Columnar body solder for packaging and processing method thereof
By designing column solder with compressive ring, second compressive layer, cobalt layer and arc-shaped reinforcement ribs, the problems of insufficient strength and poor fluidity of existing welding column materials are solved, and higher welding stability and packaging performance are achieved.
Patent Information
- Application Number
- CN202411975267.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-03-21
AI Technical Summary
The existing welding column materials have low strength and insufficient resistance to substrate warping, which can easily lead to cracking of solder joints and affect packaging performance. At the same time, the fluidity of the solder is insufficient, making it difficult to fully fill gaps and cover the target area during the welding process.
A columnar solder for packaging is designed, including a column core and a copper clad tape. A compressive ring is provided at the top and bottom of the column core, and a second compressive layer, a cobalt layer and arc-shaped reinforcement ribs are arranged inside. The copper clad tape adopts a braided mesh, porous and multi-spiral structure to enhance the mechanical strength and fluidity of the solder.
By enhancing the mechanical strength and fluidity of the solder, the stability and efficiency of welding are improved, and the solder joint cracking is prevented from being caused by warping of the substrate, ensuring welding quality and packaging performance.
Smart Images
Figure CN119658208A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of columnar solder, in particular to a columnar solder for packaging and a processing method thereof. Background Art
[0002] With the rapid development of science and technology, the use of electronic devices and integrated circuits has become more and more frequent. Among them, integrated circuit packaging is one of the processes in the processing of electronic components. Column grid array packaging is one of the commonly used packaging methods. Solder columns are components required in column grid array packaging. Existing solder columns are generally made of lead-tin alloy materials.
[0003] However, the existing columnar solder for packaging and its processing method are not perfect and still have certain defects: The solder needs to adapt to the humid environment without affecting its anti-oxidation properties, ensuring that the solder can melt at the appropriate temperature and form an effective connection. Lead-tin alloy materials generally have low strength and weak resistance to substrate warping. During the packaging process, it is easy to cause solder joints to crack due to warping and deformation, affecting the packaging performance. The fluidity of the solder needs to be enhanced to fill gaps and cover the target area during the welding process. Summary of the invention
[0004] The object of the present invention is to provide a columnar solder for packaging and a processing method thereof, so as to solve the problem that the lead-tin alloy material proposed in the above background technology generally has low strength and weak ability to resist substrate warping, and is prone to cracking of solder joints due to warping deformation during the packaging process, affecting the packaging performance, and the fluidity of the solder needs to be enhanced in order to fill gaps and cover target areas during the welding process.
[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a columnar solder for packaging, comprising a column core and a copper-clad tape, the copper-clad tape being arranged on the outside of the column core, anti-pressure rings being arranged on the top and bottom of the column core, reinforcing fillers being filled between the column core and the grooves of the copper-clad tape, a first anti-pressure layer being arranged inside the two anti-pressure rings, an anti-oxidation layer being arranged inside the two anti-pressure rings, a second anti-pressure layer being arranged inside the column core, a plurality of arc-shaped reinforcing ribs being arranged inside the column core, and a cobalt layer being filled between the second anti-pressure layer and the plurality of arc-shaped reinforcing ribs.
[0006] Preferably, a corrosion-resistant layer is provided inside the column core, a noise reduction layer is provided inside the column core, the column core material includes tin-based alloy, high-temperature resistant plastic and rubber, the copper-clad strip includes pure copper, copper-plated nickel, palladium-plated, gold-plated and silver-plated, and the outer layer of the column core is covered in a woven mesh, porous and multi-spiral structure shape.
[0007] Preferably, a flame retardant layer is provided inside the column core, and one side of the noise reduction layer is in contact with one side of the corrosion resistant layer.
[0008] Preferably, a filling layer is provided inside the column core, one side of the filling layer is in contact with one side of the flame retardant layer, and the other side of the flame retardant layer is in contact with the other side of the noise reduction layer.
[0009] Preferably, a fiber layer is provided inside the two anti-compression rings, and a copper-tin alloy is provided inside the two anti-compression rings.
[0010] Preferably, one side of the two copper-tin alloys is in contact with one side of the two fiber filament layers respectively, and the thickness of the two copper-tin alloys is greater than the thickness of the two fiber filament layers.
[0011] A method for processing a columnar solder for packaging, comprising the following processing steps: Step 1: Select appropriate metal raw materials, mix tin and lead in a ratio of 6:4, and electroplate the copper strip with a tin layer on the outside; Step 2: Add 4.0% silver and 0.5% copper to the metal raw materials to provide the solder with higher strength and corrosion resistance, heat the mixed metal to a molten state to ensure uniform alloy composition, and pour the molten solder into a mold to form a preliminary columnar body; Step 3: Cooling: Allow the cast column to cool in the mold and solidify into shape. The solidified solder is further elongated into a standard columnar shape through a drawing machine. Step 4: Cut the long column into specified lengths as needed and apply a protective layer on the solder surface to enhance the performance and storage stability of the solder.
[0012] The beneficial effects of the present invention are as follows: 1. The present invention cooperates with the anti-pressure ring, the second anti-pressure layer, the cobalt layer, the arc-shaped reinforcement ribs, the corrosion-resistant layer, the noise reduction layer and the flame-retardant layer. The anti-pressure ring, the first anti-pressure layer and the second anti-pressure layer are all made of aluminum-copper alloy, which enhances the mechanical strength and stability of the columnar solder. The cobalt layer is used to improve the performance and fluidity of the solder and make the mixing between the metal materials more uniform. The arc-shaped reinforcement ribs are made of aluminum alloy and have a certain hardness. They are evenly distributed inside the column core, which enhances the supporting strength inside the column core. The corrosion-resistant layer is made of aluminum-nickel material to enhance the durability of the solder in a humid and corrosive environment. The noise reduction layer is a sound insulation material to reduce noise. The flame-retardant layer is a fluoride, which is mainly used in the packaging and storage environment of the solder to reduce the risk of fire.
[0013] 2. The present invention sets up a first pressure-resistant layer, an anti-oxidation layer, a fiber layer, a copper-tin alloy and a filling layer. The anti-oxidation layer is a mixture of tin, silver and nickel. Adding these materials can prevent the solder from oxidizing and ensure long-term stability. The fiber layer is made of carbon fiber and is used to enhance the structural strength of the solder. The copper-tin alloy can increase the overall strength of the column core to prevent cracking caused by warping and deformation of the substrate. The filling layer is ceramic particles, which are used to fill the gap between the solder and the package to improve the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a partial front view cross-sectional structural schematic diagram of the present invention; Figure 3 For the present invention Figure 2 The enlarged view of point A in the middle; Figure 4 For the present invention Figure 2 The enlarged view of point B in the middle; Figure 5 It is a partial front view structural schematic diagram of the present invention.
[0015] In the figure: 1. column core; 2. copper clad tape; 3. anti-pressure ring; 4. first anti-pressure layer; 5. anti-oxidation layer; 6. fiber layer; 7. copper-tin alloy; 8. second anti-pressure layer; 9. cobalt layer; 10. arc-shaped reinforcement ribs; 21. corrosion-resistant layer; 22. noise reduction layer; 23. flame-retardant layer; 24. filling layer. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0017] like Figures 1 to 5 As shown, the embodiment of the present invention provides a technical solution of a columnar solder for packaging and a processing method thereof:
[0018] Embodiment 1: like Figure 1-3As shown, a columnar solder for packaging includes a column core 1 and a copper-clad tape 2, the copper-clad tape 2 is arranged on the outside of the column core 1, and anti-pressure rings 3 are arranged on the top and bottom of the column core 1. Reinforced fillers are filled between the grooves of the column core 1 and the copper-clad tape 2, and the first anti-pressure layer 4 is arranged inside the two anti-pressure rings 3, and the anti-oxidation layer 5 is arranged inside the two anti-pressure rings 3. A second anti-pressure layer 8 is arranged inside the column core 1, and a plurality of arc-shaped reinforcing ribs 10 are arranged inside the column core 1. A cobalt layer 9 is filled between the second anti-pressure layer 8 and the plurality of arc-shaped reinforcing ribs 10. The material of the column core 1 includes tin-based alloy, high-temperature resistant plastic and rubber, and the copper-clad tape 2 includes pure copper, copper plated with nickel, palladium, gold and silver, and the outer layer of the column core 1 is covered with a woven mesh, a porous structure and a multi-spiral structure. The present invention is provided with The anti-pressure ring 3, the second anti-pressure layer 8, the cobalt layer 9, the arc-shaped reinforcement ribs 10, the corrosion-resistant layer 21, the noise reduction layer 22 and the flame-retardant layer 23 are arranged in coordination. The anti-pressure ring 3, the first anti-pressure layer 4 and the second anti-pressure layer 8 are all made of aluminum-copper alloy, which enhances the mechanical strength and stability of the columnar solder. The cobalt layer 9 is used to improve the performance and fluidity of the solder and make the mixing between the metal materials more uniform. The arc-shaped reinforcement ribs 10 are made of aluminum alloy and have a certain hardness. They are evenly distributed inside the column core 1, which enhances the supporting strength inside the column core 1. The corrosion-resistant layer 21 is made of aluminum-nickel material to enhance the durability of the solder in a humid and corrosive environment. The noise reduction layer 22 is a sound insulation material to reduce noise. The flame-retardant layer 23 is a fluoride, which is mainly used in the packaging and storage environment of the solder to reduce the risk of fire.
[0019] Embodiment 2: Based on the first embodiment, Figure 2-5 As shown, a filling layer 24 is provided inside the column core 1, one side of the filling layer 24 is in contact with one side of the flame retardant layer 23, and the other side of the flame retardant layer 23 is in contact with the other side of the noise reduction layer 22, one side of the two copper-tin alloys 7 are in contact with one side of the two fiber filament layers 6 respectively, the thickness of the two copper-tin alloys 7 is greater than the thickness of the two fiber filament layers 6, the fiber filament layers 6 are provided inside the two anti-pressure rings 3, and the copper-tin alloys 7 are provided inside the two anti-pressure rings 3. The first anti-pressure layer 4, the anti-oxidation layer 5, the fiber filament layer 6, the copper-tin alloy 7 and the filling layer 24 are provided in coordination, and the anti-oxidation layer 5 is a mixture of tin, silver and nickel. Adding these materials can prevent the oxidation of the solder and ensure long-term stability. The fiber filament layer 6 is made of carbon fiber and is used to enhance the structural strength of the solder. The copper-tin alloy 7 can increase the overall strength of the column core to prevent cracking caused by warping and deformation of the substrate. The filling layer 24 is ceramic particles, which are used to fill the gap between the solder and the package to improve the heat dissipation performance.
[0020] A method for processing a columnar solder for packaging, comprising the following processing steps: Step 1: Select appropriate metal raw materials, mix tin and lead in a ratio of 6:4, and wrap the copper-clad tape 2 with a tin-plated layer on the outside by electroplating; Step 2: Add 4.0% silver and 0.5% copper to the metal raw materials to provide the solder with higher strength and corrosion resistance, heat the mixed metal to a molten state to ensure uniform alloy composition, and pour the molten solder into a mold to form a preliminary columnar body; Step 3: Cooling: Allow the cast column to cool in the mold and solidify into shape. The solidified solder is further elongated into a standard columnar shape through a drawing machine. Step 4: Cut the long column into specified lengths as needed and apply a protective layer on the solder surface to enhance the performance and storage stability of the solder.
[0021] Working principle and use process of the present invention: With the rapid development of science and technology, the use of electronic devices and integrated circuits is becoming more and more frequent. Among them, integrated circuit packaging is one of the processes in the processing of electronic components. Column grid array packaging is one of the commonly used packaging methods. The solder column is a component required for column grid array packaging. The existing solder column is generally made of lead-tin alloy material. Select suitable metal raw materials, tin and lead are mixed in a ratio of 6:4, and the copper-coated strip 2 is wrapped with a tin-plated layer on the outside by electroplating. 4.0% silver and 0.5% copper are added to the metal raw materials to provide higher strength and corrosion resistance to the solder. The mixed metal is heated to a molten state to ensure that the alloy composition is uniform. The molten solder is poured into a mold to form a preliminary columnar body. The anti-pressure ring 3, the first anti-pressure layer 4 and the second anti-pressure layer 8 are all aluminum-copper alloys, which enhance the mechanical strength and stability of the columnar solder. The cobalt layer 9 is used The invention is used to improve the performance and fluidity of the solder and make the metal materials mixed more evenly. The arc-shaped reinforcement ribs 10 are made of aluminum alloy, have a certain hardness, and are evenly distributed inside the column core 1, thereby enhancing the supporting strength inside the column core 1. The corrosion-resistant layer 21 is made of aluminum-nickel material to enhance the durability of the solder in a humid and corrosive environment. The noise reduction layer 22 is a sound insulation material to reduce noise. The flame retardant layer 23 is a fluoride, which is mainly used for the packaging and storage environment of the solder to reduce the risk of fire. The antioxidant layer 5 is a mixture of tin, silver and nickel. Adding these materials can prevent the solder from oxidizing and ensure long-term stability. The fiber layer 6 is made of carbon fiber to enhance the structural strength of the solder. The copper-tin alloy 7 can increase the overall strength of the column core to prevent cracking caused by warping and deformation of the substrate. The filling layer 24 is ceramic particles to fill the gap between the solder and the package to improve the heat dissipation performance.
[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A columnar solder for packaging, comprising a column core (1) and a copper-clad tape (2), wherein the copper-clad tape (2) is arranged outside the column core (1), and is characterized in that: The top and bottom of the column core (1) are both provided with anti-pressure rings (3), the groove between the column core (1) and the copper-clad strip (2) is filled with reinforcing filler, the interior of the two anti-pressure rings (3) is provided with a first anti-pressure layer (4), the interior of the two anti-pressure rings (3) is provided with an anti-oxidation layer (5), the interior of the column core (1) is provided with a second anti-pressure layer (8), the interior of the column core (1) is provided with a plurality of arc-shaped reinforcing ribs (10), and a cobalt layer (9) is filled between the second anti-pressure layer (8) and the plurality of arc-shaped reinforcing ribs (10).
2. The columnar solder for packaging according to claim 1, characterized in that: The column core (1) is provided with a corrosion-resistant layer (21) inside, and a noise reduction layer (22) inside. The column core (1) is made of a tin-based alloy, high-temperature-resistant plastic and rubber. The copper-clad strip (2) includes pure copper, nickel-plated copper, palladium-plated copper, gold-plated copper and silver-plated copper. The outer layer of the column core (1) is covered in a woven mesh, porous or multi-helical structure.
3. The columnar solder for packaging according to claim 2, characterized in that: A flame retardant layer (23) is provided inside the column core (1), and one side of the noise reduction layer (22) is in contact with one side of the corrosion resistant layer (21).
4. The columnar solder for packaging according to claim 3, characterized in that: A filling layer (24) is provided inside the column core (1), one side of the filling layer (24) is in contact with one side of the flame retardant layer (23), and the other side of the flame retardant layer (23) is in contact with the other side of the noise reduction layer (22).
5. The columnar solder for packaging according to claim 1, characterized in that: The two anti-pressure rings (3) are both provided with a fiber layer (6) inside, and the two anti-pressure rings (3) are both provided with a copper-tin alloy (7) inside.
6. The columnar solder for packaging according to claim 5, characterized in that: One side of the two copper-tin alloys (7) is in contact with one side of the two fiber filament layers (6), respectively, and the thickness of the two copper-tin alloys (7) is greater than the thickness of the two fiber filament layers (6).
7. A method for processing a columnar solder for packaging, the method being applicable to the columnar solder for packaging as claimed in claims 1 to 6, characterized in that : Includes the following processing steps: Step 1: Select appropriate metal raw materials, mix tin and lead in a ratio of 6:4, and electroplate the copper strip (2) with a tin layer on the outside; Step 2: Add 4.0% silver and 0.5% copper to the metal raw materials to provide the solder with higher strength and corrosion resistance, heat the mixed metal to a molten state to ensure uniform alloy composition, and pour the molten solder into a mold to form a preliminary columnar body; Step 3: Cooling: Allow the cast column to cool in the mold and solidify into shape. The solidified solder is further elongated into a standard columnar shape through a drawing machine. Step 4: Cut the long column into specified lengths as needed and apply a protective layer on the solder surface to enhance the performance and storage stability of the solder.