Voltage-matched two-end perovskite-crystalline silicon laminated assembly and preparation method thereof

Abstract

The invention discloses a voltage-matched two-end perovskite-crystalline silicon laminated assembly and a preparation method thereof, the laminated assembly comprises a perovskite top assembly and a crystalline silicon bottom assembly, the perovskite top assembly comprises a plurality of square perovskite assemblies, the square perovskite assemblies are provided with perovskite battery pieces in a laser scribing mode, and the perovskite battery pieces are arranged on the crystalline silicon bottom assembly. The adjacent perovskite cell pieces are connected in series and in parallel, the crystalline silicon bottom assembly comprises a plurality of crystalline silicon cell pieces connected in series and in parallel, the perovskite top assembly and the crystalline silicon bottom assembly are independently stacked, and the MLPE assembly is connected to one side of the crystalline silicon bottom assembly in series and is integrally connected with the perovskite top assembly in parallel. The top assembly adopts a splicing mode, efficiency loss caused by area expansion of a single perovskite assembly is avoided, the bottom assembly adopts a high working voltage and an MLPE assembly, and when the environment temperature changes, the working voltage of the bottom cell assembly can be adjusted, so that the bottom cell assembly is matched with the top cell assembly; compared with a conventional four-end assembly, the system installation cost is reduced, and meanwhile the power generation capacity of the four-end assembly is reserved.

Description

Technical Field

[0001] The present invention belongs to the technical field of photovoltaic cells, and in particular relates to a voltage-matched two-terminal perovskite-crystalline silicon stacked component and a preparation method thereof. Background Art

[0002] Perovskite solar tandem cells have attracted widespread attention due to their high photovoltaic conversion efficiency and low cost. For commercial tandem cells, four-terminal voltage matching (VM) is an easier and safer way to achieve. Compared with current matching at both ends, the VM structure can provide a way to circumvent the obstacles to manufacturing mechanical tandem solar cells. After the bottom cell string and the top cell string are connected in parallel to form a 2T tandem assembly, they can work independently or in combination without the use of a tunnel junction, allowing single-junction cells to be manufactured separately in a preferred configuration using traditional manufacturing methods before integration using a compatible intermediate layer. At the same time, the VM structure is less sensitive to day-night temperature changes in the solar spectrum, so it can also perform better under suboptimal lighting conditions.

[0003] However, in the process of enlarging and preparing perovskite crystalline silicon stacked cells, it is difficult to control efficiency and stability at the same time. Generally, the stability of high-efficiency components will be reduced accordingly. In addition, due to the high voltage problem caused by laser scribing to improve efficiency, the development of the stacking route of large-area perovskite and low-voltage crystalline silicon cells is greatly restricted. The huge voltage gap between perovskite components and crystalline silicon bottom cell components means that four-terminal stacked components usually require two inverters to be connected separately, which greatly increases the system cost of the stacked components.

[0004] Existing stacking technology patents are mostly focused on laser scribing to achieve series-parallel adjustment, but on large-area perovskite single-junction cells, the uniformity and defects of several long-series sub-cells are difficult to avoid. The limitation of the minimum current of the series structure will infinitely magnify the defects, greatly affecting the stability of efficiency. A larger proportion of patents focus on the optimization of the electrical performance and stability of perovskite single-junction or two-terminal stacked cells based on additive engineering, and there are few performance optimizations on the perovskite component end. Summary of the invention

[0005] In order to solve the technical problem of voltage matching of the above-mentioned stacked components, the present invention provides a voltage-matched two-terminal perovskite-crystalline silicon stacked component and a preparation method thereof, adopting a 2T stacking design with component end voltage matching, and utilizing small-area high-efficiency perovskite components to construct large-area stacked cells. Compared with large-area perovskite components with lower efficiency, small-area perovskite components usually have higher efficiency and lower voltage, and can better achieve voltage matching with crystalline silicon strings.

[0006] A voltage-matched two-terminal perovskite-crystalline silicon stacked component comprises a perovskite top component and a crystalline silicon bottom component, wherein the perovskite top component comprises a plurality of square perovskite components, the square perovskite components are provided with perovskite cells by laser engraving, and adjacent perovskite cells are connected in series and parallel, and the crystalline silicon bottom component comprises a plurality of crystalline silicon cells, and adjacent crystalline silicon cells are connected in series and parallel, the perovskite top component and the crystalline silicon bottom component are independently and stacked; an MLPE component is connected in series between the perovskite top component and the crystalline silicon bottom component.

[0007] Preferably, busbar lines are reserved at the top and bottom of the square perovskite component, which are combined in series and parallel to form a perovskite top component, which is then voltage matched and circuit-connected with the crystalline silicon bottom component.

[0008] Preferably, the bus line is made of alloy material, or a plating process is performed on the surface of the bus line.

[0009] Preferably, the bus line is corrugated, or the bus line is partially folded to increase the length of the curved path.

[0010] Preferably, structurally, a foldable structure or ultra-thin flexible glass is laid in the gap between adjacent square perovskite components to achieve the connection between adjacent square perovskite components and enable the components to obtain flexible curling capabilities.

[0011] Preferably, on the packaging material, in order to achieve a foldable structure or bonding of ultra-thin flexible glass with a square perovskite component, a thermoplastic adhesive film is filled and the two are combined into one by lamination.

[0012] Preferably, a layer of glass or flexible substrate is first packaged on the square perovskite component, and then the packaged square perovskite components are arranged in order and stacked with the crystalline silicon bottom components, and then a layer of polymer film and flexible substrate are secondarily packaged.

[0013] Preferably, the width or number of the bus lines is increased to improve the redundancy of the conductive performance.

[0014] The present invention also discloses a method for preparing a voltage-matched two-terminal perovskite-crystalline silicon stacked component, comprising the following steps: Step 1: prepare square perovskite components, and connect the sub-cells in series after laser scribing inside the components to form square perovskite components; perform independent primary packaging on the square perovskite components, use glass or flexible substrate as transparent front and back panels, and use thermosetting adhesive film or hot melt adhesive as adhesive material to achieve perovskite component integration; Step 2, forming a perovskite top component: the square perovskite components are arranged in a matrix, the square perovskite components in the same row are connected in series and parallel to form a component string, and the positive and negative electrodes of the component string in each row are converged and led out to form a perovskite top component; Step 3: Preset the appropriate position layout of the crystalline silicon cell string according to the electrical parameters of the perovskite top component, connect the MLPE at the circuit confluence of the crystalline silicon bottom component, and lay the crystalline silicon bottom component; Step 4: Lay out the stacked components and perform secondary packaging: Secondary packaging of non-detachable laminated components: Lay the packaging film, crystalline silicon bottom component, packaging film, perovskite top component string, packaging film, and transparent front plate on the transparent back plate in sequence, and put them into the laminator for integration; Secondary packaging of detachable stacked components: laying packaging film, crystalline silicon bottom component, packaging film, bottom component transparent front plate, detachable connecting device, top component transparent back plate, packaging film, perovskite component string, packaging film, top component transparent front plate in sequence on the bottom component transparent back plate, and entering into a laminator for integration, or dividing into two units from the detachable connection position, laminating them separately and then connecting them.

[0015] Preferably, the front plate and the back plate are highly transparent flexible transparent front plates or thickened PET highly transparent polymer substrates; the adhesive film is made of EVA, POE or EVA / POE co-extruded.

[0016] Preferably, when a foldable structure or ultra-thin flexible glass is laid in the gap between the perovskite components, a thermoplastic film is filled in the gap and the two are integrated into one by lamination.

[0017] The beneficial effects of the present invention are: (1) The voltage-matched two-terminal perovskite-crystalline silicon stacked component disclosed in the present invention is constructed by splicing the top component, which not only avoids the efficiency loss caused by the expansion of the area of ​​a single perovskite component, but also ensures the consistency between small components through testing and sorting. The bottom component adopts a high working voltage and a DC-DC buck. When the ambient temperature changes, it can adjust the working voltage of the bottom battery component to match the top battery component, reduce the voltage adaptation loss of the component, and increase the output power of the component. Compared with conventional four-terminal components, it reduces the system installation cost while retaining the power generation capacity of the four-terminal components; (2) The voltage-matched two-terminal perovskite-crystalline silicon stacked module disclosed in the present invention solves the problems of excessive weight of glass in four-terminal stacked battery modules, unreasonable application scenarios, and limitations on bending, folding, and disassembly; (3) The voltage-matched two-terminal perovskite-crystalline silicon stacked component disclosed in the present invention achieves the effect of making the entire component partially foldable and detachable by laying a thinner and more resistant-to-bending thermoplastic packaging material in the gaps between the perovskite components; secondly, the bending resistance of the busbar itself is improved through the design of the structure and materials, thereby solving the line problem that may exist after the introduction of the foldable component; (4) The voltage-matched two-terminal perovskite-crystalline silicon stacked component disclosed in the present invention realizes the direct combination of the perovskite hard component by partially expanding and contracting the glass area, thereby realizing the flexible design of the perovskite component. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 This is a schematic diagram of parallel superposition welding between perovskite components according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall parallel connection of perovskite components according to an embodiment of the present invention; Figure 3 is a schematic diagram of a method for preparing a 2T VM perovskite stack according to an embodiment of the present invention; Figure 4 It is a schematic diagram of the setting position of the MLPE buck converter according to an embodiment of the present invention. Description of Reference Numerals

[0020] 1-bus circuit, 2-perovskite cell, 3-schematic point. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example 1

[0022] This application is based on the design of the end stability of the stacked battery module, and provides a high-efficiency module for large-area perovskite-crystalline silicon two-terminal stacking. The small-area perovskite modules are combined in series and parallel by reserving the bus line to form a large-area perovskite stable top module, and then the voltage is matched with the crystalline silicon bottom battery string through MLPE (with DC-DC buck converter components). After the perovskite-crystalline silicon module is adjusted by MLPE, the bottom module and the top module are combined into one, with one positive and one negative lead, to form a 2T module. Figure 4 After the circuit shown is connected, it is encapsulated by a flexible substrate. The laminated component has a certain flexibility to achieve a partial bending effect, and the perovskite component part has a stronger mechanical strength due to the two layers of encapsulation materials.

[0023] like Figure 1 to Figure 2 As shown, the perovskite top component includes several square perovskite components (such as Figure 1The square unit shown in the figure) adopts the current commercial stable structure. The perovskite cell 2 in the square perovskite module can be connected in series or in parallel. Most of the current commercial perovskites, after laser scribing, the sub-cells are basically connected in series, such as Figure 1 As shown. The top and bottom of the square perovskite component are laser-reserved bus lines 1, and several square perovskite components are arranged in a matrix distribution. In this embodiment, adjacent perovskite components in the same row are connected in parallel through the bus lines 1 reserved at the top and bottom to form a perovskite component string, which is suitable for matching bottom components with lower voltage. The positive and negative electrodes of the perovskite component string are respectively connected to form a large-area perovskite top component. After the small-area square perovskite components are connected in parallel, the voltage is the small component voltage, which will be easier to match with the crystalline silicon string, and a four-terminal stacked component with the best open-circuit voltage matching, higher efficiency and more guaranteed stability can be obtained.

[0024] The crystalline silicon bottom component includes a plurality of crystalline silicon cells, and adjacent crystalline silicon cells are connected in series and in parallel to form a crystalline silicon bottom component. The voltage between the top component and the bottom component is balanced according to the actual situation. For example, the layout and convergence method of the crystalline silicon cells are determined according to the electrical parameters of the top perovskite component: when the voltage of the crystalline silicon bottom component is higher than the voltage of the perovskite top component, the perovskite cells in the perovskite top component are connected in series; when the voltage of the crystalline silicon bottom component is lower than the voltage of the perovskite top component, the perovskite cells in the perovskite top component are partially connected in parallel. The small-area perovskite top components are connected in parallel to lower the component voltage and better match, and the failure of a single component does not affect the overall power generation. In this embodiment, if Figure 2 As shown in the figure, the series-parallel connection of the perovskite top component is: the cells inside the square perovskite component are connected in series, and the square perovskite components are connected in parallel, which is suitable for matching the bottom component with lower voltage. In fact, the series structure can also be used between the square perovskite small components, so that the voltage of the top component will increase, which is suitable for matching the bottom component with higher voltage, and then the electrical parameters of the top component are used to determine the bottom component.

[0025] The perovskite top component and the crystalline silicon bottom component are stacked for voltage matching and circuit connection. The positive and negative electrodes of the perovskite top component and the crystalline silicon bottom component are led out after adjustment based on a DC-DC buck to obtain a 2T VM module.

[0026] After the voltages of the bottom component and the top component are matched, they can be connected in parallel and work stably. If the voltage of the top component changes during operation, the DC-DC starts working to reduce or increase (most likely reduce) the voltage of the bottom component to achieve stable operation. The voltage of the square perovskite components after series and parallel connection is the voltage of a small component, so it will be easier to match with the crystalline silicon string, and there is hope of obtaining a more efficient component. Module-level power electronic equipment (MLPE) is set in the crystalline silicon bottom component. In this embodiment, the MLPE uses a DC-DC buck to reduce efficiency losses caused by voltage mismatch. While maintaining the efficiency advantage of small-area perovskites, the preparation of stable stacked components is achieved. The setting position of the DC-DC buck is as shown in the following figure. Figure 4 As shown, the perovskite top component and the crystalline silicon bottom component are connected in parallel through a DC-DC buck, and the high efficiency of the small-area perovskite component is used to improve the photoelectric conversion efficiency of the overall component. The use of a buck converter can reduce costs and improve efficiency, and on the basis of maintaining the efficiency advantage of small-area perovskites, a stable stacked component can be prepared. At the same time, based on the DC-DC buck, the voltage of the perovskite top component and the crystalline silicon bottom component is adjusted according to the maximum power point, and the maximum power point of the perovskite top component is adjusted to be slightly lower than that of the crystalline silicon bottom component.

[0027] 2T VM modules experience relatively small efficiency losses from voltage mismatch compared to unconstrained 4T designs. The 2TVM module assembly is mounted in a similar way to existing crystalline silicon modules, which also helps gain acceptance from manufacturers and installers. This configuration also ensures that large voltage differences do not develop between the top and the cell, which brings reliability and safety. Due to different properties such as the temperature coefficients of silicon and perovskites, the ideal ratio of silicon and perovskite cells per module substring in a voltage-matched configuration increases significantly with increasing temperature. As the operating temperature increases, the fill factor of silicon and perovskite cells decreases, making the module less sensitive to voltage mismatch under warmer conditions. Therefore, under warmer conditions, the 2T VM configuration can use a wider range of cell string ratios with minimal power output loss compared to the 4T case.

[0028] In order to adapt to the flexible combination and expansion of application scenarios, it is preferred to lay a foldable structure or ultra-thin flexible glass in the gap between the square perovskite components, and realize the connection of adjacent square perovskite components based on the foldable structure or ultra-thin flexible glass. The foldable structure or ultra-thin flexible glass can realize the expansion and contraction of part of the glass area of ​​the square perovskite component, realize the direct combination of the perovskite hard component, ensure that the internal circuit is intact during bending, and achieve the effect of partial foldability and detachability of the entire component. The ultra-thin flexible glass can be as thin as 30 microns, which is only one-fourth the thickness of ordinary A4 paper, and the bending radius can reach 0.5 mm. Drawing on the idea of ​​flexible foldable screens for mobile phones, ultra-thin flexible glass components are added between perovskite and perovskite components to achieve partial foldability of the components.

[0029] At the same time, by selecting flexible packaging materials to encapsulate each square perovskite component individually, the bending performance control is achieved on the basis of ensuring the availability of the square perovskite component. Specifically, Glass or highly transparent flexible substrate (PET polymer plastic film, acrylic film, etc.) is used as the front plate or back plate. EVA, POE and other packaging films are laid between the transparent front and back plates and the battery, which can melt and fill the gaps at the lamination temperature and cross-link and solidify to achieve seamless connection between the transparent front plate (back plate) and the battery, and to achieve full coverage packaging of the square perovskite components and control of the bending resistance between the components while filling the gaps between the square perovskite components.

[0030] In order to achieve the overall bending resistance of the perovskite-crystalline silicon stacked components, we start from both the material and structure aspects. In terms of materials, for the busbars, select alloy materials or surface plating treatments with good conductivity and high mechanical strength, such as copper-silver alloys and silver-clad copper, and combine some structural designs to improve the bending resistance of the busbars. Structurally, for the busbars, a corrugated design is used to increase the bending path length of the material, reduce local stress concentration, and maintain the conductivity of the material; or increase the redundancy of the conductivity by increasing the width or number of the busbars, so that even if bending damage occurs in some parts, good conductivity can be maintained. Figure 2 The schematic point 3 shown is the positive and negative convergence focus of each row of components. The busbar at the schematic point 3 is designed with redundancy and wave (especially the busbar concave and convex at the overlap to achieve bending coverage and bending resistance) so that the total busbar line completely covers the busbar line below. When the component is bent, the force at this point is dispersed to maintain good conductivity. The wave design and the redundant design are consistent in principle, both of which reduce the possibility of breakage when the component is bent and deformed by adding extra length.

[0031] After the square perovskite module itself is packaged in one layer, it is stacked with the crystalline silicon module for secondary packaging (polymer film and flexible substrate). Since the perovskite module is equivalent to two packages, the water vapor transmission rate is reduced. Using a thin and light flexible substrate with the same refractive index as the film as the outermost packaging material can achieve better light transmittance and component flexibility characteristics to a large extent. Example 2

[0032] The present invention also discloses a method for preparing a voltage-matched two-terminal perovskite-crystalline silicon stacked component, such as Figure 3 As shown, the following steps are included: S1, prepare small-area square perovskite components: prepare multiple efficient and stable small-area square perovskite components (sizes such as 300*300mm, 500*500mm, etc.). The small-area square perovskite components use the current commercial stable structure inside. After laser scribing, the sub-cells can be connected in series or in parallel. For most current commercial perovskites, the sub-cells are basically connected in series after laser scribing. The square perovskite components are packaged independently once, and the transmission layer, perovskite active layer, etc. are coated on the conductive glass as the substrate. The perovskite sub-cells are connected in series and in parallel in combination with laser scribing. Glass or flexible substrates are used as transparent front and back panels during packaging, and thermosetting adhesive films or hot melt adhesives are used as adhesive materials to achieve the integration of perovskite components and protect and isolate the perovskite materials from water vapor and oxygen.

[0033] S2, connecting small-area square perovskite components in series and parallel to form a large-area perovskite top component: In this embodiment, according to the design principle that the voltage of the bottom heterojunction component is slightly higher than the total voltage of the top perovskite component, the perovskite components are connected in parallel to achieve relatively low voltage and high current, while maintaining the efficiency advantage of small-area perovskite, and realizing the preparation of stable stacked amplification components.

[0034] Preferably, when the gaps between the perovskite components are paved with foldable structures or ultra-thin flexible glass, a thinner thermoplastic film is filled in the gaps, and the two are combined into one by lamination. While improving flexibility, the atmosphere where the perovskite small components are located is protected to be stable, free of moisture and bubbles. By utilizing the deformation of the polymer plastic material itself and the filling of a small amount of film, the perovskite small components are fully encapsulated and the gaps between components are filled.

[0035] S3, preset and lay out the appropriate position layout of the bottom crystalline silicon solar cells according to the series and parallel arrangement, size and electrical parameters of the perovskite top components.

[0036] S4, laying out the stacked components and performing secondary packaging: Secondary packaging of non-detachable laminated components: Lay packaging film (EVA, POE or EVA / POE co-extrusion) on the transparent back panel in sequence, crystalline silicon battery string (bottom component), packaging film, perovskite top component string (foldable glass and thermoplastic film are laid in the gaps between components), packaging film, transparent front panel and put them into the laminator for integration.

[0037] Secondary packaging of detachable stacked components: On the transparent back plate of the bottom component, packaging film (EVA, POE or EVA / POE co-extrusion), crystalline silicon battery string (bottom component), packaging film, bottom component transparent front plate, detachable connection device (suction cup, buckle, etc.), top component transparent back plate, packaging film, perovskite component string (foldable glass and thermoplastic film are laid in the gap between components), packaging film, top component transparent front plate are laid in sequence, and then put into the laminator for integration, or divided into two units from the detachable connection position and laminated separately and then connected. The detachable stacked components use a detachable connection device (suction cup, buckle, etc.) between the two transparent front and back plates to achieve mechanically detachable upper and lower components independent stacking.

[0038] During the lamination process, the adhesive film melts to fill the gaps and remove air and excess adhesive film. After cross-linking and curing, the battery cell and the transparent front and rear panels are combined into one.

[0039] The front and rear panels are made of thinner and more bend-resistant thermoplastic packaging materials (high-transmittance flexible transparent acrylic or thickened PET), glass or flexible substrates. The high-transmittance flexible acrylic front panel is preferably used for full-coverage packaging to protect the shape, and the perovskite component is secondary-encapsulated in the middle. The deformation of the polymer plastic material itself and the filling of a small amount of adhesive film are used to achieve full-coverage packaging of the small perovskite components and filling of the gaps between components. It should be noted that if 2T is not removable, its front panel is the front panel of the bottom component. If 2T is removable, its front panel is an independent front panel of the bottom component. The role of flexible glass combined with thermoplastic packaging materials is not only to achieve foldability, but also to provide support to reduce deformation.

[0040] The combination of a layer of encapsulation of the square perovskite component itself and a secondary encapsulation when the crystalline silicon component is superimposed achieves the high efficiency of the component, which is both rigid and flexible. Combined with flexibility, the gaps between the perovskite components are laid with thinner and more resistant thermoplastic encapsulation materials to achieve the effect of partial foldability and detachability of the entire component. The front panel uses a highly transparent flexible transparent acrylic or thickened PET highly transparent polymer substrate, and uses the deformation of the polymer plastic material itself and a small amount of film filling to achieve full coverage encapsulation of the perovskite small component and control of the bending resistance between components.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A voltage-matched two-terminal perovskite-crystalline silicon stacked component, characterized in that: It includes a perovskite top component and a crystalline silicon bottom component. The perovskite top component includes a plurality of square perovskite components. The square perovskite components are provided with perovskite cells by laser engraving. Adjacent perovskite cells are connected in series and parallel. The crystalline silicon bottom component includes a plurality of crystalline silicon cells. Adjacent crystalline silicon cells are connected in series and parallel. The perovskite top component and the crystalline silicon bottom component are independently and stacked. An MLPE component is connected in series between the perovskite top component and the crystalline silicon bottom component.

2. The voltage-matched two-terminal perovskite-crystalline silicon stacked component according to claim 1, characterized in that: The top and bottom of the square perovskite component are reserved for busbar lines, which are combined in series and parallel to form a perovskite top component, and then voltage matching and circuit connection are performed with the crystalline silicon bottom component.

3. The voltage-matched two-terminal perovskite-crystalline silicon stacked component according to claim 2, characterized in that: The bus line is made of alloy material, or a plating process is performed on the surface of the bus line.

4. The voltage-matched two-terminal perovskite-crystalline silicon stacked component according to claim 2, characterized in that: The bus line is corrugated, or the bus line is partially folded to increase the length of the curved path.

5. The voltage-matched two-terminal perovskite-crystalline silicon stacked component according to claim 1, characterized in that: Structurally, a foldable structure or ultra-thin flexible glass is laid in the gap between adjacent square perovskite components to achieve the connection between adjacent square perovskite components and enable the components to obtain flexible curling capabilities.

6. The voltage-matched two-terminal perovskite-crystalline silicon stacked component according to claim 5, characterized in that: In terms of packaging materials, in order to achieve foldable structures or ultra-thin flexible glass and square perovskite components, thermoplastic adhesive film is filled and the two are combined into one through lamination.

7. The voltage-matched two-terminal perovskite-crystalline silicon stacked component according to any one of claims 1 to 6, characterized in that: A layer of glass or a flexible substrate is first packaged on the square perovskite component, and then the packaged square perovskite components are arranged in order and stacked with the crystalline silicon bottom components, and a layer of polymer film and a flexible substrate are secondarily packaged.

8. A method for preparing a voltage-matched two-terminal perovskite-crystalline silicon stacked component according to any one of claims 1 to 7, characterized in that: The steps include: Step 1: prepare square perovskite components, and connect the sub-cells in series after laser scribing inside the components to form square perovskite components; perform independent primary packaging on the square perovskite components, use glass or flexible substrate as transparent front and back panels, and use thermosetting adhesive film or hot melt adhesive as adhesive material to achieve perovskite component integration; Step 2, forming a perovskite top component: the square perovskite components are arranged in a matrix, the square perovskite components in the same row are connected in series and parallel to form a component string, and the positive and negative electrodes of the component string in each row are converged and led out to form a perovskite top component; Step 3: Preset the appropriate position layout of the crystalline silicon cell string according to the electrical parameters of the perovskite top component, connect the MLPE at the circuit confluence of the crystalline silicon bottom component, and lay the crystalline silicon bottom component; Step 4: Lay out the stacked components and perform secondary packaging: Secondary packaging of non-detachable laminated components: Lay the packaging film, crystalline silicon bottom component, packaging film, perovskite top component string, packaging film, and transparent front plate on the transparent back plate in sequence, and put them into the laminator for integration; Secondary packaging of detachable stacked components: laying packaging film, crystalline silicon bottom component, packaging film, bottom component transparent front plate, detachable connecting device, top component transparent back plate, packaging film, perovskite component string, packaging film, top component transparent front plate in sequence on the bottom component transparent back plate, and entering into a laminator for integration, or dividing into two units from the detachable connection position, laminating them separately and then connecting them.

9. The method for preparing a voltage-matched two-terminal perovskite-crystalline silicon stacked component according to claim 8, characterized in that: The front plate and the back plate are highly transparent flexible transparent front plates or thickened PET highly transparent polymer substrates; the adhesive film is made of EVA, POE or EVA / POE co-extruded.

10. The method for preparing a voltage-matched two-terminal perovskite-crystalline silicon stacked component according to claim 8, characterized in that: In step 2, when a foldable structure or ultra-thin flexible glass is laid in the gap between the perovskite components, a thermoplastic film is filled in the gap and the two are combined into one by lamination.

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