Needle mold testing device and method suitable for multiple processes and multiple stations

Abstract

The invention is suitable for the field of flexible printed circuit board testing, and provides a needle mold testing device and method suitable for multiple processes and multiple stations. The needle mold testing device suitable for multiple processes and multiple stations comprises a carrier which is arranged on an assembly line and is used for placing a flexible circuit board in a bending state; the lower test module is arranged below the carrier and comprises a lateral positioning assembly, a first lateral needle mold assembly and a jacking assembly; the lateral positioning assembly and the first lateral needle mold assembly are arranged at the top of the jacking assembly; the upper testing module is arranged above the carrier and comprises a first pressing block testing assembly, a second lateral needle mold assembly and a first ceiling assembly, and the first pressing block testing assembly and the second lateral needle mold assembly are arranged at the bottom of the first ceiling assembly. The device and the method can greatly reduce the equipment cost, improve the equipment stability and reduce the investment and the cost of maintenance personnel.

Description

Technical Field

[0001] The invention belongs to the field of flexible printed circuit board testing, and in particular relates to a needle mold testing device and method suitable for multiple processes and multiple stations. Background Art

[0002] Flexible Printed Circuit (FPC) is a printed circuit board made of a flexible substrate. Unlike traditional rigid printed circuit boards, flexible circuit boards can be bent, folded and wound, and can be freely formed in three-dimensional space, making them suitable for products with complex shapes or space constraints. Flexible circuit boards are widely used in various electronic products, such as mobile phones, laptops, digital cameras, medical equipment, and automotive electronic systems. Due to its lightness and bendability, it is particularly suitable for application scenarios that require saving space and weight, and is also one of the key technologies for achieving miniaturization and high-density assembly.

[0003] In order to meet the needs of consumers, mainstream consumer electronic products are gradually being updated, and many suppliers have begun to reduce costs and increase efficiency, requiring lower equipment quotations and higher testing requirements to reduce costs. In multi-hole assembly line test automation or multi-process equipment, the equipment has multiple carriers with multiple holes on the carrier, and the equipment has only one station that requires a needle mold to test the product. In the past, the conventional situation was to position the product on the carrier, and the product positioning and testing needle mold were integrated, so as to reduce the transmission of the dimension chain and reduce the interference of the intermediate links, increase the yield and reduce the risk. However, in the case of multiple carriers and multiple holes, setting a needle mold for each hole of the carrier will greatly increase the number of needle molds, resulting in expensive equipment costs, and the needle molds all need to be maintained. Each needle mold requires wiring transfer, which greatly increases the workload and difficulty of equipment maintenance, increases the complexity of the carrier, reduces the stability of the equipment, and increases the cost of the equipment. Summary of the invention

[0004] The purpose of the embodiment of the present invention is to provide a needle mold testing device suitable for multiple processes and multiple stations, aiming to significantly reduce equipment costs and increase equipment stability.

[0005] The embodiment of the present invention is implemented as follows: a needle mold testing device suitable for multiple processes and multiple stations, the needle mold testing device suitable for multiple processes and multiple stations comprising: A carrier, arranged on a linear assembly line, for placing a flexible circuit board in a bent state; A lower test module is arranged below the carrier, and comprises a lateral positioning assembly, a first lateral pin mold assembly and a lifting assembly; the lateral positioning assembly and the first lateral pin mold assembly are arranged on the top of the lifting assembly; the lifting assembly is used to lift the carrier, the lateral positioning assembly and the first lateral pin mold assembly, the lateral positioning assembly is used for one-time positioning of the X-axis of the flexible circuit board, and the first lateral pin mold assembly is used for X-axis contact test of the flexible circuit board; The upper test module is arranged above the carrier, and includes a first pressure block test assembly, a second lateral needle mold assembly and a first top plate assembly, wherein the first pressure block test assembly and the second lateral needle mold assembly are arranged at the bottom of the first top plate assembly; the first top plate assembly is used to drive the first pressure block test assembly and the second lateral needle mold assembly to move downward, the first pressure block test assembly is used for Z-axis secondary positioning and contact testing of the flexible circuit board, and the second lateral needle mold assembly is used for Y-axis contact testing of the flexible circuit board.

[0006] Preferably, the lateral positioning assembly comprises: A support frame, laterally connected to the driving device, and arranged together on the top of the jacking assembly; A product support block, arranged on the support frame; A support limit block, arranged on the support frame, for limiting the product support block; A spring is arranged between the product supporting block and the supporting limiting block.

[0007] Preferably, the first lateral needle mold assembly comprises: A sliding frame, laterally connected to a driving device, for lateral movement; A needle mold is arranged on the first sliding frame and is used for lateral contact testing.

[0008] Preferably, the first pressing block testing assembly comprises: A pressing block cover plate, arranged on the top plate at the bottom of the first top plate assembly; A pressing block connected to the pressing block cover plate via a spring; The probe passes through the pressing block and is connected to the needle sleeve protective shell on the pressing block cover plate.

[0009] Preferably, the second lateral needle mold assembly comprises: A connecting block, which is laterally connected to the driving device; An adapter plate, arranged laterally on the connecting block; A probe fixing block, disposed laterally on the adapter plate; A double-head spring probe is laterally arranged on the probe fixing block.

[0010] Another object of an embodiment of the present invention is to provide a needle mold testing method applicable to multiple processes and multiple stations, the needle mold testing method applicable to multiple processes and multiple stations comprising the following steps: Place the bent flexible circuit board on the carrier of the production line; When the carrier moves to the working area, the lower test module lifts up the carrier, and the lateral positioning component of the lower test module completes the horizontal shaping and positioning of the flexible circuit board; Control the upper test module to move downward so that the first pressing block test assembly of the upper test module can realize the positioning of the flexible circuit board in the Z-axis direction and connect the contacts in the Z-axis direction; Control the second lateral needle mold assembly of the upper test module to connect to the contact point in the Y-axis direction of the flexible circuit board; The first lateral pin mold assembly of the lower test module is controlled to connect the contact points in the X-axis direction of the flexible circuit board; Turn on the circuit to realize detection.

[0011] Another object of an embodiment of the present invention is to provide a needle mold testing device suitable for multiple processes and multiple stations, the needle mold testing device suitable for multiple processes and multiple stations comprising: A carrier, arranged on a turntable assembly line, for placing a flattened flexible circuit board; A lower test module, arranged below the carrier, comprising a platform plate and a longitudinal pin mold assembly, wherein the longitudinal pin mold assembly is arranged on the platform plate and is used for contact point testing; The upper test module is arranged above the carrier, and includes a second pressure block test assembly and a second second board assembly. The second pressure block test assembly is arranged on the second second board assembly. The second second board assembly is used to drive the second pressure block test assembly and the carrier to press downward. The second pressure block test assembly is used to perform contact test on the flexible circuit board.

[0012] Preferably, a bushing is provided on the carrier, and both the lower test module and the upper test module are provided with a guide shaft, and the bushing is used for being matched and connected with the guide shaft.

[0013] Another object of an embodiment of the present invention is to provide a needle mold testing method applicable to multiple processes and multiple stations, the needle mold testing method applicable to multiple processes and multiple stations comprising the following steps: Placing the flattened flexible circuit board on a turntable carrier; When the carrier rotates to the working area, the upper test module is controlled to press downward so that the second pressing block test assembly of the upper test module connects to the contact points on the flexible circuit board; Control the upper test module to continue to drive the carrier downward, so that the longitudinal pin mold assembly of the lower test module connects to the contact point under the flexible circuit board; Turn on the circuit to realize detection.

[0014] The embodiment of the present invention provides a needle mold testing device suitable for multiple processes and multiple stations. The device is a needle mold separation test structure, which is used for batch production of products in forming, bending and flattening states on multi-hole assembly lines and multi-process equipment, and can significantly reduce the number of test needle mold components in the equipment. Because the cost of the needle mold is high, it needs frequent maintenance, and the maintenance is difficult. The needle mold is the key structure of the test module and has a direct impact on the test yield. In addition, each needle mold has a wiring transfer signal at the tail. Reducing the needle mold can reduce the corresponding transfer line. Therefore, the device and method can greatly reduce the equipment cost, increase the stability of the equipment, and reduce the investment and cost of maintenance personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of a needle mold testing device suitable for multiple processes and multiple stations according to the first embodiment; Figure 2 is a front view of a lower test module of the second embodiment; Figure 3 is an exploded view of a lateral positioning assembly of a second embodiment; Figure 4 is a perspective view of a first lateral pin mold assembly of a second embodiment; Figure 5 is a perspective view of an upper test module of a second embodiment; Figure 6 is an exploded view of the first pressing block test assembly of the second embodiment; Figure 7 is an exploded view of a second lateral pin mold assembly of a second embodiment; Figure 8 is a three-dimensional diagram of a lower test module of a fourth embodiment; Fig. 9 is an exploded view of the lower test module of the fourth embodiment; Fig.10 is a three-dimensional diagram of an upper test module of a fourth embodiment; Figure Number: 100. Vehicle; 200, lower test module; 210, lateral positioning assembly; 220, first lateral pin mold assembly; 230, lifting assembly; 240, platform plate; 250, longitudinal pin mold assembly; 300, upper test module; 310, first pressing block test assembly; 320, second lateral pin mold assembly; 330, first first board assembly; 340, second pressing block test assembly; 350, second second board assembly; 211, support frame; 212, product support block; 213, support limit block; 221, sliding frame; 222, needle mold; 251, B2B test needle mold; 252, HOTBAR test needle mold; 311, block cover plate, 312, block; 313, probe; 321. Connecting block; 322. Adapter plate; 323. Probe fixing block; 324. Double-headed spring probe. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0017] It is understood that the terms "first", "second", etc. used in this application can be used in this article to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are only used to distinguish the first element from another element. The direction of the X / Y / Z axis mentioned in this application depends on the construction of the spatial coordinate system. If the scheme is not contradictory, the X axis can be the Y axis, the Y axis can be the Z axis, and so on. The "above" and "below" directional words used in this application are used to describe the positional relationship between components, and are not limited to the positional relationship in the general spatial sense. For example, "above" and "below" can also be "left" and "right", or "front" and "back", or oblique relative positional relationships, which are not listed here one by one.

[0018] In the first embodiment, if Figure 1 As shown, a needle mold testing device suitable for multiple processes and multiple stations is proposed, and the needle mold testing device suitable for multiple processes and multiple stations includes a carrier 100 , a lower test module 200 and an upper test module 300 .

[0019] In this embodiment, the carrier 100 is applicable to two scenarios: one is a linear assembly line, which is applicable to detecting a bent flexible circuit board, corresponding to the second and third embodiments of the present invention, such as Figure 1 The other is a turntable production line suitable for detecting flattened flexible circuit boards, corresponding to the fourth and fifth embodiments of the present invention, that is, Figure 1 The carrier 100 is placed on a disc with multiple stations.

[0020] In the second embodiment, if Figure 2-7 As shown, a needle mold testing device suitable for multiple processes and multiple stations is provided, and the needle mold testing device suitable for multiple processes and multiple stations includes: The carrier 100 is arranged on a linear assembly line and is used to place a flexible circuit board in a bent state; The lower test module is arranged below the carrier 100, and includes a lateral positioning assembly 210, a first lateral pin mold assembly 220 and a lifting assembly 230; the lateral positioning assembly 210 and the first lateral pin mold assembly 220 are arranged on the top of the lifting assembly 230; the lifting assembly 230 is used to lift the carrier 100, the lateral positioning assembly 210 and the first lateral pin mold assembly 220, the lateral positioning assembly 210 is used for one-time positioning of the flexible circuit board in the X-axis, and the first lateral pin mold assembly 220 is used for the X-axis contact test of the flexible circuit board; The upper test module is arranged above the carrier 100, and includes a first pressure block test assembly 310, a second lateral needle mold assembly 320 and a first top plate assembly 330. The first pressure block test assembly 310 and the second lateral needle mold assembly 320 are arranged at the bottom of the first top plate assembly 330; the first top plate assembly 330 is used to drive the first pressure block test assembly 310 and the second lateral needle mold assembly 320 to move downward, the first pressure block test assembly 310 is used for the Z-axis secondary positioning and contact test of the flexible circuit board, and the second lateral needle mold assembly 320 is used for the Y-axis contact test of the flexible circuit board.

[0021] In this embodiment, the carrier 100 has 20 holes, which can hold 20 products for testing at the same time, with high testing efficiency. The specific number of holes depends on the production situation. The upper test module and the lower test module are respectively above and below the assembly line. The carrier 100 places the product and moves along the assembly line. When it reaches below the upper test module, the device senses the signal, and the lifting assembly 230 of the lower test module lifts the carrier 100 and completes the positioning. The upper test module moves downward and presses on the carrier 100 to start testing. There are multiple carriers 100 running on one assembly line. Before the carrier 100 goes on the assembly line, the loading equipment puts the product into the carrier 100, and then the carrier 100 moves on the assembly line. When it reaches below the upper test module, it reaches the test station, and the lower test module lifts the carrier 100. The lower test module has a guide shaft, which cooperates with the bushing of the carrier 100 to complete the positioning. The lower test module has a carrier 100 support block. After the positioning is completed, the carrier 100 will reach this surface, and then the lateral positioning component 210 of the lower test module will move under the action of the cylinder and contact the flexible circuit board to achieve the first positioning of the X axis. Then the first pressure block test component 310 and the second lateral needle mold component 320 move downward under the push of the first day plate component 330. The limit block of the first day plate component 330 will contact the carrier of the carrier 100, and then press it into place. In this process, the first pressure block test component 310 will contact the product to complete the secondary positioning of the product. At the same time, the first pressure block test component 310 is provided with a probe, which will contact the contact on the product to test the point position in the Z direction of the product. Then, the second lateral needle mold component 320 on the top plate moves under the action of the cylinder on the first day plate component 330, and the probe on the second lateral needle mold component 320 will contact the product to complete the product Y direction contact test. Finally, the first lateral pin mold assembly 220 on the lower test module moves under the action of the cylinder and contacts the product to complete the product X-direction contact test.

[0022] In this embodiment, the device is a needle-mold separation test structure, which is used for batch production of products in a formed and bent state on multi-hole production lines and multi-process equipment, and can significantly reduce the number of test needle mold components in the equipment. Because the needle mold cost is high, it needs frequent maintenance, and the maintenance is difficult. The needle mold is the key structure of the test module and has a direct impact on the test yield. In addition, each needle mold has a wiring transfer signal at the tail. Reducing the needle mold can reduce the corresponding transfer line. Therefore, the device and method can greatly reduce the equipment cost, increase the stability of the equipment, and reduce the investment and cost of maintenance personnel.

[0023] In an optimization scheme, if Figure 3 As shown, the lateral positioning assembly 210 includes: The support frame 211 is laterally connected to the driving device and is disposed together on the top of the lifting assembly 230; A product support block 212, disposed on the support frame 211; A support limit block 213, provided on the support frame 211, for limiting the product support block 212; The spring is arranged between the product supporting block 212 and the supporting limiting block 213 .

[0024] In this optimization scheme, the driving device can be any existing power device including a cylinder, and its function is to push the support frame 211 close to the flexible circuit board. Driven by the support frame 211, the support limit block 213 contacts the flexible circuit board to shape and position it; the spring plays a buffering role to avoid damaging the flexible circuit board.

[0025] In an optimization scheme, if Figure 4 As shown, the first lateral pin mold assembly 220 includes: The sliding frame 221 is laterally connected to the driving device for lateral movement; The needle mold 222 is arranged on the first sliding frame 221 and is used for lateral contact testing.

[0026] In this optimization scheme, the driving device can be any existing power device including a cylinder, and its function is to push the sliding frame 221 close to the flexible circuit board. The sliding frame 221 is slidably arranged above the lifting assembly 230, and can achieve reciprocating movement in the X-axis direction. The needle mold is used to achieve contact test in the X-axis direction.

[0027] In an optimization scheme, if Figure 6 As shown, the first pressing block testing assembly 310 includes: A pressing block cover plate 311 is arranged on the top plate at the bottom of the first top plate assembly 330; A pressing block 312 connected to the pressing block cover plate 311 via a spring; The probe 313 passes through the pressing block 312 and is connected to the needle sleeve protective shell on the pressing block cover plate 311 .

[0028] In this optimization scheme, the pressure block cover plate 311 is fixedly set on the top plate, connected to the tail of the probe 313, and protected by the needle sleeve protective shell. The needle head of the probe 313 is set in the pinhole of the pressure block 312. A spring is set between the pressure block 312 and the pressure block cover plate 311; when the first pressure block test assembly 310 is pressed down, the limit block on the top plate will contact the carrier plate of the carrier 100, and the product will be pressed into place to complete the secondary positioning. At the same time, the probe 313 of the pressure block will contact the contact on the product to test the point position of the product in the Z direction.

[0029] In this optimization scheme, after the lateral positioning assembly 210 is in place, the product is shaped and positioned for the first time, and then the upper test module is pressed down on the carrier 100, and each first pressure block test assembly 310 on the upper test module will be pressed on the corresponding product positioning block. After the product is placed on the product positioning block, the product rebounds after bending, resulting in uncertainty in the vertical position, so there is uncertainty in the left and right and up and down positions. After the first shaping of the lateral positioning assembly 210, the front and back degrees of freedom are determined, and the up and down degrees of freedom remain. The first pressure block test assembly 310 is pressed down on the product positioning block to perform the second shaping and positioning of the product, eliminating all degrees of freedom to completely position the product. In addition to being used for shaping products, the probe of the first pressure block test assembly 310 can perform point testing on the front of the product. There is a floating gap between the pressure block and the upper test module to accommodate the position error between multi-hole test products.

[0030] In an optimization scheme, if Figure 7 As shown, the second lateral pin mold assembly 320 includes: A connecting block 321, laterally connected to the driving device; An adapter plate 322, laterally disposed on the connecting block 321; A probe fixing block 323, which is laterally arranged on the adapter plate 322; The double-headed spring probe 324 is laterally disposed on the probe fixing block 323 .

[0031] In this optimization scheme, the driving device can select all existing power devices including cylinders, and its function is to push the connecting block 321 close to the flexible circuit board. When pushed sideways, the double-headed spring probe 324 contacts the Y-axis contact of the product, thereby realizing detection.

[0032] The various optimization schemes of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0033] In the third embodiment, a needle mold testing method applicable to multiple processes and multiple stations is proposed, and the method is applicable to the needle mold testing device applicable to multiple processes and multiple stations described in the second embodiment. The needle mold testing method applicable to multiple processes and multiple stations includes the following steps S102-S112: Step S102, placing the bent flexible circuit board on the carrier 100 of the production line; Step S104, when the carrier 100 moves to the working area, the lower test module lifts up the carrier 100, and the lateral positioning assembly 210 of the lower test module completes the horizontal shaping and positioning of the flexible circuit board; Step S106, controlling the upper test module to move downward, so that the first pressing block test assembly 310 of the upper test module can realize the positioning of the flexible circuit board in the Z-axis direction and connect the contacts in the Z-axis direction; Step S108, controlling the second lateral needle mold assembly 320 of the upper test module to connect to the contacts in the Y-axis direction of the flexible circuit board; Step S110, controlling the first lateral pin mold assembly 220 of the lower test module to connect to the contacts in the X-axis direction of the flexible circuit board; Step S112, connecting the circuit to implement detection.

[0034] In this embodiment, the method adopts a separate detection method, which is used for batch production of products in a formed and bent state on multi-hole assembly lines and multi-process equipment. It can significantly reduce the number of test pin mold components in the equipment. This method can greatly reduce equipment costs, increase equipment stability, and reduce the investment and cost of maintenance personnel.

[0035] In the fourth embodiment, Figure 8-10 As shown, a needle mold testing device suitable for multiple processes and multiple stations is proposed, characterized in that the needle mold testing device suitable for multiple processes and multiple stations comprises: The carrier 100 is arranged on a turntable assembly line and is used to place a flattened flexible circuit board; A lower test module, disposed below the carrier 100, includes a platform plate 240 and a longitudinal pin mold assembly 250, wherein the longitudinal pin mold assembly 250 is disposed on the platform plate 240 for contact point testing; The upper test module is arranged above the carrier 100, and includes a second pressure block test assembly 340 and a second substrate assembly 350. The second pressure block test assembly 340 is arranged on the second substrate assembly 350. The second substrate assembly 350 is used to drive the second pressure block test assembly 340 and the carrier 100 to press downward. The second pressure block test assembly 340 is used to perform contact test on the flexible circuit board.

[0036] Wherein, the carrier 100 is provided with a bushing, and the lower test module and the upper test module are both provided with a guide shaft, and the bushing is used for being matched and connected with the guide shaft.

[0037] In this embodiment, the disc of the jig is mounted on a rotating cylinder, and at least two carriers 100 can be mounted on the disc and can rotate to switch between the loading station and the testing station. During the test, the carrier 100 completes product loading at the No. 1 station, and the disc rotates to transfer the No. 1 station carrier 100 to the No. 2 station, i.e., the testing station; the upper test module presses down, and the bushing on the second floor assembly 350 is matched and positioned with the guide shaft of the carrier 100 to ensure the matching accuracy; the second pressure block test assembly 340 is pressed on the product positioning block of the carrier 100, and then the carrier 100 and the second floor assembly 350 move downward together until they are pressed on the lower test module, and the guide shaft of the lower test module is matched with the bushing of the carrier 100 to complete the positioning, and then the second floor assembly 350 continues to press down until the top plate limit block is pressed on the carrier 100, and then the test is carried out.

[0038] In this embodiment, the product is in a flat state because it is not bent. After the product is placed in the product positioning block, it is fixed. At the same time, there are vacuum suction holes on the product positioning block to generate suction to fix the product. The structure of the second pressure block test assembly 340 can refer to the first pressure block test assembly 310 of the second embodiment. After the upper test module is pressed on the carrier 100, the spring force in the second pressure block test assembly 340 is moderate, and no compression will be performed at this time to cause the probe to leak out and press on the product. There are springs and guide shafts between the carrier 100 and the rotating platform. After the carrier 100 contacts the upper test module, it will continue to move downward together until it is pressed on the platform plate 240 of the lower test module. The structure of the longitudinal needle mold assembly 250 can adopt the first pressure block test assembly 310 of the second embodiment, or it can adopt the following structure: like Fig. 9 As shown, the longitudinal needle mold assembly 250 includes a guide shaft, a B2B test needle mold 251 and a HOTBAR test needle mold 252. The guide shaft passes through the B2B test needle mold 251 and the HOTBAR test needle mold 252. A spring is elastically connected between the B2B test needle mold 251 and the HOTBAR test needle mold 252. The needle removal process is: the upper test module is pressed on the carrier 100, the carrier 100 moves downward with the upper test module, the product positioning block on the carrier 100 is pressed on the longitudinal needle mold assembly 250 of the lower test module, and then the longitudinal needle mold assembly 250 of the lower test module starts to compress and remove the needle in the first stage, and then the second pressing block test assembly 340 of the upper test module starts to compress and remove the needle in the first stage, and then the longitudinal needle mold assembly 250 and the second pressing block test assembly 340 start to float as a whole to ensure the fit. The reason is that the product is fully positioned only after the product positioning block on the carrier 100 is fitted with the longitudinal needle mold assembly 250 of the lower test module, and then the needle can be removed.

[0039] In the fifth embodiment, a needle mold testing method applicable to multiple processes and multiple stations is proposed, and the method is applicable to the needle mold testing device applicable to multiple processes and multiple stations described in the fourth embodiment. The needle mold testing method applicable to multiple processes and multiple stations includes the following steps S202 to S208: Step S202, placing the flattened flexible circuit board on the turntable carrier 100; Step S204, when the carrier 100 rotates to the working area, the upper test module is controlled to press downward, so that the second pressure block test assembly 340 of the upper test module connects to the contacts on the flexible circuit board; Step S206, controlling the upper test module to continue to drive the carrier 100 to press downward, so that the longitudinal pin mold assembly 250 of the lower test module connects to the contact point below the flexible circuit board; Step S208, connecting the circuit to implement detection.

[0040] Among them, the specific process of step S206 is: the upper test module is pressed on the carrier 100, and the carrier 100 moves downward with the upper test module, and the product positioning block on the carrier 100 is pressed on the longitudinal needle mold assembly 250 of the lower test module, and then the longitudinal needle mold assembly 250 of the lower test module starts the first-level compression to pull out the needle, and then the second pressure block test assembly 340 of the upper test module starts the first-level compression to pull out the needle, and then the longitudinal needle mold assembly 250 and the second pressure block test assembly 340 start to float as a whole to ensure fit.

[0041] Comparing the second embodiment and the fourth embodiment of the needle mold testing device and method applicable to multiple processes and multiple stations, it can be seen that the overall structure of the two is the same, both have an upper test module, a carrier 100 and a lower test module, and both are applicable to multiple processes and multiple stations needle mold detection, and the differences between the two are as follows: Difference 1: It is not enough to completely shape and position the formed and bent products on the carrier 100, and the upper test module and the lower test module need to be provided with modules for shaping and positioning, such as the lateral positioning assembly 210 and the first pressure block test assembly 310 of the second embodiment; while the positioning of the flattened products is relatively simple, and the product positioning can be completed on the carrier 100 with the product positioning block and the cover plate, and the upper test module and the lower test module only contain the test modules, and may not contain the modules for shaping and positioning.

[0042] Difference 2: The upper test module of the second embodiment has a downward pressing action, and the lower test module has an upward pushing action. The upper test module of the fourth embodiment has a downward pressing action, and the carrier 100 moves down with the upper test module until it presses on the lower test module, and the lower test module is fixed. It should be noted that the upward pushing action of the lower test module is not necessary, and it depends on the specific equipment working conditions. The vertical lifting mechanism that can withstand a large load has a high cost, and it should be considered as much as possible not to add it under non-essential working conditions.

[0043] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A needle mold testing device suitable for multiple processes and multiple stations, characterized in that: The needle mold testing device suitable for multiple processes and multiple stations includes: A carrier, arranged on the assembly line, for placing the flexible circuit board in a bent state; A lower test module is arranged below the carrier, and comprises a lateral positioning assembly, a first lateral pin mold assembly and a lifting assembly; the lateral positioning assembly and the first lateral pin mold assembly are arranged on the top of the lifting assembly; the lifting assembly is used to lift the carrier, the lateral positioning assembly and the first lateral pin mold assembly, the lateral positioning assembly is used for one-time positioning of the X-axis of the flexible circuit board, and the first lateral pin mold assembly is used for X-axis contact test of the flexible circuit board; The upper test module is arranged above the carrier, and includes a first pressure block test assembly, a second lateral needle mold assembly and a first top plate assembly, wherein the first pressure block test assembly and the second lateral needle mold assembly are arranged at the bottom of the first top plate assembly; the first top plate assembly is used to drive the first pressure block test assembly and the second lateral needle mold assembly to move downward, the first pressure block test assembly is used for Z-axis secondary positioning and contact testing of the flexible circuit board, and the second lateral needle mold assembly is used for Y-axis contact testing of the flexible circuit board.

2. The needle mold testing device suitable for multiple processes and multiple stations according to claim 1, characterized in that: The lateral positioning assembly comprises: A support frame, laterally connected to the driving device, and arranged together on the top of the jacking assembly; A product support block, arranged on the support frame; A support limit block, arranged on the support frame, for limiting the product support block; A spring is arranged between the product supporting block and the supporting limiting block.

3. The needle mold testing device suitable for multiple processes and multiple stations according to claim 1, characterized in that: The first lateral needle mold assembly comprises: A sliding frame, laterally connected to a driving device, for lateral movement; A needle mold is arranged on the first sliding frame and is used for lateral contact testing.

4. The needle mold testing device suitable for multiple processes and multiple stations according to claim 1, characterized in that: The first compression block test assembly comprises: A pressing block cover plate, arranged on the top plate at the bottom of the first top plate assembly; A pressing block connected to the pressing block cover plate via a spring; The probe passes through the pressing block and is connected to the needle sleeve protective shell on the pressing block cover plate.

5. The needle mold testing device suitable for multiple processes and multiple stations according to claim 1, characterized in that: The second lateral needle mold assembly comprises: A connecting block, which is laterally connected to the driving device; An adapter plate, arranged laterally on the connecting block; A probe fixing block, disposed laterally on the adapter plate; A double-head spring probe is laterally arranged on the probe fixing block.

6. A needle mold testing method suitable for multiple processes and multiple stations, characterized in that: The needle mold testing method applicable to multiple processes and multiple stations comprises the following steps: Place the bent flexible circuit board on the carrier of the production line; When the carrier moves to the working area, the lower test module lifts up the carrier, and the lateral positioning component of the lower test module completes the horizontal shaping and positioning of the flexible circuit board; Control the upper test module to move downward so that the first pressing block test assembly of the upper test module can realize the positioning of the flexible circuit board in the Z-axis direction and connect the contacts in the Z-axis direction; Control the second lateral needle mold assembly of the upper test module to connect the contacts in the Y-axis direction of the flexible circuit board; The first lateral pin mold assembly of the lower test module is controlled to connect the contact points in the X-axis direction of the flexible circuit board; Turn on the circuit to realize detection.

7. A needle mold testing device suitable for multiple processes and multiple stations, characterized in that: The needle mold testing device suitable for multiple processes and multiple stations includes: A carrier, arranged on the assembly line, for placing the flexible circuit board in a flattened state; A lower test module, arranged below the carrier, comprising a platform plate and a longitudinal pin mold assembly, wherein the longitudinal pin mold assembly is arranged on the platform plate and is used for contact point testing; The upper test module is arranged above the carrier, and includes a second pressure block test assembly and a second second board assembly. The second pressure block test assembly is arranged on the second second board assembly. The second second board assembly is used to drive the second pressure block test assembly and the carrier to press downward. The second pressure block test assembly is used to perform contact test on the flexible circuit board.

8. The needle mold testing device suitable for multiple processes and multiple stations according to claim 1, characterized in that: The carrier is provided with a bushing, and both the lower test module and the upper test module are provided with a guide shaft, and the bushing is used for being matched and connected with the guide shaft.

9. A needle mold testing method suitable for multiple processes and multiple stations, characterized in that: The needle mold testing method applicable to multiple processes and multiple stations comprises the following steps: Placing the flattened flexible circuit board on a turntable carrier; When the carrier rotates to the working area, the upper test module is controlled to press downward so that the second pressing block test assembly of the upper test module connects to the contact points on the flexible circuit board; Control the upper test module to continue to drive the carrier downward, so that the longitudinal pin mold assembly of the lower test module connects to the contact point under the flexible circuit board; Turn on the circuit to realize detection.

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