High-speed digital signal processing circuit board

Abstract

The invention discloses a high-speed digital signal processing circuit board, which comprises a signal processing chip and a circuit board body, and is characterized in that the signal processing chip is arranged right above the circuit board body; the radiating fin is arranged above the signal processing chip; the shielding cover covers the signal processing chip and the radiating fin; the anti-vibration base is mounted on the circuit board body; the connector support is arranged on the edge of the circuit board body, a heat conduction pad is arranged below the signal processing chip, and the heat conduction pad is made of a silicon-based material with a low thermal resistance characteristic. A large amount of heat generated in the high-speed signal processing process is conducted to the cooling fin through the heat conduction material below the signal processing chip and then is efficiently dissipated by the cooling fin, the surface temperature of the circuit board is effectively prevented from being too high, and performance degradation of components caused by high temperature is avoided. The large-area design and material selection of the radiating fins ensure the continuity and reliability of the radiating effect.

Description

Technical Field

[0001] The present invention relates to the technical field of digital signal processing, and in particular to a high-speed digital signal processing circuit board. Background Art

[0002] A high-speed digital signal processing circuit board is mainly used to achieve high-speed data transmission and processing tasks, and is widely used in high-performance computing fields such as communications, radar, and medical imaging.

[0003] However, there are some significant problems with this type of circuit board. First, a large amount of heat is generated during high-speed signal processing, and the current heat dissipation path design is often insufficient, resulting in excessively high surface temperatures of the circuit board, which in turn causes degradation of component performance. Second, high-frequency signal transmission requires strict electromagnetic compatibility, but the existing mechanical structure does not provide sufficient shielding, making it easy for external electromagnetic interference to enter the circuit board, affecting signal integrity and system stability. Finally, physical vibration and shock are not adequately considered during circuit board design. In application scenarios that require frequent high-acceleration motion or severe vibration, solder joints and fine traces may become loose or even break. These issues are the main challenges faced by high-speed digital signal processing circuit boards in practical applications. Summary of the invention

[0004] The purpose of the present invention is to solve the problems existing in the prior art and to propose a high-speed digital signal processing circuit board.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A high-speed digital signal processing circuit board comprises: a signal processing chip and a circuit board body, wherein the signal processing chip is arranged directly above the circuit board body;

[0007] A heat sink is installed above the signal processing chip;

[0008] A shielding cover covers the signal processing chip and the heat sink;

[0009] An anti-vibration base, mounted on the circuit board body;

[0010] The connector bracket is arranged on the edge of the circuit board body.

[0011] Preferably, a thermal pad is provided under the signal processing chip, and the thermal pad is made of a silicon-based material with low thermal resistance.

[0012] Preferably, the thickness of the thermal pad ranges from 2 mm to 5 mm.

[0013] Preferably, the signal processing chip and the heat sink are connected in a multi-point contact manner, and the multi-point contact points are a plurality of micro heat-conducting columns distributed on the surface of the signal processing chip.

[0014] Preferably, the heat sink comprises at least two vertically distributed heat sink fins, and the heat sink fins are connected by a transverse connecting plate.

[0015] Preferably, the thickness of the heat dissipation fins is 1 mm to 3 mm, and the interval between two adjacent heat dissipation fins is 1 mm to 2 mm.

[0016] Preferably, the heat sink is made of aluminum or copper alloy.

[0017] Preferably, the shielding cover is provided with a plurality of ventilation holes, the diameter of the ventilation holes is 5 mm to 10 mm, and a dustproof net is arranged around the ventilation holes.

[0018] Preferably, the bottom side wall of the shielding cover is provided with two symmetrically arranged first mounting buckles, the top of the circuit board body is fixedly connected with two symmetrically arranged second mounting buckles, and the first mounting buckles are adapted to the second mounting buckles.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] 1. The large amount of heat generated during high-speed signal processing is transferred to the heat sink through the thermal conductive material under the signal processing chip, and then the heat sink dissipates the heat efficiently, effectively preventing the circuit board surface temperature from being too high and avoiding the performance degradation of components caused by high temperature. The large area design and material selection of the heat sink ensure the continuity and reliability of the heat dissipation effect.

[0021] 2. The shielding cover with fully enclosed metal structure provides a strong electromagnetic shielding effect, effectively preventing external electromagnetic interference from entering the circuit board, ensuring the integrity of the signal and the stability of the system. The tight design of the shielding cover and the circuit board grounding technology further enhance its shielding ability and meet the strict electromagnetic compatibility requirements required for high-frequency signal transmission.

[0022] 3. The anti-vibration base installed at the bottom of the circuit board and the connector bracket on the edge work together to effectively protect the solder joints and fine traces from high acceleration movement or violent vibration, reducing the risk of loose or broken components caused by physical vibration and impact. The flexible material of the anti-vibration base and the mechanical fixing design of the connector bracket jointly improve the overall vibration resistance of the circuit board, ensuring its stability and reliability in complex environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the internal structure of a high-speed digital signal processing circuit board proposed by the present invention;

[0024] Figure 2 A three-dimensional structural schematic diagram of a high-speed digital signal processing circuit board proposed by the present invention;

[0025] Figure 3 This is a schematic diagram of the connection structure between a signal processing chip and a circuit board body in a high-speed digital signal processing circuit board proposed by the present invention;

[0026] Figure 4 This is a schematic diagram of the connection structure between the heat sink fins and the horizontal connection plate in a high-speed digital signal processing circuit board proposed by the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of a connector bracket in a high-speed digital signal processing circuit board proposed by the present invention;

[0028] Figure 6 The present invention is a schematic diagram of the connection structure between a first mounting buckle and a second mounting buckle in a high-speed digital signal processing circuit board proposed by the present invention.

[0029] In the figure: 101, signal processing chip; 102, circuit board body; 2, heat sink; 3, shielding cover; 4, anti-vibration base; 5, connector bracket; 6, thermal pad; 7, micro thermal column; 8, heat sink fin; 9, horizontal connecting plate; 10, air vent; 11, first mounting buckle; 12, second mounting buckle. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] Reference Figure 1-Figure 6 This embodiment provides a high-speed digital signal processing circuit board, which includes a signal processing chip 101, a circuit board body 102, a heat sink 2, a shielding cover 3, an anti-vibration base 4 and a connector bracket 5, and the signal processing chip 101 is arranged directly above the circuit board body 102.

[0033] The heat sink 2 is installed above the signal processing chip 101, and the shielding cover 3 covers the signal processing chip 101 and the heat sink 2. The air holes 10 on the shielding cover 3 are distributed on the top and side surfaces of the shielding cover 3 to form a uniform arrangement to ensure that the airflow can enter and discharge evenly. The dustproof net is made of a fine metal mesh or a high-density nylon material and is fixed to the edge of the air hole by bonding or welding, thereby effectively blocking the intrusion of external dust and particulate matter while maintaining good air permeability. In addition, the joint between the dustproof net and the air hole 10 is sealed to prevent water vapor and fine impurities from entering through the gap to ensure reliability in long-term use.

[0034] The anti-vibration base 4 is installed on the circuit board body 102. Specifically, the anti-vibration base 4 is installed on the bottom of the circuit board body 102 and fits closely with the circuit board body 102. It can effectively absorb and disperse external vibration energy, reduce the transmission of external vibration, and thus protect the internal components on the circuit board body 102 from vibration. The connector bracket 5 is arranged at the edge of the circuit board body 102.

[0035] A thermal pad 6 is provided under the signal processing chip 101 . The thermal pad 6 is made of a silicon-based material with low thermal resistance. The low thermal resistance allows heat to be quickly transferred to the heat sink 2 and then dissipated by the heat sink 2 .

[0036] The thickness of the thermal pad 6 ranges from 2 mm to 5 mm; it is used to provide good thermal conductivity. By selecting a thermal pad 6 of appropriate thickness, the overall thickness of the circuit board body 102 can be notably increased while ensuring thermal conductivity, thereby meeting the strict space requirements of high-performance computing equipment. The thickness of the thermal pad 6 is optimized, not only having efficient heat transfer capabilities, but also absorbing external vibrations and shocks, reducing the displacement of the signal processing chip 101, and further improving the reliability and stability of the circuit board body 102.

[0037] The signal processing chip 101 is connected to the heat sink 2 by multi-point contact, and the multi-point contact points are a number of micro heat-conducting columns 7 distributed on the surface of the signal processing chip 101. These micro heat-conducting columns 7 can significantly increase the heat conduction area, thereby improving the heat dissipation effect, avoiding the occurrence of local overheating, and ensuring the stable operation of the signal processing chip 101. The design of the micro heat-conducting columns 7 not only optimizes the heat transfer path, but also simplifies the assembly process, and improves the reliability and production efficiency of the product.

[0038] The heat sink 2 includes at least two vertically distributed heat sink fins 8 , and the heat sink fins 8 are connected by a transverse connecting plate 9 .

[0039] The thickness of the heat sink 8 is 1mm to 3mm, and the interval between two adjacent heat sink fins 8 is 1mm to 2mm. The heat sink fins 8 are installed in the high heat load area of ​​the circuit board body 102, such as above the CPU or other main heating components. The arrangement and spacing of the heat sink fins 8 are precisely calculated to ensure that the airflow can flow smoothly between the heat sink fins 8 to avoid eddy currents and dead corners. In addition, in order to further improve the heat dissipation effect, a layer of thermal conductive coating can be added to the surface of the heat sink fins 8 to enhance the heat exchange efficiency between the heat sink fins 8 and the air.

[0040] The material of the heat sink 2 is aluminum or copper alloy.

[0041] The shielding cover 3 is provided with a plurality of ventilation holes 10, the diameter of the ventilation holes 10 is 5 mm to 10 mm, and a dustproof net is arranged around the ventilation holes 10, aiming at improving the air circulation inside the circuit board body 102 without affecting the electromagnetic shielding effect, effectively dissipating heat, preventing dust from entering, and ensuring the signal transmission performance and system stability.

[0042] The bottom side wall of the shielding cover 3 is provided with two symmetrically arranged first mounting buckles 11, and the top of the circuit board body 102 is fixedly connected with two symmetrically arranged second mounting buckles 12, the first mounting buckle 11 is adapted to the second mounting buckle 12, wherein the first mounting buckle 11 and the second mounting buckle 12 are arranged in an L-shape with opposite clamping, a protrusion is provided at the horizontal position of the first mounting buckle 11, and a slot adapted to the protrusion is provided at the horizontal position of the second mounting buckle 12, and the protrusion and the slot are engaged to realize the clamping connection between the first mounting buckle 11 and the second mounting buckle 12, thereby realizing the stability of the shielding cover 3, and the first mounting buckle 11 and the second mounting buckle 12 can realize quick and convenient installation and disassembly. This design not only improves the assembly efficiency, but also ensures the fixing stability of the shielding cover 3, thereby reducing the electromagnetic leakage problem caused by the loose fixing of the shielding cover 3. When disassembly is required, only the first mounting buckle 11 needs to be pressed to separate the first mounting buckle 11 from the second mounting buckle 12. This structure makes maintenance more convenient and ensures good sealing and electromagnetic shielding performance after multiple assembly and disassembly.

[0043] The specific working principle of the present invention is as follows:

[0044] In actual operation, when the device is used, the signal processing chip 101 first performs high-speed digital signal processing tasks. In this process, the signal processing chip 101 generates a large amount of heat. In order to solve this problem, the heat sink 2 is fixed above the signal processing chip 101, and the heat generated by the signal processing chip 101 is quickly conducted to the outside of the circuit board body 102 through efficient heat conductive materials. This design effectively prevents the surface temperature of the circuit board body 102 from rising, and avoids the performance degradation of components caused by high temperature.

[0045] At the same time, the shielding cover 3 covers the signal processing chip 101 and the heat sink 2, and provides a strong electromagnetic shielding effect through its fully enclosed structure made of metal material. This not only prevents external electromagnetic interference from entering the circuit board, but also ensures the integrity of the internal signal and the stability of the system. When the device is running, external electromagnetic interference sources may affect the transmission of high-speed signals. The shielding cover effectively eliminates this risk and ensures the efficiency of signal processing.

[0046] In addition, the anti-vibration base 4 is installed at the bottom of the circuit board body 102 and is made of flexible material. When the device is in high-acceleration motion or encounters severe vibration, the anti-vibration base 4 can absorb and disperse the vibration energy, effectively protecting the solder joints and fine traces on the circuit board from loosening or breaking due to physical vibration and impact. This measure greatly enhances the mechanical stability and reliability of the entire circuit board body 102.

[0047] Finally, the connector bracket 5 is arranged at the edge of the circuit board body 102, and supports the connector through a stable mechanical fixing structure. In this way, even in a high vibration environment, a stable and reliable connection with the circuit board body 102 can be maintained to avoid communication interruption caused by the connector being loose. All these components work together to ensure the efficient and stable operation of the high-speed digital signal processing circuit board in various harsh environments.

[0048] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high-speed digital signal processing circuit board, comprising: A signal processing chip (101) and a circuit board body (102), wherein the signal processing chip (101) is arranged directly above the circuit board body (102); A heat sink (2) is installed above the signal processing chip (101); A shielding cover (3) covering the signal processing chip (101) and the heat sink (2); An anti-vibration base (4) mounted on the circuit board body (102); The connector bracket (5) is arranged on the edge of the circuit board body (102).

2. A high-speed digital signal processing circuit board according to claim 1, characterized in that: A thermal pad (6) is provided below the signal processing chip (101), and the thermal pad (6) is made of a silicon-based material with low thermal resistance characteristics.

3. A high-speed digital signal processing circuit board according to claim 2, characterized in that: The thickness of the thermal conductive pad (6) ranges from 2 mm to 5 mm.

4. A high-speed digital signal processing circuit board according to claim 1, characterized in that: The signal processing chip (101) and the heat sink (2) are connected in a multi-point contact manner, and the multi-point contact points are a plurality of micro heat-conducting columns (7) distributed on the surface of the signal processing chip (101).

5. The high-speed digital signal processing circuit board according to claim 1, characterized in that: The heat sink (2) comprises at least two vertically distributed heat sink fins (8), and the heat sink fins (8) are connected via a transverse connecting plate (9).

6. A high-speed digital signal processing circuit board according to claim 5, characterized in that: The thickness of the heat dissipation fins (8) is 1 mm to 3 mm, and the interval between two adjacent heat dissipation fins (8) is 1 mm to 2 mm.

7. The high-speed digital signal processing circuit board according to claim 1, characterized in that: The material of the heat sink (2) is aluminum or copper alloy.

8. The high-speed digital signal processing circuit board according to claim 1, characterized in that: The shielding cover (3) is provided with a plurality of ventilation holes (10), the diameter of the ventilation holes (10) is 5 mm to 10 mm, and a dustproof net is arranged around the ventilation holes (10).

9. The high-speed digital signal processing circuit board according to claim 1, characterized in that: The bottom side wall of the shielding cover (3) is provided with two symmetrically arranged first mounting buckles (11), and the top of the circuit board body (102) is fixedly connected with two symmetrically arranged second mounting buckles (12), and the first mounting buckles (11) are adapted to the second mounting buckles (12).

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