Low heat conduction rotating gas guide seat for mocvd equipment and mocvd equipment

Abstract

The application discloses a low-heat-conduction rotating gas guide seat for an MOCVD device and the MOCVD device, and relates to the technical field of MOCVD devices. The base contact seat is internally provided with a gas guide channel for conveying gas to the base; the gas guide pipe fixing seat is arranged below the base contact seat; the upper end of the gas guide pipe is communicated with the gas guide channel, and the top end of the gas guide pipe abuts against the base contact seat; the bottom end of the gas guide pipe abuts against the gas guide pipe fixing seat; the heat insulation connecting structure is arranged between the base contact seat and the gas guide pipe fixing seat, so that a separated heat insulation gap is formed between the adjacent surfaces of the two; and the expanded heat dissipation surface structure is arranged on the gas guide pipe fixing seat and used for increasing the heat dissipation surface area of the gas guide pipe fixing seat. The application has the advantages of effectively reducing the heat conduction path of the high-temperature base to the bottom precision components, reducing heat transfer, protecting sensitive components such as the magnetic fluid seal, improving the operation stability and service life of the device, and the like.

Description

Technical Field

[0001] This application relates to the field of semiconductor thin film deposition equipment technology, and more specifically, to a low thermal conductivity rotating gas guide seat for MOCVD equipment and MOCVD equipment. Background Technology

[0002] In MOCVD (Metal Organic Chemical Vapor Deposition) equipment, wafers are placed on a substrate made of graphite or silicon carbide for thin film deposition. To obtain highly uniform films, the substrate needs stable levitation and precise rotation. This is achieved through a system comprising a base and a rotating gas guide. Specifically, the rotating gas guide is driven at high speed by a magnetohydrodynamic (MHD) sealed spindle assembly, which, together with the spindle assembly, drives the base on top of it to rotate. The base contains precise gas channels that inject a uniform gas flow into the bottom of the substrate, levitizing it using an air cushion principle. Simultaneously, the tangential component of the injected gas flow drives the substrate to rotate autonomously, independent of the base. This design aims to induce complex composite motions in the wafer to optimize the uniformity of the reactant gases.

[0003] The rotating gas guide, as the core of this system, is typically a hollow cylindrical quartz structure. Its core function is to act as a rotating drive shaft and transport suspended gas to the base. Existing designs mainly focus on achieving reliable transmission and gas delivery, and their structures are mostly simple thick-walled cylinders with a ring of holes at the top as gas channels, without any specialized design at the mechanical structure level to block heat transfer downwards.

[0004] However, during the manufacturing process, the temperature of the base directly supporting the high-temperature substrate can reach 1200 to 1600 degrees Celsius. A massive amount of heat will still be conducted from the high-temperature base to the top of the tightly connected rotating gas guide seat through thermal radiation and partial solid-state contact. Because the existing gas guide seat has a simple structure and lacks effective thermal insulation design, heat will be efficiently conducted downwards along its axis.

[0005] This presents a significant technical challenge: the bottom of the air guide seat is directly connected to the magnetohydrodynamic (MHD) seal spindle assembly. The MHD seal spindle assembly contains a permanent magnet, magnetic fluid, and bearings—all highly temperature-sensitive components—and its long-term reliable operating temperature is typically required to be below 150 degrees Celsius. The continuous axial heat flow from above can cause its temperature to far exceed design limits, leading to magnetic fluid evaporation failure, permanent magnet demagnetization, and permanent damage to the seal performance, ultimately resulting in equipment failure and process interruption.

[0006] To address this issue, existing technologies typically employ a passive strategy, involving the installation of an independent external cooling system (such as a water-cooled jacket) around the magnetohydrodynamic seal to attempt to remove heat already conducted to the bottom. However, this method cannot reduce upstream heat input, placing high demands on the cooling performance of the external cooling system and increasing its complexity. On the other hand, to enhance cooling, materials with lower thermal conductivity (such as quartz) are often chosen to fabricate the entire gas guide seat. While quartz exhibits good chemical stability and heat resistance, simply changing the material does not alter the fundamental path of heat conduction along the solid axis, resulting in an unsatisfactory cooling effect. Therefore, existing technologies urgently need improvement to address these problems. Summary of the Invention

[0007] The purpose of this application is to provide a low thermal conductivity rotary air guide seat and MOCVD equipment, which has the advantages of effectively reducing the heat conduction path from the high temperature base to the precision components at the bottom, reducing heat transfer, protecting sensitive components such as magnetohydrodynamic seals, and improving the operational stability and service life of the equipment.

[0008] This application provides a low thermal conductivity rotary gas guide for MOCVD equipment, comprising:

[0009] The base contact seat has an internal gas guide channel for supplying gas to the base;

[0010] The air duct fixing seat is located below the base contact seat;

[0011] The air guide tube has its upper end connected to the air guide channel, and the top end of the air guide tube abuts against the base contact seat, while the bottom end of the air guide tube abuts against the air guide tube fixing seat.

[0012] A thermally insulating connection structure is provided between the base contact seat and the air duct fixing seat. The thermally insulating connection structure is configured to form a separate thermally insulating gap between the adjacent surfaces of the two while fixing the base contact seat and the air duct fixing seat.

[0013] An extended heat dissipation surface structure is installed on the air duct fixing base to increase the heat dissipation surface area of ​​the air duct fixing base.

[0014] Furthermore, the thermal insulation connection structure includes:

[0015] At least one upwardly protruding limiting boss is provided on the top of the air tube fixing seat;

[0016] Connector located at the bottom of the base contact seat;

[0017] The base contact seat is fixedly connected to the limiting boss through a connector, thereby forming a heat insulation gap between the lower surface of the base contact seat and the upper surface of the air duct fixing seat.

[0018] Furthermore, the limiting boss is provided with a groove extending radially inward, and the connecting part is a buckle or pin that mates with the groove.

[0019] Furthermore, the extended heat dissipation surface structure includes multiple heat dissipation fins disposed on the inner peripheral wall of the air duct fixing seat and extending along the axial direction of the air duct fixing seat.

[0020] Furthermore, the heat dissipation fins extend radially inward along the air duct fixing seat and form a clearance fit with the outer peripheral wall of the air duct.

[0021] Furthermore, axially extending heat dissipation through holes are provided on the peripheral wall of the air duct fixing seat between adjacent heat dissipation fins.

[0022] Furthermore, the base contact seat includes:

[0023] The annular edge portion, the upper surface of which is used to contact the base;

[0024] The central recess is formed by the downward indentation of the lower surface of the base contact seat. The air guide channel passes through the recess and extends to the edge, and the outlet end of the air guide channel is located on the upper surface of the edge.

[0025] Furthermore, the recessed portion has at least one axial through hole.

[0026] Furthermore, as the heat dissipation fins extend radially inward from the inner peripheral wall of the air duct fixing seat, the longitudinal section gradually narrows, and the side near the base contact seat has an inclined surface.

[0027] Furthermore, an MOCVD apparatus includes the aforementioned low thermal conductivity rotary gas guide seat.

[0028] As can be seen from the above, the low thermal conductivity rotary gas guide seat and MOCVD equipment provided in this application include a base contact seat, a gas guide tube fixing seat, a gas guide tube, a thermal insulation connection structure, and an extended heat dissipation surface structure. The thermal insulation gap reduces the conduction of heat from the base contact seat to the gas guide tube fixing seat, and the extended heat dissipation surface structure enhances heat dissipation. It has the advantages of effectively reducing the heat conduction path from the high temperature base to the precision components at the bottom, reducing heat transfer, protecting sensitive components such as magnetohydrodynamic seals, and improving the operational stability and service life of the equipment. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of an MOCVD device provided in this application.

[0030] Figure 2 This is a schematic diagram of a low thermal conductivity rotary air guide seat provided in this application.

[0031] Figure 3A side view of a low thermal conductivity rotary air guide provided in this application.

[0032] Figure 4 An explosion diagram of a low thermal conductivity rotating gas guide seat provided in this application.

[0033] Figure 5 This is a schematic diagram of the structure of a base contact seat provided in this application.

[0034] Figure 6 Provided for this application Figure 5 A magnified view of a portion at point A.

[0035] Figure 7 A top view of a low thermal conductivity rotary air guide provided in this application.

[0036] Figure 8 Provided for this application Figure 7 A cross-sectional view along the BB direction.

[0037] Figure label:

[0038] 100. MOCVD equipment; 1. Rotary gas guide seat; 2. Base; 3. Thermal insulation connection structure; 4. Extended heat dissipation surface structure; 5. Plate tray; 10. Base contact seat; 11. Recess; 12. Edge; 13. Limiting protrusion; 14. Outlet end; 15. Axial through hole; 16. Shaft hole; 17. Lower surface of base contact seat; 18. Connector; 19. Gas guide channel; 20. Gas guide pipe; 21. Main body; 22. Connection 23. Insulation gap; 24. Connecting hole sidewall; 25. Connecting hole bottom plate; 26. Center hole; 27. Connecting hole; 30. Air duct fixing seat; 31. Top of air duct connecting seat; 32. Limiting boss; 33. Groove; 34. Arc-shaped groove; 35. Mounting hole; 36. Heat dissipation through hole; 37. Upper surface of air duct connecting seat; 38. Heat dissipation fins; 39. Bottom of air duct connecting seat; 40. Connecting cylinder; 41. Sloping surface. Detailed Implementation

[0039] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0040] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0041] In traditional MOCVD equipment, the gas guide seat, when supporting a high-temperature substrate, allows a significant amount of heat to be conducted downwards through its upper part. This results in precision components at the bottom of the gas guide seat, such as the magnetohydrodynamic seals, bearings, and motors, being exposed to an excessively high-temperature environment for extended periods. This leads to problems such as seal failure, material thermal deformation, and loss of bearing precision, severely restricting the equipment's production efficiency and reliability. Existing solutions, such as increasing the complexity of the cooling system or changing the materials, are insufficient, necessitating further solutions to this problem.

[0042] Please see Figures 1-3 , Figures 7-8 This application proposes a low thermal conductivity rotary air guide seat 1 for an MOCVD equipment 100, which is configured to effectively reduce heat conduction from a high-temperature base 2 to precision components below. The rotary air guide seat 1 includes a base contact seat 10, an air guide tube fixing seat 30, an air guide tube 20, a thermal insulation connection structure 3, and an extended heat dissipation surface structure 4. The base contact seat 10 has an internal gas channel 19 for supplying gas to the base 2; the gas pipe fixing seat 30 is located below the base contact seat 10; the upper end of the gas pipe 20 is connected to the gas channel 19, and the top end of the gas pipe 20 abuts against the base contact seat 10, and the bottom end of the gas pipe 20 abuts against the gas pipe fixing seat 30; the heat insulation connection structure 3 is located between the base contact seat 10 and the gas pipe fixing seat 30, and the heat insulation connection structure 3 is configured to form a separate heat insulation gap 23 between the adjacent surfaces of the base contact seat 10 and the gas pipe fixing seat 30 while fixing them together; the extended heat dissipation surface structure 4 is located on the gas pipe fixing seat 30 to increase the heat dissipation surface area of ​​the gas pipe fixing seat 30.

[0043] The base contact seat 10 is located above the rotating air guide seat 1, and its upper part is used to directly contact the high-temperature base 2 in the MOCVD equipment 100. In some embodiments, the upper edge of the base contact seat 10 is provided with a limiting protrusion 13, which can be inserted into the base 2 to fix and position the base 2.

[0044] In some embodiments, the base contact seat 10 has an internal gas guiding channel 19. For example, the gas guiding channel 19 can be one or more holes penetrating the base contact seat 10, and its shape can be circular, elliptical, or irregular to adapt to different gas flow and distribution requirements. The outlet end 14 of the gas guiding channel 19 is located on the upper surface of the base contact seat 10 to ensure that the gas can be effectively transferred to the base 2. The main functions of the base contact seat 10 are to provide mechanical support and drive the base 2 to rotate, and to serve as an interface for gas transmission, delivering gas through the internal channel to the base 2 and discharging suspended gas from the base 2 to support the suspension and rotation of the wafer disk 5 and the wafer (not shown) on the wafer disk 5.

[0045] In some embodiments, the base contact seat 10 has a central shaft hole 16 through which the rotating shaft (not shown) of the magnetohydrodynamic sealing spindle assembly passes, and the rotating shaft can drive the base 2 to rotate.

[0046] The air guide tube fixing seat 30 is located below the base contact seat 10. The main function of the air guide tube fixing seat 30 is to provide stable mechanical support and positioning for the air guide tube 20. The air guide tube fixing seat 30 can be an annular or cylindrical structure, and its material can be selected from materials with high melting point and low thermal conductivity, such as quartz.

[0047] Please see Figure 8 In some embodiments, the air tube fixing seat 30 includes, from top to bottom, an air tube connecting seat top 31, a connecting cylinder 40, and an air tube connecting seat bottom 39. The air tube connecting seat top 31 is in the shape of a hollow disc, the connecting cylinder 40 is in the shape of a hollow sleeve, and the air tube connecting seat bottom 39 is also in the shape of a hollow disc, but its diameter is the same as that of the connecting cylinder 40 and smaller than that of the air tube connecting seat top 31.

[0048] Please see Figure 4 A gas guide pipe 20 is disposed between the base contact seat 10 and the gas guide pipe fixing seat 30, connecting the gas guide channel 19 inside the base contact seat 10 and the gas guide pipe fixing seat 30. The upper end of the gas guide pipe 20 communicates with the gas guide channel 19, ensuring that gas smoothly enters the gas guide pipe 20 from the base contact seat 10. Simultaneously, the top end of the gas guide pipe 20 is configured to abut against the lower surface 17 of the base contact seat, forming a reliable gas seal. The bottom end of the gas guide pipe 20 abuts against the upper surface 37 of the gas guide pipe fixing seat, thereby fixing and supporting the gas guide pipe 20. The gas guide pipe 20 can be made of quartz material. By separately setting the gas guide pipe 20, compared with the existing structure of a thick-walled cylinder with a through hole as the gas guide channel 19, the heat radiation area of ​​the gas guide pipe 20 can be significantly increased, while reducing the overall material usage, thereby reducing the axial heat transfer contact area.

[0049] Please see Figure 4In some embodiments, the air duct 20 is a hollow cylindrical shape, which is divided into a main body 21 at the upper end and a connecting part 22 at the lower end with a diameter smaller than that of the main body 21.

[0050] Please see Figure 4 In some embodiments, the bottom 39 of the air duct connector is provided with a mounting hole 35. The mounting hole 35 is a through hole with a larger diameter at the top and a smaller diameter at the bottom. When the air duct 20 is inserted into the mounting hole 35, a small part of the main body 21 and the connecting part 22 are completely inserted into the mounting hole 35, which plays a role in sealing and fixing. The airflow flows into the air duct 20 from the bottom of the connecting part 22.

[0051] Please see Figure 4 In some embodiments, the top 31 of the air duct connector is provided with an arc-shaped groove 34. The arc-shaped groove 34 is axially arranged. When the air duct 20 abuts against the arc-shaped groove 34, it can fix and position the air duct 20. At the same time, the arc-shaped groove 34 is a semi-enclosed structure that exposes part of the air duct 20, reducing the impact on the heat dissipation of the air duct 20.

[0052] Please see Figure 5 , Figure 6 In some embodiments, the back of the base contact seat 10 is provided with a connection hole 27, which is used for positioning and connecting the air guide tube 20. Further, the connection hole 27 includes a recessed connection hole bottom plate 25 and a connection hole sidewall 24 that is flush with the back surface of the base contact seat 10. A central air guide hole 26 is also provided in the center of the connection hole 27. When the air guide tube 20 is inserted into the connection hole 27, the connection hole bottom plate 25 and the connection hole sidewall 24 provide fixation and positioning, while the central hole 26 communicates with the air guide tube 20 to guide air.

[0053] Please see Figure 4 , Figure 8 A thermally insulated connection structure 3 is disposed between the base contact seat 10 and the air duct fixing seat 30. The core function of this structure is to create a separate thermally insulated gap 23 between the adjacent surfaces of the base contact seat 10 and the air duct fixing seat 30 while simultaneously achieving a fixed connection between them. For example, the thermally insulated connection structure 3 can be composed of multiple independent support columns, connecting the two components by point contact or line contact, thereby creating an air gap in most areas. Alternatively, the thermally insulated connection structure 3 can be bolted together. This thermally insulated gap 23 is typically close to a vacuum environment to further reduce heat transfer through convection and conduction. The thermally insulated gap 23 can be selected from 2 to 20 mm.

[0054] Please see Figure 8An extended heat dissipation surface structure 4 is disposed on the air duct fixing base 30 to increase the heat dissipation surface area of ​​the air duct fixing base 30. For example, the extended heat dissipation surface structure 4 may be formed by machining multiple protrusions on the peripheral wall of the air duct fixing base 30, or by attaching a material layer with a high surface area to its surface. By increasing the heat dissipation surface area, the air duct fixing base 30 can more effectively dissipate the small amount of heat conducted down from above to the surrounding environment, thereby reducing its overall temperature.

[0055] In summary, the low thermal conductivity rotary air guide seat 1 of this embodiment effectively reduces the heat conduction path from the high-temperature base 2 to the precision components below by setting a heat-insulating connection structure 3 between the base contact seat 10 and the air guide tube fixing seat 30, and forming a separate heat-insulating gap 23 therebetween. Simultaneously, the extended heat dissipation surface structure 4 provided on the air guide tube fixing seat 30 further enhances the heat dissipation efficiency. Furthermore, the air guide tube 20 is designed as an independent tubular component instead of an opening in the air guide tube fixing seat 30, which increases the heat dissipation area while reducing the axial heat transfer area. Therefore, the operating temperature of precision components such as magnetohydrodynamic seals, bearings, and motors is significantly reduced, avoiding problems such as seal failure, material deformation, and loss of precision due to overheating, thereby improving the operational stability and reliability of the MOCVD equipment 100 and extending the service life of the equipment.

[0056] In the MOCVD equipment 100, a separate thermally insulating gap 23 needs to be formed between the base contact seat 10 of the low thermal conductivity rotating gas guide seat 1 and the gas guide tube fixing seat 30 to effectively block heat transfer. However, in practical applications, ensuring a stable connection between the base contact seat 10 and the gas guide tube fixing seat 30 under complex operating conditions such as high temperature, rotation, and potential vibration, while accurately and reliably maintaining the size and integrity of the thermally insulating gap 23, is a technical challenge that needs to be addressed. Simply setting up a thermally insulating connection structure 3 may not be able to simultaneously satisfy the requirements of connection strength, gap accuracy, and ease of assembly.

[0057] Please see Figure 4 This application further proposes a heat-insulating connection structure 3, which includes at least one upwardly protruding limiting boss 32 on the top of the air duct fixing seat 30, and a connector 18 on the bottom of the base contact seat 10. The base contact seat 10 is fixedly connected to the limiting boss 32 through the connector 18, which enables the air duct fixing seat 30 to drive the base contact seat 10 to rotate, and forms a heat-insulating gap 23 between the lower surface 17 of the base contact seat and the upper surface 37 of the air duct fixing seat.

[0058] Specifically, at least one upwardly protruding limiting boss 32 located on the top of the air duct fixing seat 30 serves to provide support and positioning points for the base contact seat 10 and precisely define the distance between the base contact seat 10 and the air duct fixing seat 30, thereby forming the required heat insulation gap 23. These limiting bosses 32 can be designed in various shapes, such as cylindrical, square, or irregular, and one or more can be provided according to actual needs to ensure connection stability and gap uniformity. They can be integrally formed with the air duct fixing seat 30 or separately manufactured and fixed to the top of the air duct fixing seat 30. The connector 18 located at the bottom of the base contact seat 10 functions to achieve a fixed connection between the base contact seat 10 and the limiting boss 32. The connector 18 can be in various forms such as bolts, screws, pins, clips, or latches, the selection depending on the required connection strength, ease of assembly, and adaptability to differences in thermal expansion. The base contact seat 10 is tightly joined to the limiting boss 32 via the connector 18, thereby firmly fixing the base contact seat 10 above the air duct fixing seat 30. The base contact seat 10 is fixedly connected to the limiting boss 32 via the connector 18, which means that the connector 18 mechanically connects the bottom of the base contact seat 10 to the top or side of the limiting boss 32. Since the limiting boss 32 protrudes upward, its height determines the separation distance between the lower surface 17 of the base contact seat and the upper surface 37 of the air duct fixing seat, thereby precisely forming and maintaining the heat insulation gap 23.

[0059] Through the above technical solution, the cooperation of the limiting boss 32 and the connector 18 provides a simple, stable, and easy-to-assemble thermal insulation connection method. The precise height of the limiting boss 32 ensures the stability and consistency of the thermal gap 23 between the base contact seat 10 and the gas pipe fixing seat 30, effectively reducing the conduction of heat from the high-temperature base contact seat 10 to the gas pipe fixing seat 30, thereby protecting downstream components and maintaining the stability of the gas temperature. At the same time, the fixed connection between the connector 18 and the limiting boss 32 ensures that during the operation of the MOCVD equipment 100, even under complex conditions such as high temperature, rotation, and vibration, the base contact seat 10 and the gas pipe fixing seat 30 can maintain a precise relative position and a stable mechanical connection, avoiding thermal insulation failure or equipment instability caused by loose connection or gap changes.

[0060] In some embodiments of this application, a scheme is proposed to fix the base contact seat 10 and the limiting boss 32 by means of a connector 18, thereby forming a heat insulation gap 23 between the two. However, in practical applications, this fixed connection method may face challenges such as assembly efficiency, connection reliability, and stability under long-term use in high-temperature environments. Especially when frequent disassembly, maintenance, or replacement of parts is required, traditional bolt connections or welding methods may not be convenient enough and may affect the precise control of the heat insulation gap 23. Some embodiments of this application further propose that the limiting boss 32 is provided with a groove 33 extending radially inward along the air duct fixing seat 30, and the connector 18 is a snap-fit ​​or pin that mates with the groove 33.

[0061] Specifically, the aforementioned limiting boss 32, as part of the thermal insulation connection structure 3, protrudes upward from the top of the air duct fixing seat 30, and has a radially inwardly extending groove 33. The groove 33 is designed to provide a precise, guiding mating interface for the connector 18. The radial extension direction of the groove 33 means that after the connector 18 is inserted, it can achieve synchronous circumferential rotation but not axial fixed connection. For example, the groove 33 can be designed as a U-shaped, V-shaped, or T-shaped groove, its geometry matching the corresponding part of the connector 18 to ensure a tight and wobble-free fit.

[0062] The aforementioned connector 18 serves to fix the base contact seat 10 to the limiting boss 32. In this embodiment, it is specifically defined as a snap-fit ​​or a pin. Whether it is a snap-fit ​​or a pin, its core function is to form a precise mechanical engagement with the groove 33 of the limiting boss 32, thereby enabling the base contact seat 10 to rotate while ensuring that the size and position of the heat insulation gap 23 can be precisely maintained.

[0063] Through the above technical solution, the radially inwardly extending groove 33 on the limiting boss 32, in conjunction with the connector 18 (snap or pin), provides an efficient and reliable connection method. This design significantly simplifies the assembly and disassembly process of the low thermal conductivity rotary air guide seat 1, especially when the MOCVD equipment 100 requires frequent maintenance or component replacement, eliminating the need for complex tools or time-consuming operations, thereby greatly reducing downtime. The precise engagement of the snap or pin ensures that the thermal insulation gap 23 between the base contact seat 10 and the air guide tube fixing seat 30 can be accurately maintained, avoiding potential thermal bridging effects caused by improper connection, thus effectively maintaining low thermal conductivity performance. In addition, this connection method can maintain good stability in high-temperature operating environments, reducing the risk of connection loosening or failure, and improving the operational reliability and service life of the equipment.

[0064] In the MOCVD equipment 100, the air duct fixing seat 30 of the low thermal conductivity rotary air duct seat 1 bears a certain heat load during operation. If the heat dissipation capacity of the air duct fixing seat 30 is insufficient, its temperature may become too high, thereby affecting the service life and normal operation of some components at the lower end of the air duct fixing seat 30. Therefore, a more efficient heat dissipation method is needed to ensure that the temperature of the air duct fixing seat 30 is maintained within a reasonable range. Some embodiments of this application propose an extended heat dissipation surface structure 4 for the aforementioned low thermal conductivity rotary air duct seat 1, including a plurality of heat dissipation fins 38 disposed on the inner peripheral wall of the air duct fixing seat 30 and extending along the axial direction of the air duct fixing seat 30. The extended heat dissipation surface structure 4 aims to improve heat dissipation efficiency by increasing the surface area. Specifically, the heat dissipation fins 38 are extended surfaces used to enhance heat transfer, so as to effectively conduct heat from the air duct fixing seat 30 to the fin surface. These heat dissipation fins 38 are disposed on the inner peripheral wall of the air duct fixing seat 30, which is close to the heated air duct 20 but spaced apart from it. This is because both the air duct 20 and the heat dissipation fins 38 need to dissipate heat, and if they are too close, they will interfere with each other and hinder heat dissipation. The axially extending configuration of the heat dissipation fins 38 not only maximizes the heat dissipation area in a limited space, but also helps heat to be quickly dissipated from the fin surface by radiation.

[0065] By providing multiple axially extending heat dissipation fins 38 on the inner peripheral wall of the air duct mounting base 30, the heat exchange surface area between the air duct mounting base 30 and the surrounding environment is significantly increased. These heat dissipation fins 38 can efficiently conduct heat from inside the air duct mounting base 30 to the fin surface and dissipate it through radiation, thereby effectively reducing the overall temperature of the air duct mounting base 30. This helps to maintain and reduce the temperature of the air duct mounting base 30, thus ensuring the reliability of other components at the lower end.

[0066] In some embodiments, the heat dissipation fins 38 are evenly distributed along the inner peripheral wall of the air duct fixing seat 30, and an air duct 20 is provided between every two heat dissipation fins 38. This makes reasonable use of space and maximizes the heat dissipation area.

[0067] In some embodiments, the heat dissipation fins 38 extend radially inward along the air duct fixing seat 30, forming a clearance fit with the outer peripheral wall of the air duct 20. Specifically, the heat dissipation fins 38 extend from the inner peripheral wall of the air duct fixing seat 30 towards the center, increasing the overall heat exchange area of ​​the air duct fixing seat 30. This extension method allows the heat dissipation fins 38 to dissipate heat more efficiently. Meanwhile, the clearance fit means that the inner edge of the heat dissipation fins 38 maintains a predetermined distance from the outer peripheral wall of the air duct 20. This clearance design aims to ensure that the heat dissipation fins 38 are as far away from the air duct 20 as possible to maximize heat radiation efficiency.

[0068] In some embodiments, the low thermal conductivity rotary air guide seat 1 enhances heat dissipation by providing an extended heat dissipation surface structure 4, such as multiple heat dissipation fins 38, on the air guide pipe fixing seat 30. However, when relying solely on the heat dissipation fins 38 for heat exchange, the space between the heat dissipation fins 38 may be relatively enclosed, limiting the efficiency of heat conduction and convection between the fins, especially in areas with poor airflow. This can lead to localized heat accumulation, affecting the overall heat dissipation effect and the operational stability of the equipment.

[0069] To further optimize heat dissipation performance and solve the above problems, this application further proposes to provide axially extending heat dissipation through holes 36 on the peripheral wall of the air duct fixing seat 30 between adjacent heat dissipation fins 38.

[0070] Specifically, the heat dissipation through-holes 36 refer to through-holes extending along the axial direction and penetrating the wall thickness on the peripheral wall of the air duct mounting base 30. These through-holes are located between adjacent heat dissipation fins 38, and their main function is to provide a direct airflow channel, allowing the cooling medium (e.g., nitrogen) to pass through the wall of the air duct mounting base 30, thereby significantly enhancing convective heat transfer efficiency. Through-holes can form a more efficient air circulation path, rapidly removing heat from the interior of the air duct mounting base 30. The shape of the through-holes can be circular, elliptical, or other irregular shapes, and their size and distribution density can be designed according to the required heat dissipation effect and structural strength.

[0071] Furthermore, the heat dissipation holes 36 are positioned corresponding to and spaced apart from the air duct 20, and the number of heat dissipation holes 36 is the same as that of the air duct 20. In this way, the heat from the air duct 20 can also be quickly dissipated through the heat dissipation holes 36, improving heat dissipation efficiency.

[0072] Through the above technical solution, axially extending heat dissipation through holes 36 are opened on the peripheral wall of the air duct fixing seat 30 between adjacent heat dissipation fins 38. This application effectively solves the problems of local heat accumulation and limited convection efficiency that may exist when relying solely on heat dissipation fins 38. Specifically, the heat dissipation through holes 36 directly establish an airflow channel penetrating the wall of the air duct fixing seat 30, allowing the cooling medium to exchange heat with the heated area more directly and efficiently, significantly enhancing the convective heat transfer effect. The heat dissipation through holes 36 can improve the airflow organization between heat dissipation fins 38, avoid the formation of dead zones, and ensure that heat can be carried away in a timely and effective manner, thereby further reducing the temperature of the air duct fixing seat 30 and improving the stability and reliability of the MOCVD equipment 100.

[0073] In the MOCVD equipment 100, the base contact seat 10 of the low thermal conductivity rotating gas guide seat 1 needs to effectively manage heat transfer and ensure structural stability while delivering gas to the base 2. However, if the internal structural design of the base contact seat 10 is not sufficiently optimized, it may lead to uneven gas distribution before entering the base 2, or an excessively large thermal conductivity contact area between the gas guide tube 20 and the base contact seat 10, thereby affecting gas delivery efficiency and overall thermal insulation performance.

[0074] In some embodiments, the base contact seat 10 of the low thermal conductivity rotary gas guide seat 1 includes: an annular edge portion 12, the upper surface of which is used to contact the base 2; a central recess portion 11, formed by an upward indentation of the lower surface 17 of the base contact seat; a gas guide channel 19 passing through the recess portion 11 and extending to the edge portion 12, with the outlet end 14 of the gas guide channel 19 located on the upper surface of the edge portion 12; wherein the upper end of the gas guide tube 20 abuts against the lower surface of the recess portion 11. Specifically, the annular edge portion 12 is the peripheral structure of the base contact seat 10, and its upper surface is designed to directly contact the base 2 in the MOCVD equipment 100. This annular design ensures a good match with the circular base 2, provides a basis for the uniform distribution of gas below the base 2, and provides a stable support interface for the base 2. The central recess portion 11 is a structure formed by a downward indentation of the lower surface 17 of the base contact seat. The gas guide channel 19 is the path for gas to enter the base 2 from the gas guide tube 20. This channel begins at the recess 11, passes through the interior of the base contact seat 10, and finally opens on the upper surface of the annular edge portion 12. This arrangement ensures that the gas is initially guided through the recess 11 before entering the base 2, and then evenly delivered to the area below the base 2 through the outlet of the edge portion 12, guaranteeing efficient and uniform gas delivery. The upper end of the gas guide tube 20 is in close contact with the lower surface of the recess 11, providing a precise and stable positioning point for the gas guide tube 20. By abutting the upper end of the gas guide tube 20 against the lower surface of the recess 11, a relatively closed cavity is formed, which helps the gas to initially converge or buffer before entering the gas guide channel 19, while also reducing the effective heat conduction area between the gas guide tube 20 and the base contact seat 10.

[0075] Through the above technical solution, an annular edge portion 12 and a central recess portion 11 are introduced into the base contact seat 10, and the gas guide channel 19 passes through the recess portion 11 and extends to the edge portion 12. At the same time, the upper end of the gas guide tube 20 is precisely abutted against the lower surface of the recess portion 11. This application effectively optimizes the flow channel design and structural connection method of gas before entering the base 2. The annular edge portion 12 ensures uniform contact and gas distribution with the base 2, while the central recess portion 11 provides a stable and precise positioning point for the gas guide tube 20, enhancing the reliability of the connection. More importantly, this structural design significantly reduces the effective heat conduction area between the gas guide tube 20 and the base contact seat 10, and may extend the path of heat transfer from the high-temperature base 2 to the gas guide tube 20 through the gas buffer space formed by the recess portion 11, thereby effectively reducing the heat conduction from the base contact seat 10 to the gas guide tube 20, and improving the overall heat insulation performance and gas delivery uniformity of the low thermal conductivity rotating gas guide seat 1.

[0076] To address this, this application further proposes that the recess 11 have at least one axial through-hole 15, which can reduce the axial heat conduction area. This through-hole is an opening penetrating the wall of the recess 11, and its shape can be circular, elliptical, rectangular, or irregular, depending on design requirements and manufacturing processes. The number of through-holes can be one or more, and their size and position can be optimized as needed to achieve optimal gas flow and heat exchange. For example, the through-holes can be evenly distributed on the upper surface of the recess 11. The function of this through-hole is to reduce the axial heat conduction area, thereby reducing downward heat conduction.

[0077] By creating at least one axial through hole 15 in the sidewall or bottom of the recess 11, the communication between the cavity below the recess 11 and the external environment is increased. This design significantly improves the heat dissipation conditions inside the cavity, avoids the accumulation of heat in the enclosed space, and thus effectively prevents local overheating of the base contact seat 10.

[0078] In some embodiments, the edge portion 12 is provided with a plurality of open ends, such as 8, 9, etc. Furthermore, the number of axial through holes 15 is the same as the number of open ends, and the axial through holes 15 are located on the central axis of the line connecting two adjacent axial through holes 15.

[0079] In some embodiments described above, an extended heat dissipation surface structure 4, such as heat dissipation fins 38, is proposed to be provided on the air duct fixing seat 30 to increase the heat dissipation surface area and thereby improve heat dissipation efficiency. However, in practical applications, the geometry of the heat dissipation fins 38 has a significant impact on heat dissipation effect, structural strength, and airflow resistance. Traditional uniform cross-section heat dissipation fins 38 may not achieve optimal heat dissipation performance in a limited space, and their structural stability may also face challenges under the high-temperature operating environment of the MOCVD equipment 100, easily leading to thermal stress concentration, deformation, or damage. Based on the above reasons, in some embodiments, the longitudinal cross-section of the heat dissipation fins 38 gradually narrows as it extends radially inward from the inner peripheral wall of the air duct fixing seat 30, and the side near the base contact seat 10 has an inclined surface 41.

[0080] Specifically, the longitudinal section of the heat dissipation fins 38 gradually narrows as they extend radially inward from the inner peripheral wall of the air duct fixing seat 30. This means that the thickness or width of the heat dissipation fins 38 gradually decreases from their root, where they connect to the air duct fixing seat 30, towards their radially inward tip. This conical or wedge-shaped design can optimize material distribution and reduce overall weight while ensuring effective heat dissipation area. For example, the heat dissipation fins 38 can be designed with a triangular, trapezoidal, or streamlined longitudinal section and integrally formed through casting, precision machining, or 3D printing. This gradually changing cross-section design helps optimize the heat conduction path from the air duct fixing seat 30 to the fin tip and improves the airflow characteristics between the fins, reducing airflow resistance and thus improving heat exchange efficiency.

[0081] Meanwhile, the heat dissipation fins 38 have a slope 41 on the side near the base contact seat 10, meaning that the edge or surface of the heat dissipation fins 38 near the top of the air duct fixing seat 30 (i.e., adjacent to the base contact seat 10) has an inclined angle. This slope 41 design has multiple functions. First, the slope 41 can guide the airflow, making it flow more smoothly in the top area of ​​the heat dissipation fins 38, reducing the generation of turbulence, thereby improving heat dissipation efficiency. Second, the slope 41, as a structural transition, helps to disperse the thermal stress at the connection between the heat dissipation fins 38 and the air duct fixing seat 30, enhancing the structural strength and stability of this area. In the high-temperature operating environment of the MOCVD equipment 100, this design can effectively reduce the risk of deformation or cracking caused by thermal stress concentration, improving the reliability and service life of the components. The slope 41 can be formed by mold forming, machining, or integrated casting to ensure a smooth connection with the fin body.

[0082] Through the above technical solution, the heat dissipation fins 38 are designed with a gradually narrowing longitudinal section as they extend radially inward from the inner peripheral wall of the air duct fixing seat 30, and have a slope 41 on the side near the base contact seat 10. This effectively optimizes the geometry of the heat dissipation fins 38. The gradually narrowing longitudinal section design optimizes material distribution, reduces weight, and helps to form a smoother airflow channel, reducing airflow resistance and thus improving heat exchange efficiency, while ensuring effective heat dissipation area. At the same time, the slope 41 design on the side near the base contact seat 10 not only further improves the airflow characteristics at the top of the fins and reduces the generation of local hot spots and eddies, but more importantly, it can effectively disperse thermal stress and enhance the structural strength and stability of the connection between the heat dissipation fins 38 and the air duct fixing seat 30. Especially in the high-temperature operating environment of the MOCVD equipment 100, it can significantly reduce the risk of deformation or damage caused by thermal stress concentration, thereby extending the service life of the equipment and ensuring long-term stability of heat dissipation performance.

[0083] In an MOCVD equipment 100, the reaction chamber typically operates at high temperatures. The gas guide often suffers from high thermal conductivity, causing heat to transfer from the high-temperature base 2 through the gas guide to other components at the lower end. This can lead to thermal deformation or damage to the lower structure of the gas guide, thereby reducing the stability of the equipment and the quality of the deposited thin film. This application proposes an MOCVD equipment 100 designed to address these problems. The MOCVD equipment 100 is a semiconductor manufacturing device used to grow high-quality thin films on substrates. Its working principle involves introducing a metal-organic compound (precursor) and reactant gas into a high-temperature reaction chamber, where a chemical reaction occurs on the substrate surface to form the desired thin film material. A typical MOCVD equipment 100 usually includes core components such as a gas delivery system, a reaction chamber (containing the base 2), a heating system, a vacuum system, and a waste gas treatment system.

[0084] The MOCVD equipment 100 includes the aforementioned low thermal conductivity rotating gas guide seat 1, whose main function is to supply gas to the base 2 of the MOCVD equipment 100 to ensure that the wafer tray 5 and the wafer on the wafer tray 5 can levitate and rotate together. Specifically, the rotating gas guide seat 1 includes a base contact seat 10, which has a gas guide channel 19 for supplying gas to the base 2; a gas guide tube fixing seat 30, which is disposed below the base contact seat 10; and a gas guide tube 20, the upper end of which communicates with the gas guide channel 19, and the top end of the gas guide tube 20 abuts against the base contact seat 10, and the bottom end of the gas guide tube 20 abuts against the gas guide tube fixing seat 30. To effectively reduce heat transfer from high-temperature areas to low-temperature areas, the air guide seat also features a heat-insulating connection structure 3, which is disposed between the base contact seat 10 and the air guide pipe fixing seat 30. This heat-insulating connection structure 3 is configured to create a separate heat-insulating gap 23 between the adjacent surfaces of the base contact seat 10 and the air guide pipe fixing seat 30 while simultaneously fixing them together. Furthermore, to further enhance heat dissipation, the air guide seat also features an extended heat dissipation surface structure 4, which is disposed on the air guide pipe fixing seat 30 to increase the heat dissipation surface area of ​​the air guide pipe fixing seat 30.

[0085] Through the above technical solution, the MOCVD equipment 100, by employing a low thermal conductivity rotating gas guide seat 1, can significantly reduce the heat transferred from the high-temperature reaction chamber to the gas guide seat. Specifically, the heat-insulating connection structure 3 in the low thermal conductivity rotating gas guide seat 1 effectively reduces the heat conduction path between the base contact seat 10 and the gas guide tube fixing seat 30, while the extended heat dissipation surface structure 4 enhances the heat dissipation capacity of the gas guide tube fixing seat 30, thereby jointly ensuring that the gas in the gas guide tube 20 can maintain a more stable temperature during transportation. This also extends the service life of key components at the lower end of the gas guide seat, thereby improving the overall operating efficiency and reliability of the MOCVD equipment 100.

[0086] To effectively block heat conduction from the base contact seat 10 to the air tube fixing seat 30, the air guide seat employs a heat-insulating connection structure 3. This heat-insulating connection structure 3 is disposed between the base contact seat 10 and the air tube fixing seat 30. Specifically, the top of the air tube fixing seat 30 has multiple upwardly protruding limiting bosses 32. The bottom of the base contact seat 10 has connecting parts 18, such as snap-fits or pins, which engage with radially inwardly extending grooves 33 on the limiting bosses 32 to fix the base contact seat 10 to the limiting bosses 32. Through this connection method, a separate heat-insulating gap 23 is formed between the lower surface 17 of the base contact seat and the upper surface 37 of the air tube fixing seat. This gap is filled with air or other low thermal conductivity media, significantly reducing the efficiency of heat conduction through solid contact. Compared with the existing technology where the base contact seat 10 and the air duct fixing seat 30 are in direct, large-area contact, resulting in rapid heat conduction, the setting of this heat insulation gap 23 avoids heat from the base contact seat 10 being directly and over a large area to the air duct fixing seat 30, thereby effectively reducing the thermal bridge effect.

[0087] Furthermore, to further enhance the heat dissipation capacity of the air duct fixing base 30, an extended heat dissipation surface structure 4 is provided on it. This structure includes multiple heat dissipation fins 38 disposed on the inner peripheral wall of the air duct fixing base 30 and extending axially along the air duct fixing base 30. These heat dissipation fins 38 extend radially inward along the air duct fixing base 30 and form a clearance fit with the outer peripheral wall of the air duct 20. When the air duct fixing base 30 heats up due to a small amount of heat conduction, these heat dissipation fins 38 increase its convective heat transfer area with the surrounding environment, accelerating heat dissipation. For example, between adjacent heat dissipation fins 38, axially extending heat dissipation through holes 36 are opened on the peripheral wall of the air duct fixing base 30, further promoting air circulation and improving heat dissipation efficiency. Compared with the traditional structure without an extended heat dissipation surface, this design can dissipate heat from the air duct fixing base 30 more quickly, avoiding heat accumulation at the bottom. As the heat dissipation fins 38 extend radially inward from the inner peripheral wall of the air duct fixing seat 30, their longitudinal section gradually narrows, and the side near the base contact seat 10 has a slope 41. This geometric optimization helps to improve the heat dissipation effect.

[0088] Please see Figure 4In some embodiments, the base contact seat 10 includes an annular edge portion 12, the upper surface of which is used to contact the base 2 of the MOCVD equipment 100. A central recess 11 is provided, formed by the upward indentation of the lower surface 17 of the base contact seat. A gas guide channel 19 passes through the recess 11 and extends to the edge portion 12, with the outlet end 14 located on the upper surface of the edge portion 12. The upper end of the gas guide pipe 20 abuts against the lower surface of the recess 11. This design of the recess 11 keeps the connection area between the gas guide pipe 20 and the base contact seat 10 relatively far from the direct heat source of the high-temperature base 2, further reducing heat conduction to the gas guide pipe 20. The recess 11 also has at least one axial through hole 15, the purpose of which is to reduce the axial cross-sectional area of ​​the recess 11, thereby reducing the heat conduction area, helping to expel any heat or process gas that may accumulate, and maintaining the cleanliness and temperature stability of the cavity.

[0089] In some embodiments, the base contact seat 10 is made of quartz material.

[0090] In some embodiments, the outlet ends 14 are evenly distributed on the edge portion 12, and the number of outlet ends 14 includes 4, 5, 6, etc., and is not limited.

[0091] Through the synergistic effect of the base contact seat 10, the air duct fixing seat 30, the air duct 20, the heat insulation connection structure 3, and the extended heat dissipation surface structure 4, the low thermal conductivity rotating air duct seat 1 can fundamentally and effectively reduce the heat conduction path from the high-temperature base 2 to the precision components at the bottom. The heat insulation connection structure 3, by forming a heat insulation gap 23, significantly weakens the heat conduction from top to bottom; while the extended heat dissipation surface structure 4 enhances the heat dissipation capacity of the air duct fixing seat 30, ensuring a relatively large temperature gradient from the upper end to the lower end of the rotating air duct seat 1, reducing the heat conduction along the axial direction downwards.

[0092] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A low thermal conductivity rotary gas guide for MOCVD equipment, characterized in that, include: The base contact seat has an internal gas guide channel for supplying gas to the base; An air duct fixing seat is located below the base contact seat; An air guide tube, the upper end of which is connected to the air guide channel, and the top end of the air guide tube abuts against the base contact seat, and the bottom end of the air guide tube abuts against the air guide tube fixing seat. A heat-insulating connection structure is disposed between the base contact seat and the air guide pipe fixing seat. The heat-insulating connection structure is configured to form a separate heat-insulating gap between the adjacent surfaces of the two while fixing the base contact seat and the air guide pipe fixing seat. An extended heat dissipation surface structure is provided on the air duct fixing seat to increase the heat dissipation surface area of ​​the air duct fixing seat; The thermal insulation connection structure includes: At least one upwardly protruding limiting boss is provided on the top of the air duct fixing seat; A connector located at the bottom of the base contact seat; The base contact seat is fixedly connected to the limiting boss through the connector, thereby forming the heat insulation gap between the lower surface of the base contact seat and the upper surface of the air duct fixing seat. The limiting boss is provided with a groove extending radially inward along the base contact seat, and the connector is a buckle or pin that cooperates with the groove. The extended heat dissipation surface structure includes a plurality of heat dissipation fins disposed on the inner peripheral wall of the air duct fixing seat and extending along the axial direction of the air duct fixing seat. The longitudinal section of the heat dissipation fins gradually narrows as they extend radially inward from the inner peripheral wall of the air duct fixing seat, and the side near the base contact seat has an inclined surface.

2. The low thermal conductivity rotary gas guide seat for MOCVD equipment according to claim 1, characterized in that, The heat dissipation fins extend radially inward along the air duct fixing seat and form a clearance fit with the outer peripheral wall of the air duct.

3. The low thermal conductivity rotary gas guide seat for MOCVD equipment according to claim 1 or 2, characterized in that, An axially extending heat dissipation through hole is provided on the peripheral wall of the air duct fixing seat between adjacent heat dissipation fins.

4. The low thermal conductivity rotary gas guide seat for MOCVD equipment according to claim 1, characterized in that, The base contact seat includes: The annular edge portion has its upper surface designed to contact the base. The central recess is formed by the downward indentation of the lower surface of the base contact seat. The air guide channel passes through the recess and extends to the edge portion, and the outlet end of the air guide channel is located on the upper surface of the edge portion.

5. The low thermal conductivity rotary gas guide seat for MOCVD equipment according to claim 4, characterized in that, At least one axial through hole is provided at the bottom of the recess.

6. An MOCVD apparatus, characterized in that, Includes a low thermal conductivity rotary air guide for MOCVD equipment as described in any one of claims 1 to 5.

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