Packaging equipment for integrated circuit production and processing and production process thereof

Abstract

The invention relates to the technical field of integrated circuit production and processing, and discloses packaging equipment for integrated circuit production and processing and a production process thereof, and the equipment comprises a supporting part, a lower packaging part is arranged at the center of the upper surface of the supporting part, an upper packaging part is arranged on the upper surface of the lower packaging part, and a fixing part is arranged right above the upper packaging part. Limiting pieces are installed around the center of the upper surface of the supporting piece, stripping pieces are connected to the center and the periphery of the bottom of an inner cavity of the lower packaging piece in an inserted mode, and the bottom ends of the stripping pieces penetrate through the supporting piece and extend downwards. A telescopic part is arranged in the center of the upper surface of the fixing part, the telescopic end of the telescopic part penetrates through the fixing part to be connected with the upper packaging part, and the periphery of the lower surface of the fixing part is attached to the top end of the limiting part; the lower portion of the outer surface of the stripping piece is sleeved with a reset piece, and the top end and the bottom end of the reset piece are attached to the lower surface of the supporting piece and the upper surface of the connecting piece respectively. The back center of the supporting member is rotatably connected with a rotating member.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing and processing technology, specifically to a packaging equipment and manufacturing process for integrated circuit manufacturing and processing. Background Technology

[0002] In the integrated circuit manufacturing process, packaging is a crucial step. Its main function is to protect the integrated circuit chip from the impact of the external environment on the chip's performance, and also to facilitate the installation and use of the integrated circuit. Packaging equipment is the key device for realizing this step, directly affecting the efficiency and quality of packaging.

[0003] In existing integrated circuit packaging equipment, after packaging, integrated circuits are often difficult to remove, which not only increases the labor intensity of operators but also reduces the overall automation level of the operation. Furthermore, the stability of the upper package during its movement when it mates with the lower package is poor, which adversely affects the packaging effect and consequently the product quality of the integrated circuit. Therefore, this paper proposes a packaging equipment and its manufacturing process for integrated circuit production. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides a packaging equipment and manufacturing process for integrated circuit production and processing, so as to solve the technical problem that after the above-mentioned packaging is completed, the integrated circuit is often difficult to remove, which not only increases the labor intensity of operators, but also reduces the overall automation level of operation.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a packaging device for integrated circuit manufacturing and processing, comprising:

[0006] The support member and the lower encapsulation member disposed at the center of the upper surface of the support member, and the upper encapsulation member is added to the upper surface of the lower encapsulation member, and a fixing member is added directly above the upper encapsulation member, and limiting members are installed around the center of the upper surface of the support member, and a stripping member is inserted and connected to the center and the surrounding area of ​​the bottom of the inner cavity of the lower encapsulation member, and the bottom end of the stripping member extends downward through the upper surface of the support member.

[0007] The telescopic component is located at the center of the upper surface of the fixed component, and the telescopic end of the telescopic component extends downward through the upper surface of the fixed component and connects with the upper encapsulation component. The lower surface of the fixed component is in contact with the top of the limiting component.

[0008] A connector is provided at the bottom of the stripper, and a reset member is sleeved on the lower part of the outer surface of the stripper. The top and bottom ends of the reset member are respectively attached to the lower surface of the support member and the upper surface of the connector.

[0009] A rotating member is connected to the back center of the support member, and a rotating end of the rotating member is coaxially connected with a first driving member, two upper sides of the rotating member are connected with a fixing member, and the first driving member is connected with the back of the support member through a first motor base;

[0010] A top pressing member is arranged on the lower surface of the rotating member, and the top pressing member corresponds to the position relationship of the connecting member.

[0011] The support member is a support base, the lower packaging member is a lower packaging base, the upper packaging member is an upper packaging base, the fixing member is a fixing base, the telescopic member is a telescopic electric rod, the material removing member is a top pressing rod, the connecting member is a connecting cone plate, the resetting member is a resetting spring, the limiting member is a limiting column, the rotating member is a rotating disc, the first driving member is a first driving motor, and the top pressing member is a top pressing plate.

[0012] When the integrated circuit is placed in the lower packaging member, the first driving member starts to work to drive the rotating member to rotate, with the rotation of the rotating member, the fixing member gradually moves until it is attached to the limiting member, at this time, the telescopic member is started under the support of the fixing member, the telescopic end thereof extends downward to drive the upper packaging member to move towards the lower packaging member, and finally the upper packaging member and the lower packaging member are attached to each other to package the integrated circuit placed therein, and the packaging of the integrated circuit is the prior art, so it is not described in detail here.

[0013] After the packaging operation is completed, the first driving member drives the rotating member to rotate again to separate the fixing member from the limiting member, and the telescopic end of the telescopic member is retracted upward to drive the upper packaging member to move upward to separate and reset the upper packaging member and the lower packaging member, in this process, the rotation of the rotating member drives the top pressing member to move upward, the top pressing member contacts the connecting member and exerts a pressing force thereon, the connecting member transmits the force to the resetting member to compress the resetting member, with the compression of the resetting member, the material removing member is driven by the connecting member to move upward to eject the packaged integrated circuit from the lower packaging member to the upper packaging member, when the top pressing member no longer exerts the pressing force on the connecting member, the resetting member restores to the original state by virtue of its elasticity to drive the connecting member and the material removing member to move downward to reset, waiting for the next packaging operation.

[0014] Preferably, a guide member is inserted on both sides of the center position of the upper surface of the fixing member, and the bottom end of the guide member is connected with the upper surface of the upper packaging member.

[0015] The guide member is a guide rod.

[0016] When the device operates, the upper packaging member moves, at this time, the guide member connected with the upper surface of the upper packaging member moves on the inserted positions on both sides of the center position of the upper surface of the fixing member to realize the synchronous action with the upper packaging member.

[0017] Preferably, the upper surface of the rear end of the support is installed with a frame connecting piece, and the top material piece is rotatably connected to the center of the frame connecting piece, and the top material piece corresponds to the position above the top end of the lower packaging piece.

[0018] The top material piece is a cam, and the frame connecting piece is a frame connecting bracket.

[0019] During the operation of the device, the frame connecting piece installed on the upper surface of the rear end of the support provides a mounting basis for the top material piece, and the top material piece rotates at the center of the frame connecting piece, and during the rotation process, it acts on the position corresponding to the top end of the lower packaging piece.

[0020] Preferably, the upper surface of the center of the frame connecting piece is installed with a second driving piece, and the second driving piece is coaxially connected to the rotating end of the top material piece.

[0021] The second driving piece is a second driving motor.

[0022] When the top material piece needs to work, the second driving piece installed on the upper surface of the center of the frame connecting piece is started, and since the second driving piece is coaxially connected to the rotating end of the top material piece, the power output by the second driving piece will be directly transmitted to the top material piece, driving the top material piece to rotate on the frame connecting piece.

[0023] Preferably, the upper surface of the front end of the support is installed with a material guiding piece, and the back of the material guiding piece is attached to the front of the lower packaging piece, and a collecting piece is installed at the center of the front surface of the support, and the collecting piece corresponds to the position of the material guiding piece.

[0024] The material guiding piece is a material guiding inclined seat, and the collecting piece is a collecting box.

[0025] When the device is running, the articles on the lower packaging piece move forward under the action of the related parts. Since the material guiding piece is installed at the center of the upper surface of the front end of the support and the back is attached to the front of the lower packaging piece, the articles will enter the material guiding piece and move to the collecting piece installed at the center of the front surface of the support under the guidance of the material guiding piece.

[0026] An integrated circuit production and processing packaging equipment production process based on the above-mentioned integrated circuit production and processing packaging equipment, comprising the following steps:

[0027] S1, equipment preparation step:

[0028] Place the integrated circuit to be packaged in the lower packaging piece. At this time, the support plays a bearing role, and the limiting piece surrounds the lower packaging piece, preparing to limit the subsequent operation;

[0029] S2, packaging execution step:

[0030] The first driving member is started, the first driving member drives the rotating member to rotate, the rotating member drives the fixed member to move downward in the process of rotating, until the lower surface of the fixed member abuts against the top end of the limiting member, at the same time, the telescopic member is started, the telescopic end extends downward, drives the upper packaging member to move downward, and abuts against the lower packaging member, so as to package the integrated circuit placed in the lower packaging member;

[0031] S3, material removal preparation step:

[0032] After the packaging is completed, the first driving member drives the rotating member to rotate reversely again, so that the upper packaging member is separated from the lower packaging member and is reset, at this time, the rotating member continues to rotate, and drives the top pressing member to move upward;

[0033] S4, material removal execution step:

[0034] In the process of moving upward of the top pressing member, the connecting member is extruded, the connecting member is pushed upward after being extruded, the material removal member is extruded upward, and the reset member is extruded at the same time, and finally the packaged integrated circuit is pushed out to the upper side of the lower packaging member;

[0035] S5, material guiding and collecting step:

[0036] The second driving member drives the material pushing member to rotate on the frame connecting member, the convex end of the material pushing member drives the integrated circuit to move outward along the limiting member to the material guiding member, so that the integrated circuit slides along the material guiding member to the inner cavity of the collecting member.

[0037] First, the equipment is prepared, the integrated circuit to be packaged is placed in the lower packaging member, the supporting member plays a bearing role, and the limiting member surrounds the lower packaging member to provide limiting, then the packaging execution stage is entered, the first driving member is started, the first driving member drives the rotating member to rotate, and then drives the fixed member to move downward to abut against the top end of the limiting member, at the same time, the telescopic member is started, the telescopic end extends downward to drive the upper packaging member to move downward and abut against the lower packaging member, and the packaging operation of the integrated circuit is completed;

[0038] After the packaging is completed, the material removal link is entered, the first driving member drives the rotating member to rotate reversely, so that the upper packaging member is separated from the lower packaging member and is reset, the rotating member continues to rotate to drive the top pressing member to move upward, the top pressing member extrudes the connecting member, the connecting member pushes the material removal member upward, the material removal member extrudes the reset member when moving upward, and finally the packaged integrated circuit is pushed out to the upper side of the lower packaging member;

[0039] Finally, the material guiding and collecting are performed, the limiting member limits the pushed-out integrated circuit, the second driving member drives the material pushing member to rotate on the frame connecting member, the convex end of the material pushing member drives the integrated circuit to move outward along the limiting member to the material guiding member, and the integrated circuit slides along the material guiding member to the inner cavity of the collecting member.

[0040] Preferably, the S1, device preparation step further comprises the step of checking whether the guide piece can normally slide up and down freely on both sides of the center position of the upper surface of the fixing piece, and whether the bottom end of the guide piece is stably connected with the upper surface of the upper packaging piece.

[0041] In the S1, device preparation step, the operation of checking whether the guide piece can slide up and down freely on both sides of the center position of the upper surface of the fixing piece is added, and whether the bottom end of the guide piece is stably connected with the upper surface of the upper packaging piece is checked.

[0042] Preferably, the S3, material removal preparation step further comprises the step of starting the second driving piece, rotating the material removal piece on the frame connecting piece, and making the protruding end of the material removal piece push the integrated circuit located above the lower packaging piece and limited by the limiting piece, so as to make the integrated circuit move outward along the limiting piece.

[0043] After the S3, material removal preparation step is completed, the second driving piece is started, the material removal piece is rotated on the frame connecting piece, and the protruding end of the material removal piece pushes the integrated circuit located above the lower packaging piece and limited by the limiting piece, so as to make the integrated circuit move outward along the limiting piece.

[0044] Preferably, after the step of the material removal piece pushing the integrated circuit to move outward along the limiting piece, the step of making the integrated circuit move to the material guide piece and slide along the material guide piece to the inner cavity of the collecting piece is further included.

[0045] After the material removal piece pushes the integrated circuit to move outward along the limiting piece, the integrated circuit will move to the material guide piece and slide along the material guide piece to the inner cavity of the collecting piece.

[0046] Preferably, in the S2, packaging execution step, the guide piece plays a guiding role for the movement of the upper packaging piece during the downward movement of the fixing piece driving the upper packaging piece, so as to ensure that the upper packaging piece and the lower packaging piece are accurately fitted.

[0047] In the S2, packaging execution step, when the fixing piece drives the upper packaging piece to move downward, the guide piece plays a guiding role for the movement of the upper packaging piece, so as to ensure that the upper packaging piece and the lower packaging piece can be accurately fitted.

[0048] Compared with the prior art, the packaging equipment for integrated circuit production and processing and the production process thereof provided by the present application have the following beneficial effects:

[0049] The packaging equipment for integrated circuit production and processing and the production process thereof, the rotating member is connected to the back surface of the supporting member, can rotate under the driving of the first driving member, and is connected to the fixed member on the two sides and the upper part, can drive the fixed member and the upper packaging member to overturn and other actions, is convenient for adjusting the position of the upper packaging member, adapts to different operation requirements, the first driving member is connected to the supporting member through the first motor seat, ensures the stability of the driving process, and the pressing member is arranged on the lower surface of the rotating member and corresponds to the position of the connecting member, the pressing member can press the connecting member when the rotating member rotates, and then drives the stripping member to move upward to realize stripping, realizes the automatic ejection of the packaged integrated circuit, and manual stripping is not needed, and the automation degree of operation is improved;

[0050] The telescopic member is arranged on the fixed member, the telescopic end of the telescopic member is connected to the upper packaging member, can drive the upper packaging member to move up and down, realizes the cooperation and packaging with the lower packaging member, and the lower surface of the fixed member is attached to the top end of the limiting member, further improves the stability of the upper packaging member when moving. BRIEF DESCRIPTION OF DRAWINGS

[0051] Figure 1 It is a whole structure schematic view of the application;

[0052] Figure 2 It is a separation structure schematic view of the upper packaging member and the lower packaging member of the application;

[0053] Figure 3 It is a rotating member and its connection structure schematic view of the application;

[0054] Figure 4 It is a fixed member cross-section structure schematic view of the application;

[0055] Figure 5 It is a lower packaging member and its connection structure schematic view of the application;

[0056] Figure 6 It is a supporting member cross-section bottom structure schematic view of the application;

[0057] Figure 7 It is a process schematic view of the application.

[0058] In the figure: 1, supporting member; 2, lower packaging member; 3, upper packaging member; 4, fixed member; 5, telescopic member; 6, guide member; 7, stripping member; 8, connecting member; 9, reset member; 10, limiting member; 11, rotating member; 12, first driving member; 13, pressing member; 14, material feeding member; 15, second driving member; 16, material guiding member; 17, collecting member; 18, frame connecting member. DETAILED DESCRIPTION

[0059] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0060] The present application provides a technical solution, a packaging equipment for integrated circuit production and processing and a production process thereof, comprising: Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 a support 1, and a lower packaging part 2 arranged at the center of the upper surface of the support 1, and an upper packaging part 3 added to the upper surface of the lower packaging part 2, and a fixing part 4 added directly above the upper packaging part 3, and a limiting part 10 mounted around the center of the upper surface of the support 1, and a stripping part 7 inserted into the center and around the bottom of the inner cavity of the lower packaging part 2, and the bottom end of the stripping part 7 extends downward through the upper surface of the support 1;

[0061] a telescopic part 5 arranged at the center of the upper surface of the fixing part 4, and the telescopic end of the telescopic part 5 extends downward through the upper surface of the fixing part 4 and is connected with the upper packaging part 3, and the lower surface of the fixing part 4 is in contact with the top end of the limiting part 10;

[0062] a connecting part 8 arranged at the bottom end of the stripping part 7, and a reset part 9 sleeved on the outer surface of the stripping part 7, and the top end and the bottom end of the reset part 9 are in contact with the lower surface of the support 1 and the upper surface of the connecting part 8, respectively;

[0063] a rotating part 11 rotatably connected to the center of the back surface of the support 1, and the rotating end of the rotating part 11 is coaxially connected with a first driving part 12, and the two sides of the upper part of the rotating part 11 are connected with the fixing part 4, and the first driving part 12 is connected with the back surface of the support 1 through a first motor seat;

[0064] a top pressing part 13 arranged on the lower surface of the rotating part 11, and the position relationship of the top pressing part 13 corresponds to that of the connecting part 8.

[0065] When the integrated circuit is placed in the lower packaging member 2, the first driving member 12 starts to operate to drive the rotating member 11 to rotate. With the rotation of the rotating member 11, the fixed member 4 gradually moves until it is attached to the limiting member 10. At this time, the telescopic member 5 is activated under the support of the fixed member 4, and the telescopic end extends downward to drive the upper packaging member 3 to move towards the lower packaging member 2, so that the upper packaging member 3 and the lower packaging member 2 are attached to each other, and the integrated circuit placed inside is packaged. The packaging of the integrated circuit is the prior art, and therefore will not be described in detail here.

[0066] After the packaging operation is completed, the first driving member 12 drives the rotating member 11 to rotate again, so that the fixed member 4 is separated from the limiting member 10, and the telescopic end of the telescopic member 5 is retracted upward to drive the upper packaging member 3 to move upward, so that the upper packaging member 3 and the lower packaging member 2 are separated and reset. In this process, the rotation of the rotating member 11 drives the top pressing member 13 to move upward, and the top pressing member 13 contacts and exerts pressure on the connecting member 8. After the connecting member 8 is pressed, the force is transmitted to the reset member 9, so that the reset member 9 is compressed and deformed. With the compression of the reset member 9, the stripping member 7 is driven by the connecting member 8 to move upward, and then the integrated circuit after packaging is ejected from the lower packaging member 2 to the upper side. When the top pressing member 13 no longer exerts pressure on the connecting member 8, the reset member 9 restores to its original state by its own elasticity, drives the connecting member 8 and the stripping member 7 to move downward and reset, and waits for the next packaging operation.

[0067] The packaging device can accurately limit the position of the fixed member 4 and the upper packaging member 3 during the packaging process through the attachment of the limiting member 10 and the fixed member 4, effectively ensuring the accuracy when the upper packaging member 3 and the lower packaging member 2 are attached, thereby improving the precision of the integrated circuit packaging and reducing the packaging defects caused by positional deviation.

[0068] With the driving force of the telescopic member 5, a stable and appropriate attachment pressure can be formed between the upper packaging member 3 and the lower packaging member 2, ensuring that the integrated circuit can be firmly packaged during the packaging process, and improving the reliability and consistency of the packaging;

[0069] The automatic attachment and separation of the upper packaging member 3 and the lower packaging member 2 are realized by the cooperation of the rotating member 11 and the first driving member 12, without the need for manual operation, which improves the automation degree of the packaging process, saves labor cost, speeds up the packaging rhythm, and improves the production efficiency;

[0070] The cooperation of the stripping member 7, the connecting member 8, the reset member 9 and the top pressing member 13 can automatically eject the integrated circuit after packaging, avoiding the damage to the integrated circuit caused by manual material taking, and further improving the automation level of the equipment, making the entire packaging process more coherent and smooth;

[0071] The linkage design between the components is reasonable and compact, from the placement of the integrated circuit, packaging to the final removal, forming a complete automatic working cycle, not only ensuring the stability of the packaging quality, but also being conducive to the realization of large-scale integrated circuit batch production.

[0072] Please refer to Figure 4 The upper surface of the fixing member 4 is provided with a guide member 6 on both sides of the center position, and the bottom end of the guide member 6 is connected with the upper surface of the upper packaging member 3.

[0073] When the device is running, the upper packaging member 3 moves, and at this time, the guide member 6 connected with the upper surface of the upper packaging member 3 will move accordingly at the insertion position on both sides of the center position of the upper surface of the fixing member 4, realizing the synchronous action with the upper packaging member 3.

[0074] Through the insertion connection of the guide member 6 on the fixing member 4 and the movement of the upper packaging member 3, the movement direction of the upper packaging member 3 can be limited and guided, ensuring the stability of the movement process of the upper packaging member 3, avoiding the deviation, and thus improving the accuracy of the device operation.

[0075] Please refer to Figure 5 With Figure 6 The upper surface of the support member 1 is provided with a frame connecting member 18 at the center position of the rear end, and a lifting member 14 is rotatably connected with the center position of the frame connecting member 18, and the lifting member 14 corresponds to the position above the top end of the lower packaging member 2.

[0076] During the operation of the device, the frame connecting member 18 installed at the center position of the rear end of the upper surface of the support member 1 provides a mounting basis for the lifting member 14, and the lifting member 14 rotates at the center position of the frame connecting member 18, and during the rotation process, it will act on the position corresponding to the top end of the lower packaging member 2.

[0077] The lifting member 14 is connected with the support member 1 through the frame connecting member 18 and can rotate, and can be used to process the articles on the top end of the lower packaging member 2, so as to separate or move the articles from the lower packaging member 2, and improve the convenience of processing the articles on the lower packaging member 2.

[0078] The upper surface of the frame connecting member 18 is provided with a second driving member 15, and the second driving member 15 is coaxially connected with the rotating end of the lifting member 14.

[0079] When the lifting member 14 needs to work, the second driving member 15 installed on the upper surface of the frame connecting member 18 is started, and since the second driving member 15 is coaxially connected with the rotating end of the lifting member 14, the power output by the second driving member 15 will be directly transmitted to the lifting member 14, driving the lifting member 14 to rotate on the frame connecting member 18.

[0080] The second driving member 15 provides a power source for the rotation of the material pushing member 14, and ensures the directness and stability of power transmission through coaxial connection, so that the rotation speed and angle of the material pushing member 14 can be effectively controlled by the second driving member 15, and the controllability of the action of the material pushing member 14 is improved.

[0081] Please refer to Figure 1 The upper surface of the support member 1 is provided with a material guiding member 16 at the front end center position, and the back surface of the material guiding member 16 is attached to the front surface of the lower packaging member 2. The collecting member 17 is installed at the center position of the front surface of the support member 1, and the position relationship of the collecting member 17 corresponds to that of the material guiding member 16.

[0082] When the device is running, the articles on the lower packaging member 2 move forward under the action of the related parts. Since the material guiding member 16 is installed at the front end center position of the upper surface of the support member 1 and the back surface is attached to the front surface of the lower packaging member 2, the articles will enter the material guiding member 16 and move to the collecting member 17 installed at the center position of the front surface of the support member 1 under the guidance of the material guiding member 16.

[0083] The material guiding member 16 is attached to the lower packaging member 2, which can smoothly receive the articles on the lower packaging member 2 and accurately guide the articles into the collecting member 17 through its guiding action, realizing the orderly conveying and centralized collection of the articles, avoiding the scattering of the articles, and improving the coherence and efficiency of the overall process.

[0084] Please refer to Figure 7 A packaging device production process for integrated circuit production and processing based on the above-mentioned packaging device for integrated circuit production and processing, comprising the following steps:

[0085] S1, device preparation step:

[0086] Place the integrated circuit to be packaged in the lower packaging member 2. At this time, the support member 1 plays a bearing role, and the limiting member 10 surrounds the lower packaging member 2, preparing to limit the subsequent operation;

[0087] S2, packaging execution step:

[0088] Start the first driving member 12, which drives the rotating member 11 to rotate. The rotating member 11 drives the fixed member 4 to move downward during rotation, until the lower surface of the fixed member 4 is attached to the top end of the limiting member 10. At the same time, the telescopic member 5 is started, and the telescopic end extends downward, driving the upper packaging member 3 to move downward and attach to the lower packaging member 2, so as to perform packaging operation on the integrated circuit placed in the lower packaging member 2;

[0089] S3, material removal preparation step:

[0090] After the packaging is completed, the first driving member 12 drives the rotating member 11 to rotate reversely, so that the upper packaging member 3 is separated from the lower packaging member 2 and is reset, at this time, the rotating member 11 continues to rotate, and the top pressing member 13 moves upward;

[0091] S4, material removing execution step:

[0092] During the upward movement of the top pressing member 13, the connecting member 8 is extruded, the connecting member 8 is pushed upward after being extruded, the material removing member 7 is pushed upward, the material removing member 7 moves upward while extruding the reset member 9, and finally the packaged integrated circuit is pushed out to the upper side of the lower packaging member 2;

[0093] S5, material guiding and collecting step:

[0094] The second driving member 15 drives the material top member 14 to rotate on the frame connecting member 18, the convex end of the material top member 14 drives the integrated circuit to move outward along the limiting member 10 to the material guiding member 16, and the integrated circuit slides along the material guiding member 16 to the inner cavity of the collecting member 17.

[0095] First, the equipment is prepared, the integrated circuit to be packaged is placed in the lower packaging member 2, the supporting member 1 plays a bearing role, the limiting member 10 surrounds the lower packaging member 2 to provide limiting, and then the packaging execution stage is entered, the first driving member 12 is started, the rotating member 11 is driven to rotate, the fixed member 4 is driven to move downward to the top end of the limiting member 10, the telescopic member 5 is started, the telescopic end is extended downward to drive the upper packaging member 3 to move downward and abut against the lower packaging member 2, and the packaging operation of the integrated circuit is completed;

[0096] After the packaging is completed, the first driving member 12 drives the rotating member 11 to rotate reversely, so that the upper packaging member 3 is separated from the lower packaging member 2 and is reset, at this time, the rotating member 11 continues to rotate, and the top pressing member 13 moves upward, the top pressing member 13 extrudes the connecting member 8, the connecting member 8 pushes the material removing member 7 upward, the material removing member 7 moves upward while extruding the reset member 9, and finally the packaged integrated circuit is pushed out to the upper side of the lower packaging member 2;

[0097] Finally, the material guiding and collecting are performed, the limiting member 10 limits the pushed-out integrated circuit, the second driving member 15 drives the material top member 14 to rotate on the frame connecting member 18, the convex end of the material top member 14 drives the integrated circuit to move outward along the limiting member 10 to the material guiding member 16, and the integrated circuit slides along the material guiding member 16 to the inner cavity of the collecting member 17;

[0098] The working process of the packaging equipment is coherent and has high automation degree, from the placement of the integrated circuit, the packaging to the material removing and the collecting, each step is automatically completed through the cooperation of each structural member, the manual operation link is reduced, the labor cost is reduced, and the packaging efficiency is improved;

[0099] The limiting piece 10 plays a limiting role multiple times, limiting the subsequent operation in the equipment preparation stage, limiting the ejected integrated circuit after the material is removed, ensuring the position accuracy of the integrated circuit in the packaging and transfer process, and improving the packaging quality;

[0100] The fixing piece 4 is attached to the limiting piece 10, and the upper packaging piece 3 is attached to the lower packaging piece 2. The multiple attachment effects make the packaging of the integrated circuit more compact and firm, and improve the packaging effect;

[0101] Through the cooperation of the pressing piece 13, the connecting piece 8, the material removing piece 7 and the resetting piece 9, the packaged integrated circuit can be smoothly ejected, avoiding damage to the integrated circuit due to improper material removing method, and protecting the product;

[0102] By cooperating the material pressing piece 14, the material guiding piece 16 and the collecting piece 17, the automatic transfer and collection of the packaged integrated circuit are realized, making the entire production and processing process more smooth and facilitating the subsequent unified processing of the integrated circuit.

[0103] In the equipment preparation step S1, it further includes the step of checking whether the guide piece 6 can normally slide up and down freely on both sides of the center position of the upper surface of the fixing piece 4, and whether the bottom end of the guide piece 6 is stably connected with the upper surface of the upper packaging piece 3.

[0104] In the equipment preparation step S1, the operation of checking whether the guide piece 6 can slide up and down freely on both sides of the center position of the upper surface of the fixing piece 4 is added, and the connection between the bottom end of the guide piece 6 and the upper surface of the upper packaging piece 3 is checked.

[0105] By checking the sliding performance of the guide piece 6 and the connection state with the upper packaging piece 3 in advance, it can be ensured that the guide piece 6 can normally play a role in the subsequent operation, avoiding affecting the stability of the packaging process due to abnormal function or loose connection of the guide piece 6.

[0106] After the material removing preparation step S3, it further includes the step of starting the second driving piece 15, the second driving piece 15 rotating the material pressing piece 14 on the frame connecting piece 18, the protruding end of the material pressing piece 14 pushing the integrated circuit located above the lower packaging piece 2 and limited by the limiting piece 10, and moving the integrated circuit outward along the limiting piece 10.

[0107] After the material removing preparation step S3 is completed, the second driving piece 15 is started, the second driving piece 15 rotates the material pressing piece 14 on the frame connecting piece 18, the protruding end of the material pressing piece 14 pushes the integrated circuit located above the lower packaging piece 2 and limited by the limiting piece 10, and moves the integrated circuit outward along the limiting piece 10;

[0108] The second driving piece 15 drives the material pressing piece 14 to realize the automatic movement of the integrated circuit, without manual intervention, which can improve the efficiency of the transfer of the integrated circuit after the material is removed, and ensure the stability of the movement process.

[0109] The step of pushing the integrated circuits to move outward along the limiting piece 10 by the material pushing piece 14 further comprises the steps of moving the integrated circuits to the material guiding piece 16 and sliding the integrated circuits along the material guiding piece 16 to the inner cavity of the collecting piece 17.

[0110] After the integrated circuits are pushed to move outward along the limiting piece 10 by the material pushing piece 14, the integrated circuits are moved to the material guiding piece 16 and slide along the material guiding piece 16 to the inner cavity of the collecting piece 17;

[0111] With the guiding action of the material guiding piece 16, the integrated circuits can be orderly slid into the collecting piece 17, realizing automatic collection of the integrated circuits, avoiding accumulation or scattering of the integrated circuits, and facilitating subsequent unified processing of the packaged integrated circuits.

[0112] S2, in the packaging execution step, when the upper packaging piece 3 is moved downward by the fixing piece 4, the guiding piece 6 plays a guiding role for the movement of the upper packaging piece 3, ensuring that the upper packaging piece 3 and the lower packaging piece 2 are accurately fitted.

[0113] In S2, in the packaging execution step, when the upper packaging piece 3 is moved downward by the fixing piece 4, the guiding piece 6 plays a guiding role for the movement of the upper packaging piece 3, ensuring that the upper packaging piece 3 and the lower packaging piece 2 are accurately fitted.

[0114] The guiding action of the guiding piece 6 can effectively ensure that the upper packaging piece 3 does not deviate during movement, thereby ensuring accurate fitting of the upper packaging piece 3 and the lower packaging piece 2, and facilitating improvement of the precision and quality of integrated circuit packaging.

[0115] The scheme: the integrated circuits to be packaged are placed in the lower packaging piece 2, the supporting piece 1 plays a bearing role, the limiting piece 10 surrounds the lower packaging piece 2 to prepare for limiting subsequent operations, and whether the guiding piece 6 can freely slide up and down on both sides of the center position on the upper surface of the fixing piece 4 and whether the bottom end of the guiding piece 6 is stably connected with the upper surface of the upper packaging piece 3 are checked.

[0116] Start the first driving piece 12, the first driving piece 12 drives the rotating piece 11 to rotate, the rotating piece 11 drives the fixing piece 4 to move downward during rotation, until the lower surface of the fixing piece 4 is fitted with the top end of the limiting piece 10, at this time the telescopic piece 5 is started, the telescopic end extends downward, driving the upper packaging piece 3 to move downward, in this process, the guiding piece 6 moves with the upper packaging piece 3 and plays a guiding role for the movement of the upper packaging piece 3, ensuring that the upper packaging piece 3 and the lower packaging piece 2 are accurately fitted, thereby performing packaging operation on the integrated circuits placed in the lower packaging piece 2;

[0117] After the packaging is completed, the first driving member 12 drives the rotating member 11 to rotate reversely, so that the upper packaging member 3 is separated from the lower packaging member 2 and is reset, the rotating member 11 continues to rotate and drives the top pressing member 13 to move upward, and the second driving member 15 is started, and the second driving member 15 drives the top material member 14 to rotate on the frame connecting member 18;

[0118] The top pressing member 13 extrudes the connecting member 8 during the upward movement, the connecting member 8 is pushed upward by the extrusion, the material removing member 7 is extruded and pushed upward by the connecting member 8, and the material removing member 7 is extruded and pushed upward by the reset member 9 during the upward movement, and finally the packaged integrated circuit is pushed out to the upper side of the lower packaging member 2, the convex end of the top material member 14 pushes the integrated circuit located above the lower packaging member 2 and limited by the limiting member 10, so that the integrated circuit moves outward along the limiting member 10;

[0119] The integrated circuit is pushed by the top material member 14 and moves to the material guiding member 16, and slides along the material guiding member 16 to the inner cavity of the collecting member 17; when the top pressing member 13 no longer applies pressure to the connecting member 8, the reset member 9 restores to the original state by virtue of its elasticity, drives the connecting member 8 and the material removing member 7 to move downward and reset, and waits for the next packaging operation.

[0120] It should be noted that in this text, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0121] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A packaging equipment for integrated circuit manufacturing and processing, characterized in that, include: Support (1), and lower encapsulation (2) disposed at the center of the upper surface of support (1), and upper encapsulation (3) is added to the upper surface of lower encapsulation (2), and a fixing member (4) is added directly above the upper encapsulation (3), and limiting members (10) are installed around the center of the upper surface of support (1), and a stripping member (7) is inserted and connected to the bottom center and the surrounding area of ​​the inner cavity of lower encapsulation (2), and the bottom end of the stripping member (7) extends downward through the upper surface of support (1); The telescopic component (5) is located at the center of the upper surface of the fixing component (4), and the telescopic end of the telescopic component (5) extends downward through the upper surface of the fixing component (4) and connects with the upper encapsulation component (3). The lower surface of the fixing component (4) is in contact with the top of the limiting component (10). The connector (8) is located at the bottom of the stripper (7), and the lower part of the outer surface of the stripper (7) is fitted with a reset member (9). The top and bottom of the reset member (9) are respectively attached to the lower surface of the support member (1) and the upper surface of the connector (8). Rotating component (11) is rotatably connected to the center of the back side of support component (1), and the rotating end of rotating component (11) is coaxially connected to the first driving component (12). The upper parts of both sides of rotating component (11) are connected to fixed component (4), and the first driving component (12) is connected to the back side of support component (1) through the first motor base. The pressing member (13) is disposed on the lower surface of the rotating member (11), and the positional relationship between the pressing member (13) and the connecting member (8) is corresponding.

2. The packaging equipment for integrated circuit manufacturing and processing according to claim 1, characterized in that: Guide members (6) are inserted and connected on both sides of the center position of the upper surface of the fixing member (4), and the bottom end of the guide member (6) is connected to the upper surface of the upper encapsulation member (3).

3. The packaging equipment for integrated circuit manufacturing and processing according to claim 1, characterized in that: A frame connector (18) is installed at the center of the rear end of the upper surface of the support member (1), and a top material member (14) is rotatably connected at the center of the frame connector (18), and the top material member (14) corresponds to the position above the top of the lower encapsulation member (2).

4. The packaging equipment for integrated circuit manufacturing and processing according to claim 3, characterized in that: The second driving member (15) is installed at the center of the upper surface of the frame connector (18), and the second driving member (15) is coaxially connected to the rotating end of the top material member (14).

5. The packaging equipment for integrated circuit manufacturing and processing according to claim 1, characterized in that: A guide (16) is installed at the center of the front end of the upper surface of the support (1), and the back of the guide (16) is in contact with the front of the lower package (2). A collector (17) is installed at the center of the front of the support (1), and the positional relationship between the collector (17) and the guide (16) is corresponding.

6. A manufacturing process for packaging equipment used in integrated circuit production and processing, based on the packaging equipment for integrated circuit production and processing as described in any one of claims 1-5, characterized in that, Includes the following steps: S1. Equipment preparation steps: The integrated circuit to be packaged is placed inside the lower package (2). At this time, the support (1) plays a supporting role, and the limiting member (10) surrounds the lower package (2) to limit the subsequent operation. S2. Encapsulation and execution steps: The first driving component (12) is activated, which drives the rotating component (11) to rotate. During the rotation of the rotating component (11), the fixed component (4) is moved downward until the lower surface of the fixed component (4) is in contact with the top of the limiting component (10). At the same time, the telescopic component (5) is activated, and its telescopic end extends downward, driving the upper package (3) to move downward and in contact with the lower package (2), thereby performing a packaging operation on the integrated circuit placed in the lower package (2). S3. Material removal preparation steps: After the encapsulation is completed, the first driving component (12) drives the rotating component (11) to rotate in the opposite direction again, so that the upper encapsulation component (3) and the lower encapsulation component (2) are separated and reset. At this time, the rotating component (11) continues to rotate, driving the top pressing component (13) to move upward. S4. Stripping execution steps: During the upward movement of the top pressing member (13), it squeezes the connecting member (8). After being squeezed, the connecting member (8) pushes the stripping member (7) upward. While the stripping member (7) moves upward, it squeezes the reset member (9), and finally pushes the packaged integrated circuit above the lower package member (2). S5. Material collection step: The second driving member (15) drives the top member (14) to rotate on the frame connector (18). The protruding end of the top member (14) drives the integrated circuit to move outward along the limiting member (10) to the guide member (16), so that the integrated circuit slides along the guide member (16) to the inner cavity of the collecting member (17).

7. The manufacturing process of a packaging equipment for integrated circuit production and processing according to claim 6, characterized in that: The S1 equipment preparation step also includes checking whether the guide (6) can slide freely up and down on both sides of the center position on the upper surface of the fixing part (4) and whether the bottom end of the guide (6) is firmly connected to the upper surface of the upper encapsulation part (3).

8. The manufacturing process of a packaging equipment for integrated circuit production and processing according to claim 6, characterized in that: After the S3 unloading preparation step, the method further includes starting the second driving member (15), which drives the top member (14) to rotate on the frame connector (18), so that the protruding end of the top member (14) pushes the integrated circuit located above the lower package (2) and limited by the limiting member (10), so that it moves outward along the limiting member (10).

9. The manufacturing process of a packaging equipment for integrated circuit production and processing according to claim 8, characterized in that: After the step of the top material member (14) pushing the integrated circuit outward along the limiting member (10), the method further includes the step of moving the integrated circuit onto the guide member (16) and sliding the integrated circuit along the guide member (16) into the inner cavity of the collecting member (17).

10. The manufacturing process of a packaging equipment for integrated circuit production and processing according to claim 6, characterized in that: In the S2 encapsulation execution step, during the process of the fixing member (4) driving the upper encapsulation member (3) to move downward, the guide member (6) plays a guiding role in the movement of the upper encapsulation member (3), ensuring that the upper encapsulation member (3) and the lower encapsulation member (2) are accurately fitted together.

Images