Micro-motor-driven distributed turbulent flow pump-free liquid cooling device for space thermal control

By installing a micro-motor driven distributed turbulence pumpless liquid cooling device with an impeller pump in the cooling channel, the problems of low heat transfer efficiency and uneven temperature distribution caused by boundary layer thickening in traditional liquid cooling technology are solved, achieving efficient and uniform heat dissipation effect, which is suitable for high-density equipment.

CN122054510APending Publication Date: 2026-05-15PLA PEOPLES LIBERATION ARMY OF CHINA STRATEGIC SUPPORT FORCE AEROSPACE ENG UNIV
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Patent Information

Application Number
CN202510972025.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-15
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Traditional single-phase liquid cooling technology suffers from problems such as low heat transfer efficiency, uneven temperature distribution, high flow resistance, and system complexity due to boundary layer thickening in high-power chip heat dissipation, making it difficult to meet the heat dissipation requirements of high-density devices.

Method used

A distributed turbulence pumpless liquid cooling device driven by a micro-motor is used. An impeller pump is installed in the cooling channel. The rotation of the impeller pump breaks the boundary layer and forms a turbulent state, so as to achieve efficient flow and uniform heat dissipation of the cooling medium.

Benefits of technology

It improves heat transfer efficiency, reduces flow resistance and pump power consumption, enhances heat dissipation uniformity, and meets the compactness and flexibility requirements of high-density equipment.

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Abstract

The invention discloses a micromotor-driven distributed turbulent flow pumpless liquid cooling device for space thermal control. The micromotor-driven distributed turbulent flow pumpless liquid cooling device comprises a pipeline body and an impeller pump, the impeller pump comprises an impeller with the outer diameter being D and capable of actively rotating. When the impeller pump is used for overall heat dissipation of a single small-size electronic element, one impeller pump is arranged in the cooling flow channel at the position 0.5 D-1. 5D away from the upstream of the small-size electronic element; when the impeller pump is used for eliminating the hot spots of the large-size electronic element, one impeller pump is arranged in the cooling flow channel at the position 0.5 D-1. 5D away from the upstream of each hot spot to be eliminated. An external pump is removed, and the impeller pump is arranged in the cooling flow channel, so that on one hand, a cooling working medium is pumped, on the other hand, a turbulent flow effect is achieved on the cooling working medium, a boundary layer is broken, and the heat dissipation effect is improved. In addition, for a large-scale heat dissipation scene, a plurality of impeller pumps can be arranged in the cooling flow channel in an array mode, the impeller pumps can be placed at local hot spots in a targeted mode, targeted heat dissipation is achieved, and the heat dissipation efficiency and uniformity are further improved.
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