Heat dissipation assembly, air conditioner and control method

Abstract

The invention belongs to the technical field of machine room air conditioners, and discloses a heat dissipation assembly, an air conditioner and a control method. The heat dissipation assembly comprises a heat exchange part and a heat exchange flow path set, the heat exchange part can exchange heat with the driving plate through the first heat exchange face, and the heat exchange flow path set is arranged on one side of the second heat exchange face so that the heat exchange flow path set can exchange heat with the heat exchange part. The heat exchange flow path set comprises a first flow path and a second flow path, the first flow path takes condensate water as a heat exchange medium, and the second flow path takes a refrigerant as a heat exchange medium. Condensed water is circulated as a heat exchange medium in the first flow path, and heat exchange can be performed with the heat exchange member. By arranging the heat exchange flow path group and controlling the heat exchange flow path group to cool the driving board in different heat exchange modes, the working energy consumption of the heat dissipation assembly can be reduced on the premise of ensuring effective cooling of the driving board, so that the driving board can work under good working conditions when in a standard load state or a relatively high load state.

Description

Technical Field

[0001] The present invention relates to the technical field of computer room air conditioning, and in particular to a heat dissipation component, an air conditioner and a control method. Background Art

[0002] At present, in the relevant technologies of computer room air conditioners, computer room air conditioners are widely used in environments such as computer rooms, base stations and energy cabinets to cool down units or batteries. Computer room air conditioners need to use refrigerant as a heat exchange medium, and cool down the units or batteries by allowing the refrigerant to absorb heat during evaporation. However, since the temperature of the refrigerant during evaporation and heat absorption is lower than the dew point temperature of water, when the computer room air conditioner cools down the units or batteries, it is easy to cause the surface temperature of the driver board of the computer room air conditioner to be too low, resulting in the risk of condensation on the surface of the driver board, thereby affecting the normal operation of the driver board and increasing the risk of failure of the computer room air conditioner. Summary of the invention

[0003] The technical problem to be solved by the present invention is that when the computer room air conditioner cools down the unit or battery, the surface temperature of the driver board of the computer room air conditioner is easily caused to be too low, so that there is a risk of condensation on the surface of the driver board. For this purpose, a heat dissipation component, an air conditioner and a control method are provided.

[0004] The present invention aims to provide a heat dissipation component for heat dissipation of a driving plate of an air conditioner, the heat dissipation component comprising a heat exchange element and a heat exchange flow path group, the heat exchange element having a first heat exchange surface and a second heat exchange surface opposite to each other in a thickness direction, the second heat exchange surface being abutted against the driving plate; the heat exchange flow path group is arranged on the first heat exchange surface, the heat exchange flow path group comprising a first flow path and a second flow path, the first flow path at least uses condensed water generated by an evaporator of the air conditioner as a heat exchange medium, and the second flow path uses a refrigerant as a heat exchange medium; the heat exchange flow path group is arranged to: control the working mode of the heat exchange flow path group according to the temperature value of the driving plate, wherein the working mode of the heat exchange flow path group comprises a first working mode in which both the first flow path and the second flow path are circulated and a second working mode in which the first flow path is circulated and the second flow path is disconnected.

[0005] In some technical solutions, the heat dissipation assembly also includes a back plate, which is connected to the heat exchange element to form a heat exchange cavity, and the heat exchange flow path group runs through the heat exchange cavity.

[0006] In some technical solutions, both the first flow path and the second flow path are provided with a reversing end; the heat dissipation assembly further includes a limit plate, and the limit plate abuts against the reversing end of the first flow path and the reversing end of the second flow path.

[0007] In some technical solutions, the first heat exchange surface is in contact with the first flow path and / or the second flow path.

[0008] In some technical solutions, the back plate is in contact with the first flow path and / or the second flow path.

[0009] In some technical solutions, the heat dissipation component also includes: a stop valve and a controller, the stop valve is arranged in the second flow path, and is used to control the opening and closing of the second flow path; the stop valve is electrically connected to the controller, and is used to control the opening and closing of the stop valve; the controller is configured to: control the stop valve to close at normal temperature to disconnect the second flow path, and control the stop valve to open in the first working mode to allow the second flow path to flow.

[0010] In some technical solutions, the heat dissipation component also includes a temperature sensing module, which is arranged on the driving board. The temperature sensing module is electrically connected to the controller, and is used to obtain the temperature value of the driving board and feed it back to the controller; the controller is set: when the temperature value of the driving board is equal to or greater than the first preset value, the controller controls the stop valve to open to allow the second flow path to flow; when the temperature value of the driving board is equal to or less than the second preset value, the controller controls the stop valve to close to disconnect the second flow path, and the first preset value is greater than the second preset value.

[0011] In some technical solutions, an air conditioner is provided for humidifying a machine room, comprising a drive board and a heat dissipation component as in the above technical solution.

[0012] In some technical solutions, the air conditioner also includes a water reservoir and a heating element, and the water outlet end of the first flow path is connected to the water reservoir; the heating element is arranged in the water reservoir, and is used to evaporate the water in the water reservoir to humidify the machine room.

[0013] In some technical schemes, the heat exchange flow path group also includes a third flow path, the water outlet end of the third flow path is connected to the water reservoir, the water inlet end of the third flow path is connected to the water supply source of the water reservoir, and the third flow path is arranged on the first heat exchange surface; or, the water inlet end of the first flow path is connected to the water supply source of the water reservoir.

[0014] In some technical solutions, the heating element is an infrared heating element, and there is a gap between the infrared heating element and the liquid level of the water storage tank.

[0015] In some technical solutions, a control method is provided for controlling the heat dissipation component of the above technical solution, including:

[0016] Continuously obtain the temperature value of the driver board;

[0017] The working mode of the heat exchange flow path group is controlled according to the temperature value of the driving plate.

[0018] In some technical solutions, the working mode of the heat exchange flow path group is controlled according to the temperature value of the driving plate, including:

[0019] Determining whether the temperature value of the driving board is lower than a first preset value;

[0020] If so, controlling the first flow path to flow to cool the driving plate;

[0021] If not, control the flow of the second flow path and maintain the flow of the first flow path to cool the driving plate together;

[0022] Determining whether the temperature of the driving board is higher than a second preset value;

[0023] If so, keep the first flow path flowing and keep the second flow path flowing to cool the driving plate together;

[0024] If not, the second flow path is controlled to be disconnected, and the first flow path is kept flowing to cool the driving plate;

[0025] Wherein, the first preset value is greater than the second preset value.

[0026] The technical solution provided by the present invention has the following beneficial effects compared with the related art:

[0027] By using condensed water as the heat exchange medium in the first flow path, the heat exchange between the first flow path and the heat exchange element at normal temperature can meet the cooling demand of the driving plate, which can not only save the energy consumption generated by the operation of the second flow path, but also avoid the risk of condensation on the surface of the driving plate caused by the second flow path being too low. In the first working mode, due to the high load of the driving plate, the heat generated by the driving plate is large and needs to be cooled as soon as possible. At this time, the first flow path is kept flowing, and the second flow path is opened so that the refrigerant also participates in cooling the driving plate. The first flow path and the second flow path are used to cool the driving plate together, so that the driving plate can work in good working conditions even when it is under a high load. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are part of the present invention and are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but do not constitute an improper limitation of the present invention. Obviously, the drawings described below are only some embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the accompanying drawings:

[0029] Figure 1 is a schematic structural diagram of a heat dissipation assembly shown in an embodiment of the present invention;

[0030] Figure 2 is one of the flow charts of the control method shown in the embodiment of the present invention;

[0031] Figure 3 This is the second flowchart of the control method shown in the embodiment of the present invention.

[0032] In the figure: 100 - driving plate, 200 - heat dissipation component, 210 - heat exchange component, 212 - first heat exchange surface, 220 - heat exchange flow path group, 222 - first flow path, 224 - second flow path, 230 - back plate, 232 - heat exchange cavity, 240 - limit plate.

[0033] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but are intended to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0034] In the description of the present invention, it should be noted that the terms "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "contacted", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Among the related technologies of computer room air conditioners, computer room air conditioners are widely used in environments such as computer rooms, base stations and energy cabinets to cool down units or batteries. Computer room air conditioners need to use refrigerant as a heat exchange medium, and cool down the units or batteries by allowing the refrigerant to absorb heat during evaporation. However, since the temperature of the refrigerant during evaporation and heat absorption is lower than the dew point temperature of water, when the computer room air conditioner cools down the units or batteries, it is easy for the surface temperature of the driver board of the computer room air conditioner to be too low, resulting in the risk of condensation on the surface of the driver board, thereby affecting the normal operation of the driver board and increasing the risk of failure of the computer room air conditioner.

[0037] Based on this technical problem, the following embodiments are proposed.

[0038] Embodiment 1

[0039] like Figure 1 As shown, this embodiment provides a heat dissipation assembly 200 for dissipating heat from a driving plate 100 of an air conditioner. The heat dissipation assembly 200 includes:

[0040] The heat exchange element 210 has a first heat exchange surface 212 and a second heat exchange surface opposite to each other in the thickness direction, and the second heat exchange surface is close to the driving plate 100;

[0041] A heat exchange flow path group 220, the heat exchange flow path group 220 is arranged on the first heat exchange surface 212, and the heat exchange flow path group 220 includes a first flow path 222 and a second flow path 224, the first flow path 222 uses at least condensed water generated by the evaporator of the air conditioner as a heat exchange medium, and the second flow path 224 uses a refrigerant as a heat exchange medium;

[0042] The heat exchange flow path group 220 is configured to control the working mode of the heat exchange flow path group 220 according to the temperature value of the driving plate 100, wherein the working mode of the heat exchange flow path group 220 includes a first working mode in which both the first flow path 222 and the second flow path 224 flow and a second working mode in which the first flow path 222 flows and the second flow path 224 is disconnected.

[0043] In this embodiment, if Figure 1 As shown, the heat dissipation assembly 200 includes a heat exchanger 210 and a heat exchange flow path group 220. The heat exchanger 210 has a first heat exchange surface 212 and a second heat exchange surface, which can play a role in heat exchange. The first heat exchange surface 212 and the second heat exchange surface are arranged opposite to each other along the thickness direction of the heat exchanger 210, and the second heat exchange surface is placed against the driving plate 100, so that the heat exchanger 210 can exchange heat with the driving plate 100 through the second heat exchange surface, and transfer the heat on the driving plate 100 to the heat exchanger 210, thereby cooling the driving plate 100. The heat exchange flow path group 220 is arranged on one side of the second heat exchange surface, so that the heat exchange flow path group 220 can exchange heat with the heat exchanger 210, thereby cooling the heat exchanger 210. The heat exchange flow path group 220 includes a first flow path 222 and a second flow path 224, and both the first flow path 222 and the second flow path 224 can play a role in heat exchange with the heat exchanger 210. Since the temperature of condensed water generated by the evaporator of the air conditioner during the refrigeration process is extremely low, the condensed water is collected and at least circulated as one of the heat exchange media in the first flow path 222 to exchange heat with the heat exchange element 210. In addition to using condensed water as the heat exchange medium in the first flow path 222, water supply can also be used as the heat exchange medium in the first flow path 222 by connecting with a water supply source, and condensed water and water supply can also be used as the heat exchange medium in the first flow path 222 at the same time.

[0044] When the driving board 100 is in a standard load state, the driving board 100 generates less heat, and the temperature of the driving board 100 is a normal working temperature. At this time, the heat dissipation component 200 will dissipate heat for the driving board 100 in the second working mode. When the driving board 100 is in a high load state, the driving board 100 generates more heat, making the temperature of the driving board 100 too high. At this time, the heat dissipation component 200 will dissipate heat for the driving board 100 in the first working mode. Since the temperature of the refrigerant during evaporation and heat absorption is lower than the temperature of the condensed water, the heat exchange flow path group 220 is set as follows: the first flow path 222 flows in both the second working mode and the first working mode, and the second flow path 224 is disconnected in the second working mode and flows in the first working mode. Since the temperature of the driving plate 100 is the normal operating temperature when the driving plate 100 is in the standard load state, the heat exchange flow path group 220 is adjusted to the second working mode. At this time, only the first flow path 222 needs to be opened and the second flow path 224 needs to be disconnected. The heat exchange between the first flow path 222 and the heat exchange element 210 can meet the cooling demand of the driving plate 100, which can save the energy consumption generated by the operation of the second flow path 224 and avoid the risk of condensation on the surface of the driving plate 100 caused by the excessively low temperature of the second flow path 224. When the load of the driving plate 100 is high, the heat generated by the driving plate 100 is large and it needs to be cooled as soon as possible. The heat exchange flow path group 220 is adjusted to the first working mode. At this time, the circulation of the first flow path 222 is maintained, and the second flow path 224 is opened, so that the refrigerant also participates in cooling the driving plate 100. The driving plate 100 is cooled by the first flow path 222 and the second flow path 224 together, so that the driving plate 100 can work in good working conditions when it is in a high load state.

[0045] Preferably, in the first working mode, the heat exchange flow path group 220 can also disconnect the first flow path 222 and only control the flow of the second flow path 224.

[0046] By using the collected condensed water as the heat exchange medium in the first flow path 222, the condensed water itself and the low temperature characteristics of the condensed water generated by the machine room air conditioner can be fully utilized, and the driver board 100 can achieve stable heat dissipation, and the risk of condensation on the surface of the driver board 100 caused by the large temperature difference between the refrigerant and the driver board 100 when evaporating and absorbing heat is reduced. By using the refrigerant as the heat exchange medium in the second flow path 224, the refrigerant enters the evaporator of the air conditioner and begins to evaporate and absorb heat. At this time, the refrigerant in the second flow path 224 performs efficient heat exchange with the heat exchange element 210, and quickly takes away the heat on the heat exchange element 210 at a lower temperature, thereby achieving rapid cooling of the driver board 100. By setting up a heat exchange flow path group 220 and controlling the first flow path 222 and the second flow path 224 to flow together or alternately to cool the driving plate 100, the working energy consumption of the heat dissipation component 200 can be reduced while ensuring the effective cooling of the driving plate 100, so that the driving plate 100 can work in good working conditions regardless of whether it is in a standard load state or a higher load state.

[0047] Optionally, in an implementation of this embodiment, as Figure 1 As shown, the heat dissipation assembly 200 further includes:

[0048] The back plate 230 is connected to the heat exchange element 210 to form a heat exchange cavity 232 , and the heat exchange flow path group 220 runs through the heat exchange cavity 232 .

[0049] In this embodiment, if Figure 1 As shown, the heat dissipation assembly 200 also includes a back plate 230, which is connected to the heat exchange element 210. There is a distance between the back plate 230 and the heat exchange element 210 and a heat exchange cavity 232 is formed. The heat exchange flow path group 220 is arranged in the heat exchange cavity 232 and passes through the heat exchange cavity 232, so that the heat exchange flow path group 220 can exchange heat with the heat exchange cavity 232, thereby reducing the temperature of the driving plate 100. By providing a back plate 230 and forming a heat exchange cavity 232 between the back plate 230 and the heat exchange element 210, the heat exchange space of the heat exchange flow path group 220 is reduced, the temperature loss of the heat exchange flow path group 220 is reduced, and the heat exchange efficiency between the heat exchange flow path group 220 and the heat exchange element 210 is improved. In addition, by providing the heat exchange flow path group 220 in the heat exchange cavity 232, the back plate 230 limits the maximum radial displacement of the heat exchange flow path group 220, thereby reducing the risk of the first flow path 222 and the second flow path 224 being away from the heat exchange element 210 due to a large radial displacement.

[0050] Preferably, the area of ​​the back plate 230 may be equal to or smaller than the area of ​​the heat exchange element 210 .

[0051] Optionally, in an implementation of this embodiment, as Figure 1As shown, both the first flow path 222 and the second flow path 224 are provided with a reversing end;

[0052] The heat dissipation assembly 200 further includes a limiting plate 240 , which abuts against the reversing end of the first flow path 222 and the reversing end of the second flow path 224 .

[0053] In this embodiment, if Figure 1 As shown, both the first flow path 222 and the second flow path 224 are provided with a reversing end, the reversing end of the first flow path is A, and the reversing end of the second flow path is B. After the condensed water in the first flow path 222 and the refrigerant in the second flow path 224 enter the heat exchange cavity 232 and flow through the reversing end, they will flow out of the heat exchange cavity 232 in opposite directions, thereby completing the heat exchange cycle. The heat dissipation component 200 also includes a limit plate 240, which abuts against the reversing end of the first flow path 222 and the reversing end of the second flow path 224. When the heat dissipation component 200 is working, it will generate vibration. During the vibration, the first flow path 222 and the second flow path 224 will produce reciprocating displacement in a direction perpendicular to the limit plate 240, thereby forming a movement. By placing the limit plate 240 against the reversing end of the first flow path 222 and the reversing end of the second flow path 224, the first flow path 222 and the second flow path tube 224 can be prevented from moving in the direction of the limit plate 240, thereby reducing the risk of the heat exchange flow path group 220 moving back and forth in a direction perpendicular to the limit plate 240.

[0054] Preferably, the reversing end of the first flow path 222 and the reversing end of the second flow path 224 are both set to protrude from the first heat exchange surface 212 of the heat exchange element 210, so that the limiting plate 240 will not occupy the heat exchange area of ​​the heat exchange element 210, avoiding affecting the heat exchange effect of the heat exchange element 210.

[0055] Optionally, in an implementation of this embodiment, as Figure 1 As shown, the first heat exchange surface 212 is in contact with the first flow path 222 and / or the second flow path 224 .

[0056] In this embodiment, if Figure 1 As shown, the first flow path 222 and / or the second flow path 224 are abutted against the first heat exchange surface 212. The abutment between the first heat exchange surface 212 and the first flow path 222 and / or the second flow path 224 not only reduces the temperature loss caused by the heat exchange between the heat exchange flow path group 220 and the air, but also improves the heat exchange efficiency between the heat exchange element 210 and the heat exchange flow path group 220 through direct contact, thereby further improving the cooling effect of the drive plate 100.

[0057] Preferably, in this embodiment, the first heat exchange surface 212 may only be in contact with the first flow path 222 , the first heat exchange surface 212 may only be in contact with the second flow path 224 , or the first heat exchange surface 212 may be in contact with both the first flow path 222 and the second flow path 224 .

[0058] Optionally, in an implementation of this embodiment, as Figure 1 As shown, the back plate 230 is in contact with the first flow path 222 and / or the second flow path 224 .

[0059] In this embodiment, if Figure 1 As shown, by placing the first flow path 222 and / or the second flow path 224 against the back plate 230, the heat exchange space of the heat exchange flow path group 220 can be further reduced and the heat can be gathered, thereby further reducing the temperature loss of the heat exchange flow path group 220 and further improving the heat exchange efficiency between the heat exchange flow path group 220 and the heat exchange element 210. By placing the back plate 230 against the first flow path 222 and / or the second flow path 224, the displacement and movement of the first flow path 222 and / or the second flow path 224 in the direction perpendicular to the driving plate during vibration can be avoided, thereby enabling the first flow path 222 and / or the second flow path 224 to be more stably fixed in the heat exchange cavity 232.

[0060] Preferably, in this embodiment, the back plate 230 may be in contact with the first flow path 222 only, the back plate 230 may be in contact with the second flow path 224 only, or the back plate 230 may be in contact with both the first flow path 222 and the second flow path 224 .

[0061] Optionally, in an implementation of this embodiment, as Figure 1 As shown, the heat dissipation assembly 200 further includes:

[0062] A stop valve, which is disposed in the second flow path 224 and is used to control the on-off of the second flow path 224;

[0063] A controller, the stop valve is electrically connected to the controller, and is used to control the opening and closing of the stop valve;

[0064] The controller is configured to: control the shutoff valve to close in the second working mode to disconnect the second flow path 224 ; and control the shutoff valve to open in the first working mode to allow the second flow path 224 to flow.

[0065] In this embodiment, if Figure 1 As shown, the heat dissipation assembly 200 further includes a stop valve and a controller, wherein the stop valve is disposed on the second flow path 224 and is electrically connected to the controller. The controller controls the opening and closing of the stop valve by sending a signal instruction to the stop valve, and the stop valve can control the on-off of the second flow path 224 by opening and closing.

[0066] Because when the driving plate 100 is in a standard load state, the heat generated by the driving plate 100 is relatively small, and the heat dissipation component 200 is adjusted to the second working mode. At this time, only the first flow path 222 needs to be circulated to meet the cooling demand of the driving plate 100. When the driving plate 100 is in a high load state, the heat generated by the driving plate 100 is relatively large, and the temperature of the driving plate 100 is relatively high. At this time, the heat dissipation component 200 is adjusted to the first working mode, and the first flow path 222 and the second flow path 224 need to be fully opened so that the first flow path 222 and the second flow path 224 can cool the driving plate 100 at the same time.

[0067] Therefore, the controller needs to be set as follows: in the second working mode, the controller controls the stop valve to close, thereby disconnecting the second flow path 224. At this time, only the first flow path 222 cools the drive plate 100. In the first working mode, the controller controls the stop valve to open, thereby allowing the second flow path 224 to flow. At this time, the first flow path 222 and the second flow path 224 cool the drive plate 100 at the same time.

[0068] Preferably, the stop valve may be a solenoid valve, a hydraulic valve, a throttle valve or the like, which can be controlled to open and close through an electrical connection.

[0069] By setting a stop valve in the second flow path 224 and electrically connecting it to the controller, when the driving plate 100 is in different load states, the heat dissipation component 200 can automatically control the on-off of the flow path in the heat exchange flow path group 220 according to the heat dissipation requirements of the driving plate 100, thereby reducing the energy consumption of the heat dissipation component 200 when cooling the driving plate 100.

[0070] Optionally, in an implementation of this embodiment, as Figure 1 As shown, the heat dissipation assembly 200 further includes:

[0071] A temperature sensing module, which is disposed on the driving board 100 and is electrically connected to the controller, and is used to obtain the temperature value of the driving board 100 and feed it back to the controller;

[0072] The controller is configured as follows: when the temperature value of the driving plate 100 is equal to or greater than a first preset value, the controller controls the stop valve to open so that the second flow path 224 flows; when the temperature value of the driving plate 100 is equal to or less than a second preset value, the controller controls the stop valve to close so that the second flow path 224 is disconnected; the first preset value is greater than the second preset value.

[0073] In this embodiment, if Figure 1As shown, the heat dissipation assembly 200 also includes a temperature sensing module, which is disposed on the driving board 100 and is electrically connected to the controller. Since the driving board 100 can transfer heat to the temperature sensing module, the temperature sensing module can continuously detect the temperature of the driving board 100 and obtain the temperature value, and convert the temperature value of the driving board 100 into a signal to feed back to the controller.

[0074] Since the heat dissipation component 200 needs to judge the temperature value of the driving plate 100 in order to switch between the standard mode and the overheating mode, a first preset value and a second preset value are set within the temperature value range of the driving plate 100. When the temperature value of the driving plate 100 is equal to or greater than the first preset value, the heat exchange flow path group 220 operates in the first working mode. When the temperature value of the driving plate 100 is equal to or less than the second preset value, the heat exchange flow path group 220 operates in the second working mode, and the controller is set to: when the temperature value of the driving plate 100 obtained by the temperature sensing module is equal to or greater than the first preset value, it means that the temperature value of the driving plate 100 is high. The heat exchange flow path group 220 needs to operate in the first working mode, and the controller controls the stop valve to open to allow the second flow path 224 to circulate. At this time, the first flow path 222 and the second flow path 224 jointly cool down the drive plate 100; when the temperature value of the drive plate 100 obtained by the temperature sensing module is equal to or less than the second preset value, it means that the temperature value of the drive plate 100 has dropped to the normal working temperature. At this time, the heat exchange flow path group 220 only needs to operate in the second working mode to meet the cooling demand of the drive plate 100, so the controller controls the stop valve to close to disconnect the second flow path 224. At this time, only the first flow path 222 remains flowing to cool the drive plate 100.

[0075] The first preset value is set to be greater than the second preset value, which can prevent the temperature of the driving plate 100 from repeatedly changing around the first preset value during the cooling process, causing the controller to control the shut-off valve to be frequently turned on and off, thereby reducing the risk of damage to each component.

[0076] Preferably, the temperature sensing module may be an IPM module (Intelligent Power Module).

[0077] By setting a temperature sensing module electrically connected to the controller, a first preset value and a second preset value, and the first preset value being greater than the second preset value, the heat dissipation component 200 can automatically detect the temperature value of the driving plate 100 and adjust the operation mode of the heat exchange flow path group 220 according to the change of the temperature value of the driving plate 100, while avoiding the frequent opening and closing of the stop valve caused by the change of the temperature value of the driving plate 100, thereby reducing the risk of damage to the components in the heat dissipation component 200.

[0078] Embodiment 2

[0079] In this embodiment, an air conditioner is provided for humidifying a machine room, and the air conditioner comprises:

[0080] A driving plate 100,

[0081] Such as the heat dissipation assembly 200 of the first embodiment.

[0082] In this embodiment, the air conditioner includes a driving board 100 and a heat dissipation assembly 200 as in the first embodiment. By providing the heat dissipation assembly 200 in the air conditioner, the energy consumption required for heat dissipation can be reduced while ensuring effective cooling of the driving board 100, so that the driving board 100 can operate in good working conditions regardless of whether it is in a standard load state or a higher load state.

[0083] Optionally, in an implementation of this embodiment, the air conditioner further includes:

[0084] A water reservoir, wherein the water outlet of the first flow path 222 is connected to the water reservoir;

[0085] A heating element is arranged in the water reservoir and is used to evaporate the water in the water reservoir to humidify the machine room.

[0086] In this embodiment, the air conditioner also includes a water tank and a heating element. The water tank is connected to the water outlet end of the first flow path 222 at the normal operating temperature of the heat exchange flow path group 220. The condensed water after flowing through the heat dissipation component 200 can flow into the water tank from the water outlet end of the first flow path 222. The heating element is set on the water tank. When it is necessary to humidify the environment such as the computer room, the heating element is started. The heating element can heat the water in the water tank to evaporate the water in the water tank, thereby realizing the humidification function.

[0087] Since the condensed water in the first flow path 222 absorbs heat after flowing through the heat exchange cavity 232, the condensed water will flow into the water reservoir at a higher temperature. By connecting the water reservoir with the water outlet end of the first flow path 222 in the cooling flow path group, the heating time of the heating element for the condensed water in the water reservoir is shortened, so that the condensed water can evaporate at a faster speed and humidify the environment such as the machine room, thereby improving the humidification efficiency of the air conditioner and reducing the humidification energy consumption of the air conditioner.

[0088] Optionally, in an implementation of this embodiment, the heat exchange flow path group 220 of the air conditioner further includes:

[0089] a third flow path, wherein a water outlet of the third flow path is connected to the water reservoir, a water inlet of the third flow path is connected to a water supply source of the water reservoir, and the third flow path is disposed on the first heat exchange surface 212;

[0090] Alternatively, the water inlet end of the first flow path 222 is connected to a water supply source of the water reservoir.

[0091] In this embodiment, the heat exchange flow path group 220 of the air conditioner may further include a third flow path, or the water inlet end of the first flow path 222 may be connected to the water supply source of the water storage tank.

[0092] When the heat exchange flow path group 220 of the air conditioner includes a third flow path, the water outlet end of the third flow path is connected to the water reservoir, and the water inlet end of the third flow path is connected to the water supply source of the water reservoir. When the amount of condensed water collected in the water reservoir is insufficient, the third flow path can replenish the water to the water reservoir, so that the heating element can continuously heat the water in the water reservoir and evaporate it. The third flow path is arranged on the first heat exchange surface 212 so that the third flow path can flow through the first heat exchange surface 212 and exchange heat with the first heat exchange surface 212, which can further improve the heat exchange efficiency of the heat exchange element 210 for the driving plate 100. The water in the third flow path absorbs heat after flowing through the first heat exchange surface 212. Therefore, the water in the third flow path will flow into the water tank at a higher temperature, thereby increasing the temperature of the water inlet into the water tank, shortening the heating time of the water in the water tank by the heating element, and allowing the water in the water tank to evaporate at a faster rate and humidify the environment such as the machine room, thereby improving the humidification efficiency of the air conditioner, reducing the humidification energy consumption of the air conditioner, and achieving energy-saving effects.

[0093] When the heat exchange flow path group connects the water inlet end of the first flow path 222 with the water supply source of the water storage tank, the heat exchange flow path group can use the water supply as the heat exchange medium in the first flow path 222 by connecting with the water supply source, and can also use the condensed water and the water supply as the heat exchange medium in the first flow path 222. By connecting the water inlet end of the first flow path 222 with the water supply source of the water storage tank, not only can the condensed water be fully utilized, but also the water supply can be introduced into the first flow path 222 to participate in the heat exchange between the heat exchange elements 210, so that the water in the first flow path will flow into the water storage tank at a higher temperature, thereby increasing the temperature of the water in the water storage tank, shortening the heating time of the heating element for the water in the water storage tank, and enabling the water in the water storage tank to evaporate at a faster speed and humidify the environment such as the machine room, thereby improving the humidification efficiency of the air conditioner, reducing the humidification energy consumption of the air conditioner, and achieving the effect of energy saving.

[0094] Optionally, in an implementation of this embodiment, the heating element is an infrared heating element, and there is a gap between the infrared heating element and the liquid level of the water storage tank.

[0095] In this embodiment, the heating element is an infrared heating element, which heats water through infrared rays, thereby causing the water to heat up and evaporate, thereby achieving a humidification function. A certain gap needs to exist between the infrared heating element and the liquid level of the water storage tank to prevent the infrared heating element from directly contacting the water and thus shielding the infrared radiation, thereby ensuring the heating efficiency of the infrared heating element on the water.

[0096] Preferably, the infrared heating element may be an infrared heating lamp.

[0097] Embodiment 3

[0098] This embodiment provides a control method, such as Figure 2 As shown, for controlling the heat dissipation assembly 200 of the first embodiment, the control method includes:

[0099] Continuously obtain the temperature value of the normal working temperature of the driving board 100;

[0100] The working mode of the normal working temperature of the heat exchange flow path group 220 is controlled according to the temperature value of the normal working temperature of the driving plate 100.

[0101] In this embodiment, if Figure 2 As shown, by continuously acquiring the temperature value of the normal working temperature of the driving plate 100, and adjusting the working mode of the normal working temperature of the heat exchange flow path group 220 according to the temperature value of the normal working temperature of the driving plate 100, when the temperature value of the normal working temperature of the driving plate 100 is high, the heat exchange flow path group 220 is adjusted to operate in the first working mode, and when the temperature value of the normal working temperature of the driving plate 100 is low, the heat exchange flow path group 220 is adjusted to operate in the second working mode. By adjusting the working mode of the normal working temperature of the heat exchange flow path group 220, when the driving plate 100 is in different load states, the heat dissipation component 200 can automatically control the on-off of the flow path in the heat exchange flow path group 220 according to the change of the temperature value of the driving plate 100, thereby reducing the energy consumption of the heat dissipation component 200 when cooling the driving plate 100.

[0102] like Figure 2 As shown, specifically, the control method includes:

[0103] Step 202: continuously acquiring the temperature value of the driving board 100;

[0104] Step 204 : Control the working mode of the heat exchange flow path group 220 according to the temperature value of the driving plate 100 .

[0105] Optionally, in an implementation of this embodiment, as Figure 3 As shown, the working mode of controlling the heat exchange flow path group 220 according to the temperature value of the driving plate 100 includes:

[0106] Continuously obtain the temperature value of the driving board 100;

[0107] Determine whether the temperature value of the driving board 100 is lower than a first preset value;

[0108] If so, the first flow path 222 is controlled to flow to cool the driving plate 100;

[0109] If not, control the second flow path 224 to flow and keep the first flow path 222 flowing, so as to cool down the driving plate 100 together;

[0110] Determine whether the temperature of the driving board 100 is higher than a second preset value;

[0111] If so, the first flow path 222 is kept flowing and the second flow path 224 is kept flowing to cool the driving plate 100 together;

[0112] If not, the second flow path 224 is controlled to be disconnected, and the first flow path 222 is kept flowing to cool the driving plate 100;

[0113] Wherein, the first preset value is greater than the second preset value.

[0114] In this embodiment, if Figure 3 As shown, the control method can be used to control the heat dissipation component 200 in the above-mentioned embodiment 1, and can also be used to control the air conditioner in the above-mentioned embodiment 2. After starting the power-on program, the control method will continuously obtain the temperature value of the driving board 100. Since the heat generated by the driving board 100 will also change as the load of the driving board 100 changes, the first preset value and the second preset value are set, and the first preset value is greater than the second preset value. When the temperature of the driving board 100 is equal to or higher than the first preset value, it means that the temperature value of the driving board 100 at this time is high, and the heat dissipation component 200 needs to enter the overheating mode to quickly cool down the driving board 100. When the temperature of the driving board 100 is equal to or lower than the second preset value, it means that the driving board 100 at this time is at a normal operating temperature, and the heat dissipation component 200 only needs to cool down the driving board 100 at normal temperature. The first preset value needs to be greater than the second preset value, so that the temperature of the driving board 100 can be prevented from repeatedly changing near the first preset value during the cooling process, causing the controller to control the shut-off valve to be frequently turned on and off, thereby reducing the risk of damage to each component in the heat dissipation component 200.

[0115] The heat dissipation component 200 will compare the obtained temperature value of the driving plate 100 with the first preset value, and determine whether the temperature value of the driving plate 100 is lower than the first preset value. When the temperature of the driving plate 100 is lower than the first preset value, it means that the driving plate 100 is at a normal working temperature at this time, and the heat dissipation component 200 only needs to cool the driving plate 100 at normal temperature. Therefore, the controller controls the shutoff valve to close, disconnects the second flow path 224, and controls the first flow path 222 to flow to cool the driving plate 100. When the temperature of the driving plate 100 is equal to or higher than the first preset value, it means that the temperature value of the driving plate 100 is high at this time, and the heat dissipation component 200 needs to enter the overheating mode to quickly cool the driving plate 100. Therefore, the heat exchange flow path group 220 keeps the first flow path 222 flowing, and controls the shutoff valve to open through the controller to allow the second flow path 224 to flow, so that the first flow path 222 and the second flow path 224 can cool the driving plate 100 together. When the heat exchange flow path group 220 cools down the drive plate 100 in the first working mode, the heat dissipation component 200 will continue to obtain the temperature of the drive plate 100, and compare the obtained temperature value of the drive plate 100 with the second preset value, and determine whether the temperature value of the drive plate 100 is higher than the second preset value. When the temperature of the drive plate 100 is higher than the second preset value, it means that the temperature value of the drive plate 100 is still high at this time, and the heat dissipation component 200 needs to continue to cool down the drive plate 100 in the first working mode. Therefore, the heat exchange flow path group 220 keeps the first flow path 222 flowing, and keeps the second flow path 224 flowing, so that the first flow path 222 and the second flow path 224 cool down the drive plate 100 together. When the temperature of the driving plate 100 is equal to or lower than the second preset value, it means that the temperature of the driving plate 100 has dropped to within the normal operating temperature range, and the heat dissipation component 200 only needs to cool the driving plate 100 at normal temperature. At this time, the controller controls the shut-off valve to close, disconnects the second flow path 224, and controls the first flow path 222 to flow to cool the driving plate 100.

[0116] The first preset value is set to be greater than the second preset value, which can prevent the temperature of the driving plate 100 from repeatedly changing around the first preset value during the cooling process, causing the controller to control the shut-off valve to be frequently turned on and off, thereby reducing the risk of damage to each component.

[0117] Through this control method, when the driving plate 100 is in different load states, the heat dissipation component 200 can compare the temperature value of the driving plate 100 with the first preset value and the second preset value, and judge and execute the currently required working mode according to the comparison result, so as to realize automatic control of the on and off of the flow path in the heat exchange flow path group 220, thereby reducing the energy consumption of the heat dissipation component 200 when cooling the driving plate 100.

[0118] like Figure 3 As shown, specifically, the control method includes:

[0119] Step 302: continuously acquiring the temperature value of the driving board 100;

[0120] Step 304: Determine whether the temperature value of the driving board 100 is lower than a first preset value;

[0121] Step 306: If yes, control the first flow path 222 to cool the driving plate 100;

[0122] Step 308: If not, control the second flow path 224 to flow and keep the first flow path 222 flowing, so as to cool down the driving plate 100 together;

[0123] Step 310: Determine whether the temperature of the driving board 100 is higher than a second preset value;

[0124] Step 312: If yes, keep the first flow path 222 flowing and keep the second flow path 224 flowing, so as to cool down the driving plate 100 together;

[0125] Step 314 : If not, control the second flow path 224 to be disconnected, and keep the first flow path 222 flowing to cool the driving plate 100 .

[0126] In summary, the ingenious design of the heat dissipation component and the air conditioner is:

[0127] First, by using the collected condensed water as the heat exchange medium in the first flow path, the condensed water itself and the low temperature characteristics of the condensed water generated by the machine room air conditioner can be fully utilized, and the driver board can achieve stable heat dissipation, and the risk of condensation on the surface of the driver board caused by the large temperature difference between the refrigerant and the driver board when evaporating and absorbing heat is reduced. By using the refrigerant as the heat exchange medium of the second flow path, the refrigerant enters the evaporator of the air conditioner and begins to evaporate and absorb heat. At this time, the refrigerant conducts efficient heat exchange with the heat exchange element in the second flow path, and quickly takes away the heat on the heat exchange element at a lower temperature, thereby achieving rapid cooling of the driver board. By setting a heat exchange flow path group and controlling the first flow path and the second flow path to flow together or alternately to cool the driver board, the working energy consumption of the heat dissipation component can be reduced while ensuring the effective cooling of the driver board, so that the driver board can work in good working conditions when it is in a standard load state or a high load state.

[0128] Second, by setting a stop valve in the second flow path and electrically connecting it to the controller, when the driving plate is in different load states, the heat dissipation component can automatically control the on-off of the flow path in the heat exchange flow path group according to the heat dissipation requirements of the driving plate, thereby reducing the energy consumption of the heat dissipation component when cooling the driving plate.

[0129] Third, by connecting the water storage tank with the water outlet end of the first flow path in the cooling flow path group, the heating time of the heating element on the condensed water in the water storage tank is shortened, so that the condensed water can evaporate at a faster rate and humidify the environment such as the machine room, thereby improving the humidification efficiency of the air conditioner and reducing the humidification energy consumption of the air conditioner.

[0130] Fourth, by setting the third flow path in the heat exchange chamber, the third flow path can flow through the heat exchange chamber and exchange heat with the heat exchange chamber, which can further improve the heat exchange efficiency of the heat exchange element to the driving plate, and the water in the third flow path absorbs heat after flowing through the heat exchange chamber. Therefore, the water in the third flow path will flow into the water storage tank at a higher temperature, thereby increasing the temperature of the water inlet into the water storage tank, shortening the heating time of the heating element for the water in the water storage tank, and allowing the water in the water storage tank to evaporate at a faster rate and humidify the environment such as the machine room, thereby improving the humidification efficiency of the air conditioner, reducing the humidification energy consumption of the air conditioner, and achieving energy-saving effects.

[0131] It is further understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar thereto. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.

[0132] It is further understood that the terms "first", "second", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a specific order or degree of importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0133] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.

[0134] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0135] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. A heat dissipation assembly for heat dissipation of a driving plate (100) of an air conditioner, characterized in that: include: A heat exchange element (210), the heat exchange element (210) having a first heat exchange surface (212) and a second heat exchange surface that are opposite to each other in a thickness direction, the second heat exchange surface being in contact with the driving plate (100); A heat exchange flow path group (220), the heat exchange flow path group (220) being arranged on the first heat exchange surface (212), the heat exchange flow path group (220) comprising a first flow path (222) and a second flow path (224), the first flow path (222) using at least condensed water generated by the evaporator of the air conditioner as a heat exchange medium, and the second flow path (224) using a refrigerant as a heat exchange medium; The heat exchange flow path group (220) is configured to control the working mode of the heat exchange flow path group (220) according to the temperature value of the driving plate (100), wherein the working mode of the heat exchange flow path group (220) includes a first working mode in which both the first flow path (222) and the second flow path (224) are flowing and a second working mode in which the first flow path (222) is flowing and the second flow path (224) is disconnected.

2. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component also includes: A back plate (230), the back plate (230) being connected to the heat exchange element (210) to form a heat exchange cavity (232), and the heat exchange flow path group (220) running through the heat exchange cavity (232).

3. The heat dissipation assembly according to claim 1, characterized in that: The first flow path (222) and the second flow path (224) are both provided with a reversing end; The heat dissipation component further comprises a limiting plate (240), wherein the limiting plate (240) abuts against the reversing end of the first flow path (222) and the reversing end of the second flow path (224).

4. The heat dissipation assembly according to claim 1, wherein: The first heat exchange surface (212) is in contact with the first flow path (222) and / or the second flow path (224).

5. The heat dissipation assembly according to claim 2, characterized in that: The back plate (230) is in contact with the first flow path (222) and / or the second flow path (224).

6. The heat dissipation assembly according to claim 1, wherein: The heat dissipation component also includes: a stop valve, the stop valve being arranged on the second flow path (224) and being used for controlling the on-off of the second flow path (224); A controller, the stop valve is electrically connected to the controller, and the controller is used to control the opening and closing of the stop valve.

7. The heat dissipation assembly according to claim 6, characterized in that: The heat dissipation component also includes: a temperature sensing module, the temperature sensing module being arranged on the driving board (100), the temperature sensing module being electrically connected to the controller and being used to obtain a temperature value of the driving board (100) and feed it back to the controller; The controller is configured such that: when the temperature value of the driving plate (100) is equal to or greater than a first preset value, the controller controls the stop valve to open so that the second flow path (224) flows; and when the temperature value of the driving plate (100) is equal to or less than a second preset value, the controller controls the stop valve to close so that the second flow path (224) is disconnected; Wherein, the first preset value is greater than the second preset value.

8. An air conditioner for humidifying a machine room, characterized in that: include: A driving plate (100), A heat dissipation assembly as described in claims 1-7.

9. The air conditioner according to claim 8, characterized in that: The air conditioner also includes: a water reservoir, wherein the water outlet end of the first flow path (222) is connected to the water reservoir; A heating element is arranged in the water reservoir and is used to evaporate the water in the water reservoir to humidify the machine room.

10. The air conditioner according to claim 9, characterized in that: The heat exchange flow path group (220) further includes: a third flow path, a water outlet end of the third flow path is connected to the water reservoir, a water inlet end of the third flow path is connected to a water supply source of the water reservoir, and the third flow path is arranged on the first heat exchange surface (212); Alternatively, the water inlet end of the first flow path (222) is connected to a water supply source of the water reservoir.

11. The air conditioner according to claim 9, characterized in that: The heating element is an infrared heating element, and there is a gap between the infrared heating element and the liquid surface of the water storage tank.

12. A control method for controlling the heat dissipation assembly according to claims 1 to 7, characterized in that: include: Continuously acquiring the temperature value of the driving plate (100); The working mode of the heat exchange flow path group (220) is controlled according to the temperature value of the driving plate (100).

13. The control method according to claim 12, characterized in that: The working mode of controlling the heat exchange flow path group (220) according to the temperature value of the driving plate (100) comprises: Determining whether the temperature value of the driving plate (100) is lower than a first preset value; If yes, controlling the first flow path (222) to flow to cool the driving plate (100); If not, controlling the second flow path (224) to flow and maintaining the first flow path (222) to flow, so as to jointly cool the driving plate (100); Determining whether the temperature of the driving plate (100) is higher than a second preset value; If so, the first flow path (222) is kept flowing and the second flow path (224) is kept flowing, so as to cool the driving plate (100) together; If not, controlling the second flow path (224) to be disconnected, and maintaining the first flow path (222) to flow to cool the driving plate (100); Wherein, the first preset value is greater than the second preset value.

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