole to form a conductor. The via hole needs to extend to the conductive layer 42 so that the conductor is electrically connected to the conductive layer 42. At this point, the first layer of stacked structure is completed.

[0052] When making other subsequent stacked structures, the above-mentioned process is also used, such as directly sputtering a conductive material layer on the insulating resin layer 46 of the previous stacked structure, and forming a circuit pattern through exposure, development and other processes, and making a conductive layer through an electroplating process, and then forming a second stacked structure through plasma cleaning, reduction treatment, pressing of insulating resin film and other processes. The subsequent other stacked structures are also carried out using the above-mentioned process. After a predetermined number of stacked structures are made, the entire product is cut using a laser cutting device to form small semi-finished products. The size structure of the semi-finished product meets the requirements of the metric 0402 and below. The size of the semi-finished product can be 0.4mm×0.2mm×0.3mm, or 0.4mm×0.2mm×0.2mm.

[0053] Finally, the outer end surface of the semi-finished product is electroplated to form an external terminal. During the electroplating, a nickel layer is electroplated on the outer surface of the external terminal 45, and then a zinc layer is electroplated to form a desired external terminal 45.

[0054] See also Figure 7 The finally formed electronic component has multiple conductive layers 42, each conductive layer 42 is wrapped by an insulating resin layer 46, and a via 48 is formed in the insulating resin layer 46. The via 48 is filled with a conductive material to form a conductor 49, and the electrical connection between the two adjacent conductive layers 42 is achieved through the conductor 49.

[0055] Since the conductive layer 42 is plasma cleaned, the roughness of the surface where the conductive layer 42 contacts the insulating resin layer 46 is between 0.08 microns and 0.11 microns, thereby improving the bonding strength between the conductive layer 42 and the insulating resin layer 46 and avoiding stratification between the conductive layer 42 and the insulating resin layer 46.

[0056] In addition, by reducing the blank with a reducing solution, the proportion of oxygen atoms in the conductive layer 42 can be lowered. For example, by weight, the proportion of oxygen atoms in the conductive metal layer is less than 2%, and the proportion of metal atoms in the conductive metal layer is greater than 60%, thereby ensuring that the electronic components have a higher quality factor.

[0057] In some embodiments, in the insulating resin layer 46 located between two adjacent conductive layers 42, the insulating resin layer 46 located 2 microns away from the bottom of the conductive layer 42 contains a first metal element and a second metal element, for example, the first metal element is copper, the second metal element is titanium, and the atomic proportion of the first metal element is between 30% and 45% by mass, and the atomic proportion of the second metal element is between 1% and 2%. In addition, in the insulating resin layer 46 located between two adjacent conductive layers 42, the atomic proportion of the first metal element is between 8% and 20% by mass in the insulating resin layer 46 located 4 microns away from the bottom of the conductive layer 42. In addition, in the insulating resin layer 46 located between two adjacent conductive layers 42, the atomic proportion of the first metal element is between 35% and 45% by mass in the insulating resin layer 46 located 6 microns away from the bottom of the conductive layer 42. In this way, at different positions away from the bottom of the conductive layer 42 , the atomic ratio of the first metal element in the insulating resin layer 46 varies, thereby ensuring the electrical insulation performance of the insulating resin layer 46 to the conductive layer 42 .

[0058] In addition, for the electronic components with the logo 51 printed on the outer end surface, in the insulating resin layer 46 at a close distance of 4 microns from the mark 51, the atomic proportion of the second metal element is between 1% and 4% by mass, that is, the proportion of titanium atoms is between 1% and 4%.

[0059] The quality factor test experiment was conducted on the electronic components that were treated with reduction after plasma cleaning and the electronic components that were not treated with reduction after plasma cleaning. The experimental results are as follows: Figure 8 As shown. Figure 8 It can be seen that compared with electronic components that have not been reduced after plasma cleaning, electronic components that have been reduced after plasma cleaning have higher quality factors and meet the use requirements of high-performance electronic components.

[0060] Finally, it should be emphasized that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An electronic component comprising a multi-layer stacked structure, each layer of the stacked structure having an insulating resin layer and a conductive layer, wherein the insulating resin layer is coated outside the conductive layer; The insulating resin layer is provided with a via hole, the via hole is filled with a conductor, and the conductor connects two adjacent conductive layers; The outer end surface of the electronic component is provided with at least two external terminals, each of which is electrically connected to one of the conductive layers; Features: At least one surface of the conductive layer is in contact with the insulating resin layer, and a roughness of the surface of the conductive layer in contact with the insulating resin layer is between 0.08 micrometers and 0.11 micrometers.

2. The electronic component according to claim 1, characterized in that: The conductive layer is a conductive metal layer, and the proportion of oxygen atoms in the conductive metal layer is less than 2% by mass.

3. The electronic component according to claim 2, characterized in that: In terms of mass, the atomic proportion of the first metal element [NICKY1] in the conductive metal layer is greater than 60%.

4. The electronic component according to claim 3, characterized in that: In the insulating resin layer located between two adjacent conductive layers, the insulating resin layer 2 microns away from the bottom of the conductive layer contains the first metal element and the second metal element. By mass, the atomic proportion of the first metal element is between 30% and 45%, and the atomic proportion of the second metal element is between 1% and 2%.

5. The electronic component according to claim 4, characterized in that: In the insulating resin layer located between two adjacent conductive layers, in the insulating resin layer 4 microns away from the bottom of the conductive layer, the atomic proportion of the first metal element is between 8% and 20% by mass.

6. The electronic component according to claim 4, characterized in that: In the insulating resin layer located between two adjacent conductive layers, in the insulating resin layer 6 microns away from the bottom of the conductive layer, the atomic proportion of the first metal element is between 35% and 45% by mass.

7. The electronic component according to claim 4, characterized in that: A mark is printed on at least one outer end surface of the electronic component, and in the insulating resin layer at a distance of 4 micrometers from the mark, the atomic proportion of the second metal element is between 1% and 4% by mass.

8. The electronic component according to any one of claims 4 to 7, characterized in that: The first metal element is copper, and the second metal element is titanium.

9. A method for manufacturing an electronic component, comprising: A multi-layer stacked structure is manufactured. When manufacturing each layer of the stacked structure, a substrate is first manufactured, and a conductive layer is manufactured on the substrate. The substrate is made of insulating resin. Features: Placing the green body with the conductive layer formed thereon in a plasma cleaning device, and performing plasma cleaning on the green body, so that the surface roughness of the conductive layer is between 0.08 micrometers and 0.11 micrometers; Covering the conductive layer with insulating resin to form an insulating resin layer, making via holes on the insulating resin layer, and filling the via holes with conductors so that the conductors connect two adjacent conductive layers; After manufacturing a stacked structure with a preset number of layers, a semi-finished product is obtained, and an external terminal is formed by electroplating on the outer end surface of the semi-finished product.

10. The method for manufacturing an electronic component according to claim 9, characterized in that: After the green body is plasma cleaned, the conductive layer is reduced using a reducing solution before the conductive layer is covered with insulating resin.

11. The method for manufacturing an electronic component according to claim 10, characterized in that: The reducing solution includes one of the following: ethanol, dilute hydrochloric acid or dilute sulfuric acid.

12. The method for manufacturing an electronic component according to claim 10, characterized in that: The reducing treatment of the conductive layer using the reducing solution includes: immersing the plasma-cleaned body in the reducing solution.

13. The method for manufacturing an electronic component according to any one of claims 9 to 12, characterized in that: Making a layer of the stacked structure includes: after making the substrate using an insulating resin, sputtering a conductive material layer on the substrate, coating the conductive material layer with photoresist, exposing and developing the conductive material layer coated with the photoresist to form a coil pattern on the substrate, and electroplating the substrate with the coil pattern to form the conductive layer on the substrate.

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