Circuit board assembly and electronic equipment
By connecting the conductive parts to the grounding pads of multiple electronic devices and covering the signal pads with shields, the problem of difficult electronic devices being miniaturized due to the installation of conductive parts is solved, and the compact layout and miniaturization of electronic devices are achieved.
Patent Information
- Application Number
- CN202411721249.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-03-11
AI Technical Summary
In the prior art, conductive components need to be installed on circuit boards, resulting in electronic devices needing to be avoided, thereby affecting the miniaturization of electronic devices.
By connecting the conductive parts to the grounding pads in multiple electronic devices, the grounding of multiple grounding pads is achieved, and the signal pads are covered with shields, making full use of the Z-direction space on the circuit board, saving the X-direction and Y-direction layout area.
The compact layout of multiple electronic devices is realized, reducing the volume of electronic devices, and conducive to miniaturization of electronic devices.
Smart Images
Figure CN119603863A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of circuit boards, and in particular relates to a circuit board assembly and an electronic device. Background Art
[0002] As more and more electronic devices are integrated on circuit boards, electromagnetic interference is becoming more and more serious. Severe electromagnetic interference may affect the normal operation of electronic devices and even the normal operation of electronic equipment.
[0003] In the related art, a conductive component is used to electrically connect a circuit board to a structural support of an electronic device, thereby forming a Faraday cage for shielding interference. However, since the conductive component needs to be installed on the circuit board, adjacent electronic devices need to be moved away to provide installation space for the conductive component. If multiple conductive components are required, more avoidance space is required, which is very unfavorable for the miniaturization of electronic equipment. Summary of the invention
[0004] The present application aims to provide a circuit board assembly and an electronic device, which at least solves the problem in the related art that the design of electronic devices avoiding conductive components makes it difficult to miniaturize the electronic device.
[0005] In order to solve the above technical problems, this application is implemented as follows:
[0006] In a first aspect, an embodiment of the present application provides a circuit board assembly, including:
[0007] Circuit boards;
[0008] A plurality of electronic devices are arranged on the circuit board, wherein the electronic devices include signal pads and ground pads;
[0009] A shielding member, covering at least a signal pad in any electronic device;
[0010] A conductive member, one side of which is connected to ground pads in a plurality of electronic devices, and the other side of which is grounded.
[0011] In a second aspect, an embodiment of the present application provides an electronic device, including:
[0012] As the circuit board assembly in the first aspect.
[0013] In the embodiment of the present application, the conductive member is connected to the ground pads in multiple electronic devices, that is, multiple ground pads are electrically connected to the conductive member at the same time. Since the conductive member is electrically connected to the ground structure in the electronic device, multiple ground pads can be grounded through one conductive member. When the conductive member is electrically connected to multiple ground pads, the conductive member in this embodiment is not directly mounted on the circuit board, so the electronic device does not need to provide installation avoidance space for the conductive member, and a small gap can be left between the multiple electronic devices, so that the installation layout of the multiple electronic devices is more compact, and the multiple electronic devices can be brought close together by adjusting the layout of the electronic devices.
[0014] The conductive part is electrically connected to the ground pad, and then the signal pad is covered with a shielding part, so that the conductive part can be brought into contact with the ground structure to achieve grounding. This solution makes full use of the Z-direction space on the circuit board and does not affect the X-direction and Y-direction layout on the circuit board, saving the layout area of the circuit board and facilitating the miniaturization of electronic equipment.
[0015] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0017] Figure 1 is one of the schematic diagrams of the distribution form of multiple electronic devices according to an embodiment of the present application;
[0018] Figure 2 is a second schematic diagram of the distribution of multiple electronic devices according to an embodiment of the present application;
[0019] Figure 3 is one of the structural schematic diagrams of a circuit board assembly according to an embodiment of the present application;
[0020] Figure 4 This is a second structural schematic diagram of a circuit board assembly according to an embodiment of the present application;
[0021] Figure 5 is one of the structural schematic diagrams of the circuit board assembly and the structural support according to the embodiment of the present application;
[0022] Figure 6 This is a second structural schematic diagram of a circuit board assembly and a structural support according to an embodiment of the present application;
[0023] Figure 7 is a schematic diagram of the matching area of the buffer gasket and the ground pad according to an embodiment of the present application;
[0024] Figure 8 This is the third structural schematic diagram of the circuit board assembly and the structural support according to the embodiment of the present application.
[0025] Reference numerals:
[0026] 100 circuit board assembly, 110 circuit board, 111 grounding area, 120 electronic device, 121 signal pad, 122 grounding pad, 123 device group, 124 first electronic device, 130 shielding member, 140 conductive member, 150 insulating film, 160 buffer gasket, 170 spring contact, 200 structural support. DETAILED DESCRIPTION
[0027] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0028] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.
[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0030] Combine the following Figure 1-Figure 8 A circuit board assembly and an electronic device according to embodiments of the present application are described.
[0031] Combination Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, according to some embodiments of the present application, the circuit board assembly 100 includes: a circuit board 110, an electronic device 120, a shielding member 130 and a conductive member 140. The number of the electronic devices 120 is multiple, and the multiple electronic devices 120 are arranged on the circuit board 110. The electronic device 120 includes a signal pad 121 and a ground pad 122. The shielding member 130 at least covers the signal pad 121 in any electronic device 120. One side of the conductive member 140 is connected to the ground pad 122 in the multiple electronic devices 120, and the other side of the conductive member 140 is grounded.
[0032] The electronic devices 120 are mounted on the circuit board 110. The multiple electronic devices 120 include at least one of a resistor, a capacitor, and an inductor. The electronic device 120 is usually connected to an electrical signal at one end and to a ground signal at the other end. Therefore, a signal pad 121 and a ground pad 122 are provided on the electronic device 120. The signal pad 121 is used to connect the electrical signal, and the ground pad 122 is used to connect the ground signal.
[0033] As the internal space of electronic devices becomes more and more compact, the space on the circuit board 110 becomes smaller and smaller. A shielding member 130 can be used to replace the shielding cover in the related art, and a layer of shielding member 130 can be directly laid on the electronic device 120. The shielding member 130 can be attached to the electronic device 120, thereby saving space above the circuit board 110. Since the signal pad 121 is used to connect the signal, the shielding member 130 needs to cover at least the signal pad 121. In other embodiments, if conditions permit, the shielding member 130 can also cover the ground pad 122.
[0034] In this embodiment, the conductive member 140 is connected to the ground pads 122 in the multiple electronic devices 120, that is, the multiple ground pads 122 are electrically connected to the conductive member 140 at the same time. Since the conductive member 140 is electrically connected to the grounding structure in the electronic device, the multiple ground pads 122 can be grounded through one conductive member 140. When the conductive member 140 is electrically connected to the multiple ground pads 122, the conductive member 140 in this embodiment is not directly mounted on the circuit board 110, so the electronic device 120 does not need to provide installation avoidance space for the conductive member 140, and a small gap can be left between the multiple electronic devices 120, so that the installation layout of the multiple electronic devices 120 is more compact, and the multiple electronic devices 120 can be brought close together by adjusting the layout of the electronic devices 120.
[0035] Combination Figure 3 and Figure 7As shown, the conductive member 140 is electrically connected to the ground pad 122, and then the shielding member 130 is used to cover the signal pad 121, so that the conductive member 140 can be in contact with the ground structure, thereby achieving antenna grounding. This solution fully utilizes the Z-direction space on the circuit board 110 and does not affect the X-direction and Y-direction layout of the circuit board 110, saving the layout area of the circuit board 110, which is conducive to the miniaturization of electronic equipment.
[0036] Exemplarily, the electronic device 120 is a capacitor, one end of the capacitor is connected to the signal, and the other end is grounded. By adjusting the layout of multiple electronic devices 120, the ground pads 122 are brought close together to form a large-area grounding.
[0037] In a possible application, the electronic device 120 is fixed on the circuit board 110 by soldering, and the conductive member 140 is fixed on the ground pad 122 by soldering.
[0038] In a possible application, the shielding member 130 may be a shielding film or a shielding layer having a shielding function.
[0039] like Figure 4 As shown, in a possible application, the circuit board assembly 100 further includes an insulating film 150. The insulating film 150 is firstly covered on the electronic device 120, and then the shielding member 130 is covered.
[0040] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, a grounding area 111 ( Figure 1 and Figure 2 The projection of one side of the conductive member 140 on the circuit board 110 overlaps with the grounding area 111, and the plurality of electronic devices 120 are arranged along the circumference of the grounding area 111 ( Figure 1 and Figure 2 The arrow on the dotted line box points to a ) distribution, and the ground pad 122 extends into the grounding area 111, and the signal pad 121 extends out of the grounding area 111.
[0041] A grounding area 111 is defined on the circuit board 110, and the projection of one side of the conductive member 140 on the circuit board 110 overlaps with the grounding area 111, that is, the projection area of one side of the conductive member 140 on the circuit board 110 is equal to the area of the grounding area 111. A plurality of electronic devices 120 are distributed along the circumference of the grounding area 111, so that the plurality of electronic devices 120 can be arranged adjacent to each other in sequence along the circumference of the grounding area 111. The grounding pads 122 of the electronic devices 120 extend into the grounding area 111, so that the plurality of grounding pads 122 can be compactly arranged in the grounding area 111, and one side of the conductive member 140 covers the grounding area 111, so that the plurality of grounding pads 122 in the grounding area 111 can be in contact with one side of the conductive member 140 at the same time, thereby achieving grounding of the plurality of grounding pads 122. Since the multiple ground pads 122 extend into the grounding area 111 , the multiple electronic devices 120 are distributed in a “head-to-head” manner, and the layout of the multiple ground pads 122 on the circuit board 110 is more compact, which is beneficial to saving the layout area of the circuit board 110 .
[0042] By flexibly adjusting the layout of the electronic device 120, different sizes of grounding areas 111 can be formed to adapt to different sizes of the conductive member 140. After the conductive member 140 is welded to the grounding pad 122, the shielding member 130 is then covered on the signal pad 121 to form a complete shielding structure.
[0043] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, the spacing between the ground pads 122 in two adjacent electronic devices 120 is less than or equal to the spacing between the signal pads 121 .
[0044] When multiple electronic devices 120 are mounted on the circuit board 110, the spacing between the ground pads 122 of any two adjacent electronic devices 120 is less than or equal to the spacing between the signal pads 121. When the spacing between adjacent ground pads 122 is equal to the spacing between adjacent signal pads 121, the two adjacent electronic devices 120 are distributed in parallel on the circuit board 110. When the spacing between adjacent ground pads 122 is less than the spacing between adjacent signal pads 121, there is an angle between the two adjacent electronic devices 120, and the spacing between adjacent electronic devices 120 gradually increases from the ground pad 122 to the signal pad 121. In the above manner, the ground pads 122 in adjacent electronic devices 120 can be attached to each other, so that the ground pads 122 in multiple electronic devices 120 are close together, and one side of the conductive member 140 can cover multiple ground pads 122 at the same time with a smaller area, which can save the layout area of the circuit board 110 and reduce the volume of the conductive member 140, which is further conducive to the miniaturization of electronic equipment.
[0045] In some embodiments, optionally, the plurality of electronic devices 120 are covered with a shielding member 130 except for the ground pads 122 , and are fixed to the circuit board 110 through the shielding member 130 .
[0046] refer to Figures 4 to 6 The tops and sides of the signal pads 121 of the multiple electronic devices 120 are covered with a shielding member 130, and one side of the shielding member 130 is extended to be fixed on the circuit board 110. This arrangement can improve the signal shielding effect of the shielding member 130 on the signal pads 121 and ensure the working stability of the signal pads 121.
[0047] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, the circuit board assembly 100 includes at least two device groups 123, any device group 123 includes at least two electronic devices 120, and the extension direction of the electronic device 120 is set (one of the multiple electronic devices 120 is a first electronic device 124, and the first electronic device 124 is used as an example, Figure 2 The arrow at H in the figure indicates the extension direction of the first electronic device 124, which is from the signal pad 121 to the ground pad 122. In one device group 123, at least two electronic devices 120 have the same extension direction, and the electronic devices 120 in different device groups 123 have different extension directions.
[0048] The multiple electronic devices 120 are grouped to form at least two device groups 123 on the circuit board 110. Any device group 123 includes at least two electronic devices 120, that is, at least two electronic devices 120 form a group, so that the multiple electronic devices 120 are distributed on the circuit board 110 in the form of multiple groups.
[0049] The extension direction of the electronic device 120 is defined as pointing from the signal pad 121 to the ground pad 122. In a device group 123, at least two electronic devices 120 have the same extension direction, that is, at least two electronic devices 120 are distributed in parallel. In different device groups 123, the extension direction of the electronic device 120 is different. Through the above manner, the distribution regularity of the multiple electronic devices 120 can be improved, thereby improving the layout space utilization rate of the multiple electronic devices 120 on the circuit board 110, reducing the layout space occupied by the multiple electronic devices 120 on the circuit board 110, which is conducive to reducing the volume of the circuit board assembly 100, thereby facilitating the miniaturization of electronic equipment.
[0050] Combination Figure 1 and Figure 2As shown, in some embodiments, optionally, the extension direction of the electronic device 120 is from the signal pad 121 to the ground pad 122, one of the multiple electronic devices 120 is set as the first electronic device 124, and a part of the ground pads 122 in other electronic devices 120 are provided in the extension direction of the first electronic device 124.
[0051] In the extension direction of the first electronic device 124, other electronic devices 120 except the first electronic device 124 are distributed, and a part of the grounding pads 122 in the other electronic devices 120 are located in the extension direction of the first electronic device 124, that is, the grounding pad 122 in the first electronic device 124 faces at least one grounding pad 122 in the other electronic devices 120, so that the grounding pads 122 of multiple electronic devices 120 can be brought together, and one side of the conductive member 140 can cover multiple grounding pads 122 at the same time with a smaller area, which is conducive to the miniaturization of electronic equipment.
[0052] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, the width of the ground pad 122 is W1, and the distance between two adjacent ground pads 122 is W2, where W1>W2.
[0053] In order to reduce the layout space of multiple electronic devices 120 on the circuit board 110, the ground pads 122 in the multiple electronic devices 120 can be brought closer to each other, that is, the spacing between the ground pads 122 in adjacent electronic devices 120 can be reduced to provide space for the layout of other components, or the volume of the circuit board assembly 100 can be directly reduced.
[0054] In this embodiment, the distance between two adjacent ground pads 122 is limited to be smaller than the width of the ground pad 122 . Taking the width of the ground pad 122 as a reference, the distance between two adjacent ground pads 122 is limited to be smaller, so that the spatial layout of the multiple ground pads 122 is more compact.
[0055] Combination Figure 6 and Figure 7 As shown, in some embodiments, optionally, the circuit board assembly 100 further includes: a buffer gasket 160 , the buffer gasket 160 covers the plurality of ground pads 122 , and the conductive member 140 is electrically connected to the ground pad 122 via the buffer gasket 160 .
[0056] If the conductive part 140 is directly brought into contact with the electronic device 120, some electronic devices 120 may be sensitive to reliability. The conductive part 140 is directly arranged above the electronic device 120, and long-term compression may cause damage to some electronic devices 120. In order to reduce the damage to the electronic device 120, a buffer gasket 160 is added between the ground pad 122 and the conductive part 140. The buffer gasket 160 is not limited here, and may be other conductive soft pads, etc. The buffer gasket 160 serves as an intermediate buffer component, which can reduce the direct contact between the conductive part 140 and the electronic device 120, thereby reducing the damage to the electronic device 120.
[0057] A buffer pad 160 is added between the ground pad 122 and the conductive member 140 to reduce the single-point force of the ground pad 122, thereby reducing the reliability risk of the electronic device 120. At the same time, the antenna is grounded without sacrificing the X-direction and Y-direction space of the circuit board 110, which is conducive to miniaturization of the circuit board assembly 100.
[0058] In a possible embodiment, the implementation process of the circuit board assembly 100 is as follows: the electronic device 120 is soldered to the circuit board 110, the ground pad 122 is tinned and the conductive part 140 is soldered, the circuit board 110 and the signal pad 121 are covered with an insulating film 150, the circuit board 110 and the signal pad 121 are covered with a shielding part 130, and the conductive part 140 is contacted with the structural support 200 to achieve grounding.
[0059] like Figure 8 As shown, in some embodiments, optionally, a spring contact 170 is provided on one side of the conductive member 140 , and the spring contact 170 is in elastic contact with the buffer gasket 160 .
[0060] A spring contact 170 is provided on one side of the conductive member 140, and the conductive member 140 is in elastic contact with the buffer gasket 160 through the spring contact 170. Therefore, the conductive member 140 and the buffer gasket 160 do not need to be welded, but the elasticity of the spring contact 170 is used to stably fit the conductive member 140 and the buffer gasket 160. Of course, in other embodiments, the conductive member 140 can also be fixed to the buffer gasket 160 by welding.
[0061] In a possible embodiment, the implementation process of the circuit board assembly 100 is as follows: the electronic device 120 is soldered to the circuit board 110, the ground pad 122 is spot-tinned and the buffer gasket 160 is soldered, the conductive member 140 is spot-welded above the buffer gasket 160, an insulating film 150 is covered on the circuit board 110 and the signal pad 121, a shielding member 130 is covered on the circuit board 110 and the signal pad 121, and the conductive member 140 is contacted with the structural bracket 200 for grounding.
[0062] In some embodiments, optionally, the buffer pad 160 is disposed opposite to the grounding area 111 .
[0063] The buffer gasket 160 serves as a connecting component between the conductive member 140 and the grounding pad 122. The buffer gasket 160 needs to be in contact with the grounding pad 122. Since the grounding pad 122 extends into the grounding area 111, the buffer gasket 160 and the grounding area 111 are arranged relative to each other in this embodiment, and the size of the buffer gasket 160 is limited within the range of the corresponding grounding area 111, which can reduce the material consumption of the buffer gasket 160.
[0064] In an embodiment of the present application, an electronic device is proposed, including the circuit board assembly 100 in any of the above embodiments. The electronic device in this embodiment can achieve the technical effects of the circuit board assembly 100 in any of the above embodiments, which will not be repeated here.
[0065] Exemplarily, the electronic device may be a mobile phone, a tablet computer, a desktop computer, etc.
[0066] Combination Figure 5 , Figure 6 and Figure 8 As shown, in some embodiments, optionally, the electronic device further includes: a structural support 200 , the structural support 200 is in a grounded state, and the conductive member 140 is electrically connected to the structural support 200 .
[0067] The circuit board assembly 100 contacts the structural support 200 through the conductive member 140 to form a Faraday cage, thereby reducing mutual interference between different modules and ensuring the normal operation of the electronic device.
[0068] In a possible application, one side of the conductive member 140 is welded to the buffer pad 160, and the other side of the conductive member 140 is in elastic contact with the structural support 200. Alternatively, one side of the conductive member 140 is in elastic contact with the buffer pad 160, and the other side of the conductive member 140 is welded to the structural support 200.
[0069] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0070] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.
Claims
1. A circuit board assembly, characterized in that: include: Circuit boards; A plurality of electronic devices are arranged on the circuit board, wherein the electronic devices include signal pads and ground pads; A shielding member, at least covering a signal pad in any of the electronic devices; A conductive member, one side of which is connected to the ground pads in the plurality of electronic devices, and the other side of which is grounded.
2. The circuit board assembly according to claim 1, characterized in that: A grounding area is provided on the circuit board, a projection of one side of the conductive member on the circuit board overlaps with the grounding area, a plurality of electronic components are distributed along the circumference of the grounding area, the grounding pad extends into the grounding area, and the signal pad extends out of the grounding area.
3. The circuit board assembly according to claim 1, characterized in that: The distance between the ground pads in two adjacent electronic devices is less than or equal to the distance between the signal pads.
4. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The plurality of electronic devices are covered with the shielding member except the ground pad, and are fixed on the circuit board through the shielding member.
5. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The width of the ground pad is W1, and the distance between two adjacent ground pads is W2, where W1>W2.
6. The circuit board assembly according to claim 2, characterized in that: The circuit board assembly further comprises: A buffer gasket is covered on the plurality of ground pads, and the conductive member is electrically connected to the ground pads through the buffer gasket.
7. The circuit board assembly according to claim 6, characterized in that: A spring contact is provided on one side of the conductive member, and the spring contact is in elastic contact with the buffer gasket.
8. The circuit board assembly according to claim 6, characterized in that: The buffer pad is arranged opposite to the grounding area.
9. An electronic device, characterized in that: include: A circuit board assembly as claimed in any one of claims 1 to 8.
10. The electronic device according to claim 9, characterized in that: The electronic device further comprises: The structural support is in a grounded state, and the conductive member is electrically connected to the structural support.