Testing device and testing method compatible with memory alloy wire and air valve

Abstract

The invention belongs to the technical field of memory alloy testing, and discloses a testing device and a testing method compatible with a memory alloy wire and an air valve. The testing device comprises a constant-temperature box, a control box arranged in the constant-temperature box, a wire testing assembly and an air valve testing platform, wherein a controller is arranged in the control box, and the wire testing assembly and the air valve testing platform are movably arranged with the box body. Wherein the wire material testing assembly comprises a detachable wire material clamping device and a wire material testing platform. At the moment, the wire material testing assembly and the air valve testing platform can be respectively or simultaneously arranged on the box body and are connected with a controller in a wiring manner, so that the performance test of a plurality of memory alloy wire materials and a plurality of / or a plurality of memory alloy air valves can be simultaneously realized through the device. The testing method is carried out based on the testing device. Therefore, the method has the technical advantages of being simple in testing process, low in testing cost and high in accuracy.

Description

Technical Field

[0001] The invention relates to the technical field of memory alloy testing, and in particular to a testing device and a testing method for memory alloy wires and gas valves. Background Art

[0002] Memory alloy is a new type of alloy material. Due to its excellent deformation recovery ability, it has important application value in various fields such as aviation, construction, and electronics.

[0003] Specifically, the gas valve is a traditional industrial device that controls gas pressure by adjusting the valve opening. It has important applications in various scenarios such as air compression systems and gas delivery systems. Compared with traditional gas valves, the memory alloy gas valve made of memory alloy wire has the technical advantage of being able to automatically control gas pressure; thus, it has better market application prospects than traditional gas valves. In actual application, before the memory alloy gas valve is put into use, it is necessary to test the displacement characteristics and fatigue characteristics of the memory alloy wire placed inside it, and test the pressure control performance of the entire memory alloy gas valve to ensure that it meets the actual application needs in specific applications.

[0004] However, the inventors found that the existing memory alloy wires and devices made based on the memory alloy wires are tested separately, that is, their corresponding test devices are independent of each other, which has the defects of high testing cost and complicated testing process. At the same time, since the memory alloy valve is a new type of valve, there is no mature memory alloy valve testing device on the market, and thus the reliability of the test results cannot be ensured; and the existing memory alloy valve testing devices are mostly imported equipment, which also has the problem of high testing cost. Summary of the invention

[0005] The purpose of the present invention is to provide a testing device and a testing method for memory alloy wires and gas valves, so as to improve the technical problems of high testing cost, complicated testing process and difficulty in ensuring testing accuracy of existing memory alloy wires and gas valves.

[0006] To achieve the above object, the present invention proposes the following technical solutions:

[0007] A testing device compatible with memory alloy wire and gas valve is provided, comprising:

[0008] A thermostatic box, the thermostatic box comprising a door, the door being provided with a viewing window;

[0009] A control box, the control box is placed in the thermostatic box, including a controller, a main body, and a fixing plate; the controller is placed in the main body, including an MCU chip; the fixing plate is fixedly arranged on the upper surface of the main body, and is provided with a plurality of mounting holes and a plurality of wire holes; wherein the mounting holes are arranged in an array, and the wire holes are dispersed around the area where the mounting holes are located;

[0010] A wire testing assembly, the wire testing assembly comprising a wire clamp and a wire testing platform; wherein the wire clamp is a detachable structure and is detachably arranged on the wire testing platform; the wire testing platform is a detachable structure and is detachably arranged on the control box;

[0011] The wire clamp comprises a connecting rod, an upper adapter, an upper locking buckle, an upper wire, a lower wire, a lower locking buckle, a lower adapter, a weight connecting rod and a weight; wherein the upper locking buckle is axially provided with an upper stepped through hole, the aperture of the upper part of the upper stepped through hole is larger than the aperture of the lower part, and the upper part is provided with a thread; the lower locking buckle is axially provided with a lower stepped through hole, the aperture of the upper part of the lower stepped through hole is smaller than the aperture of the lower part, and the lower part is provided with a thread; wherein the upper stepped through hole and the lower stepped through hole are respectively provided for the two ends of the wire to be tested to pass through; the lower end of the connecting rod is fixed to the upper end of the upper adapter by threaded penetration; The lower end is fixed to the upper part of the upper stepped through hole in the upper lock buckle by threading, and one end of the wire to be tested is placed between the two; one end of the upper wire is conductively connected to the upper lock buckle, and the other end passes through the wire hole to be connected to the external power supply; one end of the lower wire is conductively connected to the lower lock buckle, and the other end passes through the wire hole to be connected to the external power supply; the upper end of the lower adapter is fixed to the lower part of the lower stepped through hole in the lower lock buckle by threading, and the other end of the wire to be tested is placed between the two; the lower end of the lower adapter is fixed to the mounting part of the weight connecting rod by threading; the weight is sleeved on the weight connecting rod;

[0012] The wire material testing platform comprises a plurality of slide rails, a plurality of sliders, a connecting plate, a wire material testing frame, a supporting member, a baffle, a plurality of first displacement sensors and a plurality of water bath boxes; wherein the wire material testing frame comprises a vertical plate and a horizontal plate, wherein the horizontal plate is vertically extended outward along the upper side of the vertical plate; the upper end surface of the connecting rod is movably connected with the horizontal plate; the slide rails are fixed to the fixing plate at intervals through fixing members penetrating the mounting holes and are perpendicular to the viewing window; the sliders are movably arranged in the slide rails in a one-to-one correspondence, and the vertical plates are fixed to the sliders through connecting plates; the supporting member One end of the baffle is movably connected to the vertical plate, and the other end is provided with a U-shaped groove for the weight connecting rod to pass through; one end of the baffle is fixed to the fixed plate at intervals through a fixing piece passing through the mounting hole, and the other end is provided for the notch of the weight to be sleeved to limit the weight; the water bath box is placed in the control box and embedded in the fixed plate, including a plurality of water inlets and a plurality of water outlets; each first displacement sensor is movably placed in the water bath box and detects the displacement of the weight in the vertical direction, and is connected to the MCU chip through a communication line passing through the wire hole;

[0013] A gas valve testing platform, the gas valve testing platform comprising a gas valve testing bracket, a plurality of second displacement sensors, and a plurality of pressure sensors; wherein the gas valve testing bracket is fixed to the fixing plate at intervals by fixing parts passing through the mounting holes, each second displacement sensor is movably arranged at an interval at the upper end of the gas valve testing bracket, and each pressure sensor is movably arranged at an interval at the lower end of the gas valve testing bracket; wherein the second displacement sensor, the gas valve to be tested, and the pressure sensor are coaxially arranged in a one-to-one correspondence; wherein the plunger of the gas valve to be tested is arranged close to the second displacement sensor, and the pressure connecting rod of the gas valve to be tested is arranged in contact with the pressure sensor; each pressure sensor, each second displacement sensor, and the PCB board of the gas valve to be tested are communicatively connected with the MCU chip via a communication line passing through the wire hole.

[0014] Furthermore, the lower end of the upper stepped through hole and the upper end of the lower stepped through hole are both chamfered.

[0015] Furthermore, the wire clamp includes a thick wire clamp and a thin wire clamp; wherein the thick wire clamp is used for passing and fixing the memory alloy wire with a diameter of 0.1mm to 0.3mm, and the thin wire clamp is used for passing and fixing the memory alloy wire with a diameter of 20μm to 80μm.

[0016] Furthermore, the wire clamp includes an upper limit ring and a lower limit ring; the upper wire and the lower wire both include wiring terminals; wherein the wiring terminals of the upper wire and the upper limit ring are sequentially mounted on the upper locking buckle, and the wiring terminals of the lower wire and the lower limit ring are sequentially mounted on the lower locking buckle.

[0017] Furthermore, the vertical plate, the horizontal plate and the air valve test bracket are all provided with a plurality of through holes arranged in an array.

[0018] Furthermore, the wire material testing platform includes a temperature sensor, which is disposed on the vertical plate and is communicatively connected to the MCU chip via a communication line passing through the wire hole.

[0019] A testing method for compatible memory alloy wire and gas valve is also provided, including:

[0020] Obtaining a gas valve to be tested; wherein the gas valve to be tested is one or more;

[0021] The gas valve to be tested is fixed on the gas valve test bracket, and is coaxially arranged with the corresponding pressure sensor and the second displacement sensor at the same time, and the signal lines of the gas valve to be tested, the pressure sensor and the second displacement sensor are connected to the MCU chip through the threading hole;

[0022] After the gas valve test platform is fixed on the fixing plate, the control box is placed in a constant temperature box that has reached a stable preset temperature;

[0023] Based on the MCU chip, the PCB board of the gas valve to be tested is powered on to shrink the memory alloy wire inside, driving the plunger to descend. The second displacement sensor detects the plunger's descending displacement value, stores it, and then sends it to the MCU chip; at the same time, the plunger descends to press the pressure connecting rod, and the pressure sensor detects the pressure value, stores it, and then sends it to the MCU chip; thereby realizing the control performance test of the gas valve to be tested;

[0024] After the test of the gas valve to be tested is completed, the control box is taken out from the constant temperature box, and then the gas valve test platform is removed from the fixed plate;

[0025] Obtaining a wire material to be tested; wherein the wire material to be tested is one or more;

[0026] The upper wire and the lower wire are respectively wound around the upper locking buckle and the lower locking buckle; the two ends of the wire to be tested are respectively inserted into the upper stepped through hole and the lower stepped through hole, and the upper adapter and the upper locking buckle, as well as the lower adapter and the lower locking buckle are locked by matching threads to achieve the clamping of the wire to be tested; the connecting rod and the upper adapter are assembled, and the weight connecting rod and the lower adapter are assembled by matching threads; thereby, the wire clamp and the wire to be tested are assembled; then, the wire clamp carrying the wire to be tested is fixed to the horizontal plate through the upper end of the connecting rod, and a number of weights of preset weights are set on the weight connecting rod;

[0027] The support member is installed on the vertical plate based on the position of the weight connecting rod, and the weight connecting rod is inserted into the U-shaped groove of the support member; the first displacement sensor is placed in the water bath box, and the slider is adjusted to align the first displacement sensor with the bottom of the weight; the baffle is installed on the fixed plate based on the position of the weight, and the free end of the baffle is placed in the notch of the weight; the wire to be tested and the wire of the first displacement sensor are connected to the MCU chip through the threading hole for communication;

[0028] Based on the MCU chip, the wire to be tested is energized to make it contract, and the first displacement sensor detects the displacement value of the weight and stores it and then sends it to the MCU chip to implement deformation performance testing of the wire to be tested;

[0029] Repeat the previous step to achieve fatigue performance test of the wire to be tested.

[0030] Furthermore, obtaining the wire material to be tested includes:

[0031] Remove the gas valve to be tested from the gas valve test bracket;

[0032] The housing of the gas valve to be tested is removed, the sleeve relationship between the plunger and the pressure connecting rod is released, and the terminal is removed to take out the memory alloy wire therein as the wire to be tested.

[0033] Furthermore, before the wire to be tested and the wire of the first displacement sensor are connected to the MCU chip through the threading hole for communication; it includes:

[0034] The temperature sensor is placed on the vertical plate, and its wire is connected to the MCU chip through the threading hole.

[0035] Further, after placing the first displacement sensor in the water bath box, the method includes:

[0036] When it is determined that the test environment temperature is lower than the working temperature of the first displacement sensor, external water is allowed to flow in from the water inlet and out from the water outlet to realize circulation in the water bath box; wherein the water temperature of the external water is not lower than the working temperature of the first displacement sensor.

[0037] Furthermore, the test of the gas valve to be tested and the test of the wire material to be tested can be carried out at the same time

[0038] Beneficial effects:

[0039] It can be seen from the above technical solutions that the technical solution of the present invention provides a testing device to simultaneously complete the performance test of the memory alloy wire and the memory alloy gas valve.

[0040] From the overall structure, a control box and a wire test assembly and a gas valve test platform that can be detachably matched with the control box are provided. Therefore, when it is necessary to test the wire or the gas valve, only the test component connected to the control box needs to be replaced with the wire test assembly or the gas valve test platform.

[0041] Specifically, in order to realize the deformation performance test and life test of the wire, the wire test assembly is provided to include a wire clamp and a wire test platform. In order to improve the reliability of wire clamping, the wire clamp is provided to include an upper lock buckle and an upper adapter, a lower lock buckle and a lower adapter that cooperate with each other, and an upper step through hole is provided in the upper lock buckle, and a lower step through hole is provided in the lower lock buckle to increase the effective length of wire clamping. In order to reduce the test error, a support is provided to limit the weight connecting rod to avoid the test error caused by the shaking of the wire, and a baffle is provided to limit the weight to avoid the test error caused by the rotation of the weight; a slider and a slide rail structure are provided to ensure that the first displacement sensor can detect the displacement value of the weight directly related to the deformation of the wire. In order to realize effective testing under various test conditions, a water bath box is provided to set the first displacement sensor to ensure the working reliability of the first displacement sensor.

[0042] In order to test the control performance of the memory alloy gas valve, a gas valve test platform was set up. In order to ensure the reliability of the test results, the second displacement sensor, the gas valve and the pressure sensor were coaxially arranged, and the pressure connecting rod in the gas valve was connected to the pressure sensor through the bottom thread.

[0043] At the same time, in order to simplify the entire circuit connection relationship and realize comprehensive control, an MCU chip is set up so that each sensor, gas valve or wire material can communicate with it to improve the circuit structure integration of the entire device.

[0044] In summary, it can be seen that the technical solution modularizes the test structures corresponding to different test items of memory alloy wires and air valves, so that various test requirements can be achieved by replacing modules to improve test efficiency and reduce test costs. At the same time, the accuracy of test results is effectively improved through specific test structure settings.

[0045] It should be appreciated that all combinations of the foregoing concepts, as well as additional concepts described in greater detail below, may be considered to be part of the inventive subject matter of the present disclosure, provided such concepts are not mutually inconsistent.

[0046] The foregoing and other aspects, embodiments and features of the present invention can be more fully understood from the following description in conjunction with the accompanying drawings. Other additional aspects of the present invention, such as the features and / or beneficial effects of the exemplary embodiments, will be apparent from the following description or learned from the practice of the specific embodiments according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in various figures may be represented by the same reference numeral. For clarity, not every component is labeled in every figure. Embodiments of various aspects of the present invention will now be described by way of example and with reference to the accompanying drawings, in which:

[0048] Figure 1 This is a schematic diagram of the structure of the thermostat described in this embodiment;

[0049] Figure 2 This is a schematic diagram of the structure of the control box described in this embodiment;

[0050] Figure 3 Schematic diagram of the structure of the wire clamp described in this embodiment;

[0051] Figure 4 This is a partial structural schematic diagram of the wire clamp, the support member and the baffle according to this embodiment;

[0052] Figure 5 This is a schematic diagram of the structure of the wire material testing platform described in this embodiment;

[0053] Figure 6 A schematic diagram of the structure of the water bath box described in this embodiment;

[0054] Figure 7 This is a schematic diagram of the structure of the wire clamp and the wire testing platform in this embodiment;

[0055] Figure 8 This is a schematic diagram of the structure of the gas valve testing platform described in this embodiment;

[0056] Fig. 9 is a schematic diagram of the structure of the gas valve to be tested in this embodiment;

[0057] Fig.10 This is a circuit structure topology diagram corresponding to the test device described in this embodiment. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meaning understood by people with general skills in the field to which the present invention belongs.

[0059] The words "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, unless the context clearly indicates otherwise, the singular form of "a", "an" or "the" and other similar words do not indicate a quantitative limitation, but rather indicate the presence of at least one. Words such as "include" or "comprise" and the like mean that the elements or objects appearing before "include" or "comprise" cover the features, wholes, steps, operations, elements and / or components listed after "include" or "comprise", and do not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components and / or their collections. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0060] The existing memory alloy wires and devices made based on the memory alloy wires are tested separately, that is, their corresponding test devices are independent of each other, which has the defects of high testing cost and complicated testing process. At the same time, since the memory alloy gas valve is a new type of gas valve, there is no mature memory alloy gas valve testing device on the market, and thus the reliability of the test results cannot be ensured; and the existing memory alloy gas valve testing devices are mostly imported equipment, and thus there is also the problem of high testing cost. Based on this, the present embodiment aims to provide a testing device and a testing method compatible with memory alloy wires and gas valves to simultaneously improve the above technical defects.

[0061] The following is a detailed introduction to the testing device for the compatible memory alloy wire and the gas valve described in this embodiment in conjunction with the accompanying drawings.

[0062] Combination Figures 1 to 9 As shown, the device includes a thermostatic box 1, a control box 2, a wire testing assembly (wherein the wire testing assembly includes a wire clamp 3 and a wire testing platform 4) and a gas valve testing platform 5 that cooperate with each other. Specifically, each component includes the following structure:

[0063] The thermostatic box 1 comprises a door 101, and a viewing window 101a is provided on the door 101. The viewing window 101a is used to observe the test process inside the thermostatic box 1. A wiring hole 102 is also provided on one side of the thermostatic box 1 to facilitate the test structure inside the thermostatic box and external wiring control.

[0064] The control box 2 is placed in the thermostat 1, and includes a controller 201, a main body 202, and a fixing plate 203. Specifically, the controller 201 is placed in the main body 202, and includes an MCU chip. The fixing plate 203 is fixed to the upper surface of the main body 202, and is provided with a plurality of mounting holes 203a and a plurality of wire holes 203b. Among them, the mounting holes 203a are arranged in an array, and the wire holes 203b are scattered around the area where the mounting holes are located.

[0065] The wire clamp 3 in the wire test assembly is a detachable structure, and is detachably arranged on the wire test platform 4; the wire test platform 4 is a detachable structure, and is detachably placed on the control box 2. Specifically, in order to achieve the reliability of clamping various wires, the wire clamp 3 is also provided to include a thick wire clamp and a thin wire clamp; wherein the thick wire clamp is used for threading and fixing a memory alloy wire with a diameter of 0.1mm to 0.3mm, and the thin wire clamp is used for threading and fixing a memory alloy wire with a diameter of 20μm to 80μm.

[0066] The wire clamp 3 includes a connecting rod 301, an upper adapter 302, an upper locking buckle 303, an upper wire 304, a lower wire 305, a lower locking buckle 306, a lower adapter 307, a weight connecting rod 308 and a weight 309. The upper locking buckle 303 is provided with an upper stepped through hole along the axial direction, the aperture of the upper part of the upper stepped through hole is larger than the aperture of the lower part, and the upper part is provided with a thread. The lower locking buckle 306 is provided with a lower stepped through hole along the axial direction, the aperture of the upper part of the lower stepped through hole is smaller than the aperture of the lower part, and the lower part is provided with a thread. The upper stepped through hole and the lower stepped through hole are respectively provided for the two ends of the wire to be tested to pass through.

[0067] In terms of specific structural connection, the lower end of the connecting rod 301 is fixed to the upper end of the upper adapter 302 by threading. The lower end of the upper adapter 302 is fixed to the upper part of the upper stepped through hole in the upper lock buckle 303 by threading, and one end of the wire to be tested is placed between the two. One end of the upper wire 304 is conductively connected to the upper lock buckle 303, and the other end passes through the wire hole 203b to connect to the external power supply. One end of the lower wire 305 is conductively connected to the lower lock buckle 306, and the other end passes through the wire hole 203b to connect to the external power supply. The upper end of the lower adapter 307 is fixed to the lower part of the lower stepped through hole in the lower lock buckle 306 by threading, and the other end of the wire to be tested is placed between the two. The lower end of the lower adapter 307 is fixed to the mounting portion of the weight connecting rod 308 by threading; the weight 309 is sleeved on the weight connecting rod.

[0068] The wire material testing platform 4 includes a plurality of slide rails 401, a plurality of sliders 402, a connecting plate 403, a wire material testing frame 404, a supporting member 405, a baffle 406, a plurality of first displacement sensors 407 and a plurality of water bath boxes 408. The wire material testing frame 404 includes a vertical plate 404a and a horizontal plate 404b, and the horizontal plate 404b is vertically extended outward along the upper side of the vertical plate 404a.

[0069] In terms of specific structure, the upper end surface of the connecting rod 301 is movably connected to the horizontal plate 404b. The slide rails 401 are fixed to the fixed plate 203 at intervals through the fixing parts inserted in the mounting holes, and are perpendicular to the window 101a to facilitate the observation of the test process. The sliders 402 are movably arranged in the slide rails 401 one by one, and the vertical plates are fixed on the sliders 402 through the connecting plates. In order to lock the sliders 402 at the target position, screws are vertically arranged inward along the outer wall of the slide rail 401 to pass through the sliders 402 and the slide rail 401 at the same time, thereby achieving the locking between the two. At this time, correspondingly, long holes are provided on the two arms of the slide rail 401 for the screws to pass through. One end of the support member 405 is movably connected to the vertical plate 404a, and the other end is provided with a U-shaped groove for the weight connecting rod 308 to pass through. One end of the baffle 406 is fixed to the fixed plate 203 at intervals through a fixing member passing through the mounting hole 203a, and the other end is provided for the notch of the weight 309 to be set to limit the weight 309. The water bath box 408 is placed in the control box 2 and embedded in the fixed plate 203, including a plurality of water inlets 408a and a plurality of water outlets 408b. Each first displacement sensor 407 is movably placed in the water bath box 408 and detects the displacement of the weight 309 in the vertical direction, and is connected to the MCU chip through a communication line passing through the wire hole 203b.

[0070] In order to detect the actual temperature during the wire testing process, the wire testing platform 4 is provided to include a temperature sensor 409 . The temperature sensor 409 is provided on the vertical plate 404 a and is communicatively connected to the MCU chip via a communication line passing through the wire hole.

[0071] The gas valve test platform 5 includes a gas valve test bracket 501, a plurality of second displacement sensors 502, and a plurality of pressure sensors 503. The gas valve test bracket 501 is fixed to the fixed plate 203 at intervals through a fixing member passing through the mounting hole 203a, and each second displacement sensor 502 is movably placed at an interval on the upper end of the gas valve test bracket 501, and each pressure sensor 503 is movably placed at an interval on the lower end of the gas valve test bracket 501. The second displacement sensor 502, the gas valve 501 to be tested, and the pressure sensor 503 are coaxially arranged in a one-to-one correspondence. Specifically, the plunger 601 of the gas valve 6 to be tested is arranged close to the second displacement sensor 502, and the pressure connecting rod 602 of the gas valve to be tested is arranged in contact with the pressure sensor 503. Each pressure sensor 503, each second displacement sensor 502, and the PCB board 603 of the gas valve 6 to be tested are connected to the MCU chip for communication via a communication line passing through the wire hole.

[0072] In order to facilitate the installation and fixation of each component as required, the vertical plate, the horizontal plate and the gas valve test bracket are provided with a plurality of through holes arranged in an array. At this time, each component can be fixed to any position of the corresponding vertical plate, horizontal plate and gas valve test bracket by a fixing member penetrating through the through hole.

[0073] As a specific embodiment, the gas valve 6 to be tested in this embodiment includes a plunger 601, a pressure connecting rod 602, a PCB board 603, a terminal 604 and a housing 605. The terminal 604 is fixed on the PCB board 603 after clamping the memory alloy wire, the pressure connecting rod 602 is connected to the pressure sensor 503 through the bottom thread, the plunger 601 is placed in the pressure connecting rod 602 with a spring, the memory alloy wire is placed at the arc of the plunger 601, and the housing 605 is sleeved on the plunger 601, and the bottom surface is tightly attached to the PCB board 603.

[0074] In specific implementation, when a wire material or air valve test is required, only the test component connected to the control box 2 is replaced with a wire material test assembly or an air valve test platform 5 .

[0075] In order to realize the deformation performance test and life test of the wire, the wire test assembly is provided to include a wire clamp and a wire test platform. In order to improve the reliability of wire clamping, the wire clamp 3 is provided to include an upper lock buckle 303 and an upper adapter 302, a lower lock buckle 306 and a lower adapter 307 that cooperate with each other, and an upper step through hole is provided in the upper lock buckle 303, and a lower step through hole is provided in the lower lock buckle 306 to increase the effective length of wire clamping. In order to reduce the test error, a support member 405 is provided to limit the weight connecting rod 308 to avoid the test error caused by the shaking of the wire, and a baffle 406 is provided to limit the weight 309 to avoid the test error caused by the rotation of the weight 309; a slider 402 and a slide rail 401 structure are provided to ensure that the first displacement sensor can detect the displacement value of the weight directly related to the deformation of the wire. In order to achieve effective testing under various test conditions, a water bath box 408 is provided to perform the first displacement sensor setting to ensure the working reliability of the first displacement sensor.

[0076] In order to test the control performance of the memory alloy valve, a valve test platform 5 is set up. In order to ensure the reliability of the test results, the second displacement sensor 502, the valve to be tested 6 and the pressure sensor 503 are coaxially arranged, and the pressure connecting rod in the valve is connected to the pressure sensor through the bottom thread.

[0077] At the same time, in order to simplify the entire circuit connection relationship and realize comprehensive control, an MCU chip is set up so that each sensor, gas valve or wire material can communicate with it to improve the circuit structure integration of the entire device.

[0078] Specific, combined Fig.10 As shown, the circuit described in this embodiment includes the following structure:

[0079] The MCU chip includes a serial port interface, a bus interface, a plurality of pulse modulation interfaces and a plurality of ADC interfaces. Specifically, the external PC-side host computer is connected to the serial port interface through a serial port bus; the constant temperature box 1, each first displacement sensor 407, and each second displacement sensor 502 are connected to the bus interface through a corresponding 485 bus transceiver; each pressure sensor 503 and temperature sensor are connected to the ADC interface through a corresponding precision amplifier and a high-precision ADC converter; the pulse modulation interface is electrically connected to the wire to be tested or the gas valve to be tested through a high-speed driver. Specifically, in order to electrically control the wire to be tested or the gas valve to be tested based on the MUC chip, a programmable DC power supply is also provided, and its input end is connected to the bus interface through a 485 bus transceiver, and the output end is electrically connected to the wire to be tested and the gas valve to be tested. Further, the circuit structure also includes a plurality of current sampling modules and a plurality of voltage sampling modules to monitor the electrical signals acting on the wire to be tested and the gas valve to be tested. Specifically, their input ends are electrically connected to the wire material to be tested and the gas valve to be tested, and their output ends are communicatively connected to the ADC interface through a precision operational amplifier and a high-precision ADC converter which are arranged in sequence accordingly.

[0080] At this time, in the specific implementation, a total of three circuit control feedback processes are included.

[0081] First, during the test preparation process: For the thermostat, the MCU chip sends temperature control instructions to the thermostat through the bus interface to achieve temperature regulation inside it. Build a communication connection between the MCU chip and the PC host computer to facilitate subsequent data transmission.

[0082] Secondly, in the electrical control process of the wire material to be tested and / or the gas valve to be tested: the programmable DC obtains 220V power through the mains, and receives the electrical control instructions transmitted from the bus interface and forwarded by the 485 bus transceiver to control the power on of the wire material to be tested and the gas valve to be tested, and the corresponding electrical signals are fed back to the MCU chip through the current sampling module and the voltage sampling module for closed-loop monitoring and control. In this process, the MCU chip also sends PWM pulse signals to the high-speed driver through the pulse modulation interface to act on the wire material to be tested and the gas valve to be tested.

[0083] Then, in the sensor signal monitoring process: for the first displacement sensor and the second displacement sensor, the power supply signal is obtained through the AC220V to DC12V module to start displacement detection. Specifically, the displacement signal of the plunger or weight is detected based on the infrared laser, and is sent to the MCU chip through the 485 bus transceiver and bus interface based on the 485 bus protocol.

[0084] For the pressure sensor, the positive and negative power supplies are obtained through the 12V to 5V and 5V to -5V in the power module. At this time, the pressure sensor obtains the force generated by the memory alloy wire in the valve to be tested during movement through the pressure connecting rod and the indirect spring load, and the signal is amplified by the precision op amp and sent to the high-precision ADC converter for detection, and the test results are sent to the MCU chip. Similarly, for the temperature sensor, the power supply signal is obtained through the 12V to 5V module in the power module to achieve real-time detection of the ambient temperature of the wire to be tested, and the signal is amplified by the precision op amp and sent to the high-precision ADC converter for detection and then sent to the MCU chip.

[0085] For the current sampling module and the voltage sampling module, when the wire is powered on and moves, the memory alloy wire will get the corresponding voltage and current. The sampled voltage signal and current signal are amplified by their corresponding precision amplifiers to detect more accurate voltage and current signals in real time, and then sampled by the high-speed ADC converter and sent to the MCU chip. Specifically, since the memory alloy wire will change its resistance due to the movement during the movement, the real-time resistance change of the wire can be calculated by detecting the real-time voltage and current of the memory alloy wire and inputting them into the MCU chip for processing.

[0086] Specifically, take the test process of the gas valve to be tested as an example:

[0087] First, the PC host computer sends a control instruction to the MCU chip, and the MCU chip receives and sends a temperature control command to the thermostat based on the control instruction (such as heating to 120 degrees and maintaining for 5 minutes, with a heating rate of 3 degrees per minute). Secondly, when the temperature sensor detects that the ambient temperature near the memory alloy wire reaches the preset 120 degrees, the MCU chip starts to store the data of the displacement sensor. Then, the MCU chip controls the programmable DC power supply to output a 10V10MA power supply, and the pulse modulation interface outputs a 100% control signal to the memory alloy wire in the gas valve to be tested. At the same time, the voltage sampling module and the current sampling module sample the voltage and current on the memory alloy wire and send them to the MCU after processing, so as to calculate the resistance of the memory alloy wire in real time and store it. Then, send a command to control the thermostat to cool down from 120 degrees to -20 degrees, with a cooling rate of 2 degrees per minute. When the temperature sensor detects that the ambient temperature near the memory alloy wire reaches -20 degrees, the MCU microcontroller will keep the constant temperature box for 5 minutes, and then heat it to 120 degrees after the time is up. At this time, the heating rate will be changed, and the heating rate in the heating command sent by the MCU microcontroller will change from the original 3 degrees per minute to 2 degrees per minute. In this process, the displacement data and current and voltage data are detected and obtained to realize the test of the gas valve to be tested. When the temperature sensor detects that the ambient temperature near the memory alloy wire reaches 120 degrees again, the test ends at this time. During the test, the displacement data and resistance data stored in the MCU microcontroller will be uploaded to the PC host computer in real time within the specified period according to the upload rate sent by the PC host computer.

[0088] As a specific implementation, in order to allow the wire to be quickly inserted into the upper locking buckle 303 and the lower locking buckle 306 , the lower end of the upper stepped through hole and the upper end of the lower stepped through hole are both chamfered.

[0089] In order to improve the reliability of the wire fixation so as to effectively energize the wire, the wire clamp 3 is provided to include an upper limit ring and a lower limit ring; the upper wire and the lower wire both include connection terminals. Specifically, the connection terminal of the upper wire and the upper limit ring are sequentially sleeved on the upper locking buckle 303, and the connection terminal of the lower wire and the lower limit ring are sequentially sleeved on the lower locking buckle 306.

[0090] In summary, it can be seen that the technical solution modularizes the test structures corresponding to different test items of memory alloy wires and air valves, so that various test requirements can be achieved by replacing modules to improve test efficiency and reduce test costs. At the same time, the accuracy of test results is effectively improved through specific test structure settings.

[0091] The testing method of the compatible memory alloy wire and the gas valve described in this embodiment is based on the testing device, which is specifically introduced as follows:

[0092] If a valve test is required, the method includes:

[0093] Step S102: Obtain the gas valve to be tested.

[0094] In this embodiment, there are one or more gas valves to be tested.

[0095] Step S104, fix the gas valve to be tested on the gas valve test bracket, and set it coaxially with the corresponding pressure sensor and the second displacement sensor at the same time, and then connect the signal lines of the gas valve to be tested, the pressure sensor and the second displacement sensor to the MCU chip for communication through the threading holes.

[0096] Step S106: After the gas valve test platform is fixed on the fixing plate, the control box is placed in a constant temperature box that has reached a stable preset temperature.

[0097] Step S108, based on the MCU chip, the PCB board of the gas valve to be tested is energized to shrink the memory alloy wire inside, driving the plunger to descend. The second displacement sensor detects the plunger's descending displacement value, stores it, and sends it to the MCU chip; at the same time, the plunger descends to press the pressure connecting rod, and the pressure sensor detects the pressure value, stores it, and sends it to the MCU chip; thereby realizing the control performance test of the gas valve to be tested.

[0098] Step S110, after the test of the gas valve to be tested is completed, the control box is taken out from the constant temperature box, and then the gas valve test platform is removed from the fixed plate.

[0099] If wire testing is required, the method includes:

[0100] Step S202: Obtain the wire material to be tested.

[0101] In this embodiment, the number of the wires to be tested is one or more.

[0102] As an optional implementation, if the wire to be tested comes from the gas valve to be tested, step S202 includes:

[0103] Step S2022: remove the gas valve to be tested from the gas valve test bracket.

[0104] Step S2024, dismantle the housing of the gas valve to be tested, release the sleeve relationship between the plunger and the pressure connecting rod, and remove the terminal to take out the memory alloy wire therein as the wire to be tested.

[0105] At this time, based on steps S2022 to S2024, the performance of the wire in the gas valve to be tested can be tested.

[0106] Step S204, winding the upper wire and the lower wire around the upper lock buckle and the lower lock buckle respectively; inserting the two ends of the wire to be tested into the upper step through hole and the lower step through hole respectively, locking the upper adapter and the upper lock buckle, and the lower adapter and the lower lock buckle by matching threads to achieve the clamping of the wire to be tested; continuing to assemble the connecting rod and the upper adapter, and the weight connecting rod and the lower adapter by matching threads; thereby achieving the assembly between the wire clamp and the wire to be tested. The wire clamp carrying the wire to be tested is fixed to the horizontal plate through the upper end of the connecting rod, and a number of weights of preset weights are set on the weight connecting rod.

[0107] At this time, step S204 can be used to achieve the clamping of the wire and the fixed connection between the wire clamp and the wire testing platform.

[0108] Step S206: Mount the support member on the vertical plate based on the position of the weight connecting rod, and insert the weight connecting rod into the U-shaped groove of the support member. Place the first displacement sensor in the water bath box, and adjust the slider to align the first displacement sensor with the bottom of the weight; install the baffle on the fixed plate based on the position of the weight, and place the free end of the baffle in the notch of the weight. Then connect the wire to be tested and the wire of the first displacement sensor to the MCU chip through the threading hole.

[0109] At this time, the related test errors can be avoided based on step S206.

[0110] At the same time, in order to accurately obtain the test environment temperature to improve the reliability of the test result, the setting step S206 also includes:

[0111] Step S2062: place a temperature sensor on the vertical plate, and connect its wires to the MCU chip for communication through the wire holes.

[0112] At this time, the ambient temperature of the wire material test can be acquired in real time through the temperature sensor to avoid test abnormalities caused by abnormalities in the constant temperature box.

[0113] In order to achieve effective testing under various test conditions, the setting step S206 also includes:

[0114] Step S2062': when it is determined that the test environment temperature is lower than the working temperature of the first displacement sensor, external water is allowed to flow in from the water inlet and out from the water outlet to realize circulation in the water bath box; wherein the water temperature of the external water is not lower than the working temperature of the first displacement sensor.

[0115] Step S208: Based on the MCU chip, the wire to be tested is energized to make it contract, and the first displacement sensor detects the displacement value of the weight and stores it and then sends it to the MCU chip to implement deformation performance testing of the wire to be tested.

[0116] If fatigue performance test or life test is required, it is only necessary to repeat step S208.

[0117] As a preferred embodiment, if it is necessary to test the wire and the air valve at the same time, the wire test platform and the air valve test platform can be installed on the control box at the same time, and steps S102 to S110 and steps S202 to S208 can be performed at the same time. Steps S102 to S110 can be performed first, or steps S202 to S208 can be performed first, or only steps S102 to S110 or only steps S202 to S208 can be performed according to actual needs.

[0118] At this time, based on the above method, effective testing of wires or gas valves can be achieved quickly, accurately and at low cost.

[0119] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. A person with ordinary knowledge in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. A testing device compatible with memory alloy wire and air valve, characterized in that: include: A thermostatic box, the thermostatic box comprising a door, the door being provided with a viewing window; A control box, the control box is placed in the thermostatic box, including a controller, a main body, and a fixing plate; the controller is placed in the main body, including an MCU chip; the fixing plate is fixedly arranged on the upper surface of the main body, and is provided with a plurality of mounting holes and a plurality of wire holes; wherein the mounting holes are arranged in an array, and the wire holes are dispersed around the area where the mounting holes are located; A wire testing assembly, the wire testing assembly comprising a wire clamp and a wire testing platform; wherein the wire clamp is a detachable structure and is detachably arranged on the wire testing platform; the wire testing platform is a detachable structure and is detachably arranged on the control box; The wire clamp comprises a connecting rod, an upper adapter, an upper locking buckle, an upper wire, a lower wire, a lower locking buckle, a lower adapter, a weight connecting rod and a weight; wherein the upper locking buckle is axially provided with an upper stepped through hole, the aperture of the upper part of the upper stepped through hole is larger than the aperture of the lower part, and the upper part is provided with a thread; the lower locking buckle is axially provided with a lower stepped through hole, the aperture of the upper part of the lower stepped through hole is smaller than the aperture of the lower part, and the lower part is provided with a thread; wherein the upper stepped through hole and the lower stepped through hole are respectively provided for the two ends of the wire to be tested to pass through; the lower end of the connecting rod is fixed to the upper end of the upper adapter by threaded penetration; The lower end is fixed to the upper part of the upper stepped through hole in the upper lock buckle by threading, and one end of the wire to be tested is placed between the two; one end of the upper wire is conductively connected to the upper lock buckle, and the other end passes through the wire hole to be connected to the external power supply; one end of the lower wire is conductively connected to the lower lock buckle, and the other end passes through the wire hole to be connected to the external power supply; the upper end of the lower adapter is fixed to the lower part of the lower stepped through hole in the lower lock buckle by threading, and the other end of the wire to be tested is placed between the two; the lower end of the lower adapter is fixed to the mounting part of the weight connecting rod by threading; the weight is sleeved on the weight connecting rod; The wire material testing platform comprises a plurality of slide rails, a plurality of sliders, a connecting plate, a wire material testing frame, a supporting member, a baffle, a plurality of first displacement sensors and a plurality of water bath boxes; wherein the wire material testing frame comprises a vertical plate and a horizontal plate, wherein the horizontal plate is vertically extended outward along the upper side of the vertical plate; the upper end surface of the connecting rod is movably connected with the horizontal plate; the slide rails are fixed to the fixing plate at intervals through fixing members penetrating the mounting holes and are perpendicular to the viewing window; the sliders are movably arranged in the slide rails in a one-to-one correspondence, and the vertical plates are fixed to the sliders through connecting plates; the supporting member One end of the baffle is movably connected to the vertical plate, and the other end is provided with a U-shaped groove for the weight connecting rod to pass through; one end of the baffle is fixed to the fixed plate at intervals through a fixing piece passing through the mounting hole, and the other end is provided for the notch of the weight to be sleeved to limit the weight; the water bath box is placed in the control box and embedded in the fixed plate, including a plurality of water inlets and a plurality of water outlets; each first displacement sensor is movably placed in the water bath box and detects the displacement of the weight in the vertical direction, and is connected to the MCU chip through a communication line passing through the wire hole; A gas valve testing platform, the gas valve testing platform comprising a gas valve testing bracket, a plurality of second displacement sensors, and a plurality of pressure sensors; wherein the gas valve testing bracket is fixed to the fixing plate at intervals by fixing parts passing through the mounting holes, each second displacement sensor is movably arranged at an interval at the upper end of the gas valve testing bracket, and each pressure sensor is movably arranged at an interval at the lower end of the gas valve testing bracket; wherein the second displacement sensor, the gas valve to be tested, and the pressure sensor are coaxially arranged in a one-to-one correspondence; wherein the plunger of the gas valve to be tested is arranged close to the second displacement sensor, and the pressure connecting rod of the gas valve to be tested is arranged in contact with the pressure sensor; each pressure sensor, each second displacement sensor, and the PCB board of the gas valve to be tested are communicatively connected with the MCU chip via a communication line passing through the wire hole.

2. The testing device for compatible memory alloy wire and gas valve according to claim 1, characterized in that: The lower end of the upper stepped through hole and the upper end of the lower stepped through hole are both provided with chamfers.

3. The testing device for compatible memory alloy wire and gas valve according to claim 1, characterized in that: The wire clamp includes a thick wire clamp and a thin wire clamp; wherein the thick wire clamp is used for passing and fixing the memory alloy wire with a diameter of 0.1mm to 0.3mm, and the thin wire clamp is used for passing and fixing the memory alloy wire with a diameter of 20μm to 80μm.

4. The testing device for compatible memory alloy wire and gas valve according to claim 1, characterized in that: The wire clamp includes an upper limit ring and a lower limit ring; the upper wire and the lower wire both include connection terminals; wherein the connection terminals of the upper wire and the upper limit ring are sequentially sleeved on the upper locking buckle, and the connection terminals of the lower wire and the lower limit ring are sequentially sleeved on the lower locking buckle.

5. The testing device for compatible memory alloy wire and gas valve according to claim 1, characterized in that: The vertical plate, the horizontal plate and the air valve test bracket are all provided with a plurality of through holes arranged in an array.

6. The testing device for compatible memory alloy wire and gas valve according to claim 1, characterized in that: The wire material testing platform includes a temperature sensor, which is arranged on the vertical plate and is communicatively connected with the MCU chip via a communication line passing through a wire hole.

7. A method for testing compatible memory alloy wire and air valve, characterized in that: include: Obtaining a gas valve to be tested; wherein the gas valve to be tested is one or more; The gas valve to be tested is fixed on the gas valve test bracket, and is coaxially arranged with the corresponding pressure sensor and the second displacement sensor at the same time, and the signal lines of the gas valve to be tested, the pressure sensor and the second displacement sensor are connected to the MCU chip through the threading hole; After the gas valve test platform is fixed on the fixing plate, the control box is placed in a constant temperature box that has reached a stable preset temperature; Based on the MCU chip, the PCB board of the gas valve to be tested is powered on to shrink the memory alloy wire inside, driving the plunger to descend. The second displacement sensor detects the plunger's descending displacement value, stores it, and then sends it to the MCU chip; at the same time, the plunger descends to press the pressure connecting rod, and the pressure sensor detects the pressure value, stores it, and then sends it to the MCU chip; thereby realizing the control performance test of the gas valve to be tested; After the test of the gas valve to be tested is completed, the control box is taken out from the constant temperature box, and then the gas valve test platform is removed from the fixed plate; Obtaining a wire material to be tested; wherein the wire material to be tested is one or more; The upper wire and the lower wire are respectively wound around the upper locking buckle and the lower locking buckle; the two ends of the wire to be tested are respectively inserted into the upper stepped through hole and the lower stepped through hole, and the upper adapter and the upper locking buckle, as well as the lower adapter and the lower locking buckle are locked by matching threads to achieve the clamping of the wire to be tested; the connecting rod and the upper adapter are assembled, and the weight connecting rod and the lower adapter are assembled by matching threads; thereby, the wire clamp and the wire to be tested are assembled; then, the wire clamp carrying the wire to be tested is fixed to the horizontal plate through the upper end of the connecting rod, and a number of weights of preset weights are set on the weight connecting rod; The support member is installed on the vertical plate based on the position of the weight connecting rod, and the weight connecting rod is inserted into the U-shaped groove of the support member; the first displacement sensor is placed in the water bath box, and the slider is adjusted to align the first displacement sensor with the bottom of the weight; the baffle is installed on the fixed plate based on the position of the weight, and the free end of the baffle is placed in the notch of the weight; the wire to be tested and the wire of the first displacement sensor are connected to the MCU chip through the threading hole for communication; Based on the MCU chip, the wire to be tested is energized to make it contract, and the first displacement sensor detects the displacement value of the weight and stores it and then sends it to the MCU chip to implement deformation performance testing of the wire to be tested; Repeat the previous step to achieve fatigue performance test of the wire to be tested.

8. The method for testing compatible memory alloy wire and gas valve according to claim 7, characterized in that: Obtaining the wire to be tested includes: Remove the gas valve to be tested from the gas valve test bracket; The housing of the gas valve to be tested is removed, the sleeve relationship between the plunger and the pressure connecting rod is released, and the terminal is removed to take out the memory alloy wire therein as the wire to be tested.

9. The method for testing compatible memory alloy wire and gas valve according to claim 7, characterized in that: After placing the first displacement sensor in the water bath box, including: When it is determined that the test environment temperature is lower than the working temperature of the first displacement sensor, external water is allowed to flow in from the water inlet and out from the water outlet to realize circulation in the water bath box; wherein the water temperature of the external water is not lower than the working temperature of the first displacement sensor.

10. The method for testing compatible memory alloy wire and gas valve according to claim 7, characterized in that: The gas valve to be tested and the wire material to be tested can be tested simultaneously.

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