Silicon wafer loading system, exposure equipment and silicon wafer transmission method

Abstract

The invention provides a silicon wafer loading system, exposure equipment and a silicon wafer transmission method. The silicon wafer loading system comprises a sealing element, a first moving part, a door part and a loading platform, the sealing piece is provided with a connecting opening, and the first moving part is movably arranged between a sealing position and an unsealing position in the direction close to or away from the loading platform. The door component is arranged on the first moving part and moves along with the first moving part; and the first moving part is configured to drive the door component to move after the wafer box and the sealing piece form sealing. The first moving part capable of moving along the direction close to or away from the loading platform is additionally arranged, so that the sealing element is matched with the box body of the wafer box in the wafer loading and unloading process of the silicon wafer loading system, and the sealing of the exposure equipment is kept; the internal environment of the exposure equipment is improved, and the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a silicon wafer loading system, exposure equipment, and a silicon wafer transmission method. Background Art

[0002] In the exposure equipment, the wafer library is one of the external silicon wafer interfaces of the exposure equipment. During the silicon wafer transmission process, the wafer library provides a wafer box interface to complete the functions of wafer box positioning, loading, unloading, scanning, etc., and transmits the silicon wafer information to the silicon wafer transmission subsystem, thereby cooperating with the robot to realize the function of transferring materials into the system.

[0003] With the continuous development of technology in the integrated circuit manufacturing industry, the resolution, overlay accuracy, yield and other indicators of exposure equipment are constantly improving. At the same time, the granularity requirements inside the exposure equipment are also constantly increasing. However, in the process of loading and unloading silicon wafers, the existing wafer library has a process of penetration between the internal and external worlds of the exposure equipment, which poses risks such as particle contamination and laser leakage. In addition, during the exposure process of the exposure equipment, the wafer cannot be loaded and unloaded through the wafer library, which also affects the yield of the exposure equipment.

[0004] Based on this, how to keep the internal world of the exposure equipment isolated from the external world and prevent particle contamination and laser leakage during the process of loading the film box in the film library has become a technical problem that needs to be solved by technical personnel in this field. Summary of the invention

[0005] The purpose of the present invention is to provide a silicon wafer loading system, exposure equipment, and silicon wafer transmission method, so that the silicon wafer loading system can always keep the internal world of the exposure equipment isolated from the external world during the process of loading the wafer box, thereby preventing particle contamination and laser leakage.

[0006] In order to achieve the above object, the present invention provides a film library, comprising: a sealing plate, a first moving part, a door component and a loading platform for placing a film box;

[0007] The sealing member has an interface for connecting the inner world of the exposure device with the outside world, and the first moving part is movably arranged between a sealing position and an unsealing position in a direction close to or away from the loading platform; the door component is arranged on the first moving part and moves with the first moving part; when the first moving part is in the sealing position, the door component blocks the interface and forms a seal with the sealing member; when the first moving part is in the unsealing position, the interface is exposed;

[0008] Wherein, the first moving part is configured to drive the door component to move after the film box loaded on the loading platform cooperates with the sealing member and forms a seal.

[0009] Optionally, the silicon wafer loading system further includes a second moving part;

[0010] The first moving part is movably arranged on the second moving part in a direction approaching or moving away from the loading platform; the second moving part is movably arranged in a direction perpendicular to the loading platform;

[0011] Wherein, the second moving part is configured to drive the first moving part to move after the first moving part moves to the unsealing position.

[0012] Optionally, the first moving part includes a first guide shaft, the second moving part includes a second guide shaft, the first guide shaft is arranged on the second moving part in a direction close to or away from the loading platform, and the second guide shaft is arranged in a direction perpendicular to the loading platform;

[0013] The first moving part is movably disposed along the first guide axis, and the second moving part is movably disposed along the second guide axis.

[0014] Optionally, the first moving part further includes a first driving member, and the second moving part further includes a second driving member;

[0015] The first driving member is used to drive the first moving part to reciprocate on the first guide shaft; the second driving member is used to drive the second moving part to reciprocate on the second guide shaft.

[0016] Optionally, the silicon wafer loading system further includes an unlocking module, which is disposed on the door component and is used to dock with the wafer box and move with the door component.

[0017] Optionally, the unlocking module comprises an unlocking mechanism, which is used to be inserted into a lock hole on a film box door of the film box and rotate around an axis to achieve unlocking between the box body of the film box and the film box door.

[0018] Optionally, the unlocking module includes an adsorption mechanism, and the adsorption mechanism is used to adsorb an adsorption interface on the cassette door of the cassette.

[0019] Optionally, the silicon wafer loading system further comprises a scanning mechanism and a third moving part, wherein the scanning mechanism is disposed on the third moving part, and the third moving part is rotatably disposed on the first moving part between a scanning position and a waiting position;

[0020] When the third moving part is in the scanning position, the scanning mechanism extends into the interior of the film box; when the third moving part is in the waiting position, the scanning mechanism is located outside the film box;

[0021] The third moving part moves along with the movement of the first moving part.

[0022] Optionally, the third moving part includes a scanning motion axis and a bracket, one end of the bracket is connected to the scanning motion axis, and the other end is connected to the scanning mechanism, and the scanning motion axis drives the bracket to rotate around the axis; the rotation axis of the third moving part is set perpendicular to the movement direction of the first moving part.

[0023] Optionally, a locking mechanism and a conveying mechanism are provided on the loading platform, wherein the locking mechanism is used to extend into a positioning hole at the bottom of the film box to fix the film box; and the conveying mechanism is used to drive the film box to move on the loading platform.

[0024] Optionally, the sealing member is a plate-shaped member, and when the door component is in the sealing position, a side of the door component facing the outside is flush with the sealing member.

[0025] Optionally, the film box includes a box body, and the box body is used to adapt to and seal with the sealing member.

[0026] Optionally, the film box includes a standard box body or an adapter box body;

[0027] The standard box body comprises a film box door detachably connected to the box body, and the film box door has a lock hole and / or an adsorption interface;

[0028] The adapter box body has an open surface opened on one side of the box body, and when the adapter box body is sealed with the sealing member, the open surface faces the unlocking module.

[0029] In order to achieve the above object, the present invention further provides an exposure device, comprising a robot and the silicon wafer loading system as described above;

[0030] After the wafer loading system completes loading the wafer box, the robot extends into the wafer box to take out the silicon wafers in the wafer box and / or place the processed silicon wafers in the wafer box.

[0031] In order to achieve the above object, the present invention also provides a silicon wafer transmission method, comprising:

[0032] Placing the film box on a loading platform, and the loading platform drives the film box to move to a handover station;

[0033] The sealing member cooperates with the box body of the film box to form a seal, and the first moving part drives the door component to move in a direction away from the loading platform;

[0034] completing scanning of the silicon wafer in the wafer box;

[0035] The silicon wafers in the wafer box are grabbed by a robot, and / or the processed silicon wafers are placed in the wafer box.

[0036] Optionally, the silicon wafer loading system includes an unlocking module, and the wafer box includes a standard box body or an adapter box body;

[0037] The standard cassette body has a cassette door. When the standard cassette body is located at the handover station, the cassette door contacts the unlocking module, and the cassette body of the cassette forms a seal with the sealing member. The unlocking module releases the lock between the cassette door and the cassette body, and the first moving part drives the unlocking module and the cassette door to move in a direction away from the loading platform.

[0038] or,

[0039] The adapter box body has an open surface, and when the adapter box body is located at the handover station, the open surface forms a seal with the sealing member; the first moving part drives the unlocking module to move in a direction away from the loading platform.

[0040] Optionally, the silicon wafer loading system includes a second moving part;

[0041] After the first moving part drives the door component to move, the second moving part drives the first moving part to move in a direction perpendicular to the loading platform to complete scanning of the silicon wafers in the wafer box.

[0042] Optionally, the silicon wafer loading system further comprises a scanning mechanism and a third moving part, and the scanning mechanism is arranged on the third moving part;

[0043] During the movement of the second moving part, the third moving part rotates from the waiting position to the scanning position at the scanning start position to drive the scanning mechanism to extend into the interior of the film box, and rotates from the scanning position to the waiting position at the scanning end position to drive the scanning mechanism to extend out of the interior of the film box;

[0044] The second moving part drives the scanning mechanism to move to the scanning start position after the first moving part completes the movement;

[0045] After the scanning mechanism extends into the wafer box, the scanning mechanism is driven to move to the scanning end position to complete the scanning of the silicon wafer in the wafer box by the scanning mechanism;

[0046] And after the scanning mechanism extends out of the interior of the film box, it moves to the loading completion station.

[0047] Compared with the existing wafer library, the silicon wafer loading system, exposure equipment, and silicon wafer transmission method provided by the present application have the following advantages:

[0048] The silicon wafer loading system provided by the present application is provided with a first moving part that can move in a direction close to or away from the loading platform, and a door component is arranged on the first moving part, and can move with the movement of the first moving part. After the wafer box loaded on the loading platform cooperates with the seal to form a seal, the first moving part drives the door component to move in a direction away from the loading platform, so that during the process of loading and unloading wafers in the silicon wafer loading system, the seal and the box body of the wafer box cooperate to maintain the isolation between the internal environment of the exposure device and the external environment; avoiding the problems in the prior art that the internal environment of the exposure device and the external environment are penetrated due to the movement of the loading platform, causing particle pollution, laser leakage, etc., improving the internal environment of the exposure device, which is conducive to improving the product yield.

[0049] Furthermore, the wafer box includes a standard box body and an adapter box body, the standard box body and the adapter box body are used to load silicon wafers of different sizes, and the adapter box body can be used to load silicon wafers of different sizes by replacing different positioning devices; therefore, the silicon wafer loading system provided in the present application can match wafer boxes of different specifications, and then adapt to silicon wafers of different sizes, thereby improving the user experience.

[0050] The exposure equipment provided in the present application utilizes a robot arm to pick up and place the loaded silicon wafers in the wafer box. Since the loading platform remains stationary during the entire process of loading and unloading the wafers, and cooperates with the seal and the box body of the wafer box, the internal environment of the exposure equipment is isolated from the external environment. Therefore, during the exposure process of the exposure equipment, the above-mentioned silicon wafer loading system can still load and unload the wafers, and can avoid problems such as particle contamination and laser leakage, which is beneficial to improving product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic diagram of the structure of a silicon wafer loading system provided by an embodiment of the present invention;

[0052] Figure 2 A schematic diagram of the back structure of a silicon wafer loading system provided by an embodiment of the present invention;

[0053] Figure 3 A schematic diagram of the connection relationship between the first moving part and the door component provided in an embodiment of the present invention;

[0054] Figure 4 A schematic structural diagram of a first moving part provided by an embodiment of the present invention;

[0055] Figure 5a A schematic diagram of the structure of a standard box provided by an embodiment of the present invention;

[0056] Figure 5b A schematic structural diagram of a first adapter box provided by an embodiment of the present invention;

[0057] Figure 5c A schematic structural diagram of a second adapter box provided by an embodiment of the present invention;

[0058] Figure 6a A schematic diagram of a scanning process of a first scanning mechanism provided in an embodiment of the present invention;

[0059] Figure 6b A schematic diagram of a scanning process of a second scanning mechanism provided by an embodiment of the present invention;

[0060] Figure 6c A schematic diagram of a scanning process of a third scanning mechanism provided in an embodiment of the present invention;

[0061] Figure 7 A schematic diagram of the structure of a silicon wafer transmission system provided by an embodiment of the present invention;

[0062] Figure 8 A flow chart of a silicon wafer transmission method provided by an embodiment of the present invention;

[0063] Fig. 9 A schematic diagram of a standard box transporting silicon wafers provided by an embodiment of the present invention;

[0064] Fig.10 A schematic diagram of an adapter box transmission silicon chip provided in an embodiment of the present invention.

[0065] The description of each reference numeral is as follows:

[0066] 1- Seal;

[0067] 2-first moving part; 20-motor; 21-synchronous pulley;

[0068] 3- Second movement unit;

[0069] 4- Scanning mechanism;

[0070] 5-third moving part; 50-scanning moving axis; 51-support;

[0071] 6-Door parts;

[0072] 7-loading platform; 71-locking mechanism;

[0073] 8-unlocking module; 80-unlocking mechanism; 81-adsorption mechanism;

[0074] 9-film box; 90-standard box body; 900-film box door; 901-adsorption interface; 902-locking hole; 91-adapter box body; 910-200mm positioning device; 911-200mm box body; 912-150mm positioning device; 913-150mm box body;

[0075] 10-Silicon wafer. DETAILED DESCRIPTION

[0076] In order to make the purpose, advantages and features of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0077] As used in this specification, the singular forms "a", "an" and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the term "at least two" is generally used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "the proximal end" and "the distal end" generally refer to two corresponding parts, which include not only the endpoints, and the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. In addition, as used in this specification, an element disposed on another element generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements may be direct or indirect through an intermediate element, and it cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element may be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. The terms "upper", "lower", "top" and "bottom" are generally relative position relationships arranged in the direction of gravity; the terms "vertical, vertical direction" generally refer to the direction of gravity, which is generally perpendicular to the ground, and "horizontal, horizontal plane direction" generally refers to the direction parallel to the ground; for ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0078] The purpose of the present invention is to provide a silicon wafer loading system, exposure equipment, and silicon wafer transmission method, so that the silicon wafer loading system can always keep the internal world of the exposure equipment isolated from the external world during the process of loading the wafer box, thereby preventing particle contamination and laser leakage.

[0079] Those skilled in the art can understand that in the existing wafer library, it is usually necessary to move the loading platform to unlock the wafer box and the wafer box door, and then perform subsequent scanning and loading and unloading steps. In this process, once the loading platform moves, a gap will be generated on the outer surface of the wafer library, and the internal environment of the exposure machine and the external environment will penetrate, thereby causing problems such as particle contamination and laser leakage, which will cause the yield of silicon wafers to decrease, and the wafer library cannot complete loading and unloading during the exposure process of the exposure device, affecting the yield of the exposure device. Based on this, this embodiment sets a seal and a first moving part. After the wafer box and the seal cooperate and form a seal, the first moving part is used to achieve the purpose of moving away from the loading platform, so that the seal and the box body of the wafer box cooperate to keep the internal environment of the exposure device isolated from the external environment, ensuring the yield of the product, and also enabling the above-mentioned silicon wafer loading system to load and unload wafers during the exposure process of the exposure device.

[0080] Please refer to Figures 1 to 4 The present invention provides a silicon wafer loading system, comprising: a sealing member 1, a first moving part 2, a door component 6 and a loading platform 7 for placing a film box 9; the sealing member 1 has an interface for connecting the internal world of the exposure device with the outside world, and the first moving part 2 is movably arranged between a sealing position and an unsealing position in a direction close to or away from the loading platform 7; the door component 6 is arranged on the first moving part 2 and moves with the first moving part 2; when the first moving part 2 is in the sealing position, the door component 6 blocks the interface and forms a seal with the sealing member 1; when the first moving part 2 is in the unsealing position, the interface is exposed; wherein the first moving part 2 is configured to drive the door component 6 to move after the film box 9 loaded on the loading platform 7 cooperates with the sealing member 1 and forms a seal; and at this time, the loading platform 7 remains stationary. Furthermore, the sealing member 1 is a plate-shaped member, and when the door component 6 is in the sealing position, the side of the door component 6 facing the outside world is flush with the sealing member 1. It should be noted that in Figure 1In the illustrated example, the door component 6 is a plate-shaped member, which can be moved in a direction close to or away from the loading platform 7 under the drive of the first moving part 2. The plane size of the door component 6 is adapted to the plane size of the film box 9, or the plane size of the door component 6 can be slightly smaller than the plane size of the film box 9, so as to ensure that there is no gap between the box body of the film box 9 and the sealing member 1 during the movement of the door component 6. When the film box 9 is not in contact with the sealing member 1, the door component 6 and the sealing plate 1 are on the same plane to maintain the sealing of the exposure device; after the film box 9 moves to contact with the sealing member 1, the door component 6 moves in a direction away from the loading platform 7 under the action of the first moving part 2. At this time, the loading platform 7 and the sealing member 1 remain stationary and form a sealed state together with the box body of the film box 9 to keep the internal environment of the exposure device isolated from the external environment, avoid particle contamination, laser leakage and other problems, improve the internal environment of the exposure device, and help improve the product yield.

[0081] Furthermore, the silicon wafer loading system also includes a second moving part 3; the first moving part 2 is arranged on the second moving part 3, and the first moving part 2 can move on the second moving part 3 in a direction close to or away from the loading platform 7; the second moving part 3 is movably arranged in a direction perpendicular to the loading platform 7; wherein the second moving part 3 is configured to drive the first moving part 2 to move after the first moving part 2 moves to the unsealing position; and the loading platform 7 remains stationary at this time. It should be noted that, in the present embodiment, the first moving part 2 is arranged on the second moving part 3, and during the process of the first moving part 2 moving from the sealing position to the unsealing position in the direction away from the loading platform 7, the second moving part 3 remains stationary; and when the first moving part 2 moves to the unsealing position, the second moving part 3 drives the first moving part 2 to move together in a direction perpendicular to the loading platform 7; in Figure 1 and Figure 2 , the moving direction of the first moving part 2 is set parallel to the straight line A, the moving direction of the second moving part 3 is set parallel to the straight line B, and the moving direction of the first moving part 2 is perpendicular to the moving direction of the second moving part 3. In other embodiments, during the movement of the first moving part 2, the second moving part 3 may also move together, so that the movement trajectory of the door component 6 is curved; at the same time, the moving direction of the first moving part 2 and the moving direction of the second moving part 3 may also be set at other angles, which is not limited in this embodiment.

[0082] As an alternative embodiment, please refer to Figure 3 to Figure 4, the first moving part 2 includes a first guide shaft, the second moving part 3 includes a second guide shaft, the first guide shaft is arranged on the second moving part 3 along the direction close to or away from the loading platform 7, the second guide shaft is arranged along the direction perpendicular to the loading platform 7, the first moving part 2 is movably arranged along the first guide shaft, and the second moving part 3 is movably arranged along the second guide shaft. Further, the first moving part 2 also includes a first driving member, and the second moving part 3 also includes a second driving member, wherein the first driving member is mainly composed of a motor 20, a synchronous belt and a synchronous pulley 21, the motor 20 is used to provide power, the synchronous pulley 21 drives the synchronous belt transmission, and then drives the ball screw to realize the reciprocating motion of the first moving part 2 on the first guide shaft. The second driving member is mainly composed of a driving device (which can be another motor) and a coupling, the driving device is used to provide power, the coupling transmission, thereby driving the ball screw, and then realizing the reciprocating motion of the second moving part 3 on the second guide shaft. In other embodiments, the first moving part 2 and the second moving part 3 can also be configured as other components with similar functions, and those skilled in the art can configure this according to actual conditions.

[0083] As an optional embodiment, please continue to refer to Figure 1 The loading platform 7 also has a conveying mechanism (not shown in the figure); the conveying mechanism is used to drive the film box 9 to the locking position (the film box 9 is in the position such as Fig. 9 (b) position shown in Fig.10 (b) position shown in FIG. 1 ) and the handover station (the film box 9 is in the position shown in FIG. Fig. 9 (c) position shown in or Fig.10 (d) position shown in ). Furthermore, a locking mechanism 71 is provided on the loading platform 7, and the chip box 9 is locked with the loading platform 7 by the locking mechanism 71. The conveying mechanism drives the loading platform 7 to move, and the loading platform 7 drives the chip box 9 and the locking mechanism 71 to move together. It should be noted that after the chip box 9 is placed on the loading platform 7, the silicon wafer loading system is also provided with a detection mechanism, which confirms the position information of the chip box 9 by means of a presence detection sensor and a position sensor. After confirming that the chip box 9 is placed in the correct position, the locking mechanism 71 is activated to lock the loading platform 7 with the bottom of the chip box 9. When the chip box 9 is located at the locking position and the handover position, the first moving part 2 is always in the sealing position. After the chip box 9 reaches the handover position and contacts with the unlocking module 8, the first moving part 2 starts to move from the sealing position to the unsealing position.

[0084] In an optional embodiment, a conveying mechanism and a locking mechanism 71 are provided on the loading platform 7. The conveying mechanism can be a slider disposed on a slide rail, which is disposed in a direction close to or away from the door component 6. The locking mechanism 71 can be an axis, which is disposed on the loading platform 7 and can be driven by a driving device to rotate the locking mechanism 71 and extend into the positioning hole at the bottom of the film box 9 to achieve locking. At the same time, after the locking mechanism 71 locks the film box 9 and the loading platform 7, the conveying mechanism drives the transfer platform 7 to move, and the transfer platform 7 drives the locking mechanism 71 and the film box 9 to move between the locking station and the handover station. Of course, in other embodiments, the conveying mechanism and the locking mechanism 71 can also be other components with the same function. For example, the locking mechanism 71 can be a component with an adsorption function, which can be adsorbed with the bottom of the film box 9 after determining that the film box 9 is placed in the correct position to achieve locking; the conveying mechanism can also be a conveyor belt or other components with a moving function, which is not limited in this embodiment. The moving direction of the conveying mechanism is the direction close to or away from the door component 6. Figure 1 and Figure 2 is the direction parallel to line A.

[0085] Please refer to Figure 5a to Figure 5c ,in, Figure 5a It is a schematic diagram of the structure of a standard box body 90; Figure 5b and Figure 5c The wafer box 9 includes a standard box 90 and an adapter box 91. The standard box 90 and the adapter box 91 are used to load silicon wafers 10 of different sizes, and the adapter box 91 has positioning devices of different sizes to adapt to silicon wafers 10 of different sizes. Figure 5a In the illustrated example, the standard box 90 is a front-opening universal pod or front-opening unified fod (FOUP), which is used to load 300 mm silicon wafers 10; Figure 5b and Figure 5c In the illustrated example, the adapter cassette 91 is an open cassette adapter (OCA), the standard configuration of which is assembled by using a 200 mm positioning device 910 to assemble a 200 mm cassette 911 (eg, Figure 5b As shown), and by replacing the 200mm positioning device 910 with a 150mm positioning device 912, a 150mm box body 913 (as shown) can be assembled. Figure 5cAs shown), the conversion from loading 200 mm silicon wafers 10 to loading 150 mm silicon wafers 10 is realized. Of course, in other embodiments, the adapter box 91 can also select positioning devices of different sizes according to the different sizes of the silicon wafers 10, so as to meet the use of silicon wafers 10 of different specifications. With such configuration, the silicon wafer loading system provided in this embodiment can match the wafer boxes 9 of different specifications, and then adapt to the silicon wafers 10 of different sizes, which improves the user experience. At the same time, by simply replacing the wafer box 9, the positioning device and the corresponding bracket 51, the loading of silicon wafers 10 of different sizes can be realized, which also improves the user experience.

[0086] Please refer to Figure 3 5, the wafer loading system is provided with an unlocking module 8, which is arranged on the door component 6, and is used to dock with the wafer box 9 and move with the door component 6. After the wafer box 9 is located at the handover station and contacts the unlocking module 8, the first moving part 2 at least drives the unlocking module 8 to move in a direction away from the loading platform 7. As an optional embodiment, the wafer box 9 includes a standard box body 90, and the standard box body 90 has a wafer box door 900, which is locked with the box body of the wafer box 9 before the wafer box 9 is unlocked by the unlocking module 8. When the standard box body 90 is located at the handover station, the wafer box door 900 contacts the unlocking module 8.

[0087] Optionally, after the cassette door 900 contacts the unlocking module 8 , the unlocking module 8 releases the lock between the cassette door 900 and the cassette body of the cassette 9 , and the first moving part 2 drives the unlocking module 8 and the cassette door 900 to move in a direction away from the loading platform 7 .

[0088] Preferably, the unlocking module 8 includes an adsorption mechanism 81 and an unlocking mechanism 80. The unlocking module 80 is used to be inserted into the lock hole 902 on the film box door 900 and rotate around the axis to realize the unlocking between the box body of the film box 9 and the film box door 900; the adsorption mechanism 81 is used to adsorb the adsorption interface 901 on the film box door 900. When the standard box body 90 is located at the handover station, the film box door 900 is adsorbed by the adsorption mechanism 81, and the unlocking mechanism 80 releases the lock between the film box door 900 and the standard box body 90. The first moving part 2 drives the adsorption mechanism 81 and the film box door 900 to move, so as to realize the separation of the film box door 900 from the standard box body 90.

[0089] In one embodiment, please refer to Figure 5aThe adsorption mechanism 81 is adsorbed with the adsorption interface 901 on the cassette door 900 by vacuum adsorption. The unlocking mechanism 80 is arranged on the door component 6 together with the adsorption mechanism 81. The unlocking mechanism 80 can be a protrusion protruding outward, which is adapted to the locking hole 902 on the cassette door 900, can extend into the locking hole 902, and realizes the unlocking of the cassette door 900 and the standard cassette body 90 by rotating around the axis. In this embodiment, two unlocking mechanisms 80 are provided, and correspondingly, two locking holes 902 are also provided on the cassette door 900. The standard cassette body 90 (FOUP) is provided with a cassette door 900, which is locked with the cassette body of the cassette 9 during the movement of the cassette 9. When the standard box body 40 moves to the handover station, the adsorption mechanism 81 is adsorbed onto the film box door 900; at the same time, the unlocking mechanism 80 extends into the lock hole 902 on the film box door 900 and rotates synchronously, thereby realizing the unlocking between the film box door 900 and the standard box body 90; thereafter, the first moving part 2 drives the adsorption mechanism 81 adsorbed with the film box door 900 to move in a direction away from the loading platform 7, so that the film box door 900 is separated from the standard box body 90, and the standard box body 90 is in an open state, so that the sensor can extend into it and scan and confirm the state inside the film box 9.

[0090] As another alternative embodiment, please refer to Figure 5b and Figure 5c The film box 9 includes an adapter box body 91, and the adapter box body 91 has an open surface. When the adapter box body 91 is located at the handover station, the open surface contacts the unlocking module 8; the first moving part 2 drives the unlocking module 8 to move in a direction away from the loading platform 7.

[0091] Optional, in Figure 5b and Figure 5c In the illustrated example, the adapter box 91 is not provided with a film box door 900, and one side thereof is in a completely open state. When the adapter box 91 is moved to the handover station, since it does not have a film box door 900, the adsorption mechanism 81 does not need to start vacuum adsorption, and the unlocking mechanism 80 does not need to unlock the film box door 900 and the film box 9; when the open surface of the adapter box 91 contacts the unlocking module 8, the first moving part 2 can drive the adsorption mechanism 81 and the unlocking mechanism 80 to move away from the loading platform 7, and the sensor can enter the adapter box 91 through the open surface to complete the corresponding scan.

[0092] Please refer to Figure 2 , Figures 6a to 6c ,in, Figure 6a Schematic diagram of the scanning process of a standard box 40 loaded with a 300 mm silicon wafer 6, Figure 6b FIG. 4 is a schematic diagram of the scanning process of the adapter box 41 loaded with a 200 mm silicon wafer 6. Figure 6cThe schematic diagram is a scanning process diagram of the adapter box 41 loaded with 150mm silicon wafers 6. The silicon wafer loading system also includes a scanning mechanism 4 and a third moving part 5. The scanning mechanism 4 is arranged on the third moving part 5. The third moving part 5 is rotatably arranged on the first moving part 2 between the scanning position and the waiting position. When the third moving part 5 is in the scanning position, the scanning mechanism 4 extends into the interior of the wafer box 9. When the third moving part 5 is in the waiting position, the scanning mechanism 4 is located outside the wafer box 9. The third moving part 5 moves with the movement of the first moving part 2. Further, the third moving part 5 includes a scanning motion shaft 50 and a bracket 51. One end of the bracket 51 is connected to the scanning motion shaft 50, and the other end is connected to the scanning mechanism 4. The scanning motion shaft 50 drives the bracket 51 to rotate around the axis. The rotation axis of the third moving part 5 is arranged perpendicular to the movement direction of the first moving part 2.

[0093] Optionally, when the first moving part 2 moves to the unsealing position, the third moving part 5 is always in the waiting position. At this time, the second moving part 3 drives the first moving part 2, the scanning mechanism 4 and the third moving part 5 to move to the scanning start position (the second moving part 3 is in the position of Fig. 9 (g) position shown in or Fig.10 The scanning motion axis 50, for example, controls the solenoid valve to change direction, so as to extend the cylinder, so that the bracket 51 can rotate toward the direction close to the film box 9 until the scanning mechanism 4 extends into the interior of the film box 9 (the scanning mechanism 4 is in the position shown in FIG. Fig. 9 The position (h) shown in Fig.10 The third moving part 5 moves from the waiting position to the scanning position. In this embodiment, the scanning mechanism 4 is a scanning sensor. Then, the second moving part 3 continues to drive the first moving part 2, the scanning mechanism 4 and the third moving part 5 to move to the scanning end position (the second moving part 3 is in the position shown in FIG. 1 ). Fig. 9 (i) position shown in or Fig.10 The scanning motion axis 50 drives the bracket 51 to rotate away from the film box 9 until the scanning mechanism 4 extends out of the film box 9 (the scanning mechanism 4 is in the position shown in FIG. 4 ). Fig. 9 The position (j) shown in Fig.10 (i) position shown in the figure); the third moving part 5 is always in the scanning position between the scanning start position and the scanning end position, and the distance between the scanning start position and the scanning end position is adapted to the height of the film box 9 in the direction perpendicular to the loading platform 7.

[0094] Preferably, the scanning mechanism 4 is mainly used to detect whether there are silicon wafers 10 in the wafer box 9, whether the multi-layer stacked silicon wafers 10 are placed normally, and whether the deviation in the direction perpendicular to the loading platform 7 meets the requirements. Possible situations include normal wafers, cross-slots, stacked wafers, etc. Once cross-slots, stacked wafers, etc. occur, the loading and unloading process can be paused to adjust the position of the silicon wafer 10. In addition, the silicon wafer loading system is also provided with a protruding wafer detection mechanism before the second moving part 3 starts to move and after the silicon wafer loading system completes loading the wafer box 9. Please refer to Figures 6a to 6c , the scanning mechanism 4 scans the state of the silicon wafer 10. In this embodiment, the scanning mechanism 4 can be a beam sensor, which determines whether the silicon wafer 10 is in a normal state, a cross-slot state, a stacked state, etc. through the vertical motion scanning of the beam sensor on the bracket 51 and the software algorithm logic. At the same time, the silicon wafer loading system also includes a protruding chip sensor, which is arranged on the frame of the silicon wafer loading system, specifically located above the seal 1. Lmax and Lmin are determined by the structure of the protruding chip detection sensor and the wafer box 9. When the position of the silicon wafer 10 exceeds Lmax, the protruding chip sensor will report an error, triggering the protruding chip error reporting mechanism, and subsequent scanning and the action of taking and placing the silicon wafer 10 cannot be performed.

[0095] In an optional embodiment, the third moving part 5 includes a driving device, a scanning motion shaft 50 and a bracket 51. The driving device is connected to the scanning motion shaft 50, the scanning mechanism 4 is arranged at one end of the bracket 51 close to the film box 9, and the scanning mechanism 4 and the third moving part 5 are both arranged on the first moving part 2. The first moving part 2 is arranged on the second moving part 3. Therefore, in the process that the first moving part 2 drives the door component 6 to move from the sealing position to the unsealing position, the scanning mechanism 4 and the third moving part 5 move with the movement of the first moving part 2; after the first moving part 2 moves to the unsealing position, the second moving part 3 drives the first moving part 2, the scanning mechanism 4 and the third moving part 5 to move together in a direction perpendicular to the loading platform 7, thereby completing the scanning of the silicon wafer 10 inside the film box 9 and the loading of the film box 9 by the silicon wafer loading system.

[0096] Furthermore, after the first moving part 2 moves to the unsealing position in the direction away from the loading platform 7, the second moving part 3 not only drives the first moving part 2, the scanning mechanism 4 and the third moving part 5 to move to the scanning start position and the scanning end position in sequence in the direction perpendicular to the loading platform 7 to complete the scanning of the silicon wafer 10 inside the wafer box 9, but also needs to continue to drive the first moving part 2, the scanning mechanism 4 and the third moving part 5 to move to the loading completion position in the direction perpendicular to the loading platform 7 after the scanning mechanism 4 completes the scanning of the silicon wafer 10 inside the wafer box 9 (the scanning mechanism 4 is in the position as shown in FIG. Fig. 9 The position (k) shown in Fig.10At this time, the robot will perform a pick-and-place operation on the silicon wafer 10 in the wafer box 9. After the robot completes the pick-and-place operation, the silicon wafer loading system performs an unloading process on the wafer box 9. This process generally does not require scanning by the scanning mechanism 4. However, if it is necessary to obtain the placement status of the exposed silicon wafer 10 inside the wafer box 9, a scanning step can also be added to the unloading process.

[0097] Please refer to Figure 5a to Figure 5c as well as Figure 7 The wafer box 9 includes a box body, which is used to adapt to the sealing member 1 for docking and sealing. Optionally, the wafer box 9 includes a standard box body 90 or an adapter box body 91; the standard box body 90 includes a wafer box door 900 detachably connected to the box body; the wafer box door 900 has a lock hole 902 and / or an adsorption interface 901; the adapter box body 91 has an open surface opened on one side of the box body, and when the adapter box body 91 is sealed with the sealing member 1, the open surface faces the unlocking module 8. In this configuration, the wafer box includes a standard box body and an adapter box body, and the standard box body and the adapter box body are loaded with silicon wafers of different sizes, and the adapter box body can be loaded with silicon wafers of different sizes by replacing different positioning devices, thereby improving the user experience.

[0098] In another embodiment, the present invention further provides an exposure device, comprising: a robot (not shown in the figure) and the wafer loading system as described above; after the wafer loading system completes loading the wafer cassette 9, the robot extends into the wafer cassette 9 to take out the wafer 10 in the wafer cassette 9 and / or places the processed wafer 10 in the wafer cassette 9. In an optional embodiment, when the wafer cassette 9 moves to the handover station and the scanning mechanism 4 completes scanning of the wafer 10 in the wafer cassette 9 and confirms that there is no abnormality, the robot extends into the wafer cassette 9, takes out the stacked wafers 10 in the wafer cassette 9, and places them on the exposure machine; at the same time, the processed wafer 10 is placed in the wafer cassette 9, and the wafer cassette 9 is finally transported to the outside of the wafer loading system under the joint action of the first moving part 2, the second moving part 3 and the conveying mechanism for subsequent processes. It should be noted that in the process of loading and unloading wafers in the existing wafer library, due to the movement of the loading platform 7, problems such as particle contamination and laser leakage may occur, which in turn affects the product yield. Therefore, the existing wafer library cannot perform loading and unloading operations during the exposure process of the exposure machine, which also affects the yield of the exposure equipment. However, when using the silicon wafer loading system including the above-mentioned silicon wafer loading system, the loading platform 7 can cooperate with the sealing member 1 and the box body of the wafer box 9 to keep the internal environment of the exposure equipment isolated from the external environment. Therefore, during the exposure process of the exposure machine, the above-mentioned silicon wafer loading system and the silicon wafer loading system can still perform loading and unloading operations.

[0099] In another embodiment, please refer to Figures 8 to 10 The present invention also provides a silicon wafer transmission method, comprising:

[0100] Step S1: Place the film box 9 on the loading platform 7, and the loading platform 7 drives the film box 9 to move to the handover station (such as Fig. 9 (a) position to (c) position shown in Fig.10 (a) to (d) positions shown in FIG.

[0101] Step S2: After the sealing member 1 cooperates with the body of the film box 9 to form a seal, the first moving part 2 drives the door component 6 to move in a direction away from the loading platform 7 (eg Fig. 9 (d) position to (f) position shown in Fig.10 (e) position shown in );

[0102] Step S3: completing scanning of the silicon wafer 10 in the wafer box 9;

[0103] Step S4: grabbing the silicon wafer 10 in the wafer box 9 by a robot arm, and / or placing the processed silicon wafer 10 in the wafer box 9 .

[0104] In an optional embodiment, in step S1, the film box 9 is placed on the loading platform 7 (such as Fig. 9 (a) position shown in Fig.10 (a) position shown in the figure), it is necessary to use the presence detection sensor and the position sensor to confirm whether the position information of the film box 9 is correct. Specifically, the product information of the film box 9 can be captured by the presence detection sensor, and the position sensor can be used to confirm whether the position of the film box 9 is located at the predetermined position; after confirming that it is correct, the locking mechanism 71 is rotated to lock the bottom of the film box 9 with the loading platform 7 (such as Fig. 9 (b) position shown in Fig.10 The loading platform 7 is driven by the conveying mechanism to move, and the loading platform 7 drives the film box 9 and the locking mechanism 71 to move from the locking position to the direction close to the door component 6 to the handover position (as shown in FIG. Fig. 9 (c) position shown in Fig.10 (d) position shown in Fig. 9 The film box 9 in the film box contacts the unlocking module 8, and the vacuum adsorption and unlocking (such as Fig. 9 In step S2, the first moving part 2 drives the door component 6 (including the adsorption mechanism 81 and the unlocking mechanism 80) to move away from the loading platform 7 (such as Fig. 9 The position (f) shown in Fig.10(e) position shown in FIG. 1 ), if the film box 9 includes a film box door 900, the film box door 900 and the door component 6 are driven together to move away from the loading platform 7. At this time, the loading platform 7 remains stationary and cooperates with the seal 1 and the box body of the film box 9 to keep the internal environment of the exposure device isolated from the external environment. In step S3, the second moving part 3 drives the first moving part 2 and the scanning mechanism 4 to move to the scanning start position (such as Fig. 9 The position (g) shown in Fig.10 The drive device in the scanning mechanism 4 drives the scanning motion axis 50 to rotate toward the direction close to the film box 9, so that the scanning mechanism 4 extends into the film box 9 (such as Fig. 9 The position (h) shown in Fig.10 At this time, the second moving part 3 drives the first moving part 2, the scanning mechanism 4, and the door component 6 to move in a direction perpendicular to the loading platform 7, so that the scanning mechanism 4 can scan the multi-layer silicon wafers 10 stacked in the wafer box 9, and finally move to the scanning end position (such as Fig. 9 (i) position shown in Fig.10 After the scanning mechanism 4 completes scanning of the silicon wafer 10 in the film box 9, the driving device in the scanning mechanism 4 drives the scanning motion axis 50 to rotate away from the film box 9, so that the scanning mechanism 4 leaves the interior of the film box 9 (such as Fig. 9 The position (j) shown in Fig.10 At this time, the second moving part 3 continues to drive the first moving part 2, the scanning mechanism 4, and the door component 6 to move to the loading completion position (such as Fig. 9 The position (k) shown in Fig.10 (j) position shown in the figure) to avoid the movement track of the robot. In step S4, the robot moves back and forth between the exposure machine and the cassette 9 to transport the silicon wafer 10. It should be noted that the "and / or" here means that during the process of the robot moving back and forth between the exposure machine and the cassette 9 once, it can grab the silicon wafer 10 in the cassette 9 and move it from the cassette 9 to the exposure machine, and grab the processed silicon wafer 10 and return it from the exposure machine to the cassette 9, or only complete one of the above two operations during one round trip, and it does not mean that the robot grabs the silicon wafer 10 in the cassette 9 and the processed silicon wafer 10 at the same time during one movement.

[0105] With such configuration, the above-mentioned silicon wafer transfer method can, on the one hand, be used to load and unload wafers during the exposure process of the exposure machine without having to worry about problems such as particle contamination and laser leakage affecting the yield, and can reduce the time the exposure machine has to wait for the silicon wafers 10 to be loaded and unloaded after completing the exposure of a batch of products; on the other hand, the above-mentioned silicon wafer loading system can adapt to different wafer boxes 9, and only by replacing the wafer boxes 9, the positioning device and the bracket 51, the loading of silicon wafers 10 of different sizes can be achieved, which broadens the scope of application of the silicon wafer loading system and improves the user experience.

[0106] As an alternative embodiment, please refer to Fig. 9 The wafer cassette 9 includes a standard cassette body 90, and the standard cassette body 90 has a cassette door 900; the wafer loading system includes an unlocking module 8, and when the standard cassette body 90 is located at the handover station, the cassette door 900 contacts the unlocking module 8, and the cassette body of the wafer cassette 9 forms a seal with the sealing member 1; the unlocking module 8 releases the lock between the cassette door 900 and the cassette body of the wafer cassette 9, and the first moving part 2 drives the unlocking module 8 and the cassette door 900 to move in a direction away from the loading platform 7. It should be noted that when using the standard cassette body 90 (i.e., FOUP), since the standard cassette body 90 has the cassette door 900, in step S2 of the above-mentioned wafer transfer method, the unlocking module 8 includes an adsorption mechanism 81 and an unlocking mechanism 80, and the adsorption mechanism 81 needs to be used to adsorb the adsorption mechanism 81 and the cassette door 900 together by vacuum adsorption (such as Fig. 9 (d) position shown in FIG. 1 ), and extends into the locking hole 902 of the cassette door 900 through the unlocking mechanism 80 (as shown in FIG. 1 ). Fig. 9 (e) position shown in FIG. 1 ), synchronously rotate to unlock the film box door 900 and the standard box body 90 (as shown in FIG. Fig. 9 (f) position shown in FIG); in the subsequent steps S3 and S4 of the movement process, the adsorption mechanism 81 always maintains adsorption with the film box door 900 and moves with the second moving part 3.

[0107] As another alternative embodiment, please refer to Fig.10 The wafer box 9 includes an adapter box body 91, and the adapter box body 91 has an open surface; the silicon wafer loading system includes an unlocking module 8, and when the adapter box body 91 is located at the handover station, the open surface of the adapter box body 91 forms a seal with the sealing member 1; the first moving part 2 drives the unlocking module 8 to move in a direction away from the loading platform 7. It should be noted that when the adapter box body 91 (i.e., OCA) is used, since the adapter box body 91 is open and the wafer box door 900 is not provided, after the adapter box body 91 contacts the unlocking module 8, the first moving part 2 can directly drive the unlocking module 8 (including the adsorption mechanism 81 and the unlocking mechanism 80 in this embodiment) to move, without the need for vacuum adsorption and unlocking processes.

[0108] In an alternative embodiment, the wafer loading system includes a second moving part 3; after the first moving part 2 drives the door component 6 to move, the second moving part 3 drives the first moving part 2 to move in a direction perpendicular to the loading platform 7 to complete the scanning of the wafer 10 in the wafer box 9. Further, the wafer loading system also includes a scanning mechanism 4 and a third moving part 5, and the scanning mechanism 4 is arranged on the third moving part 5; during the movement of the second moving part 3, the third moving part 5 rotates from the waiting position to the scanning position at the scanning start position to drive the scanning mechanism 4 to extend into the interior of the wafer box 9, and rotates from the scanning position to the waiting position at the scanning end position to drive the scanning mechanism 4 to extend out of the interior of the wafer box 9; after the first moving part 2 completes its movement, the second moving part 3 drives the scanning mechanism 4 to move to the scanning start position; and after the scanning mechanism 4 extends into the interior of the wafer box 9, the second moving part 3 drives the scanning mechanism 4 to move to the scanning end position to complete the scanning mechanism 4 scanning the wafer 10 in the wafer box 9; and after the scanning mechanism 4 extends out of the interior of the wafer box 6, it moves to the loading completion position. It should be noted that during the movement of the second moving part 3, if the loaded film box 9 is a standard box body 90, the second moving part 3 will drive the first moving part 2, the scanning mechanism 4, the door component 6 (including the adsorption mechanism 81 and the unlocking mechanism 80) and the film box door 900 to move together; if the loaded film box 9 is an adapter box body 91, the second moving part 3 will drive the first moving part 2, the scanning mechanism 4 and the door component 6 (including the adsorption mechanism 81 and the unlocking mechanism 80) to move together.

[0109] In another optional embodiment, the above silicon wafer transfer method only describes the process of loading the silicon wafer 10, and the process of unloading the silicon wafer 10 can be understood as the reverse operation of the loading process, which can be:

[0110] Step S10: taking out the silicon wafer 10 in the wafer box 9 by a robot, and / or placing the processed silicon wafer 10 into the wafer box 9;

[0111] Step S20: the second moving part 3 drives the first moving part 2, the scanning mechanism 4, and the door component 6 (if the film box 9 is a standard box body 90, it also includes the film box door 900) to move from the loading completion station to the scanning start station;

[0112] Step S30: According to the demand, whether to scan the inside of the film box 9 through the scanning mechanism 4 is selected;

[0113] Step S40: the first moving part 2 drives the unlocking module 8 to move toward the loading platform 7 until the unlocking module 8 contacts the film box 9 (if the film box 9 is a standard box body 90, the unlocking mechanism 80 also rotates in the opposite direction to lock the film box door 900 with the standard box body 90, and the adsorption mechanism 81 releases the vacuum adsorption state); at this time, the loading platform 7 remains stationary;

[0114] Step S50 : the conveying mechanism drives the film box 9 to move from the handover station to the locking station; at the same time, the locking mechanism 71 releases the lock between the film box 9 and the loading platform 7 .

[0115] In summary, in the silicon wafer loading system, exposure equipment, and silicon wafer transmission method provided in the embodiments of the present invention, the silicon wafer loading system includes: a seal, a first moving part, a door component, and a loading platform for placing a film box; the seal has an interface for connecting the internal world of the exposure equipment with the outside world, and the first moving part is movably arranged between a sealing position and an unsealing position in a direction close to or away from the loading platform; the door component is arranged on the first moving part and moves with the first moving part; when the first moving part is in the sealing position, the door component blocks the interface and forms a seal with the seal; when the first moving part is in the unsealing position, the interface is exposed; wherein the first moving part is configured to drive the door component to move after the film box loaded on the loading platform cooperates with the seal and forms a seal; and at this time the loading platform remains stationary.

[0116] In this configuration, a first moving part that can move in a direction close to or away from the loading platform is added, and the door component is arranged on the first moving part and can move with the movement of the first moving part. After the wafer box loaded on the loading platform cooperates with the seal to form a seal, the first moving part drives the door component to move in a direction away from the loading platform, so that during the process of loading and unloading wafers in the silicon wafer loading system, the loading platform remains stationary and cooperates with the seal and the box body of the wafer box to keep the internal environment of the exposure device isolated from the external environment; avoiding the problems in the prior art that the internal environment of the exposure device and the external environment are penetrated due to the movement of the loading platform, causing particle pollution, laser leakage, etc., improving the internal environment of the exposure device, which is conducive to improving the product yield.

[0117] Furthermore, the wafer box includes a standard box body and an adapter box body, wherein the standard box body is usually used to load 300mm silicon wafers, and the adapter box body can load 200mm and 150mm silicon wafers respectively by replacing the positioning device. Therefore, the silicon wafer loading system provided in the present application can match wafer boxes of different specifications, and then adapt to silicon wafers of different sizes, thereby improving the user experience.

[0118] Furthermore, a robot is used to pick up and place the silicon wafers in the completed wafer box. Since the loading platform remains stationary during the entire process of loading and unloading the wafers, and cooperates with the seal and the box body of the wafer box, the internal environment of the exposure equipment is isolated from the external environment. Therefore, during the exposure process of the exposure equipment, the above-mentioned silicon wafer loading system can still load and unload the wafers, and can avoid problems such as particle contamination and laser leakage, which is beneficial to improving product yield.

[0119] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A silicon wafer loading system, characterized in that: include: A seal, a first moving part, a door component, and a loading platform; The sealing member has an interface for connecting the inner world of the exposure device with the outside world, and the first moving part is movably arranged between a sealing position and an unsealing position in a direction close to or away from the loading platform; the door component is arranged on the first moving part and moves with the first moving part; when the first moving part is in the sealing position, the door component blocks the interface and forms a seal with the sealing member; when the first moving part is in the unsealing position, the interface is exposed; Wherein, the first moving part is configured to drive the door component to move after the film box loaded on the loading platform cooperates with the sealing member and forms a seal.

2. The silicon wafer loading system according to claim 1, characterized in that: The silicon wafer loading system further includes a second moving part; The first moving part is arranged on the second moving part, and the first moving part can move on the second moving part in a direction close to or away from the loading platform; the second moving part is movably arranged in a direction perpendicular to the loading platform; Wherein, the second moving part is configured to drive the first moving part to move after the first moving part moves to the unsealing position.

3. The silicon wafer loading system according to claim 2, characterized in that: The first moving part includes a first guide shaft, the second moving part includes a second guide shaft, the first guide shaft is arranged on the second moving part in a direction close to or away from the loading platform, and the second guide shaft is arranged in a direction perpendicular to the loading platform; The first moving part is movably disposed along the first guide axis, and the second moving part is movably disposed along the second guide axis.

4. The silicon wafer loading system according to claim 3, characterized in that: The first moving part further includes a first driving member, and the second moving part further includes a second driving member; The first driving member is used to drive the first moving part to reciprocate on the first guide shaft; the second driving member is used to drive the second moving part to reciprocate on the second guide shaft.

5. The silicon wafer loading system according to claim 1, characterized in that: The silicon wafer loading system further comprises an unlocking module, which is arranged on the door component and is used for docking with the wafer box and moving with the door component.

6. The silicon wafer loading system according to claim 5, characterized in that: The unlocking module comprises an unlocking mechanism, which is used to be inserted into a lock hole on a film box door of the film box and rotate around an axis to achieve unlocking between the box body of the film box and the film box door.

7. The silicon wafer loading system according to claim 5, characterized in that: The unlocking module comprises an adsorption mechanism, and the adsorption mechanism is used for adsorbing an adsorption interface on a cassette door of the cassette.

8. The silicon wafer loading system according to claim 1, characterized in that: The silicon wafer loading system further comprises a scanning mechanism and a third moving part, wherein the scanning mechanism is arranged on the third moving part, and the third moving part is rotatably arranged on the first moving part between a scanning position and a waiting position; When the third moving part is in the scanning position, the scanning mechanism extends into the interior of the film box; when the third moving part is in the waiting position, the scanning mechanism is located outside the film box; The third moving part moves along with the movement of the first moving part.

9. The silicon wafer loading system according to claim 8, characterized in that: The third moving part includes a scanning motion axis and a bracket, one end of the bracket is connected to the scanning motion axis, and the other end is connected to the scanning mechanism, and the scanning motion axis drives the bracket to rotate around the axis; the rotation axis of the third moving part is set perpendicular to the movement direction of the first moving part.

10. The silicon wafer loading system according to claim 1, characterized in that: The loading platform is provided with a locking mechanism and a conveying mechanism. The locking mechanism is used to extend into a positioning hole at the bottom of the film box to fix the film box; the conveying mechanism is used to drive the film box to move on the loading platform.

11. The silicon wafer loading system according to claim 1, characterized in that: The sealing member is a plate-shaped member, and when the door component is in the sealing position, a side of the door component facing the outside is flush with the sealing member.

12. The silicon wafer loading system according to any one of claims 1 to 11, characterized in that: The film box comprises a box body, and the box body is used for matching with and sealing the sealing member.

13. The silicon wafer loading system according to claim 12, characterized in that: The film box includes a standard box body or an adapter box body; The standard box body comprises a film box door detachably connected to the box body, and the film box door has a lock hole and / or an adsorption interface; The adapter box body has an open surface opened on one side of the box body, and when the adapter box body is sealed with the sealing member, the open surface faces the unlocking module.

14. An exposure device, characterized in that: A method of manufacturing a silicon wafer comprising: comprising a robot and a silicon wafer loading system as claimed in any one of claims 1 to 13; After the wafer loading system completes loading the wafer box, the robot extends into the wafer box to take out the silicon wafers in the wafer box and / or place the processed silicon wafers in the wafer box.

15. A silicon wafer transmission method, characterized in that: include: Placing the film box on a loading platform, and the loading platform drives the film box to move to a handover station; The sealing member cooperates with the box body of the film box to form a seal, and the first moving part drives the door component to move in a direction away from the loading platform; completing scanning of the silicon wafer in the wafer box; The silicon wafers in the wafer box are grabbed by a robot, and / or the processed silicon wafers are placed in the wafer box.

16. The silicon wafer transfer method according to claim 15, characterized in that: The silicon wafer loading system comprises an unlocking module, and the wafer box comprises a standard box body or an adapter box body; The standard cassette body has a cassette door. When the standard cassette body is located at the handover station, the cassette door contacts the unlocking module, and the cassette body of the cassette forms a seal with the sealing member. The unlocking module releases the lock between the cassette door and the cassette body, and the first moving part drives the unlocking module and the cassette door to move in a direction away from the loading platform. or, The adapter box body has an open surface, and when the adapter box body is located at the handover station, the open surface forms a seal with the sealing member; the first moving part drives the unlocking module to move in a direction away from the loading platform.

17. The silicon wafer transfer method according to claim 16, wherein: The silicon wafer loading system includes a second moving part; After the first moving part drives the door component to move, the second moving part drives the first moving part to move in a direction perpendicular to the loading platform to complete scanning of the silicon wafers in the wafer box.

18. The silicon wafer transfer method according to claim 17, wherein: The silicon wafer loading system further comprises a scanning mechanism and a third moving part, wherein the scanning mechanism is arranged on the third moving part; During the movement of the second moving part, the third moving part rotates from the waiting position to the scanning position at the scanning start position to drive the scanning mechanism to extend into the interior of the film box, and rotates from the scanning position to the waiting position at the scanning end position to drive the scanning mechanism to extend out of the interior of the film box; The second moving part drives the scanning mechanism to move to the scanning start position after the first moving part completes the movement; and after the scanning mechanism extends into the interior of the wafer box, drives the scanning mechanism to move to the scanning end position to complete the scanning mechanism scanning the silicon wafer in the wafer box; And after the scanning mechanism extends out of the interior of the film box, it moves to the loading completion station.

Images