FCCSP packaging structure and preparation method thereof

Abstract

The invention provides an FCCSP packaging structure and a preparation method thereof. The active surface of a chip faces a circuit layer and is electrically connected with the circuit layer; the plastic package layer is located on the circuit layer and wraps the periphery of the chip, and the cooling fin is located on the chip and the plastic package layer; heat dissipation glue is arranged between the heat dissipation sheet and the chip, and adhesive glue is arranged between the heat dissipation sheet and the plastic packaging layer. According to the FCCSP packaging structure, the cooling fins are connected with the chip through heat-conducting glue to optimize the cooling effect, the cooling fins are connected with the plastic packaging layer around the chip through adhesive glue to optimize the fixing effect, and the cooling capacity and the structural reliability of the FCCSP packaging structure are improved; in addition, the heat conductivity coefficient of the heat dissipation glue and the viscidity of the adhesive glue are set, so that the heat dissipation capacity and the structural reliability are both improved; and finally, when the FCCSP packaging structure is prepared, the process units are cut firstly, and then the cooling fins are arranged for the process units respectively, so that the problem of delamination and stripping between the cooling fins and the process units, which is easily caused by the fact that the FCCSP packaging structure which is easily warped is cut after the cooling fins are integrally arranged, is solved, and the structural reliability is further improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor integrated circuit manufacturing, and in particular relates to an FCCSP packaging structure and a preparation method thereof. Background Art

[0002] With the continuous advancement of semiconductor technology, the size of chips has become smaller and smaller, which has led to a gradual reduction in the contact area between the package and the external environment. This trend has greatly reduced the heat dissipation efficiency, becoming a problem that needs to be solved urgently.

[0003] In the structural design of the existing FCCSP (Flip Chip Chip Scale Package) package, adhesive is usually used to connect the heat sink to the chip to achieve the functions of heat dissipation and fixation at the same time. However, with the development of technology and the increase in demand for high-end products, the contact area between the heat sink and the chip in the small-sized FCCSP package has become smaller, resulting in this traditional heat dissipation method can no longer meet the heat dissipation requirements of the small-sized FCCSP package structure in current high-performance devices.

[0004] At the same time, due to the thin package volume of the FCCSP package itself, warpage is prone to occur, resulting in local structural delamination, causing the reliability of the FCCSP package structure to be poor, making it difficult to adapt to different application environments that need to withstand interference from external unstable factors such as stress.

[0005] Therefore, there is an urgent need for a structure or method that can improve the heat dissipation capacity and structural reliability of the FCCSP packaging structure to ensure that the FCCSP packaged chip can still maintain good heat dissipation performance during high-load operation, thereby ensuring the stability and reliability of the product.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology part of the present application. Summary of the invention

[0007] In view of the above shortcomings of the prior art, an object of the present invention is to provide a FCCSP packaging structure and a preparation method thereof, so as to solve the problem that the heat dissipation performance and structural reliability of the FCCSP packaging structure in the prior art cannot meet the requirements.

[0008] To achieve the above object, the present invention provides a FCCSP packaging structure, the FCCSP packaging structure comprising: a chip, a circuit layer, a plastic sealing layer and a heat sink;

[0009] The chip is located on the circuit layer, the active surface of the chip faces the circuit layer and is electrically connected to the circuit layer; the plastic packaging layer is located on the circuit layer and wraps the side of the chip, and the heat sink is located on the upper surface of the chip and the plastic packaging layer;

[0010] Heat dissipation glue is arranged between the heat sink and the chip, and adhesive glue is arranged between the heat sink and the plastic sealing layer.

[0011] Optionally, the thermal conductivity of the heat dissipation adhesive is greater than 6 W / (m·K).

[0012] Optionally, the heat dissipation adhesive is TIM adhesive.

[0013] Optionally, the viscosity of the adhesive is greater than 60 mPa·s.

[0014] Optionally, the adhesive glue is AD glue.

[0015] Optionally, a circuit connection layer is provided on the active surface of the chip, and the active surface of the chip is electrically connected to the circuit layer through the circuit connection layer.

[0016] Optionally, the circuit connection layer is a metal bump, and a filling protection layer is filled between the metal bumps.

[0017] Optionally, the plastic encapsulation layer is molded resin.

[0018] Optionally, the heat sink is made of copper.

[0019] The present invention also provides a method for preparing an FCCSP packaging structure, the method for preparing any one of the above-mentioned FCCSP packaging structures, the method comprising:

[0020] Prepare n process units including a circuit layer, a chip and a plastic sealing layer in the FCCSP packaging structure on a wafer, where n is an integer greater than or equal to 1;

[0021] Cutting the n process units on the wafer to obtain n independent process units;

[0022] A heat dissipation glue is set on the chip of each process unit, and an adhesive glue is set on the plastic sealing layer of each process unit; a heat sink is set on each process unit, and the position of the heat sink corresponding to the chip is connected to the chip through the heat dissipation glue, and the position of the heat sink corresponding to the plastic sealing layer is connected to the plastic sealing layer through the adhesive glue.

[0023] As described above, the FCCSP packaging structure and preparation method thereof of the present invention have the following beneficial effects:

[0024] The present invention optimizes the heat dissipation effect by arranging a heat sink to be connected to the chip through a thermally conductive adhesive, and at the same time optimizes the fixing effect by fixing the heat sink to the plastic sealing layer around the chip through an adhesive, thereby improving the heat dissipation capacity and structural reliability of the FCCSP packaging structure;

[0025] The present invention ensures the dual improvement of heat dissipation capacity and structural reliability by setting the thermal conductivity of the heat dissipation glue and the viscosity range of the adhesive glue;

[0026] The present invention cuts the process units first and then respectively sets heat sinks for the process units when preparing the FCCSP packaging structure, thereby avoiding the problem of delamination between the heat sink and the process unit that is easily caused when the FCCSP packaging structure that is prone to warping is cut after the heat sink is set as a whole and the heat dissipation adhesive reduces the adhesion area, thereby further improving the structural reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Shown is a schematic top view of the FCCSP packaging structure without a heat sink in the present invention.

[0028] Figure 2 A schematic side cross-sectional view of an FCCSP packaging structure without a heat sink in the present invention is shown.

[0029] Figure 3 Shown is a schematic top view of a FCCSP packaging structure with a heat sink in the present invention.

[0030] Figure 4 Shown is a schematic side cross-sectional view of an FCCSP packaging structure provided with a heat sink in the present invention.

[0031] Figure 5 The figure shows a side cross-sectional view of a FCCSP packaging structure provided with a heat sink in the prior art.

[0032] Component number description

[0033] 11. Chip; 12. Circuit connection layer; 13. Metal bump; 14. Filling protection layer; 15. Plastic sealing layer; 16. Heat dissipation glue;

[0034] 17. Adhesive glue; 18. Adhesive heat dissipation glue;

[0035] 21. Circuit layer; 22. Solder ball layer; 30. Heat sink; 40. Process unit. DETAILED DESCRIPTION

[0036] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0037] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the schematic diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0038] For convenience of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings.

[0039] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0040] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0041] In the prior art, the FCCSP packaging structure has a smaller size, resulting in a smaller contact area between the heat sink 30 and the chip 11 compared with packaging structures such as FCBGA (Flip Chip Ball Grid Array), making it difficult to meet its heat dissipation requirements; and the thinner packaging body of the FCCSP package itself makes it more prone to warping or delamination, resulting in the need for structural reliability.

[0042] The present invention provides a FCCSP packaging structure, such as Figure 1-Figure 4 As shown, Figure 1 FIG. 1 is a top view of the FCCSP packaging structure without the heat sink 30. Figure 2 is a side cross-sectional view of the FCCSP packaging structure without the heat sink 30, Figure 1AA' in Figure 2 The section line of Figure 3 A top view of a FCCSP package structure with a heat sink 30 is provided. Figure 4 is a side cross-sectional view of the FCCSP packaging structure without the heat sink 30, Figure 3 BB' in Figure 4 The FCCSP packaging structure includes: a chip 11, a circuit layer 21, a plastic layer 15 and a heat sink 30;

[0043] The chip 11 is located on the circuit layer 21, and the active surface of the chip 11 faces the circuit layer 21 and is electrically connected to the circuit layer 21; the plastic layer 15 is located on the circuit layer 21 and wraps the side of the chip 11, and the heat sink 30 is located on the upper surface of the chip 11 and the plastic layer 15;

[0044] A heat dissipation glue 16 is disposed between the heat sink 30 and the chip 11 , and an adhesive glue 17 is disposed between the heat sink 30 and the plastic packaging layer 15 .

[0045] The present invention optimizes the heat dissipation effect by setting a heat sink 30 to be connected to the chip 11 through a thermally conductive adhesive, and at the same time, the heat sink 30 is fixedly connected to the plastic sealing layer 15 around the chip 11 through an adhesive 17 to optimize the fixing effect, thereby improving the heat dissipation capacity and structural reliability of the FCCSP packaging structure; since the chip 11 mainly transfers heat to the heat sink 30 through the heat dissipation adhesive 16, the glue connecting the heat sink 30 and the chip 11 uses the heat dissipation adhesive 16 with stronger heat dissipation capacity, rather than the heat dissipation adhesive 16 with stronger heat dissipation capacity. Figure 5 As shown, the heat dissipation adhesive 1816 commonly used in the prior art that takes into account both heat dissipation and adhesion is used, so that the heat dissipation efficiency of the FCCSP packaging structure can be improved; at the same time, because the plastic packaging layer 15 around the chip 11 itself does not generate obvious heat that needs to be dissipated, a more viscous adhesive 17 can be set between the plastic packaging layer 15 and the heat sink 30, so as to compensate for the reduction in adhesion caused by the reduced adhesive area when the heat dissipation adhesive 1816 is replaced by the heat dissipation adhesive 16, so as to further improve the heat dissipation capacity of the FCCSP packaging structure while ensuring that its structural reliability is not affected.

[0046] In one embodiment, the thermal conductivity of the heat dissipation adhesive 16 is greater than 6 W / (m·K).

[0047] Specifically, in W / (m·K), "W" stands for watt, which is the unit of power and indicates the energy transferred per second; "m" stands for meter, which is the unit of length; and "K" stands for Kelvin, which is the unit of temperature.

[0048] The present invention sets the thermal conductivity range of the heat dissipation adhesive 16, thereby ensuring that the heat dissipation capacity of the heat dissipation adhesive 16 can meet the heat dissipation requirements of the FCCSP packaging structure.

[0049] In one embodiment, the heat dissipation adhesive 16 is TIM (Thermal Interface Material) adhesive.

[0050] Specifically, the heat dissipation performance and adhesive performance of TIM glue can produce different heat dissipation performance and adhesive performance according to the adjustment of its composition, but generally speaking, TIM glue with strong heat dissipation capability has poor adhesion. The composition of the TIM glue used as the heat dissipation glue 16 here meets the requirements of its thermal conductivity range to ensure the heat dissipation performance of the FCCSP packaging structure.

[0051] Preferably, the heat dissipation adhesive 16 is spread over the surface of the chip 11 as much as possible when the heat sink 30 is mounted on the chip 11 but does not overflow the surface of the chip 11 to ensure the maximization of the heat dissipation performance, while not affecting the area of ​​the adhesive 17 on the outside of the chip 11 that is set on the plastic packaging layer 15 to bond with the heat sink 30, so as to ensure that the adhesion with the heat sink 30 can meet the structural reliability requirements of the FCCSP packaging structure.

[0052] In one embodiment, the viscosity of the adhesive 17 is greater than 60 mPa·s.

[0053] Specifically, in mPa·s, "m" stands for one thousandth, which is an order of magnitude; "Pa" stands for Pascal, which means a pressure of 1 newton per square meter, which is the unit of pressure; and "s" stands for second, which is the unit of time.

[0054] The present invention sets the viscosity range of the adhesive 17, thereby ensuring that the adhesive force of the adhesive 17 can meet the structural reliability requirements of the FCCSP packaging structure, especially avoiding the warping and delamination problems that are easily generated in the FCCSP packaging.

[0055] In one embodiment, the adhesive glue 17 is AD glue (acrylic glue).

[0056] Specifically, the heat dissipation performance and adhesive performance of AD glue can produce different heat dissipation performance and adhesive performance according to the adjustment of its components. The components of the AD glue used as the adhesive 17 here meet the requirements of its viscosity range to ensure the structural reliability of the FCCSP packaging structure, avoid adverse problems such as delamination caused by warping, and ensure the product yield of the FCCSP packaging structure.

[0057] Preferably, the adhesive glue 17 is spread over the surface of the plastic sealing layer 15 as much as possible when the heat sink 30 is mounted on the plastic sealing layer 15 but does not overflow the surface of the plastic sealing layer 15, so as to ensure the maximum adhesion to the heat sink 30, while not affecting the area of ​​the heat dissipation glue 16 set on the chip 11 outside the plastic sealing layer 15 for heat dissipation with the heat sink 30, and avoiding overflow of glue to affect the overall yield of the FCCSP packaging structure, ensuring that the adhesion with the heat sink 30 can meet the structural reliability requirements of the FCCSP packaging structure.

[0058] Preferably, the heat dissipation glue 16 is TIM glue, and the adhesive glue 17 is AD glue.

[0059] Specifically, Figure 1-Figure 2 The heat dissipation glue 16 and adhesive glue 17 shown in the figure are only for illustration of coating before the heat sink 30 is attached. The actual coating position and area need to be designed based on experience to ensure the aforementioned coverage requirements of the heat dissipation glue 16 and adhesive glue 17 after the heat sink 30 is attached.

[0060] In one embodiment, Figure 4 As shown, a circuit connection layer 12 is provided on the active surface of the chip 11 , and the active surface of the chip 11 is electrically connected to the circuit layer 21 through the circuit connection layer 12 .

[0061] In one embodiment, the circuit connection layer 12 is a metal bump 13 .

[0062] In one embodiment, Figure 4 As shown, the circuit connection layer 12 is a metal bump 13 , and a filling protection layer 14 is filled between the metal bumps 13 .

[0063] Preferably, the filling protection layer 14 is liquid resin.

[0064] The present invention fills liquid resin between the metal bumps 13 as the filling protection layer 14, thereby ensuring that the metal bumps 13 are not oxidized, avoiding problems such as short circuits between the metal bumps 13, and improving the product yield of the FCCSP packaging structure.

[0065] In one embodiment, the plastic encapsulation layer 15 is molded resin.

[0066] Specifically, using molded resin as the plastic sealing layer 15 can not only ensure the plastic sealing effect of the FCCSP packaging structure, but also increase the adhesive force that can be formed between the heat sink 30, thereby further improving the reliability of the FCCSP packaging structure.

[0067] In one embodiment, Figure 4 As shown, the plastic encapsulation layer 15 wraps the metal bump 13 and the exposed surface of the filling protection layer 14 .

[0068] The present invention can further improve the plastic sealing effect of the plastic sealing layer 15 on the FCCSP packaging structure by providing the plastic sealing layer 15 to wrap the metal bump 13 and fill the exposed surface of the protective layer 14, thereby improving the structural reliability of the FCCSP packaging structure.

[0069] In one embodiment, the heat sink 30 is a metal heat sink 30 .

[0070] In one embodiment, the heat sink 30 is made of copper.

[0071] The present invention uses copper as the material of the heat sink 30 to achieve better heat conduction and heat dissipation effects.

[0072] Specifically, the heat sink 30 may also be a heat dissipation structure made of any other suitable material or structure, all of which are within the protection scope of the present invention.

[0073] In one embodiment, the circuit layer 21 is a circuit substrate.

[0074] Specifically, the circuit layer 21 may also be any other suitable circuit interconnection structure, all of which are within the protection scope of the present invention.

[0075] In one embodiment, a solder ball layer 22 is disposed on a surface of the circuit layer 21 away from the chip 11 .

[0076] In one embodiment, the solder balls in the solder ball layer 22 are tin alloy solder balls.

[0077] Specifically, the solder balls may also be made of other suitable materials, all of which are within the protection scope of the present invention.

[0078] The present invention also provides a method for preparing an FCCSP packaging structure, the method for preparing any one of the above-mentioned FCCSP packaging structures, the method comprising:

[0079] Step 1: preparing n process units 40 including the circuit layer 21, the chip 11 and the plastic packaging layer 15 in the FCCSP packaging structure on a wafer, where n is an integer greater than or equal to 1;

[0080] Step 2: cutting the n process units 40 on the wafer to obtain n independent process units 40;

[0081] Step 3: A heat dissipation glue 16 is set on the chip 11 of each process unit 40, and an adhesive glue 17 is set on the plastic sealing layer 15 of each process unit 40; a heat sink 30 is set on each process unit 40, and the heat sink 30 is connected to the chip 11 through the heat dissipation glue 16 at a position corresponding to the chip 11, and the heat sink 30 is connected to the plastic sealing layer 15 through the adhesive glue 17 at a position corresponding to the plastic sealing layer 15.

[0082] The preparation method of the FCCSP packaging structure of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the above sequence does not strictly represent the preparation method sequence of the FCCSP packaging structure protected by the present invention, and those skilled in the art may change it according to the actual preparation steps.

[0083] First, step 1 is performed to prepare n process units 40 including the circuit layer 21 , the chip 11 and the plastic packaging layer 15 in the FCCSP packaging structure on a wafer, where n is an integer greater than or equal to 1.

[0084] In one embodiment, each of the process units 40 on the wafer includes all structures in the FCCSP packaging structure except the heat sink 30 .

[0085] Then, if Figure 1-Figure 2 As shown, Figure 1 is a top view of the FCCSP package structure after cutting without the heat sink 30, Figure 2 is a side cross-sectional view of the FCCSP package structure after cutting without the heat sink 30, Figure 1 AA' in Figure 2 According to the section line, step 2 is performed to cut the n process units 40 on the wafer to obtain n independent process units 40.

[0086] Finally, if Figure 3-Figure 4 As shown, Figure 3 It is a top view of the FCCSP packaging structure with the heat sink 30 set after cutting, Figure 4 is a side cross-sectional view of the FCCSP package structure with the heat sink 30 set after cutting, Figure 3 BB' in Figure 4 The section line of the embodiment of the present invention is followed to perform step 3, wherein a heat dissipation glue 16 is disposed on the chip 11 of each process unit 40, and an adhesive glue 17 is disposed on the plastic sealing layer 15 of each process unit 40; a heat sink 30 is disposed on each process unit 40, and the position of the heat sink 30 corresponding to the chip 11 is connected to the chip 11 through the heat dissipation glue 16, and the position of the heat sink 30 corresponding to the plastic sealing layer 15 is connected to the plastic sealing layer 15 through the adhesive glue 17.

[0087] In the prior art, the FCCSP packaging structure directly sets a whole large heat sink 30 on the wafer, and then cuts it into pieces together with the process unit 40 on the lower wafer. Since the whole heat sink 30 itself is prone to warping or displacement when cutting, and the FCCSP packaging structure itself is prone to warping, it is more likely to cause structural delamination during the process of singulation, resulting in the heat dissipation efficiency between the heat sink 30 and the process unit 40 being affected, and easily leading to the defect of the overall product. However, since the FCCSP packaging structure is considered to be a small-size packaging structure at the wafer level, people in the field generally believe that the whole should be subjected to all front-end processes including the setting of the heat sink 30 before the back-end process of cutting into pieces is carried out.

[0088] The present invention first cuts the process units 40 from the wafer, and then respectively sets the heat sink 30 on each individual process unit 40, thereby avoiding the increased risk of delamination between the entire heat sink 30 and the process unit 40 when the entire heat sink 30 is cut. At the same time, it also avoids the warping and delamination that is more likely to occur when the entire heat sink 30 is cut due to the structure with low adhesive force in which only the plastic sealing layer 15 and the heat sink 30 are fixedly connected by the adhesive 17 between the heat sink 30 and the process unit 40. Therefore, the FCCSP packaging structure in which the heat dissipation adhesive 16 and the adhesive 17 are set in the present invention is matched, and the heat dissipation performance and structural reliability of the FCCSP packaging structure are guaranteed at the same time.

[0089] In summary, the FCCSP packaging structure and the preparation method thereof of the present invention can optimize the heat dissipation effect by arranging a heat sink connected to the chip through a thermally conductive adhesive, and at the same time, the heat sink is fixedly connected to the plastic sealing layer around the chip through an adhesive to optimize the fixing effect, thereby improving the heat dissipation capacity and structural reliability of the FCCSP packaging structure; in addition, by setting the thermal conductivity of the heat dissipation adhesive and the viscosity range of the adhesive, the dual improvement of the heat dissipation capacity and the structural reliability is guaranteed; finally, by first cutting the process units and then respectively arranging the heat sinks for the process units when preparing the FCCSP packaging structure, the problem of delamination and peeling between the heat sink and the process unit is avoided when the FCCSP packaging structure, which is prone to warping, is cut after the heat sink is arranged as a whole and the heat dissipation adhesive reduces the adhesion area, thereby further improving the structural reliability.

[0090] Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0091] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A FCCSP packaging structure, characterized in that: The FCCSP packaging structure includes: a chip, a circuit layer, a plastic sealing layer and a heat sink; The chip is located on the circuit layer, the active surface of the chip faces the circuit layer and is electrically connected to the circuit layer; the plastic packaging layer is located on the circuit layer and wraps the side of the chip, and the heat sink is located on the upper surface of the chip and the plastic packaging layer; Heat dissipation glue is arranged between the heat sink and the chip, and adhesive glue is arranged between the heat sink and the plastic sealing layer.

2. The FCCSP packaging structure according to claim 1, characterized in that: The thermal conductivity of the heat dissipation adhesive is greater than 6 W / (m·K).

3. The FCCSP packaging structure according to claim 2, characterized in that: The heat dissipation adhesive is TIM adhesive.

4. The FCCSP packaging structure according to any one of claims 1 to 3, characterized in that: The viscosity of the adhesive is greater than 60 mPa·s.

5. The FCCSP packaging structure according to claim 4, characterized in that: The adhesive glue is AD glue.

6. The FCCSP packaging structure according to claim 1, characterized in that: The active surface of the chip is provided with a circuit connection layer, and the active surface of the chip is electrically connected to the circuit layer through the circuit connection layer.

7. The FCCSP packaging structure according to claim 6, characterized in that: The circuit connection layer is a metal bump, and a filling protection layer is filled between the metal bumps.

8. The FCCSP packaging structure according to claim 1, characterized in that: The plastic sealing layer is molded resin.

9. The FCCSP packaging structure according to claim 1, characterized in that: The material of the heat sink is copper.

10. A method for preparing a FCCSP packaging structure, characterized in that: The preparation method is used to prepare the FCCSP packaging structure according to any one of claims 1 to 9, and the preparation method comprises: Prepare n process units including a circuit layer, a chip and a plastic sealing layer in the FCCSP packaging structure on a wafer, where n is an integer greater than or equal to 1; Cutting the n process units on the wafer to obtain n independent process units; A heat dissipation glue is set on the chip of each process unit, and an adhesive glue is set on the plastic sealing layer of each process unit; a heat sink is set on each process unit, and the position of the heat sink corresponding to the chip is connected to the chip through the heat dissipation glue, and the position of the heat sink corresponding to the plastic sealing layer is connected to the plastic sealing layer through the adhesive glue.

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