Active optical element temperature field and surface shape adjusting device and system and control method thereof

Abstract

The invention discloses an active optical element temperature field and surface shape adjusting device and system and a control method thereof, and the device comprises an optical element which is provided with an optical surface and a side surface; the bracket is arranged on the side surface of the optical element; the semiconductor coolers are arranged on the support, and the semiconductor coolers are used for heating or cooling the optical element and adjusting the curvature or the surface height of the optical surface when a control signal is applied to the semiconductor coolers; and the heat transfer layer is arranged between the optical element and the bracket. The semiconductor cooler on the side face of the optical element is used for accurately controlling the temperature change, the temperature of the local area of the optical element can be accurately controlled, high-precision adjustment of the surface shape of the optical surface of the optical element can be achieved, and compared with a traditional piezoelectric technology or a mechanical adjustment means, the adjustment precision is higher, and the adjustment precision is higher. And the cost is lower, and the device is more suitable for miniaturization and integration design.

Description

Technical Field

[0001] The present invention relates to the fields of synchrotron radiation, free electron laser, integrated circuit and related active optical technology, and in particular to an active optical element temperature field and surface shape adjustment device, system and control method thereof. Background Art

[0002] As the application demand for optical deformable mirrors in multiple fields continues to increase, traditional deformable mirrors can no longer meet the accuracy requirements, so active optical technology has been introduced. In astronomy, piezoelectric technology corrects atmospheric turbulence through multi-point driving, and similar technology is also used in the fields of synchrotron radiation and free electron lasers. However, traditional piezoelectric technology or other mechanical adjustment methods are easily affected by hysteresis or creep, resulting in low surface shape adjustment accuracy of optical elements.

[0003] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an active optical element 10 temperature field and surface shape adjustment device, system and control method thereof, so as to solve the problem that traditional piezoelectric technology or other mechanical adjustment means are easily affected by hysteresis effect or creep, resulting in low surface shape adjustment accuracy of optical elements.

[0005] The technical solution of the present invention is as follows:

[0006] In a first aspect, the present invention provides an active optical element temperature field and surface shape adjustment device, comprising:

[0007] An optical element, wherein the optical element has an optical surface and a side surface;

[0008] A bracket, wherein the bracket is arranged on a side of the optical element;

[0009] A plurality of semiconductor refrigerators, wherein the semiconductor refrigerators are arranged on the bracket and are used to increase or decrease the temperature of the optical element and adjust the curvature or surface height of the optical surface when a control signal is applied to the semiconductor refrigerators;

[0010] A heat transfer layer is disposed between the optical element and the bracket.

[0011] According to a further configuration of the present invention, the semiconductor refrigerator is embedded in the bracket.

[0012] According to a further configuration of the present invention, the bracket is arranged in one piece or in sections.

[0013] According to a further configuration of the present invention, the optical surface includes a first optical surface and a second optical surface; the side surfaces include a first side surface, a second side surface, a third side surface and a fourth side surface; the first optical surface and the second optical surface are arranged opposite to each other; the first side surface and the second side surface are arranged opposite to each other in the width direction of the optical element, and the third side surface and the fourth side surface are arranged opposite to each other in the length direction of the optical element; and the semiconductor refrigerator is arranged on the third side surface or the fourth side surface.

[0014] In a further configuration of the present invention, the first optical surface or the second optical surface intersects with the first side surface and the second side surface along the length direction of the bracket, and the bracket is perpendicular to the first optical surface or the second optical surface.

[0015] According to a further configuration of the present invention, the semiconductor refrigerators are distributed at intervals on the third side surface or the fourth side surface and extend to both ends of the third side surface or the fourth side surface.

[0016] According to a further configuration of the present invention, the optical element is a rectangular planar hexahedron; the ratio of the length to the width of the optical element is between 1 and 100; the length of the optical element is between 20 and 1500 mm, the width of the optical element is between 5 and 90 mm; and the thickness of the optical element is between 10 and 800 mm.

[0017] According to a further configuration of the present invention, there is a height difference between the bracket and the first optical surface; the height difference is 0-50 mm;

[0018] The thickness of the heat transfer layer is 0-10 mm.

[0019] In the second aspect, the present invention provides an active optical element temperature field and surface shape adjustment system, which includes a semiconductor refrigerator control unit and the active optical element temperature field and surface shape adjustment device as described above, the semiconductor refrigerator control unit is connected to the active optical element temperature field and surface shape adjustment device, and is used to output a control signal to drive the semiconductor refrigerator to work.

[0020] In a third aspect, the present invention provides a method for controlling the temperature field and surface shape of an active optical element, which comprises the steps of:

[0021] The semiconductor refrigerator control unit detects the current surface parameters of the optical element and obtains the corresponding deformation matrix of the optical element under unit power according to the adaptive optical control algorithm;

[0022] Obtaining the power value required by the semiconductor refrigerator 30 according to the deformation corresponding matrix and the required surface parameters;

[0023] The semiconductor refrigerator is driven to heat or cool according to the power value to adjust the surface shape of the optical element 10 .

[0024] The present invention provides an active optical element temperature field and surface shape adjustment device, system and control method thereof, the device comprising: an optical element, the optical element having an optical surface and a side surface; a bracket, the bracket being arranged on the side surface of the optical element; a plurality of semiconductor refrigerators, the semiconductor refrigerators being arranged on the bracket, the semiconductor refrigerators being used to increase or decrease the temperature of the optical element and adjust the curvature or surface height of the optical surface when a control signal is applied; a heat transfer layer, the heat transfer layer being arranged between the optical element and the bracket. The present invention can accurately control the temperature change through the semiconductor refrigerator on the side surface of the optical element, can accurately control the temperature of the local area of ​​the optical element, can achieve high-precision adjustment of the surface shape of the optical surface of the optical element, and compared with traditional piezoelectric technology or mechanical adjustment means, it not only has higher adjustment accuracy, but also lower cost, and is more suitable for miniaturization and integrated design. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary personnel in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0026] Figure 1 It is a schematic diagram of the overall structure of the temperature field and surface shape adjustment device of the active optical element in the present invention.

[0027] Figure 2 It is a cross-sectional view of the temperature field and surface shape adjustment device of the active optical element in the present invention.

[0028] Figure 3 It is another overall structural schematic diagram of the temperature field and surface shape adjustment device of the active optical element in the present invention.

[0029] Figure 4 It is a flow chart of the temperature field and surface shape adjustment control method of the active optical element in the present invention.

[0030] The marks in the accompanying drawings are: 10, optical element; 11, first optical surface; 12, second optical surface; 13, first side surface; 14, second side surface; 15, third side surface; 16, fourth side surface; 20, bracket; 30, semiconductor refrigerator; 40, heat transfer layer. DETAILED DESCRIPTION

[0031] The present invention provides an active optical element temperature field and surface shape adjustment device, system and control method thereof. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0032] In the embodiments and the scope of the patent application, unless the text specifically defines the article, "a", "an", "the" and "the" may also include plural forms. If there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0033] It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that when an element is said to be "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there can also be intermediate elements. In addition, the "connection" or "coupling" used herein can include wireless connection or wireless coupling. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0034] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as generally understood by those skilled in the art in the art to which the present invention belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as herein.

[0035] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0036] Please also see Figures 1 to 3 The present invention provides a preferred embodiment of a temperature field and surface shape adjustment device for an active optical element.

[0037] In some embodiments, Figure 1 and Figure 2 As shown, the present invention provides an active optical element temperature field and surface shape adjustment device, which includes: an optical element 10, a bracket 20, a plurality of semiconductor refrigerators 30 and a heat transfer layer 40. The optical element 10 has an optical surface and a side surface; the bracket 20 is arranged on the side surface of the optical element 10; the semiconductor refrigerator 30 is arranged on the bracket 20, and the semiconductor refrigerator 30 is used to increase or decrease the temperature of the optical element 10 and adjust the curvature or surface height of the optical surface when a control signal is applied; the heat transfer layer 40 is arranged between the optical element 10 and the bracket 20.

[0038] Specifically, the semiconductor refrigerator 30 (Thermoelectric Cooler, TEC) is a device that works based on the thermoelectric effect (Peltier effect). When current passes through the two ends of the TEC, one end absorbs heat and the other end releases heat. In this way, the TEC can lower the temperature at its cold end (i.e., the heat-absorbing end) and increase the temperature at the hot end (the heat-releasing end). The advantage of TEC is that it has a fast response speed and high control accuracy. It can quickly change the temperature when needed, and then adjust the surface shape of the optical element through temperature changes.

[0039] The semiconductor cooler 30 is an active device with electrodes disposed thereon, and the electrodes are connected to a control signal to drive the semiconductor cooler 30 to increase or decrease the temperature so as to change the overall temperature gradient distribution of the optical element 10. The control signal may be a control signal such as voltage, current, or power.

[0040] The optical element 10 can be made of any material suitable for use in an optical system, such as glass, silicon, corundum, germanium, silicon carbide, silicon oxide, or metal.

[0041] In this embodiment, the semiconductor refrigerator 30 is installed on the side of the optical element 10 through the bracket 20. By applying a control signal to heat or cool part of the semiconductor refrigerator 30, and transferring heat through the heat transfer layer 40, the temperature of the local area can be accurately controlled, thereby effectively adjusting the surface shape of the optical element 10. For example, by locally heating or cooling certain areas, the local curvature or surface height of the optical surface of the optical element 10 can be changed, thereby correcting the optical deformation caused by temperature changes, and achieving the optical element 10 to maintain wavefront quality while bearing high loads.

[0042] The temperature field and surface shape adjustment device of the optical element 10 provided by the present invention has a simple structure, is easy to disassemble and replace, does not require a complex drive system or a multi-point adjustment device, and is suitable for miniaturization and integrated design. Compared with the traditional piezoelectric drive system, TEC has a low cost and is easy to obtain and use. In addition, TEC can accurately control temperature changes and has a high adjustment resolution, thereby achieving high-precision adjustment of the surface shape of the optical element 10, especially in scenarios requiring rapid response and long-term stability. It is particularly suitable for different application fields, such as synchrotron radiation, free electron lasers, integrated circuits and other optical fields, and is particularly suitable for fields with high demands for optical surface shape and surface shape control of the optical element 10 under thermal deformation.

[0043] In some embodiments, Figure 2 As shown, the semiconductor cooler 30 is embedded in the bracket 20 .

[0044] Specifically, the bracket 20 has a groove, and the semiconductor cooler 30 is embedded in the bracket 20 to form a whole with the bracket 20, so that the overall volume of the temperature field and surface shape adjustment device of the active optical element 10 is smaller. The number of the semiconductor coolers 30 is set according to the size of the optical element 10.

[0045] In some embodiments, Figure 1 and Figure 3 As shown, the bracket 20 is arranged in one piece or in sections.

[0046] Specifically, the support 20 may be a whole, and all the semiconductor refrigerators 30 are mounted on the support 20. The support 20 may also be composed of multiple sections, and each section of the support is provided with a plurality of semiconductor refrigerators 30.

[0047] In some embodiments, Figure 1 As shown, the optical surface includes a first optical surface 11 and a second optical surface 12; the side surfaces include a first side surface 13, a second side surface 14, a third side surface 15 and a fourth side surface 16; the first optical surface 11 and the second optical surface 12 are arranged opposite to each other; the first side surface 13 and the second side surface 14 are arranged opposite to each other in the width direction of the optical element 10, and the third side surface 15 and the fourth side surface 16 are arranged opposite to each other in the length direction of the optical element 10; the semiconductor cooler 30 is arranged on the third side surface 15 or the fourth side surface 16.

[0048] Specifically, the optical element 10 is a hexahedral structure, and the overall shape can be an irregular cube, such as an ellipsoid, a torus, etc. The first optical surface 11 and the second optical surface 12 can be a plane structure, a cylindrical structure, a spiral tube structure, a spherical structure or an elliptical structure, a parabolic structure, a hyperbolic structure or other non-spherical structures. In this embodiment, the first optical surface 11 is used as a reflective surface, and the first optical surface 11 has a constant or non-constant radius of curvature. The first side surface 13 and the second side surface 14 are arranged along the width direction of the optical element 10, and the radius of curvature of the first side surface 13 and the second side surface 14 is 10 mm to infinity, that is, the first side surface 13 and the second side surface 14 can be planes.

[0049] The third side surface 15 and the fourth side surface 16 are arranged along the length direction of the optical element 10, and the semiconductor coolers 30 are distributed individually or in pairs on the third side surface 15 or the fourth side surface 16. In addition, the semiconductor coolers 30 are distributed at intervals on the third side surface 15 or the fourth side surface 16 and extend to both ends of the third side surface 15 or the fourth side surface 16, so that the temperature can be evenly transferred, so as to facilitate the surface shape control of the optical element 10.

[0050] In some embodiments, Figure 1 As shown, the first optical surface 11 or the second optical surface 12 intersects with the first side surface 13 and the second side surface 14 along the length direction of the bracket 20 , and the bracket 20 is perpendicular to the first optical surface 11 or the second optical surface 12 .

[0051] Specifically, the optical surface of the first optical surface 11 and the second optical surface 12 that is a reflective surface intersects with the first side surface 13 and the second side surface 14, and the bracket 20 of the semiconductor refrigerator 30 is parallel to the first optical surface 11, so that the temperature field can be more evenly distributed on the surface of the optical element 10. When the first optical surface 11 is a reflective surface, the first optical surface 11 is polished.

[0052] In some embodiments, the optical element 10 is a rectangular planar hexahedron. The ratio of the length to the width of the optical element 10 is between 1 and 100. The length of the optical element 10 is 20 to 1500 mm, for example, 20 mm, 500 mm, and 1500 mm, and the width of the optical element 10 is 5 to 90 mm, for example, 5 mm, 45 mm, and 90 mm. In this way, the optical element 10 can meet the needs of miniaturized precision instruments to large optical equipment, and this size range has good thermal expansion management, which can avoid excessive thermal stress under extreme temperature conditions.

[0053] Furthermore, the thickness of the optical element 10 is 10-800 mm. As the thickness of the optical element 10 increases, the impact of temperature compensation on the optical surface of the optical element 10 decreases. Therefore, the temperature compensation of the optical element 10 is preferably in the range of 20-70 mm. For example, the thickness of the optical element 10 can be 20 mm, 40 mm, or 70 mm.

[0054] In some embodiments, Figure 1 As shown, the bracket 20 and the first optical surface 11 have a height difference h0; the height difference is 0-50 mm. Specifically, there is a certain height difference between the bracket 20 and the first optical surface 11, and the heat transfer layer 40 and the first optical surface 11 also have a height difference, which can prevent the bracket 20 and the heat transfer layer 40 from affecting the light beam on the first optical surface 11.

[0055] Furthermore, the thickness d0 of the heat transfer layer 40 is 0-10 mm.

[0056] Specifically, the heat transfer layer 40 is a heat transfer medium in a liquid state, such as liquid metal (for example, GaIn, GaInSn in different proportions), thermally conductive gel, indium foil or other high thermal conductivity materials. In order to avoid the failure of reducing the flow-induced vibration caused by the semiconductor refrigerator 30 due to the heat transfer layer 40 being too thin, and to avoid the liquid metal dripping and contaminating other components due to excessive spacing, the heat transfer layer 40 is set between 0-10 mm, for example, it can be 2 mm, 5 mm, or 10 mm.

[0057] In some embodiments, the present invention provides an active optical element temperature field and surface shape adjustment system, which includes a semiconductor refrigerator control unit and the active optical element temperature field and surface shape adjustment device as described above, wherein the semiconductor refrigerator control unit is connected to the active optical element temperature field and surface shape adjustment device to output a control signal to drive the semiconductor refrigerator to work. The specific details are as described in an embodiment of an active optical element temperature field and surface shape adjustment device, which will not be repeated here.

[0058] In some embodiments, Figure 4 As shown, the present invention provides a method for controlling the temperature field and surface shape of an active optical element, which comprises the steps of:

[0059] S100, the semiconductor refrigerator control unit detects the current surface parameters of the optical element, and obtains the corresponding deformation matrix of the optical element under unit power according to the adaptive optical control algorithm;

[0060] S200, obtaining a power value required by the semiconductor refrigerator according to the deformation corresponding matrix and the required surface parameters;

[0061] S300, driving the semiconductor refrigerator to heat or cool according to the power value to adjust the surface shape of the optical element.

[0062] In this embodiment, the semiconductor refrigerator control unit first collects the surface parameters of the optical surface of the optical element, and then combines the adaptive optical control algorithm, such as the singular value decomposition method, to obtain the deformation corresponding matrix A of the optical element under unit power, and then uses the power calculation formula v=(A T A) -1 A T b. Calculate the power value required by each semiconductor refrigerator, and then drive the semiconductor refrigerator individually or simultaneously for heating or cooling according to the power value, and further transfer the temperature of the semiconductor refrigerator to the optical element through the heat transfer layer to realize the adaptive surface shape adjustment function of the optical element.

[0063] In summary, the active optical element temperature field and surface shape adjustment device, system and control method provided by the present invention have the following beneficial effects:

[0064] By precisely controlling the temperature change through the semiconductor cooler on the side of the optical element, the temperature of the local area of ​​the optical element can be precisely controlled, and high-precision adjustment of the surface shape of the optical surface of the optical element can be achieved. Compared with traditional piezoelectric technology or mechanical adjustment methods, it not only has higher adjustment accuracy and lower cost, but is also more suitable for miniaturization and integrated design.

[0065] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. An active optical element temperature field and surface shape adjustment device, characterized in that: include: An optical element, wherein the optical element has an optical surface and a side surface; A bracket, wherein the bracket is arranged on a side of the optical element; A plurality of semiconductor refrigerators, wherein the semiconductor refrigerators are arranged on the bracket and are used to increase or decrease the temperature of the optical element and adjust the curvature or surface height of the optical surface when a control signal is applied to the semiconductor refrigerators; A heat transfer layer is disposed between the optical element and the bracket.

2. The active optical element temperature field and surface shape adjustment device according to claim 1, characterized in that: The semiconductor refrigerator is embedded in the bracket.

3. The active optical element temperature field and surface shape adjustment device according to claim 2, characterized in that: The bracket is arranged in one piece or in sections.

4. The active optical element temperature field and surface shape adjustment device according to claim 1, characterized in that: The optical surface includes a first optical surface and a second optical surface; the side surfaces include a first side surface, a second side surface, a third side surface and a fourth side surface; the first optical surface and the second optical surface are arranged opposite to each other; the first side surface and the second side surface are arranged opposite to each other in the width direction of the optical element, and the third side surface and the fourth side surface are arranged opposite to each other in the length direction of the optical element; the semiconductor refrigerator is arranged on the third side surface or the fourth side surface.

5. The active optical element temperature field and surface shape adjustment device according to claim 4, characterized in that: The first optical surface or the second optical surface intersects with the first side surface and the second side surface along the length direction of the bracket, and the bracket is perpendicular to the first optical surface or the second optical surface.

6. The active optical element temperature field and surface shape adjustment device according to claim 4, characterized in that: The semiconductor refrigerators are distributed at intervals on the third side surface or the fourth side surface and extend to both ends of the third side surface or the fourth side surface.

7. The active optical element temperature field and surface shape adjustment device according to claim 1, characterized in that: The optical element is a rectangular plane hexahedron; the ratio of the length to the width of the optical element is between 1 and 100; the length of the optical element is between 20 and 1500 mm, the width of the optical element is between 5 and 90 mm; and the thickness of the optical element is between 10 and 800 mm.

8. The active optical element temperature field and surface shape adjustment device according to claim 4, characterized in that: There is a height difference between the bracket and the first optical surface; the height difference is 0-50 mm; The thickness of the heat transfer layer is 0-10 mm.

9. An active optical element temperature field and surface shape adjustment system, characterized in that: It comprises a semiconductor refrigerator control unit and an active optical element temperature field and surface shape adjustment device as described in any one of claims 1 to 8, wherein the semiconductor refrigerator control unit is connected to the active optical element temperature field and surface shape adjustment device and is used to output a control signal to drive the semiconductor refrigerator to work.

10. A control method for the active optical element temperature field and surface shape adjustment system according to claim 9, characterized in that: Includes steps: The semiconductor refrigerator control unit detects the current surface parameters of the optical element and obtains the corresponding deformation matrix of the optical element under unit power according to the adaptive optical control algorithm; Obtaining the power value required by the semiconductor refrigerator according to the deformation corresponding matrix and the required surface parameters; The semiconductor refrigerator is driven to heat or cool according to the power value to adjust the surface shape of the optical element.

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