Single-side chemical treatment method, system and equipment for solar cell silicon wafer

Abstract

The invention relates to a single-side chemical treatment method, system and equipment for a solar cell silicon wafer, and relates to the field of semiconductors. A rolling signal is sent to the rolling shaft bracket, and the rolling shaft bracket drives the solar cell silicon wafer to move above a chemical solution in the chemical tank along a first direction; in response to the solar cell silicon wafer moving to the position above the gushing mechanism, a gushing signal is sent to the gushing mechanism, and the gushing mechanism gushes the chemical solution to the lower surface of the solar cell silicon wafer; in response to continuous movement of the solar cell silicon wafer in the first direction until the solar cell silicon wafer is about to leave the position above the gushing mechanism, a gushing stop signal is sent to the gushing mechanism, and the gushing mechanism stops gushing; when the solar cell silicon wafer is located in the chemical tank, the lower surface of the solar cell silicon wafer at least covers one gushing mechanism. Under the condition, on the basis of preventing the chemical solution from turning over to the upper surface of the solar cell silicon wafer, the mass transfer rate of the lower surface of the solar cell silicon wafer is improved, and the yield is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a single-side chemical treatment method, system and equipment for a solar cell silicon wafer. Background Art

[0002] Single-sided chemical treatment of solar cell silicon wafers refers to chemical treatment of only one side of the cell (usually the front surface or the back surface) to improve its performance and efficiency. This treatment method is very common in the semiconductor manufacturing industry and can significantly improve the photoelectric conversion efficiency of solar cells. In order to achieve the purpose of chemical treatment of only one side of the solar cell silicon wafer, the common practice in the prior art is to place the solar cell silicon wafer horizontally on the surface of the chemical solution in the chemical tank during the chemical treatment process, so that only the lower surface of the solar cell silicon wafer is in contact with the liquid surface of the chemical solution, thereby achieving the purpose of single-sided treatment of the solar cell silicon wafer.

[0003] However, the above-mentioned actual operation of single-sided treatment of solar cell silicon wafers still has great shortcomings and deficiencies. Due to environmental influences, the liquid level of the chemical solution will always fluctuate slightly. As the solar cell silicon wafers used are becoming thinner and thinner, when the solar cell silicon wafers are placed horizontally on the liquid level of the chemical solution for treatment, the slight fluctuation of the liquid level of the chemical solution will cause the chemical solution to wet the upper surface of the solar cell silicon wafer; secondly, when the solar cell silicon wafers are placed on the liquid level of the chemical solution for treatment, the siphon phenomenon caused by the surface tension of the solution will also cause the chemical solution to be sucked to the upper surface of the solar cell silicon wafer. Both of the above situations will chemically treat the upper surface portion of the solar cell silicon wafer that does not need to be treated, thereby making the quality of the solar cell silicon wafer unqualified. Summary of the invention

[0004] The purpose of the present invention is to provide a single-side chemical treatment method, system and equipment for solar cell silicon wafers to solve the problems existing in the above-mentioned prior art.

[0005] To achieve the above object, the technical solution adopted by the present invention is: In a first aspect, the present invention provides a single-side chemical treatment method for a solar cell silicon wafer, the method comprising: The roller support drives the solar cell silicon wafer to move along a first direction into the chemical solution in the chemical tank, and the lower surface of the solar cell silicon wafer does not contact the liquid surface of the chemical solution; In response to the solar cell silicon wafer moving to above the spraying mechanism, a spraying signal is sent to the spraying mechanism, and the spraying mechanism sprays the chemical solution to the lower surface of the solar cell silicon wafer, thereby wetting the lower surface of the solar cell silicon wafer and performing chemical treatment on the lower surface of the solar cell silicon wafer; In response to the solar cell silicon wafer continuing to move along the first direction until it is about to leave the top of the spouting mechanism, a stop spouting signal is sent to the spouting mechanism, and the spouting mechanism stops spouting; Wherein, when the solar cell silicon wafer is located in the chemical tank, the lower surface of the solar cell silicon wafer is covered by at least one of the gushing mechanisms.

[0006] In a possible implementation manner, the thickness of the solar cell silicon wafer is 10-200 μm, and there are at least two solar cell silicon wafers in the chemical bath.

[0007] In a possible implementation, the distance between the lower surface of the solar cell silicon wafer and the liquid surface of the chemical solution is 1-5 mm.

[0008] In a possible implementation, the chemical solution is a single-component chemical solution or a multi-component chemical solution.

[0009] In a possible implementation, when the spraying mechanism sprays the chemical solution onto the lower surface of the solar cell silicon wafer, a continuous spraying method is adopted.

[0010] In a possible implementation manner, the first direction is a horizontal direction.

[0011] In a possible implementation manner, the width of the ejection mechanism is less than or equal to the width of the solar cell silicon wafer.

[0012] In a possible implementation, the height of the chemical solution sprayed by the spraying mechanism is the distance between the lower surface of the solar cell silicon wafer and the spraying port of the spraying mechanism.

[0013] In a second aspect, the present invention provides a single-sided chemical treatment system for a solar cell silicon wafer, the system being applied to the single-sided chemical treatment method for a solar cell silicon wafer as described above, the system comprising: A sending module, used for sending a rolling signal to the roller support; A control module, which is used to control the roller support to drive the solar cell silicon wafer to move along a first direction above the chemical solution in the chemical tank; The sending module is further used for sending a gushing signal to the gushing mechanism in response to the solar cell silicon wafer moving above the gushing mechanism; The control module is further used to control the spraying mechanism to spray the chemical solution onto the lower surface of the solar cell silicon wafer, thereby wetting the lower surface of the solar cell silicon wafer and performing chemical treatment on the lower surface of the solar cell silicon wafer; The sending module is further used for sending a stop signal to the spouting mechanism in response to the solar cell silicon wafer continuing to move along the first direction until it is about to leave the top of the spouting mechanism; The control module is also used to control the ejection mechanism to stop ejecting.

[0014] In a third aspect, the present invention provides a computer device, comprising a processor and a memory, wherein the memory stores at least one instruction, at least one program, a code set or an instruction set, and the processor can load and execute at least one instruction, at least one program, a code set or an instruction set to implement the single-sided chemical treatment method for solar cell silicon wafers provided above.

[0015] In a fourth aspect, the present invention provides a computer-readable storage medium, in which at least one instruction, at least one program, code set or instruction set is stored. A processor can load and execute at least one instruction, at least one program, code set or instruction set to implement the single-sided chemical treatment method for solar cell silicon wafers provided above.

[0016] In a fifth aspect, the present invention provides a computer program product or a computer program, the computer program product or the computer program comprising computer program instructions, the computer program instructions being stored in a computer-readable storage medium. A processor reads the computer instructions from the computer-readable storage medium and executes the computer instructions, so that the computer device executes the single-sided chemical treatment method for a solar cell silicon wafer as provided above.

[0017] The beneficial effects brought about by the technical solution provided by the present invention include at least: By sending a rolling signal to the roller bracket, the roller bracket drives the solar cell silicon wafer to move above the chemical solution in the chemical tank along the first direction, and the lower surface of the solar cell silicon wafer does not contact the liquid surface of the chemical solution; in response to the solar cell silicon wafer moving to the top of the spraying mechanism, a spraying signal is sent to the spraying mechanism, and the spraying mechanism sprays the chemical solution to the lower surface of the solar cell silicon wafer, thereby wetting the lower surface of the solar cell silicon wafer and chemically treating the lower surface of the solar cell silicon wafer; in response to the solar cell silicon wafer continuing to move along the first direction until it is about to leave the top of the spraying mechanism, a stop spraying signal is sent to the spraying mechanism, and the spraying mechanism stops spraying; wherein, when the solar cell silicon wafer is located in the chemical tank, the lower surface of the solar cell silicon wafer is covered by at least one spraying mechanism. In this case, on the basis of avoiding the chemical solution from turning over to the upper surface of the solar cell silicon wafer, the mass transfer rate of the lower surface of the solar cell silicon wafer can be improved, the surface treatment effect can be enhanced, the yield rate can be improved, and the manufacturing cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0019] Figure 1 A flow chart of a single-side chemical treatment method for a solar cell silicon wafer provided by an exemplary embodiment of the present invention is shown.

[0020] Figure 2 A schematic structural diagram of a solar cell silicon wafer beginning to enter a chemical bath in a single-side chemical treatment method for a solar cell silicon wafer provided by an exemplary embodiment of the present invention is shown.

[0021] Figure 3 A schematic structural diagram showing a method for single-sided chemical treatment of a solar cell silicon wafer provided by an exemplary embodiment of the present invention, in which a solar cell silicon wafer moves into a chemical tank to cover a first gushing mechanism, and the first gushing mechanism starts to gushing.

[0022] Figure 4 A schematic structural diagram showing a method for single-sided chemical treatment of a solar cell silicon wafer provided by an exemplary embodiment of the present invention in which a portion of the lower surface of a solar cell silicon wafer is gradually wetted and two spraying mechanisms spray simultaneously.

[0023] Figure 5 A schematic structural diagram showing a method for single-sided chemical treatment of a solar cell silicon wafer provided by an exemplary embodiment of the present invention in which the lower surface of a solar cell silicon wafer is completely wetted and three spraying mechanisms spray simultaneously.

[0024] Figure 6 A structural block diagram of a single-side chemical treatment system for a solar cell silicon wafer provided by an exemplary embodiment of the present invention is shown.

[0025] Figure 7 A schematic structural diagram of a computer device for executing a single-side chemical treatment method for a solar cell silicon wafer provided by an exemplary embodiment of the present invention is shown. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0028] Figure 1 A flow chart of a single-side chemical treatment method for a solar cell silicon wafer provided by an exemplary embodiment of the present invention is shown. The single-side chemical treatment method for a solar cell silicon wafer specifically comprises the following steps: Step 101 , the roller support 1 drives the solar cell silicon wafer 2 to move along a first direction into the chemical solution 4 in the chemical tank 3 , and the lower surface of the solar cell silicon wafer 2 does not contact the liquid surface of the chemical solution 4 .

[0029] In the embodiments of this application, please refer to Figure 2 , at this time, the solar cell silicon wafer 2 starts to enter the chemical tank 3 driven by the roller support 1, and the first direction is preferably a horizontal direction. In one example, the distance between the lower surface of the solar cell silicon wafer 2 and the liquid surface of the chemical solution 4 is 1mm. In another example, the distance between the lower surface of the solar cell silicon wafer 2 and the liquid surface of the chemical solution 4 is 2mm. In another example, the distance between the lower surface of the solar cell silicon wafer 2 and the liquid surface of the chemical solution 4 is 3mm. In another example, the distance between the lower surface of the solar cell silicon wafer 2 and the liquid surface of the chemical solution 4 is 4mm. In another example, the distance between the lower surface of the solar cell silicon wafer 2 and the liquid surface of the chemical solution 4 is 5mm. In one example, the thickness of the solar cell silicon wafer 2 is 10μm. In another example, the thickness of the solar cell silicon wafer 2 is 100μm. In another example, the thickness of the solar cell silicon wafer 2 is 200μm.

[0030] In an embodiment of the present application, the roller bracket is a mechanical device for supporting and guiding a rolling component, and is composed of a fixed frame (not shown in the figure) and a rotatable roller. The rotatable roller is driven by a motor (not shown in the figure) and can provide stable support while reducing friction.

[0031] It can be understood that there are also roller supports 1 on both sides of the chemical tank 3, which are not shown in the figure, and are used to guide unprocessed solar cell silicon wafers 2 into the range of the chemical tank 3 and guide processed solar cell silicon wafers 2 out of the range of the chemical tank 3 respectively.

[0032] Step 102, in response to the solar cell silicon wafer 2 moving to above the spraying mechanism 5, a spraying signal is sent to the spraying mechanism 5, and the spraying mechanism 5 sprays the chemical solution 4 to the lower surface of the solar cell silicon wafer 2, thereby wetting the lower surface of the solar cell silicon wafer 2 and chemically treating the lower surface of the solar cell silicon wafer 2.

[0033] In the embodiment of the present application, the chemical solution 4 is a single-component chemical solution or a multi-component chemical solution. In one example, the chemical solution 4 is a mixed solution of nitric acid and hydrofluoric acid. In another example, the chemical solution 4 is a nickel plating solution. In another example, the chemical solution 4 is a propanol solution.

[0034] In the embodiment of the present application, when the spraying mechanism 5 sprays the chemical solution 4 to the lower surface of the solar cell silicon wafer 2, a continuous spraying method is adopted to achieve the best mass transfer effect. In addition, the width of the spraying mechanism 5 is less than or equal to the width of the solar cell silicon wafer 2 to ensure that the spraying range is within the lower surface range of the solar cell silicon wafer 2, and the moving direction of the solar cell silicon wafer 2 is its length direction.

[0035] It is worth mentioning that the height of the chemical solution 4 sprayed by the spraying mechanism 5 is the distance between the lower surface of the solar cell silicon wafer 2 and the spraying port 51 of the spraying mechanism 5 to ensure the stability of the movement process of the solar cell silicon wafer 2.

[0036] In some embodiments, at least two solar cell silicon wafers 2 are chemically treated simultaneously in the chemical bath 3 .

[0037] Step 103 , in response to the solar cell silicon wafer 2 continuing to move along the first direction until it is about to leave the top of the spraying mechanism 5 , a spray stop signal is sent to the spraying mechanism 5 , and the spraying mechanism 5 stops spraying.

[0038] In the embodiment of the present application, there is a gushing mechanism 5 between two adjacent rollers 11 of the roller support 1, and when the entire solar cell silicon wafer 2 enters the chemical tank 3, the lower surface of the solar cell silicon wafer 2 is covered with at least one gushing mechanism 5. Preferably, when the entire solar cell silicon wafer 2 enters the chemical tank 3, the lower surface of the solar cell silicon wafer 2 is covered with at least two gushing mechanisms 5 at the same time, so as to ensure the stability of the movement process of the solar cell silicon wafer 2, prevent liquid from turning over, and achieve an ideal mass transfer rate.

[0039] In the embodiments of this application, please refer to Figure 3 , Figure 4 and Figure 5 The spray mechanism 5 will continue to spray only when it is below the solar cell silicon wafer 2. It will not spray when it is not below the solar cell silicon wafer 2, which can prevent the liquid from overflowing to the upper surface of the solar cell silicon wafer 2. As can be seen from the figure, when the first spray mechanism 5 starts to spray, the chemical solution 4 can continuously wet the lower surface of the solar cell silicon wafer 2 by virtue of the surface tension of the solution. Figure 4 The lower surface of the solar cell silicon wafer 2 is wetted. Figure 5 The figure shows a state where the lower surface of the solar cell silicon wafer 2 is completely wetted.

[0040] In a different Figure 3 , Figure 4 and Figure 5 In the illustrated embodiment, the chemical solution 4 in the chemical tank 3 does not contact the lower surface of the solar cell silicon wafer 2, and the lower surface of the solar cell silicon wafer 2 is completely wetted by the gushing chemical solution 4 to undergo a chemical reaction (i.e., the lower surface of the solar cell silicon wafer 2 is continuously wetted without relying on the surface tension of the solution). This method can greatly reduce the amount of chemical solution 4 used and simplify the device structure.

[0041] As a supplementary note, see Figures 2 to 5 The gushing mechanism 5 is a mechanical device for ejecting liquid, which is fixed in the chemical tank 3 by a fixed bracket (not shown in the figure). In addition to the above-mentioned gushing port 51, it also includes a driving control unit 52. The driving control unit 52 includes a pump for driving the gushing port 51 to eject, and a control valve for controlling the pump to open or close. In one example, a photoelectric sensor is installed at the entrance of the solar cell silicon wafer 2 into the chemical tank 3 to detect the time point when the solar cell silicon wafer 2 enters the chemical tank 3. Combined with the size of the solar cell silicon wafer 2 and the moving speed of the solar cell silicon wafer 2 (i.e., the rotation speed of the roller bracket 1), the opening and closing time of each gushing mechanism 5 can be preset.

[0042] In summary, the present application sends a rolling signal to the roller bracket, and the roller bracket drives the solar cell silicon wafer to move above the chemical solution in the chemical tank along the first direction, and the lower surface of the solar cell silicon wafer does not contact the liquid surface of the chemical solution; in response to the solar cell silicon wafer moving to the top of the spouting mechanism, a spouting signal is sent to the spouting mechanism, and the spouting mechanism spouts the chemical solution to the lower surface of the solar cell silicon wafer, thereby wetting the lower surface of the solar cell silicon wafer and chemically treating the lower surface of the solar cell silicon wafer; in response to the solar cell silicon wafer continuing to move along the first direction until it leaves the top of the spouting mechanism, a stop spouting signal is sent to the spouting mechanism, and the spouting mechanism stops spouting; wherein, there is a spouting mechanism between two adjacent rollers of the roller bracket; when the entire solar cell silicon wafer enters the chemical tank, the lower surface of the solar cell silicon wafer is covered with at least one spouting mechanism. In this case, on the basis of avoiding the chemical solution from turning over to the upper surface of the solar cell silicon wafer, the mass transfer rate of the lower surface of the solar cell silicon wafer can be improved, the surface treatment effect can be enhanced, the yield rate can be improved, and the manufacturing cost can be reduced.

[0043] Figure 6 The structure block diagram of a single-side chemical treatment system for a solar cell silicon wafer provided by an exemplary embodiment of the present invention is shown. The single-side chemical treatment system for a solar cell silicon wafer is applied to the single-side chemical treatment method for a solar cell silicon wafer as described above. The system comprises: A sending module 601, which is used to send a rolling signal to the roller support; A control module 602, which is used to control the roller support to drive the solar cell silicon wafer to move along a first direction above the chemical solution in the chemical tank; The sending module 601 is further used to send a gushing signal to the gushing mechanism in response to the solar cell silicon wafer moving above the gushing mechanism; The control module 602 is also used to control the spraying mechanism to spray the chemical solution to the lower surface of the solar cell silicon wafer, thereby wetting the lower surface of the solar cell silicon wafer and performing chemical treatment on the lower surface of the solar cell silicon wafer; The sending module 601 is further used for sending a stop signal to the spouting mechanism in response to the solar cell silicon wafer continuing to move along the first direction until it is about to leave the top of the spouting mechanism; The control module 602 is also used to control the ejection mechanism to stop ejecting.

[0044] Specifically, the method of controlling the gushing by the system is: First, the sending module 601 sends a rolling signal to the roller bracket to make the roller bracket start rolling; Secondly, the time point when the solar cell silicon wafer enters the chemical tank is detected by a photoelectric sensor installed at the entrance of the solar cell silicon wafer into the chemical tank, and the signal of the solar cell silicon wafer entering the chemical tank detected by the photoelectric sensor is received by the control module 602; Then, the control module 602 calculates the position change of the solar cell silicon wafer in the chemical tank corresponding to the change over time according to the rotation speed of the roller of the roller support and the size of the solar cell silicon wafer; Finally, the control module 602 sends a "spray" or "no spray" instruction to the spray port of the spray mechanism according to the calculated real-time position of the solar cell silicon wafer.

[0045] In some embodiments, the thickness of the solar cell silicon wafer is 10-200 μm, and there are at least two solar cell silicon wafers in the chemical bath.

[0046] In some embodiments, the distance between the lower surface of the solar cell silicon wafer and the liquid surface of the chemical solution is 1-5 mm.

[0047] In some embodiments, the chemical solution is a single-component chemical solution or a multi-component chemical solution.

[0048] In some embodiments, when the spraying mechanism sprays the chemical solution onto the lower surface of the solar cell silicon wafer, a continuous spraying method is adopted.

[0049] In some embodiments, the first direction is a horizontal direction.

[0050] In some embodiments, the width of the ejection mechanism is less than or equal to the width of the solar cell silicon wafer.

[0051] In some embodiments, the height of the chemical solution sprayed by the spraying mechanism is the distance between the lower surface of the solar cell silicon wafer and the spraying port of the spraying mechanism.

[0052] It should be noted that the single-sided chemical treatment system for solar cell silicon wafers provided in the above embodiment is only illustrated by the division of the above functional modules. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the equipment can be divided into different functional modules to complete all or part of the functions described above.

[0053] Figure 7 A schematic diagram of the structure of a computer device for performing a single-side chemical treatment method for a solar cell silicon wafer provided by an exemplary embodiment of the present invention is shown, and the computer device includes: The processor 701 includes one or more processing cores. The processor 701 executes various functional applications and data processing by running software programs and modules.

[0054] The receiver 702 and the transmitter 703 can be implemented as a communication component, and the communication component can be a communication chip. Optionally, the communication component can be implemented to include a signal transmission function. That is, the transmitter 703 can be used to transmit a control signal to the image acquisition device and the scanning device, and the receiver 702 can be used to receive the corresponding feedback instruction.

[0055] The memory 704 is connected to the processor 701 via a bus 705 .

[0056] The memory 704 may be used to store at least one instruction, and the processor 701 may be used to execute the at least one instruction to implement each step in the above method embodiment.

[0057] An embodiment of the present invention also provides a computer-readable storage medium, which stores at least one instruction, at least one program, code set or instruction set, which is loaded and executed by a processor to implement the above-mentioned single-side chemical treatment method of solar cell silicon wafers.

[0058] The present invention also provides a computer program product or a computer program, which includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the single-sided chemical treatment method for a solar cell silicon wafer described in any of the above embodiments.

[0059] Optionally, the computer readable storage medium may include: a read-only memory (ROM), a random access memory (RAM), a solid state drive (SSD), or an optical disk. Among them, the random access memory may include a resistance random access memory (ReRAM) and a dynamic random access memory (DRAM). The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages and disadvantages of the embodiments.

[0060] It should be understood that the specific examples herein are only intended to help those skilled in the art to better understand the present disclosure, rather than to limit the scope of the present invention.

[0061] It is understood that in the various implementations of this specification, the size of the sequence number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the present disclosure.

[0062] It can be understood that the various implementation modes described in this specification can be implemented individually or in combination, and the present disclosure is not limited to this.

[0063] Unless otherwise stated, all technical and scientific terms used in this disclosure have the same meaning as those generally understood by those skilled in the art of the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. The singular forms of "a", "above", and "the" used in this disclosure and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0064] It can be understood that the processor of the present disclosure can be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method implementation method can be completed by the hardware integrated logic circuit or software instructions in the processor. The above processor can be a general processor, a digital signal processor (DigitalSignalProcessor, DSP), an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field programmable gate array (Field Programmable Gate Array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the present disclosure can be implemented or executed. The general processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in the present disclosure can be directly embodied as a hardware decoding processor to perform, or the hardware and software modules in the decoding processor can be combined to perform. The software module can be located in a mature storage medium in the field such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory, and the processor reads the information in the memory and completes the steps of the above method in combination with its hardware.

[0065] It is understood that the memory in the present disclosure may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memory. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (programmable ROM, PROM), an erasable programmable read-only memory (erasable PROM, EPROM), an electrically erasable programmable read-only memory (EEPROM) or a flash memory. The volatile memory may be a random access memory (RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0066] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this specification.

[0067] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method implementation methods and will not be repeated here.

[0068] In the several embodiments provided in this specification, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device implementation described above is only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0069] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0070] In addition, each functional unit in each embodiment of the present specification may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0071] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this specification, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of this specification. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, etc., various media that can store program codes.

[0072] The above is only a specific implementation of this specification, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in this specification, which should be included in the protection scope of this specification. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A single-sided chemical treatment method for a solar cell silicon wafer, characterized in that: The method comprises: Sending a rolling signal to the roller support, the roller support drives the solar cell silicon wafer to move above the chemical solution in the chemical tank along a first direction, and the lower surface of the solar cell silicon wafer does not contact the liquid surface of the chemical solution; In response to the solar cell silicon wafer moving to above the spraying mechanism, a spraying signal is sent to the spraying mechanism, and the spraying mechanism sprays the chemical solution to the lower surface of the solar cell silicon wafer, thereby wetting the lower surface of the solar cell silicon wafer and performing chemical treatment on the lower surface of the solar cell silicon wafer; In response to the solar cell silicon wafer continuing to move along the first direction until it is about to leave the top of the spouting mechanism, a stop spouting signal is sent to the spouting mechanism, and the spouting mechanism stops spouting; Wherein, when the solar cell silicon wafer is located in the chemical tank, the lower surface of the solar cell silicon wafer is covered by at least one of the gushing mechanisms.

2. The single-side chemical treatment method for solar cell silicon wafer according to claim 1, characterized in that: The thickness of the solar cell silicon wafer is 10-200 μm, and there are at least two solar cell silicon wafers in the chemical tank.

3. The single-side chemical treatment method for solar cell silicon wafer according to claim 1, characterized in that: The distance between the lower surface of the solar cell silicon wafer and the liquid surface of the chemical solution is 1-5 mm.

4. The single-side chemical treatment method for solar cell silicon wafer according to claim 1, characterized in that: The chemical solution is a single-component chemical solution or a multi-component chemical solution.

5. The single-side chemical treatment method for solar cell silicon wafer according to claim 1, characterized in that: When the spraying mechanism sprays the chemical solution onto the lower surface of the solar cell silicon wafer, a continuous spraying method is adopted.

6. The single-side chemical treatment method for solar cell silicon wafer according to claim 1, characterized in that: The first direction is a horizontal direction.

7. The single-side chemical treatment method for solar cell silicon wafer according to claim 1, characterized in that: The width of the gushing mechanism is less than or equal to the width of the solar cell silicon wafer.

8. The single-side chemical treatment method for solar cell silicon wafer according to claim 1, characterized in that: The height of the chemical solution sprayed by the spraying mechanism is the distance between the lower surface of the solar cell silicon wafer and the spraying port of the spraying mechanism.

9. A single-side chemical treatment system for solar cell silicon wafers, characterized in that: The system is applied to the single-side chemical treatment method of a solar cell silicon wafer according to any one of claims 1 to 8, and the system comprises: A sending module, used for sending a rolling signal to the roller support; A control module, which is used to control the roller support to drive the solar cell silicon wafer to move along a first direction above the chemical solution in the chemical tank; The sending module is further used for sending a gushing signal to the gushing mechanism in response to the solar cell silicon wafer moving above the gushing mechanism; The control module is further used to control the spraying mechanism to spray the chemical solution onto the lower surface of the solar cell silicon wafer, thereby wetting the lower surface of the solar cell silicon wafer and performing chemical treatment on the lower surface of the solar cell silicon wafer; The sending module is further used for sending a stop signal to the spouting mechanism in response to the solar cell silicon wafer continuing to move along the first direction until it is about to leave the top of the spouting mechanism; The control module is also used to control the ejection mechanism to stop ejecting.

10. A computer device, characterized in that: The computer device includes a processor and a memory, wherein the memory stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, at least one program, a code set or an instruction set is loaded and executed by the processor to implement the single-sided chemical treatment method for a solar cell silicon wafer as described in any one of claims 1 to 8.

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