Display module

Abstract

The invention discloses a display module. The display module comprises a display panel and a circuit board. The display panel comprises an array substrate and an opposite substrate which are oppositely arranged, and the array substrate comprises a first glass substrate and a first driving circuit layer arranged on the first glass substrate; the circuit board comprises a second glass substrate and a second driving circuit layer, and the second driving circuit layer is arranged on one surface of the second glass substrate; the circuit board is arranged on one surface of the array substrate, the projection of the second glass substrate on the plane where the first glass substrate is located is located in the first glass substrate, and the first driving circuit layer is electrically connected with the second driving circuit layer; the display module is provided with a welding area, and in the welding area, the first glass substrate and the second glass substrate are fixedly connected through a laser welding technology. Through the arrangement, the circuit board can be electrically connected with the array substrate without using a chip on film, so that the use cost of the chip on film is saved, and the problem that the cost of a liquid crystal display in the prior art is relatively high is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module. Background Art

[0002] LCD (Liquid Crystal Display) is a widely used display technology. A liquid crystal display generally includes a display panel and a circuit board. The display panel includes an array substrate and a color film substrate that are relatively arranged. The display panel and the circuit board of the liquid crystal display are usually electrically connected using COF (Chip On Film).

[0003] Currently, liquid crystal displays have the problem of high cost. Summary of the invention

[0004] The present application mainly provides a display module to solve the problem of high cost of liquid crystal displays in the prior art.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a display module, comprising:

[0006] The display panel comprises an array substrate and an opposite substrate arranged opposite to each other; the array substrate comprises a first glass substrate and a first driving circuit layer arranged on the first glass substrate;

[0007] A circuit board, comprising a second glass substrate and a second driving circuit layer, wherein the second driving circuit layer is disposed on a surface of the second glass substrate;

[0008] Wherein, the circuit board is arranged on a surface of the array substrate, and the projection of the second glass substrate on the plane where the first glass substrate is located is located inside the first glass substrate;

[0009] The display module has a welding area, in which the first glass substrate and the second glass substrate are fixedly connected by a laser welding process; and the first driving circuit layer and the second driving circuit layer are electrically connected.

[0010] In some embodiments, the second glass substrate has a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface; the second driving circuit layer is disposed on the first surface;

[0011] The second glass substrate is provided with a first through hole, the first through hole passes through the first surface and the second surface; the first through hole is filled with a first conductive paste;

[0012] The second driving circuit layer is electrically connected to the first driving circuit layer through the first conductive paste.

[0013] In some embodiments, the first glass substrate has a third surface and a fourth surface opposite to each other, the third surface is disposed toward the counter substrate; the first driving circuit layer is disposed on the third surface;

[0014] In a first direction, the size of the array substrate is larger than the size of the counter substrate, and the array substrate includes a bonding area protruding from one side of the counter substrate;

[0015] The circuit board is arranged on the third surface and is located in the bonding area, and the second surface is arranged toward the third surface.

[0016] In some embodiments, the thickness of the circuit board is the same as the thickness of the opposing substrate; the first side surface is disposed close to the opposing substrate, and the first through hole is disposed close to the first side surface;

[0017] The welding area is located in the bonding area and is arranged along the edge of the bonding area. The welding area is spaced apart from the first through hole. The first driving circuit layer and the second driving circuit layer are not arranged in the welding area.

[0018] In some embodiments, the first glass substrate has a third surface and a fourth surface facing each other; the third surface is disposed toward the counter substrate, and the first driving circuit layer is disposed on the third surface; the circuit board is disposed on the fourth surface, and the second surface is disposed toward the fourth surface;

[0019] The first glass substrate is provided with a second through hole, the second through hole passes through the third surface and the fourth surface, and the second through hole is filled with a second conductive paste;

[0020] The second through hole is arranged in alignment with the first through hole, and the first driving circuit layer and the second driving circuit layer are electrically connected via the second conductive paste and the first conductive paste in sequence.

[0021] In some embodiments, the first glass substrate further has a second side surface connecting the third surface and the fourth surface; the first through hole is disposed close to the first side surface, and the second through hole is disposed close to the second side surface; the first side surface is flush with the second side surface;

[0022] The welding area is arranged along the edge of the second glass substrate and is spaced apart from the first through hole; the second driving circuit layer is not arranged in the welding area.

[0023] In some embodiments, the size of the array substrate is equal to the size of the counter substrate.

[0024] In some embodiments, the first glass substrate is provided with a plurality of the second through holes, the second glass substrate is provided with a plurality of the first through holes, and the plurality of the second through holes are provided in a one-to-one correspondence with the plurality of the first through holes; and / or,

[0025] The first through hole is prepared by using a glass punching process; and / or the second through hole is prepared by using a glass punching process.

[0026] In some embodiments, the first glass substrate has a third surface and a fourth surface opposite to each other, and a second side surface connecting the third surface and the fourth surface, the third surface is disposed toward the counter substrate; the first driving circuit layer is disposed on the third surface and extends to the second side surface;

[0027] The circuit board is arranged on the fourth surface; the second glass substrate has a first surface and a second surface opposite to each other, the second driving circuit layer is arranged on the first surface, and the second surface is arranged toward the fourth surface;

[0028] The display module further includes a flexible circuit board, one end of which is electrically connected to the first drive circuit layer on the second side surface, and the other end of which is bent to a side of the circuit board away from the fourth surface and electrically connected to the second drive circuit layer;

[0029] The welding area is arranged along the edge of the second glass substrate and is spaced apart from the flexible circuit board.

[0030] In some embodiments, the second glass substrate is glass residue remaining after cutting a large glass plate; and / or,

[0031] The display module includes one circuit board, or the display module includes a plurality of circuit boards spaced apart from each other.

[0032] In some embodiments, when the first glass substrate and the second glass substrate are laser welded in the welding area, a laser with an average power of 75W and a long focal length scanning galvanometer with a focal length of 255mm are used; the single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / S; and / or,

[0033] The width of the welding area is 200-300 μm.

[0034] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a display module, including a display panel and a circuit board. The display panel includes an array substrate and a counter substrate arranged relatively to each other, the array substrate includes a first glass substrate and a first driving circuit layer arranged on the first glass substrate; the circuit board includes a second glass substrate and a second driving circuit layer, the second driving circuit layer is arranged on a surface of the second glass substrate; the circuit board is arranged on a surface of the array substrate, and the projection of the second glass substrate on the plane where the first glass substrate is located is located in the first glass substrate, and the first driving circuit layer is electrically connected to the second driving circuit layer; the display module has a welding area, and in the welding area, the first glass substrate and the second glass substrate are fixedly connected by a laser welding process. Through the above arrangement, the circuit board is directly arranged on a surface of the array substrate, and the laser welding process is directly used in the welding area to fix the circuit board and the array substrate, so that the electrical connection between the circuit board and the array substrate can be realized without using a flip chip film, and signal transmission can be realized, which saves the use cost of the flip chip film, is conducive to solving the problem of high cost of liquid crystal displays in the prior art, and at the same time, the structure of traditional liquid crystal displays can also be changed. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0036] Figure 1 is a schematic diagram of a top view of the structure of a display module provided in the first embodiment of the present application;

[0037] Figure 2 yes Figure 1 A schematic diagram of a top view structure of a display panel of a provided display module;

[0038] Figure 3 yes Figure 1 A schematic diagram of the structure of a circuit board of a provided display module;

[0039] Figure 4 yes Figure 3 A schematic diagram of the top view of the circuit board provided;

[0040] Figure 5 yes Figure 1 The AA cross-sectional diagram of the display module provided;

[0041] Figure 6 is a bottom-up structural schematic diagram of a display module provided in a second embodiment of the present application;

[0042] Figure 7 yes Figure 6 A schematic diagram of the top view structure of the provided display module;

[0043] Figure 8 yes Figure 6 A schematic diagram of the structure of a display panel of a provided display module when viewed from above;

[0044] Fig. 9 yes Figure 6 A CC cross-sectional diagram of the provided display module;

[0045] Fig.10 is a schematic diagram of a top view of the structure of a display module provided in the third embodiment of the present application;

[0046] Fig.11 yes Fig.10 A schematic diagram of the structure of the display module from above is provided;

[0047] Fig.12 yes Fig.10 A schematic diagram of the side view structure of a display panel of a provided display module;

[0048] Fig.13 yes Fig.10 A schematic diagram of the structure of the circuit board of the provided display module.

[0049] Figure Number:

[0050] Display module 100; display panel 1; array substrate 11; opposing substrate 12; first glass substrate 13; third surface 131; fourth surface 132; second through hole 133; second conductive paste 134; second side 135; second contact pad 14; circuit board 2; second glass substrate 21; first surface 211; second surface 212; first side 213; first through hole 214; first conductive paste 215; first contact pad 22; flexible circuit board 3; welding area H; bonding area B. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0052] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0053] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0054] See also Figures 1 to 5 , Figure 1 is a schematic diagram of a top view of the display module provided in the first embodiment of the present application, Figure 2 yes Figure 1 A schematic diagram of a top view structure of a display panel of a display module is provided, Figure 3 yes Figure 1 The schematic diagram of the circuit board structure of the display module provided, Figure 4 yes Figure 3 The schematic diagram of the top view of the circuit board provided, Figure 5 yes Figure 1 AA cross-sectional diagram of the display module provided.

[0055] See also Figures 1 to 5 The present application provides a display module 100 , which includes a display panel 1 and a circuit board 2 .

[0056] The display panel 1 includes an array substrate 11 and an opposing substrate 12 that are arranged opposite to each other, a liquid crystal layer (not shown) is arranged between the array substrate 11 and the opposing substrate 12, and the array substrate 11 and the opposing substrate 12 are connected by a frame glue (not shown) arranged between the array substrate 11 and the opposing substrate 12. Specifically, the array substrate 11 includes a first glass substrate 13 and a first driving circuit layer (not shown) arranged on the first glass substrate 13. The circuit board 2 includes a second glass substrate 21 and a second driving circuit layer (not shown), and the second driving circuit layer is arranged on a surface of the second glass substrate 21.

[0057] The circuit board 2 is disposed on a surface of the array substrate 11, and the projection of the second glass substrate 21 of the circuit board 2 on the plane where the first glass substrate 13 of the array substrate 11 is located is located inside the first glass substrate 13. Figure 1 As shown, the display module 100 has a welding area H, in which the first glass substrate 13 of the array substrate 11 and the second glass substrate 21 of the circuit board 2 are fixedly connected by a laser welding process, and the first driving circuit layer is electrically connected to the second driving circuit layer.

[0058] It can be understood that in the present application, by directly setting the circuit board 2 on a surface of the array substrate 11, and directly using the laser welding process to fix the circuit board 2 and the array substrate 11 in the welding area H, the electrical connection between the circuit board 2 and the array substrate 11 can be achieved without using a cover chip film, and signal transmission can be achieved, thereby saving the cost of using the cover chip film, which is beneficial to solving the problem of high cost of liquid crystal displays in the prior art. At the same time, directly using laser welding of the circuit board 2 and the array substrate 11 also changes the structure of traditional liquid crystal displays and realizes the diversity of the display module 100 structure. In addition, the projection of the second glass substrate 21 of the circuit board 2 on the plane where the first glass substrate 13 of the array substrate 11 is located is located within the first glass substrate 13, which is also beneficial to achieve a narrow frame design.

[0059] For details, see Figure 1 , Figure 3 and Figure 4 The second glass substrate 21 of the circuit board 2 has a first surface 211 and a second surface 212 opposite to each other, and a first side surface 213 connecting the first surface 211 and the second surface 212, and the second driving circuit layer is disposed on the first surface 211. In a specific embodiment, the first surface 211 and the second surface 212 are disposed opposite to each other along the thickness direction of the display module 100.

[0060] In some embodiments, Figure 3 , Figure 4 and Figure 5As shown, the second glass substrate 21 is provided with a first through hole 214, the first through hole 214 passes through the first surface 211 and the second surface 212, the first through hole 214 is filled with a first conductive paste 215, and the second driving circuit layer of the circuit board 2 is electrically connected to the first driving circuit layer of the array substrate 11 through the first conductive paste 215 in the first through hole 214.

[0061] Specifically, the position of the first through hole 214 is aligned with the signal transmission position of the first driving circuit layer of the array substrate 11, one end of the first conductive paste 215 extends to the first surface 211 and is electrically connected to the second driving circuit layer arranged on the first surface 211, and the other end extends to the second surface 212 and is electrically connected to the first driving circuit layer of the array substrate 11 to facilitate signal transmission.

[0062] In some embodiments, the second glass substrate 21 is provided with a plurality of first through holes 214, the plurality of first through holes 214 are arranged at intervals from each other, the first through holes 214 are prepared by a glass punching process, and the first conductive paste 215 is formed by grouting the first through holes 214. Figure 5 As shown, the first through hole 214 is a straight through hole, and a plurality of first through holes 214 are arranged near the first side surface 213 of the second glass substrate 21 and are spaced apart from each other. In other embodiments, the first through holes 214 may also be arranged in any shape such as an inclined hole or a wedge-shaped hole, as long as the first through holes 214 penetrate the first surface 211 and the second surface 212 so that the first conductive paste 215 filled in the first through holes 214 can conduct the first driving circuit layer and the second driving circuit layer to realize signal transmission.

[0063] See also Figure 1 and Figure 2 The first glass substrate 13 of the array substrate 11 has a third surface 131 and a fourth surface 132 relative to each other. Specifically, the third surface 131 and the fourth surface 132 are arranged relatively to each other along the thickness direction of the display module 100, the third surface 131 is arranged toward the opposite substrate 12, and the first driving circuit layer of the array substrate 11 is arranged on the third surface 131.

[0064] In this embodiment, see Figure 1 , Figure 2 and Figure 5 In the first direction, the size of the array substrate 11 is larger than that of the opposing substrate 12. The array substrate 11 includes a bonding area B protruding from one side of the opposing substrate 12. The circuit board 2 is arranged on the third surface 131 and is located in the bonding area B. The second surface 212 is arranged toward the third surface 131, that is, the first surface 211 of the second glass substrate 21 of the circuit board 2 on which the second driving circuit layer is arranged is away from the array substrate 11.

[0065] Specifically, the array substrate 11, the opposing substrate 12 and the circuit board 2 are all rectangular. In the circumferential direction of the display module 100, only one side of the array substrate 11 protrudes from the opposing substrate 12, and the other three sides are basically aligned with the opposing substrate 12, so that only one side of the display module 100 has a frame.

[0066] It can be understood that in this embodiment, by directly setting the circuit board 2 on the third surface 131 of the first glass substrate 13 of the array substrate 11 and locating it in the bonding area B, after the circuit board 2 and the array substrate 11 are aligned through the reference, the first conductive paste 215 can be aligned and contacted with the signal transmission position of the first driving circuit layer of the array substrate 11, and the circuit board 2 is welded and fixed on the third surface 131 of the array substrate 11 by a laser welding process, so that the first driving circuit layer of the array substrate 11 and the second driving circuit layer of the circuit board 2 can be directly connected stably through the first conductive paste 215, avoiding the use of a flip chip film to electrically connect the circuit board 2 and the array substrate 11, saving the cost of using the flip chip film, and the circuit board 2 is directly laser welded to the third surface 131 of the array substrate 11 and located in the bonding area B, which also changes the structure of the traditional liquid crystal display and realizes the diversity of the display module 100 structure; at the same time, compared with the circuit board 2 being partially located outside the display panel 1, setting the circuit board 2 in the bonding area B is also more conducive to reducing the frame size of the display module 100 and more conducive to realizing a narrow frame design.

[0067] In some embodiments, Figure 5 As shown, the first surface 211 of the second glass substrate 21 of the circuit board 2 may also be provided with a first contact pad 22, the second drive circuit layer may be electrically connected to the first contact pad 22, one end of the first conductive paste 215 filled in the first through hole 214 may be directly electrically connected to the first contact pad 22 of the first surface 211, and then electrically connected to the second drive circuit layer. Similarly, the third surface 131 of the first glass substrate 13 of the array substrate 11 may also be provided with a second contact pad 14, the second contact pad 14 is provided in the bonding area B, the first drive circuit layer may be electrically connected to the second contact pad 14 on the third surface 131, and then electrically connected to the other end of the first conductive paste 215 filled in the first through hole 214, and the first drive circuit layer and the second drive circuit layer are electrically connected.

[0068] In some embodiments, in addition to being provided with the second driving circuit layer, the first surface 211 of the second glass substrate 21 of the circuit board 2 may also be bonded with other components. The second surface 212 of the second glass substrate 21 is arranged toward the third surface 131, and the first surface 211 is arranged away from the array substrate 11. This is more conducive to the second surface 212 and the third surface 131 being bonded together, so as to facilitate laser welding of the second glass substrate 21 and the first glass substrate 13 and conduction of the first conductive paste 215 and the first driving circuit layer, thereby avoiding the influence of other components on the laser welding.

[0069] Specifically, in some embodiments, the thickness of the circuit board 2 is the same as the thickness of the opposing substrate 12, that is, after the circuit board 2 is welded to the bonding area B of the first glass substrate 13 of the array substrate 11, the surface of the circuit board 2 facing away from the array substrate 11 is basically flush with the surface of the opposing substrate 12 facing away from the array substrate 11, which is beneficial to reducing the thickness of the display module 100.

[0070] In some embodiments, the second glass substrate 21 of the circuit board 2 is the glass residue left after the large glass plate is cut. For example, the size of the circuit board 2 is smaller than that of the array substrate 11 or the counter substrate 12, and the large glass plate can be cut to form the glass substrate required for the array substrate 11 or the counter substrate 12 of the display panel 1, and the scraps left after the large glass plate is cut to form the glass substrate required for the display panel 1 are used to prepare the second glass substrate 21 required for the circuit board 2. It can be understood that the use of the glass residue left after the large glass plate is cut to prepare the second glass substrate 21 required for the circuit board 2 can improve the utilization rate of the glass, reduce the remaining glass residue, and further reduce the production cost of the circuit board 2 of the display module 100.

[0071] For details, see Figures 1 to 5 , the first side surface 213 of the second glass substrate 21 of the circuit board 2 is arranged close to the counter substrate 12, and the first through hole 214 is arranged close to the first side surface 213, that is, the first through hole 214 on the second glass substrate 21 is arranged close to the counter substrate 12. The welding area H is located in the bonding area B and is arranged along the edge of the bonding area B. Specifically, the welding area H is spaced apart from the first through hole 214, and the first drive circuit layer and the second drive circuit layer are not arranged in the welding area H. The second glass substrate 21 and the first glass substrate 13 are welded in the welding area H by using a laser welding process. At the welding position, the corresponding parts of the second glass substrate 21 and the first glass substrate 13 are melted and combined, and the second glass substrate 21 is fixedly connected to the first glass substrate 13. The first drive circuit layer and the second drive circuit layer are not arranged in the welding area H, which can avoid the influence of laser welding on the first drive circuit layer and the second drive circuit layer.

[0072] Specifically, Figure 1As shown, the welding area H is only arranged along the outer edge of the bonding area B, and the welding area H is roughly U-shaped. The welding area H is not arranged at the position corresponding to the first side surface 213 of the second glass substrate 21, that is, the welding area H is not arranged at the position adjacent to the first through hole 214, so as to avoid affecting the first drive circuit layer and the second drive circuit layer at the position of the first through hole 214 during welding, resulting in the first drive circuit layer and the second drive circuit layer being unable to achieve stable electrical connection. In other embodiments, the welding area H can also be arranged at other positions, for example, the welding area H can be arranged only at one side of the bonding area B corresponding to the second glass substrate 21 away from the opposite substrate 12, or the welding area H can be arranged only corresponding to the short side of the bonding area B, and the welding area H can be in any shape such as a straight line or a curve, as long as the first drive circuit layer and the second drive circuit layer are not arranged in the welding area H, and it can be arranged at a distance from the first through hole 214.

[0073] In some embodiments, the width of the welding area H is in the range of 200-300 μm, and the welding area H can also be a clearance area for laser welding, ensuring that there are no first driving circuit layers and second driving circuit layers and other wirings or components in the clearance area, thereby avoiding the influence of laser welding on wirings or components and causing abnormal display of the display module 100.

[0074] In some embodiments, when laser welding is performed on the first glass substrate 13 and the second glass substrate 21 in the welding area H, a laser with an average power of 75w and a long focal length scanning galvanometer with a focal length of 255mm are used, the single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / S, so that the welding effect of the first glass substrate 13 and the second glass substrate 21 is better, a more stable connection is achieved, and other components or wiring are not affected.

[0075] In some embodiments, the display module 100 may include one circuit board 2, or may include multiple circuit boards 2, which can be selected according to the size of the display panel 1. For example, when the size of the display panel 1 is small, the display module 100 may include only one circuit board 2; when the size of the display panel 1 is large, the display module 100 may include multiple circuit boards 2, and the second glass substrates 21 of the multiple circuit boards 2 have the same structure. The multiple circuit boards 2 are arranged at intervals in the bonding area B of the array substrate 11. In the welding area H, the second glass substrates 21 of the multiple circuit boards 2 are welded together with the first glass substrate 13 of the array substrate 11 by a laser welding process, so that the first drive circuit layer and the second drive circuit layer are electrically connected, so as to drive and control the display panel 1 to realize the display function.

[0076] See also Figures 6 to 9 , Figure 6 is a bottom-up structural schematic diagram of a display module provided in the second embodiment of the present application, Figure 7 yes Figure 6 The schematic diagram of the top view structure of the display module provided, Figure 8 yes Figure 6 A schematic diagram of the structure of the display panel of the display module provided is shown as a bottom view. Fig. 9 yes Figure 6 A CC cross-sectional diagram of the display module is provided.

[0077] See also Figures 6 to 9 The second embodiment of the present application also provides another display module 100, which is different from the display module 100 provided in the first embodiment in that, in this embodiment, the circuit board 2 is arranged on the fourth surface 132 of the first glass substrate 13 of the array substrate 11, and the second surface 212 of the second glass substrate 21 of the circuit board 2 is arranged toward the fourth surface 132. That is, the second glass substrate 21 of the circuit board 2 is arranged on the surface of the array substrate 11 away from the opposite substrate 12, and the second surface 212 of the second glass substrate 21 without the second driving circuit layer is arranged toward the fourth surface 132. Specifically, the second surface 212 is arranged in contact with the fourth surface 132. In this embodiment, the circuit board 2 is welded to the fourth surface 132 of the first glass substrate 13 of the array substrate 11 by using a laser welding process, that is, the circuit board 2 is welded and fixed to the back of the array substrate 11.

[0078] Further, in this embodiment, see Figure 8 and Fig. 9 The first glass substrate 13 of the array substrate 11 is further provided with a second through hole 133, the second through hole 133 penetrates the third surface 131 and the fourth surface 132 of the first glass substrate 13, and the second through hole 133 of the array substrate 11 is filled with a second conductive paste 134. The second through hole 133 of the first glass substrate 13 of the array substrate 11 is aligned with the first through hole 214 of the second glass substrate 21 of the circuit board 2, and the first driving circuit layer and the second driving circuit layer are electrically connected in sequence through the second conductive paste 134 and the first conductive paste 215.

[0079] Specifically, one end of the second conductive paste 134 extends to the third surface 131 of the first glass substrate 13 and is electrically connected to the first driving circuit layer disposed on the third surface 131, and the other end extends to the fourth surface 132 of the first glass substrate 13 and is in corresponding contact with the first conductive paste 215 filled in the first through hole 214 of the second glass substrate 21 to achieve electrical connection. Since the first conductive paste 215 in the first through hole 214 extends to the first surface 211 of the second glass substrate 21 and is electrically connected to the second driving circuit layer disposed on the first surface 211, the first driving circuit layer and the second driving circuit layer can be electrically connected in sequence through the second conductive paste 134 in the second through hole 133 and the first conductive paste 215 in the first through hole 214, so as to facilitate signal transmission, thereby facilitating driving and controlling the display panel 1. In the present embodiment, there is no need to use a chip-on-chip film to achieve electrical connection between the circuit board 2 and the array substrate 11, which saves the cost of using the chip-on-chip film and helps to solve the problem of high cost of liquid crystal displays in the prior art. In addition, the circuit board 2 is welded and fixed to the back of the array substrate 11, which can also change the structure of the traditional liquid crystal display and realize the diversified design of the display module 100 structure.

[0080] In some embodiments, the first glass substrate 13 is provided with a plurality of second through holes 133, the plurality of second through holes 133 are arranged at intervals from each other, the second through holes 133 can be prepared by a glass punching process, and the second conductive paste 134 is formed by grouting the second through holes 133. Specifically, the plurality of second through holes 133 of the first glass substrate 13 and the plurality of first through holes 214 of the second glass substrate 21 are arranged in a one-to-one correspondence, so that the second conductive paste 134 in the plurality of second through holes 133 and the first conductive paste 215 in the plurality of first through holes 214 are electrically connected in a one-to-one correspondence.

[0081] In a specific embodiment, Fig. 9 As shown, the second through hole 133 is a straight through hole, and a plurality of second through holes 133 are spaced apart from each other. In other embodiments, the second through hole 133 may also be set to any shape such as an inclined hole or a wedge-shaped hole, as long as the second through hole 133 passes through the third surface 131 and the fourth surface 132, so that the second conductive paste 134 filled in the second through hole 133 can conduct the second driving circuit layer and the first conductive paste 215, and then conduct the first driving circuit layer, so as to achieve signal transmission.

[0082] Specifically, the first glass substrate 13 of the array substrate 11 further has a second side surface 135 connecting the third surface 131 and the fourth surface 132. In some embodiments, the first through hole 214 of the second glass substrate 21 is arranged correspondingly close to the first side surface 213, and the second through hole 133 of the first glass substrate 13 is arranged correspondingly close to the second side surface 135. The first side surface 213 of the second glass substrate 21 is arranged flush with the second side surface 135 of the first glass substrate 13. That is, the first through hole 214 and the second through hole 133 are arranged correspondingly close to the same side of the display panel 1. In other embodiments, the first through hole 214 and the second through hole 133 may not be arranged correspondingly close to the first side surface 213 and the second side surface 135, and may be arranged correspondingly at any other position, as long as the first driving circuit layer and the second driving circuit layer can be electrically connected through the first conductive paste 215 in the first through hole 214 and the second conductive paste 134 in the second through hole 133, so as to realize signal transmission, so as to drive and control the display panel 1.

[0083] like Figure 6 As shown, in some embodiments, the welding area H is arranged along the edge of the second glass substrate 21 and is spaced apart from the first through hole 214, and the second driving circuit layer is not arranged in the welding area H. Figure 6 As shown, the welding area H is roughly U-shaped, and the welding area H is not set at the position corresponding to the first side surface 213 of the second glass substrate 21, that is, the welding area H is not set at the position adjacent to the first through hole 214, so as to avoid affecting the first driving circuit layer at the position of the first through hole 214 during welding, resulting in the failure of the first driving circuit layer and the second driving circuit layer to achieve stable electrical connection. In other embodiments, the welding area H can also be set at other positions, for example, the welding area H can be set only corresponding to the side surface of the second glass substrate 21 opposite to the first side surface 213, or the welding area H can be set only corresponding to the short side of the second glass substrate 21, and the welding area H can be any shape such as a straight line or a curve, as long as the first driving circuit layer and the second driving circuit layer are not set in the welding area H, and it can be set at a distance from the first through hole 214.

[0084] In some embodiments, Fig. 9As shown, the first surface 211 of the second glass substrate 21 of the circuit board 2 may also be provided with a first contact pad 22, the second drive circuit layer may be electrically connected to the first contact pad 22, one end of the first conductive paste 215 filled in the first through hole 214 may be directly electrically connected to the first contact pad 22 of the first surface 211, and further electrically connected to the second drive circuit layer. Similarly, the third surface 131 of the first glass substrate 13 of the array substrate 11 may also be provided with a second contact pad 14, the first drive circuit layer may be electrically connected to the second contact pad 14 on the third surface 131, one end of the second conductive paste 134 filled in the second through hole 133 may be directly electrically connected to the second contact pad 14 on the third surface 131, and further electrically connected to the first drive circuit layer, and then the electrical connection between the first conductive paste 215 and the second conductive paste 134 is realized to realize the electrical connection between the first drive circuit layer and the second drive circuit layer.

[0085] In this embodiment, the width of the welding area H is the same as the width of the welding area H of the display module 100 provided in the first embodiment, and can also be set in the range of 200-300 μm. The welding area H can be a clearance area for laser welding, ensuring that there are no first drive circuit layer and second drive circuit layer and other wiring or components in the clearance area, so as to avoid the influence of laser welding on wiring or components and cause the display module 100 to display abnormally. Similarly, in this embodiment, in some implementation methods, when laser welding the first glass substrate 13 and the second glass substrate 21 in the welding area H, a laser with an average power of 75w and a long focal length scanning galvanometer with a focal length of 255mm are used, the single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / S, so that the welding effect of the first glass substrate 13 and the second glass substrate 21 is better, a more stable connection is achieved, and other components or circuit layers will not be affected.

[0086] In some embodiments, the size of the array substrate 11 is equal to the size of the opposite substrate 12. Specifically, the array substrate 11 and the opposite substrate 12 are both rectangular, and the four sides of the array substrate 11 are aligned with the four sides of the opposite substrate 12. It can be understood that in this embodiment, by providing the second through hole 133 on the first glass substrate 13 of the array substrate 11 and filling the second conductive paste 134 in the second through hole 133, the circuit board 2 is provided on the fourth surface 132 of the array substrate 11 away from the opposite substrate 12, the first conductive paste 215 in the first through hole 214 of the second glass substrate 21 and the second conductive paste 134 in the second through hole 133 of the first glass substrate 13 are arranged in contact with each other, and then the second glass substrate 21 is fixedly welded to the fourth surface 132 of the array substrate 11 away from the opposite substrate 12 by a laser welding process, so that the second driving circuit layer of the circuit board 2 is electrically connected with the second driving circuit layer of the array substrate 11, and the array substrate 11 does not need to be provided with a specific bonding area B. That is, different from the display module 100 of the first embodiment, in this embodiment, in the first direction, the array substrate 11 does not include a bonding area B protruding from one side of the opposing substrate 12, and the size of the array substrate 11 is aligned with the size of the opposing substrate 12, so that the display module 100 can achieve a borderless design on all four sides, which is beneficial to reducing the size of the display module 100, realizing a truly borderless design, and meeting more usage requirements.

[0087] In other embodiments, the size of the array substrate 11 may not be equal to the size of the opposing substrate 12. For example, the size of the array substrate 11 may be larger than the size of the opposing substrate 12. The second glass substrate 21 of the circuit board 2 is still welded to the fourth surface 132 of the first glass substrate 13, and can be designed as needed.

[0088] In this embodiment, the rest of the structure and configuration of the display module 100 are the same as those of the display module 100 provided in the first embodiment, and will not be described in detail herein.

[0089] See also Figures 10 to 13 , Fig.10 is a schematic diagram of a top view of a display module provided in the third embodiment of the present application, Fig.11 yes Fig.10 The schematic diagram of the structure of the display module from above is provided. Fig.12 yes Fig.10 A schematic diagram of the side view structure of the display panel of the display module provided, Fig.13 yes Fig.10 A schematic diagram of the structure of the circuit board of the provided display module.

[0090] See also Figures 10 to 13The third embodiment of the present application provides another display module 100, which is different from the display module 100 of the first embodiment and the second embodiment. In this embodiment, the display module 100 also includes a flexible circuit board 3, and the second glass substrate 21 of the circuit board 2 in this embodiment is not provided with a first through hole 214, and the first glass substrate 13 of the array substrate 11 is not provided with a second through hole 133.

[0091] Specifically, in this embodiment, the first glass substrate 13 has a third surface 131 and a fourth surface 132 that are opposite to each other, and a second side surface 135 connecting the third surface 131 and the fourth surface 132. The third surface 131 is disposed toward the opposite substrate 12, and the first driving circuit layer is disposed on the third surface 131 and extends to the second side surface 135. That is, different from the display module 100 of the first embodiment and the second embodiment, the first driving circuit layer of the first glass substrate 13 in this embodiment is not only disposed on the third surface 131, but also extends to the second side surface 135 of the first glass substrate 13.

[0092] The circuit board 2 is disposed on the fourth surface 132 of the first glass substrate 13, that is, the circuit board 2 is disposed on the surface of the array substrate 11 away from the opposite substrate 12. Specifically, the second glass substrate 21 has a first surface 211 and a second surface 212 opposite to each other and a first side surface 213 connecting the first surface 211 and the second surface 212, the second driving circuit layer is disposed on the first surface 211, and the second surface 212 is disposed toward the fourth surface 132. Specifically, the second surface 212 of the second glass substrate 21, on which the second driving circuit layer is not disposed, is disposed in contact with the fourth surface 132 of the first glass substrate 13 away from the opposite substrate 12.

[0093] In this embodiment, one end of the flexible circuit board 3 is electrically connected to the first driving circuit layer extending to the second side surface 135, and the other end is bent to the side of the circuit board 2 away from the fourth surface 132, and is electrically connected to the second driving circuit layer of the circuit board 2. That is, in this embodiment, the second driving circuit layer of the circuit board 2 and the first driving circuit layer of the array substrate 11 are electrically connected through the flexible circuit board 3, and are not electrically connected by using the first conductive paste 215 in the first through hole 214 or the second conductive paste 134 in the second through hole 133 as in the first and second embodiments.

[0094] It can be understood that in this embodiment, the first driving circuit layer of the first glass substrate 13 is directly extended to the second side surface 135 of the first glass substrate 13, and it is not necessary to perform glass drilling on the first glass substrate 13 of the array substrate 11 to form the second through hole 133 and then grout to form the second conductive paste 134, nor is it necessary to perform glass drilling on the second glass substrate 21 of the circuit board 2 to form the first through hole 214 and then grout to form the first conductive paste 215, and it is not necessary to align the second through hole 133 with the first through hole 214 or the first through hole 214 with the signal transmission position of the array substrate 11 before signal transmission can be realized. The flexible substrate 13 is directly used for the first through hole 214. The flexible circuit board 3 is electrically connected to the second driving circuit layer and the first driving circuit layer, which can save the process steps of glass drilling and grouting, simplify the process flow, save production costs, and at the same time, there is no need to use a cover chip film, saving the cost of using the cover chip film; and the circuit board 2 is arranged on the fourth surface 132 of the first glass substrate 13, and the other end of the flexible circuit board 3 is bent to the side of the circuit board 2 away from the fourth surface 132, that is, the circuit board 2 is arranged on the back side of the array substrate 11, which can also save the frame size of the display module 100, which is conducive to realizing a narrow frame design, and can also change the structure of the traditional liquid crystal display to form a new display module 100.

[0095] In some embodiments, Fig.12 and Fig.13 As shown, the first surface 211 of the second glass substrate 21 of the circuit board 2 may also be provided with a first contact pad 22, the second drive circuit layer may be electrically connected to the first contact pad 22, and one end of the flexible circuit board 3 may be directly electrically connected to the first contact pad 22 of the first surface 211 after being bent to the side of the circuit board 2 away from the fourth surface 132, and further electrically connected to the second drive circuit layer. Similarly, the second side surface 135 of the first glass substrate 13 of the array substrate 11 may also be provided with a second contact pad 14, the first drive circuit layer extending to the second side surface 135 of the first glass substrate 13 may be electrically connected to the second contact pad 14 on the second side surface 135, one end of the flexible circuit board 3 may be directly electrically connected to the second contact pad 14 of the second side surface 135, and further electrically connected to the first drive circuit layer, and the electrical connection between the first drive circuit layer and the second drive circuit layer is achieved through the flexible circuit board 3.

[0096] In some embodiments, the size of the array substrate 11 is equal to the size of the counter substrate 12, the first side surface 213 is flush with the second side surface 135, and the circuit board 2 is disposed on the fourth surface 132 of the first glass substrate 13, which is conducive to realizing the design of the display module 100 without a frame on all four sides, meeting more usage requirements. In other embodiments, the size of the array substrate 11 may not be equal to the size of the counter substrate 12, for example, the size of the array substrate 11 may be larger than the size of the counter substrate 12, and the circuit board 2 may not be welded on the fourth surface 132 of the first glass substrate 13.

[0097] In some embodiments, the welding area H is arranged along the edge of the second glass substrate 21 and is spaced apart from the flexible circuit board 3. In the welding area H, a laser welding process is used to weld and fix the second glass substrate 21 of the circuit board 2 to the fourth surface 132 of the first glass substrate 13 of the array substrate 11, thereby achieving a fixed connection between the circuit board 2 and the array substrate 11.

[0098] Specifically, the welding area H is roughly U-shaped, and the welding area H is not set at the position of the second glass substrate 21 corresponding to the first side surface 213, that is, the welding area H is not set at the position of the second glass substrate 21 close to the flexible circuit board 3, so as to avoid affecting the flexible circuit board 3 and the first drive circuit layer electrically connected to the flexible circuit board 3 during welding, resulting in the first drive circuit layer, the flexible circuit board 3 and the second drive circuit layer being unable to achieve stable electrical connection. In other embodiments, the welding area H can also be set at other positions, for example, the welding area H can be set only corresponding to the side surface of the second glass substrate 21 opposite to the first side surface 213, or the welding area H can be set only corresponding to the short side of the second glass substrate 21, and the welding area H can be any shape such as a straight line or a curve, as long as the first drive circuit layer and the second drive circuit layer are not set in the welding area H, and it can be set at a distance from the flexible circuit board 3.

[0099] It can be understood that the circuit board 2 and the array substrate 11 can be electrically connected through the flexible circuit board 3, so as to drive and control the display panel 1 to realize the display function. The circuit board 2 is welded and fixed to the fourth surface 132 of the array substrate 11, and the position of the circuit board 2 is fixed. During the transportation of the display module 100 or when a collision, shaking, etc. occurs, the circuit board 2 and the array substrate 11 can be stably connected to the flexible circuit board 3, thereby ensuring that the circuit board 2 and the array substrate 11 can achieve a stable and effective electrical connection, avoiding the situation that when the display module 100 is transported, collided or shaken, the circuit board 2 is not fixedly connected to the array substrate 11, the circuit board 2 moves or the flexible circuit board 3 moves, resulting in poor contact between the flexible circuit board 3 and the second drive circuit layer of the circuit board 2 or the first drive circuit layer of the array substrate 11, thereby resulting in the problem that the second drive circuit layer and the first drive circuit layer cannot be stably electrically connected, which is beneficial to improving the display effect of the display module 100.

[0100] In some embodiments, the display module 100 may include one circuit board 2, or may include multiple circuit boards 2; the flexible circuit board 3 may be provided as one or multiple, and may be selected according to the size of the display panel 1. For example, when the size of the display panel 1 is small, the display module 100 may include only one circuit board 2 and one or more flexible circuit boards 3; when the size of the display panel 1 is large, the display module 100 may include multiple circuit boards 2 and multiple flexible circuit boards 3, the multiple circuit boards 2 are arranged at intervals from each other, the multiple flexible circuit boards 3 are also arranged at intervals from each other, and one end of each flexible circuit board 3 is electrically connected to the first drive circuit layer extending to the second side surface 135, and the other end is bent to the side of the circuit board 2 away from the fourth surface 132 and electrically connected to the second drive circuit layer, so as to realize the electrical connection between the first drive circuit layer and the second drive circuit layer.

[0101] In this embodiment, the rest of the structure and configuration of the display module 100 are the same as those of the display module 100 provided in the first embodiment, and will not be described in detail herein.

[0102] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display module, characterized in that: include: The display panel comprises an array substrate and an opposing substrate which are arranged opposite to each other; The array substrate comprises a first glass substrate and a first driving circuit layer arranged on the first glass substrate; A circuit board, comprising a second glass substrate and a second driving circuit layer, wherein the second driving circuit layer is disposed on a surface of the second glass substrate; Wherein, the circuit board is arranged on a surface of the array substrate, and the projection of the second glass substrate on the plane where the first glass substrate is located is located inside the first glass substrate; The display module has a welding area, in which the first glass substrate and the second glass substrate are fixedly connected by a laser welding process; and the first driving circuit layer and the second driving circuit layer are electrically connected.

2. The display module according to claim 1, characterized in that: The second glass substrate has a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface; the second driving circuit layer is disposed on the first surface; The second glass substrate is provided with a first through hole, the first through hole passes through the first surface and the second surface; the first through hole is filled with a first conductive paste; The second driving circuit layer is electrically connected to the first driving circuit layer through the first conductive paste.

3. The display module according to claim 2, characterized in that: The first glass substrate has a third surface and a fourth surface opposite to each other, the third surface is arranged toward the counter substrate; the first driving circuit layer is arranged on the third surface; In a first direction, the size of the array substrate is larger than the size of the counter substrate, and the array substrate includes a bonding area protruding from one side of the counter substrate; The circuit board is arranged on the third surface and is located in the bonding area, and the second surface is arranged toward the third surface.

4. The display module according to claim 3, characterized in that: The thickness of the circuit board is the same as that of the opposing substrate; the first side surface is disposed close to the opposing substrate, and the first through hole is disposed close to the first side surface; The welding area is located in the bonding area and is arranged along the edge of the bonding area. The welding area is spaced apart from the first through hole. The first driving circuit layer and the second driving circuit layer are not arranged in the welding area.

5. The display module according to claim 2, characterized in that: The first glass substrate has a third surface and a fourth surface facing each other; the third surface is arranged toward the counter substrate, and the first driving circuit layer is arranged on the third surface; the circuit board is arranged on the fourth surface, and the second surface is arranged toward the fourth surface; The first glass substrate is provided with a second through hole, the second through hole passes through the third surface and the fourth surface, and the second through hole is filled with a second conductive paste; The second through hole is arranged in alignment with the first through hole, and the first driving circuit layer and the second driving circuit layer are electrically connected via the second conductive paste and the first conductive paste in sequence.

6. The display module according to claim 5, characterized in that: The first glass substrate further has a second side surface connecting the third surface and the fourth surface; the first through hole is arranged close to the first side surface, and the second through hole is arranged close to the second side surface; the first side surface is flush with the second side surface; The welding area is arranged along the edge of the second glass substrate and is spaced apart from the first through hole; the second driving circuit layer is not arranged in the welding area.

7. The display module according to claim 6, characterized in that: The size of the array substrate is equal to the size of the counter substrate.

8. The display module according to claim 5, characterized in that: The first glass substrate is provided with a plurality of the second through holes, the second glass substrate is provided with a plurality of the first through holes, and the plurality of the second through holes are provided in a one-to-one correspondence with the plurality of the first through holes; and / or, The first through hole is prepared by using a glass punching process; and / or the second through hole is prepared by using a glass punching process.

9. The display module according to claim 1, characterized in that: The first glass substrate has a third surface and a fourth surface opposite to each other, and a second side surface connecting the third surface and the fourth surface, wherein the third surface is disposed toward the counter substrate; the first driving circuit layer is disposed on the third surface and extends to the second side surface; The circuit board is arranged on the fourth surface; The second glass substrate has a first surface and a second surface opposite to each other, the second driving circuit layer is arranged on the first surface, and the second surface is arranged toward the fourth surface; The display module further includes a flexible circuit board, one end of which is electrically connected to the first drive circuit layer on the second side surface, and the other end of which is bent to a side of the circuit board away from the fourth surface and electrically connected to the second drive circuit layer; The welding area is arranged along the edge of the second glass substrate and is spaced apart from the flexible circuit board.

10. The display module according to any one of claims 1 to 9, characterized in that: The second glass substrate is glass residue remaining after cutting of a large glass plate; and / or, The display module includes one circuit board, or the display module includes a plurality of circuit boards spaced apart from each other.

11. The display module according to any one of claims 1 to 9, characterized in that: When laser welding the first glass substrate and the second glass substrate in the welding area, a laser with an average power of 75W and a long focal length scanning galvanometer with a focal length of 255mm are used; the single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / S; and / or, The width of the welding area is 200-300 μm.

Images