Puncture leakage prevention method for PI screen printing plate

Abstract

The invention discloses a PI (polyimide) screen anti-piercing method which comprises the following steps: S1, firstly, leading a screen raw material needing to be produced into a corresponding mold for heating, melting the raw material in a mold cavity for molding, after standing for a period of time, opening the mold, taking out the molded screen, and taking out the molded screen; the screen printing plate is taken out, the taken-out screen printing plate is put into cold water to be cooled, the surface of the screen printing plate is washed through corresponding cleaning equipment, burr grinding treatment is conducted on the cleaned surface, and surface drying can be conducted through drying equipment after grinding is completed. The protection area of a non-pattern area of the PI film can be effectively increased, the service life of the screen printing plate can be effectively prolonged due to the fact that the anti-puncturing leakage film is integrated, and the problem that printing is affected due to the fact that the distance between the anti-puncturing leakage film and lines cannot be well mastered through pure manual pasting and the lines are too close to the lines or the lines are covered is solved. And defects of printed products and waste of printing materials are effectively reduced.

Description

Technical Field

[0001] The invention relates to the technical field of screen printing, in particular to a PI screen puncture prevention method. Background Art

[0002] Solar cells are generally divided into single crystal silicon, polycrystalline silicon, and amorphous silicon. Single crystal silicon solar cells are the fastest-developed solar cells at present. Their structure and production process have been finalized, and the products have been widely used in space and on the ground. This type of solar cell uses high-purity single crystal silicon rods as raw materials. In order to reduce production costs, solar cells used on the ground use solar-grade single crystal silicon rods, and the material performance indicators have been relaxed. Some can also use the head and tail materials and waste single crystal silicon materials processed by semiconductor devices, which are re-drawn into single crystal silicon rods dedicated to solar cells. The solar cells need to be printed through a screen during the processing process.

[0003] At present, in the process of battery cell printing, foreign matter is easy to leak in the non-printing area of ​​the screen, resulting in defective printed products and waste of printing materials. Ordinary tape is used to attach to the screen to prevent leakage, but the non-printing area cannot be well covered on both sides of the line. In addition, since it is purely hand-pasted, the distance between the lines cannot be well controlled, and the problem of being too close to the line or covering the line may occur, thus affecting printing. Summary of the invention

[0004] The purpose of the present invention is to provide a PI screen puncture prevention method to solve the problem raised in the above background technology that in the current battery cell printing process, foreign matter is prone to puncture in the non-printing area of ​​the screen, resulting in defective printed products and waste of printing materials. Ordinary tape is used to attach to the screen to prevent puncture, but the non-printing area on both sides of the line cannot be well covered. Moreover, since it is purely hand-pasted, the distance between the lines cannot be well controlled, and the problem of being too close to the line or covering the line is prone to occur, thus affecting printing.

[0005] To achieve the above object, the present invention provides the following technical solution: a PI screen anti-leakage method, the anti-leakage method comprising the following steps:

[0006] S1. First, introduce the screen material to be produced into the corresponding mold for heating. The raw material is melted in the mold cavity to form it. After standing for a period of time, the mold is opened to take out the formed screen. The taken-out screen is placed in cold water to cool down, and its surface is rinsed with corresponding cleaning equipment. After cleaning, the surface is ground to remove burrs. After grinding, the surface can be dried by drying equipment.

[0007] S2. Then paste the PI film on the surface of the dried screen. After pasting, paste a layer of anti-puncture film of a certain thickness on the screen, and use a lower temperature to make the anti-puncture film adhere to the PI film first, and then use laser equipment to print the pattern required in the production process according to the pattern, and then tear off the anti-puncture film covering the pattern. Finally, after sufficient temperature and pressure, it is completely cured and firmly attached to the surface of the PI film as a protective layer.

[0008] Preferably, the anti-puncture leakage film is made of glass fiber fabric as a base material coated with polytetrafluoroethylene, and the anti-puncture leakage film has a thickness of 20UM.

[0009] Preferably, the screen material is melted and formed in the mold cavity for a standing time of generally 10 minutes, and the formed screen is placed in cold water for a cooling time of generally 5 minutes.

[0010] Preferably, the temperature at which the puncture-proof film is finally cured and heated is set to 70-110° C., and the pressure at which the puncture-proof film is finally cured is set to 0.3-0.5 MPa.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] The present invention further affixes a 20UM thick anti-puncture film on the screen that has originally been affixed with the PI film, and firmly adheres to the surface of the PI film as a protective layer. The use of the anti-puncture film as a substitute for the ordinary tape can effectively increase the protection area of ​​the non-pattern area of ​​the PI film, and the anti-puncture film is integrated, which can effectively increase the service life of the screen. At the same time, it avoids the problem that pure manual affixation cannot well grasp the distance between the lines, and it is easy to cause the lines to be too close or cover the lines, thereby affecting printing, and effectively reduces the defects of printed products and the waste of printing materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure after the puncture-proof leak-proof film of the present invention is pasted. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] Embodiment 1:

[0016] See also Figure 1 A PI screen anti-leakage method, the anti-leakage method comprises the following steps:

[0017] S1. First, introduce the screen material to be produced into the corresponding mold for heating. The raw material is melted in the mold cavity to form it. After standing for a period of time, the mold is opened to take out the formed screen. The taken-out screen is placed in cold water to cool down, and its surface is rinsed with corresponding cleaning equipment. After cleaning, the surface is ground to remove burrs. After grinding, the surface can be dried by drying equipment to make the screen surface smoother and drier, making the process of pasting the anti-puncture film smoother and more tightly and firmly pasted.

[0018] S2. Then paste PI film on the surface of the dried screen. After pasting, paste a layer of anti-puncture film of a certain thickness on the screen, and use a lower temperature to make the anti-puncture film adhere to the PI film first, and then use laser equipment to print the graphics required in the production process according to the pattern, and then tear off the anti-puncture film covering the pattern. Finally, after sufficient temperature and pressure, it is completely cured and firmly attached to the surface of the PI film as a protective layer. By using anti-puncture film as a substitute for ordinary tape, the protection area of ​​the non-pattern area of ​​PI film can be effectively increased. The anti-puncture film is an integrated type, which can effectively increase the service life of the screen. At the same time, it can avoid the problem that pure manual pasting cannot grasp the distance between the lines well, and it is easy to appear too close to the offline line or cover the lines, thereby affecting printing.

[0019] In this embodiment: the material used for the anti-puncture leakage film is made of glass fiber fabric as the base material coated with polytetrafluoroethylene, and the thickness of the anti-puncture leakage film is 20UM, which can make the anti-puncture leakage film more flexible and firm, and avoid the problem of cracking and damage caused by stress during the printing process, resulting in poor printing quality.

[0020] In this embodiment, the screen material is melted in the mold cavity and the standing time for forming is generally 10 minutes, and the formed screen is placed in cold water for cooling time of generally 5 minutes, which can make the forming more stable and firm, and further improve the overall stability of the screen.

[0021] In the present embodiment: the temperature for the final curing heating of the anti-puncture leakage film is set to 70-110°C, and the pressure for the final curing of the anti-puncture leakage film is set to 0.3-0.5MPa, which can make the anti-puncture leakage film fit more closely to the screen to avoid falling off and separation after long-term use, effectively increase the overall sealing performance of the screen, and improve the overall printing effect.

[0022] Embodiment 2:

[0023] Different from the first embodiment, the PI screen anti-leakage method of the present embodiment comprises the following steps:

[0024] S1. First, introduce the screen material to be produced into the corresponding mold for heating. The raw material is melted in the mold cavity to form it. After standing for a period of time, the mold is opened to take out the formed screen. The taken-out screen is placed in cold water to cool down, and its surface is rinsed with corresponding cleaning equipment. After cleaning, the surface is ground to remove burrs. After grinding, the surface can be dried by drying equipment.

[0025] S2. Then, the PI film is pasted on the surface of the dried screen, and is manually attached to the screen using ordinary tape to prevent leakage. The non-printing area cannot be well covered on both sides of the lines, thereby achieving sealing and leak-proofing of the non-printing area.

[0026] In summary: compared with Example 2, the first embodiment uses an anti-puncture film as a substitute for ordinary tape, which can effectively increase the protection area of ​​the non-pattern area of ​​the PI film, and the anti-puncture film is integrated, which can effectively increase the service life of the screen. At the same time, it avoids the problem that pure manual pasting cannot well grasp the distance between the lines, and it is easy to cause the lines to be too close or cover the lines, thereby affecting printing, effectively reducing the defects of printed products and the waste of printing materials.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PI screen anti-leakage method, characterized by: The anti-leakage method comprises the following steps: S1. First, introduce the screen material to be produced into the corresponding mold for heating, melt the material in the mold cavity to form, and after standing for a period of time, open the mold to take out the formed screen, put the taken out screen into cold water to cool it down, and rinse its surface with corresponding cleaning equipment, grind the surface after cleaning, and dry the surface with drying equipment after grinding; S2. Then paste the PI film on the surface of the dried screen. After pasting, paste a layer of anti-puncture film of a certain thickness on the screen, and use a lower temperature to make the anti-puncture film adhere to the PI film first, and then use laser equipment to print the pattern required in the production process according to the pattern, and then tear off the anti-puncture film covering the pattern. Finally, after sufficient temperature and pressure, it is completely cured and firmly attached to the surface of the PI film as a protective layer.

2. A PI screen puncture prevention method according to claim 1, characterized in that: The anti-puncture leakage film is made of glass fiber fabric as a base material coated with polytetrafluoroethylene, and the thickness of the anti-puncture leakage film is 20UM.

3. A PI screen puncture prevention method according to claim 1, characterized in that: The time for the screen material to be melted and formed in the mold cavity is generally 10 minutes, and the time for the formed screen to be cooled in cold water is generally 5 minutes.

4. A PI screen puncture prevention method according to claim 1, characterized in that: The temperature at which the puncture-proof film is finally cured and heated is set to 70-110° C., and the pressure at which the puncture-proof film is finally cured is set to 0.3-0.5 MPa.

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