Laser cutting and workpiece coating method, apparatus, computer readable storage medium
By utilizing the gap between the initial workpiece and the remaining workpiece during laser cutting for chip removal and heat dissipation, combined with edge cutting and polishing, the problems of dust obstruction and adhesion are solved, improving cutting quality and the stability of subsequent coatings.
Patent Information
- Application Number
- CN202510205956.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2026-08-25
AI Technical Summary
Dust can obstruct the laser beam during laser cutting, leading to incomplete cutting. Dust adhesion can cause surface and sidewall abnormalities, affecting the quality of surface coatings in subsequent processes.
First, the workpiece to be cut is cut according to the first mode to form a gap between the initial workpiece and the remaining workpiece to be cut. The gap is used for chip removal and heat dissipation. Then, edge cutting and polishing are carried out to reduce dust residue.
It effectively reduces dust adhesion and residue on the workpiece surface, reduces abnormalities in subsequent surface coating processes, and improves cutting yield.
Smart Images
Figure CN122625934A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of laser cutting technology, and in particular to laser cutting and workpiece coating methods, apparatus, and computer-readable storage media. Background Technology
[0002] In related laser cutting technologies, the laser beam follows the contour of the product being cut, and the corresponding laser energy and number of cuts are set to perform repeated cutting to achieve complete cutting of the product.
[0003] The drawbacks are that dust during the cutting process can obstruct the laser beam, leading to incomplete cutting. Additionally, dust adhesion to the surface and sidewalls can cause abnormalities in the surface coating during subsequent processes. Summary of the Invention
[0004] The laser cutting and workpiece coating methods, apparatus, and computer-readable storage media provided in this application effectively reduce the adhesion and residue of dust and other waste on the workpiece surface.
[0005] In a first aspect, this application provides a laser cutting method, which includes: cutting a workpiece to be cut according to a first mode to obtain an initial workpiece and a remaining workpiece to be cut; wherein there is a gap between the initial workpiece and the remaining workpiece to be cut; cutting the edge of the initial workpiece according to a second mode to obtain an intermediate workpiece; and polishing the intermediate workpiece to obtain a target workpiece.
[0006] Before cutting the workpiece according to the first mode, the process includes: obtaining the size of the target workpiece and laser parameters; obtaining the first mode based on the laser parameters and the size of the target workpiece, wherein the size of the initial workpiece obtained by cutting according to the first mode is larger than the size of the target workpiece.
[0007] The laser parameters include the spot diameter; the first mode is obtained based on the laser parameters and the size of the target workpiece, including: adding a distance greater than or equal to the spot diameter outward from the size of the target workpiece to obtain the first target size; and obtaining the first mode based on the first target size.
[0008] Before cutting the workpiece according to the first mode, the process further includes: adding a distance greater than or equal to the spot radius to the outer edge of the target workpiece size to obtain a second target size; wherein the second target size is smaller than the first target size; and obtaining the second mode based on the second target size.
[0009] The method also includes: removing chips through gaps during the cutting process.
[0010] In a second aspect, this application provides a workpiece coating method, the method comprising: obtaining a target workpiece; wherein the target workpiece is obtained by cutting as provided in the first aspect; and coating the target workpiece.
[0011] The process of coating the target workpiece includes cleaning the target workpiece and then coating the cleaned target workpiece.
[0012] Thirdly, this application provides a laser cutting apparatus, which includes a laser source and a control module, wherein the control module is used to control the laser source to cut the workpiece to be cut according to the laser cutting method provided in the first aspect.
[0013] Fourthly, this application provides a workpiece coating apparatus, which includes a coating assembly for coating a workpiece according to the workpiece coating method provided in the second aspect.
[0014] Fifthly, this application provides a computer-readable storage medium for storing a computer program, which, when executed by a processor, implements the method provided in the first or second aspect.
[0015] The beneficial effects of this application are as follows: Unlike the prior art, the laser cutting and workpiece coating method, apparatus, and computer-readable storage medium provided in this application, during laser cutting, first cut the workpiece to be cut according to the first mode to obtain an initial workpiece and a remaining workpiece to be cut. The gap generated between the initial workpiece and the remaining workpiece to be cut can be used to provide chip removal for subsequent edge cutting and polishing operations, thereby reducing the residue of cutting dust on the workpiece. In addition, the gap can also increase the heat dissipation effect and reduce the damage of cutting temperature to the workpiece. Furthermore, after edge cutting, polishing is performed to effectively reduce the adhesion and residue of dust and other waste on the surface of the workpiece, and reduce the abnormality of the surface coating in subsequent processes. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:
[0017] Figure 1 This is a schematic flowchart of an embodiment of the laser cutting method provided in this application;
[0018] Figure 2 This is a schematic flowchart of another embodiment of the laser cutting method provided in this application;
[0019] Figure 3 This is a schematic flowchart of another embodiment of the laser cutting method provided in this application;
[0020] Figure 4 and Figure 5 This is a schematic diagram illustrating the application scenario of the laser cutting method provided in this application;
[0021] Figure 6 This is a schematic flowchart of an embodiment of the workpiece coating method provided in this application;
[0022] Figure 7 This is a schematic diagram of the structure of an embodiment of the laser cutting apparatus provided in this application;
[0023] Figure 8 This is a schematic diagram of the structure of an embodiment of the workpiece coating apparatus provided in this application;
[0024] Figure 9 This is a schematic diagram of an embodiment of the computer-readable storage medium provided in this application. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0027] In related laser cutting technologies, the laser beam follows the contour of the product being cut, and the corresponding laser energy and number of cuts are set to perform repeated cutting to achieve complete cutting of the product.
[0028] The drawbacks are that dust during the cutting process can obstruct the laser beam, leading to incomplete cutting. Additionally, dust adhesion to the surface and sidewalls can cause abnormalities in the surface coating during subsequent processes.
[0029] Based on this, in laser cutting, the workpiece to be cut is first cut according to the first mode to obtain an initial workpiece and a remaining workpiece to be cut. The gap generated between the initial workpiece and the remaining workpiece can be used to provide chip removal for subsequent edge cutting and polishing operations, thereby reducing the residue of cutting dust on the workpiece. The gap can also increase heat dissipation, reducing the damage to the workpiece caused by cutting temperature. Furthermore, after edge cutting, polishing is performed to effectively reduce the adhesion and residue of dust and other waste on the surface of the workpiece, reducing the abnormality of the surface coating in subsequent processes. See any of the following embodiments for details.
[0030] See Figure 1 , Figure 1 This is a schematic flowchart of an embodiment of the laser cutting method provided in this application. The method includes:
[0031] Step 11: Cut the workpiece to be cut according to the first mode to obtain the initial workpiece and the remaining workpiece to be cut; wherein, there is a gap between the initial workpiece and the remaining workpiece to be cut.
[0032] In some embodiments, the workpiece to be cut is a larger workpiece, and the target workpiece is a smaller workpiece. Therefore, at least one target workpiece can be cut from a workpiece to be cut.
[0033] In some embodiments, the first mode includes laser parameters and the contour dimensions corresponding to the initial workpiece. That is, a corresponding laser source can be generated according to the laser parameters, and laser lines can be drawn according to the contour dimensions corresponding to the initial workpiece to obtain the initial workpiece and the remaining workpiece to be cut.
[0034] In some embodiments, after the target workpiece is cut out, other target workpieces can be cut out again from the remaining workpiece to be cut in the same manner.
[0035] In some embodiments, the first mode may include the following cutting methods:
[0036] In the first mode, the contour corresponding to the initial workpiece is segmented into at least two segments, such as three, four, or five segments. The specific number depends on the contour dimensions.
[0037] Then, the workpiece is cut into segments. After the first segment is cut, a gap corresponding to the first segment exists on the workpiece, and subsequent segments are cut. When cutting each subsequent segment, the gaps allow for increased heat dissipation and allow dust generated during the cutting process to fall below, reducing dust accumulation on the top of the workpiece. For example, the initial workpiece's contour is divided into three segments: the first, second, and third. After cutting the first segment, a gap corresponding to the first segment exists on the workpiece. When cutting the second segment, the gaps allow for increased heat dissipation and allow dust generated during the cutting process to fall below. After cutting the second segment, a gap corresponds to the second segment exists on the workpiece. When cutting the third segment, the gaps allow for increased heat dissipation and allow dust generated during the cutting process to fall below. This process yields the initial workpiece and the remaining workpiece to be cut.
[0038] In some embodiments, before cutting the workpiece according to the first mode, it is necessary to configure the first mode based on the parameters of the workpiece. For example, see [reference needed]. Figure 2 The process before cutting the workpiece according to the first mode can be as follows:
[0039] Step 21: Obtain the dimensions and laser parameters of the target workpiece.
[0040] In some embodiments, the dimensions of the target workpiece can be manually input into the laser cutting device beforehand. This data may also include information such as the material of the target workpiece. Based on the material and dimensions of the target workpiece, laser parameters, such as laser power and spot diameter, can then be determined.
[0041] Step 22: Obtain the first mode based on the laser parameters and the size of the target workpiece, wherein the size of the initial workpiece obtained by cutting according to the first mode is larger than the size of the target workpiece.
[0042] In some embodiments, the laser parameters include the spot diameter. When determining the first mode, a first target size is obtained by adding a distance greater than or equal to the spot diameter outward from the size of the target workpiece; the first mode is then obtained based on the first target size. That is, the first target size can be used as the outline size of the initial workpiece. Therefore, when cutting the workpiece according to the first mode, an initial workpiece can be obtained, or an initial workpiece slightly larger than the first target size.
[0043] Step 12: Cut the edge of the initial workpiece according to the second pattern to obtain the intermediate workpiece.
[0044] The intermediate workpiece is smaller than the initial workpiece. The outline of the intermediate workpiece better reflects the shape of the target workpiece. That is, an intermediate workpiece with a shape similar to the target workpiece can be cut using the second mode. Because a gap already exists, when cutting the edge of the initial workpiece according to the second mode, the gap can increase heat dissipation and allow dust generated during the cutting process to fall downwards, reducing dust accumulation.
[0045] In some embodiments, the second mode also needs to be determined in advance.
[0046] Step 13: Polish the intermediate workpiece to obtain the target workpiece.
[0047] In some embodiments, laser polishing can be used to polish the intermediate workpiece to obtain the target workpiece.
[0048] Laser polishing is a technique that uses a laser to polish the surface of a material. Its working principle involves using a laser to melt or evaporate the surface layer of the material. Then, through capillary force or thermocapillary action, the molten metal flows and fills the uneven areas of the surface, achieving a smooth surface finish. The process parameters for laser polishing include laser power, scanning speed, and pulse width, which directly affect the polishing effect and surface roughness. By adjusting these parameters, different polishing effects can be achieved.
[0049] In this embodiment, during laser cutting, the workpiece to be cut is first cut according to the first mode to obtain an initial workpiece and a remaining workpiece to be cut. The gap between the initial workpiece and the remaining workpiece to be cut can be used to provide chip removal for subsequent edge cutting and polishing operations, thereby reducing the residue of cutting dust on the workpiece. In addition, the gap can also increase the heat dissipation effect and reduce the damage of cutting temperature to the workpiece. Furthermore, after edge cutting, polishing is performed to effectively reduce the adhesion and residue of dust and other waste on the surface of the workpiece, and reduce the abnormality of the surface coating in subsequent processes.
[0050] Furthermore, before cutting, the workpiece parameters and laser parameters are comprehensively considered, and the corresponding cutting mode is set to increase the workpiece cutting yield.
[0051] See Figure 3 , Figure 3 This is a schematic flowchart of another embodiment of the laser cutting method provided in this application. The method includes:
[0052] Step 31: Based on the dimensions of the target workpiece, add a distance greater than or equal to the spot radius to obtain the second target dimension.
[0053] The size of the second target is smaller than the size of the first target.
[0054] Step 32: Obtain the second pattern based on the second target size.
[0055] In some embodiments, the laser parameters include the spot diameter. When determining the second mode, a second target size is obtained by adding a distance greater than or equal to the spot radius outward from the target workpiece size; the second mode is then derived based on this second target size. That is, the second target size can be used as the contour size of the intermediate workpiece. Furthermore, by cutting the edge of the initial workpiece according to the second mode, the intermediate workpiece can be obtained.
[0056] Step 33: Cut the workpiece to be cut according to the first mode to obtain the initial workpiece and the remaining workpiece to be cut; wherein, there is a gap between the initial workpiece and the remaining workpiece to be cut.
[0057] Step 34: Cut the edge of the initial workpiece according to the second pattern to obtain the intermediate workpiece.
[0058] Step 35: Polish the intermediate workpiece to obtain the target workpiece.
[0059] In this embodiment, steps 33 to 35 have the same or similar technical solutions as any embodiment of this application, and will not be described in detail here.
[0060] During the cutting process, chips are removed through gaps.
[0061] In some embodiments, the laser cutting apparatus is equipped with corresponding chip removal components. For example, chip removal components are provided on both the upper and lower surfaces of the workpiece, and the chip removal components are used to remove dust during laser cutting of the workpiece. Based on this, after cutting the workpiece according to the first mode and obtaining the gap between the initial workpiece and the remaining workpiece to be cut, the dust generated during cutting can be guided through the gap to the chip removal components below for chip removal.
[0062] In one application scenario, combined Figure 4 and Figure 5 Explanation:
[0063] If you want to get Figure 4 The target workpiece with the shape shown can be processed according to the following... Figure 5 The cutting is performed as shown. Among them, Figure 5 The left side is an overall schematic diagram, and the right side is a partial schematic diagram. First, the workpiece to be cut is cut according to the first mode, resulting in the initial workpiece and the remaining workpiece to be cut. Specifically, along... Figure 5 Cut along the gap line to create a slot, which expands the space for chip removal and heat dissipation. Then, along... Figure 5 Cut along the cutting line to create the product's shape. Finally, follow... Figure 5The Polish Line is polished on the sidewalls to remove surface adhesion and obtain the target workpiece with the corresponding Out Line shape.
[0064] In this embodiment, during laser cutting, the workpiece to be cut is first cut according to the first mode to obtain an initial workpiece and a remaining workpiece to be cut. The gap between the initial workpiece and the remaining workpiece to be cut can be used to provide chip removal for subsequent edge cutting and polishing operations, thereby reducing the residue of cutting dust on the workpiece. In addition, the gap can also increase the heat dissipation effect and reduce the damage of cutting temperature to the workpiece. Furthermore, after edge cutting, polishing is performed to effectively reduce the adhesion and residue of dust and other waste on the surface of the workpiece, and reduce the abnormality of the surface coating in subsequent processes.
[0065] Furthermore, before cutting, the workpiece parameters and laser parameters are comprehensively considered, and the corresponding cutting mode is set to increase the workpiece cutting yield.
[0066] See Figure 6 , Figure 6 This is a schematic diagram of an embodiment of the workpiece coating method provided in this application. The method includes:
[0067] Step 61: Obtain the target workpiece.
[0068] The target workpiece is obtained by cutting using the method provided in any of the above embodiments.
[0069] Step 62: Apply a coating to the target workpiece.
[0070] In some embodiments, the target workpiece is cleaned, and a coating is applied to the cleaned target workpiece.
[0071] In this embodiment, since the target workpiece is cut according to any of the above embodiments, the adhesion and residue of dust and other waste on the workpiece surface have been effectively reduced, thereby reducing the abnormality of subsequent surface coating when coating is applied.
[0072] See Figure 7 , Figure 7 This is a schematic diagram of an embodiment of the laser cutting apparatus provided in this application. The laser cutting apparatus 70 includes a laser source 71 and a control module 72. The control module 72 is used to control the laser source 71 to cut the workpiece to be cut according to the laser cutting method of any of the above embodiments.
[0073] See Figure 8 , Figure 8 This is a schematic diagram of an embodiment of the workpiece coating apparatus provided in this application. The workpiece coating apparatus 80 includes a coating component 81, which is used to coat a workpiece according to the workpiece coating method of any of the above embodiments.
[0074] See Figure 9 , Figure 9 This is a schematic diagram of an embodiment of the computer-readable storage medium provided in this application. The computer-readable storage medium 90 is used to store a computer program 91, which, when executed by a processor, implements the following method:
[0075] The workpiece to be cut is cut according to the first mode to obtain the initial workpiece and the remaining workpiece to be cut; there is a gap between the initial workpiece and the remaining workpiece to be cut; the edge of the initial workpiece is cut according to the second mode to obtain the intermediate workpiece; the intermediate workpiece is polished to obtain the target workpiece;
[0076] Alternatively, obtain the target workpiece; apply a coating to the target workpiece.
[0077] It is understood that when computer program 91 is executed by a processor, it is also used to implement the methods of any of the above embodiments.
[0078] In summary, the laser cutting and workpiece coating method, apparatus, and computer-readable storage medium provided in this application, during laser cutting, first cut the workpiece to be cut according to a first mode to obtain an initial workpiece and a remaining workpiece to be cut. The gap generated between the initial workpiece and the remaining workpiece to be cut can be used to provide chip removal for subsequent edge cutting and polishing operations, thereby reducing the residue of cutting dust on the workpiece. In addition, the gap can also increase the heat dissipation effect and reduce the damage of cutting temperature to the workpiece. Furthermore, after edge cutting, polishing is performed to effectively reduce the adhesion and residue of dust and other waste on the surface of the workpiece, reducing the abnormality of the surface coating in subsequent processes.
[0079] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.
[0080] If the integrated units in the other embodiments described above are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0081] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A laser cutting method, characterized in that, The method includes: The workpiece to be cut is cut according to the first mode to obtain an initial workpiece and a remaining workpiece to be cut; wherein, there is a gap between the initial workpiece and the remaining workpiece to be cut. The edges of the initial workpiece are cut according to the second pattern to obtain the intermediate workpiece; The intermediate workpiece is polished to obtain the target workpiece.
2. The method according to claim 1, characterized in that, Before cutting the workpiece according to the first mode, the following steps are included: Obtain the dimensions and laser parameters of the target workpiece; The first mode is obtained based on the laser parameters and the size of the target workpiece, wherein the size of the initial workpiece obtained by cutting according to the first mode is larger than the size of the target workpiece.
3. The method according to claim 2, characterized in that, The laser parameters include the spot diameter; The step of obtaining the first mode based on laser parameters and the size of the target workpiece includes: Based on the dimensions of the target workpiece, a distance greater than or equal to the diameter of the light spot is added outward to obtain the first target size; The first pattern is obtained based on the first target size.
4. The method according to claim 3, characterized in that, Before cutting the workpiece according to the first mode, the method further includes: Based on the dimensions of the target workpiece, a distance greater than or equal to the spot radius is added outward to obtain a second target size; wherein, the second target size is smaller than the first target size; The second pattern is obtained based on the second target size.
5. The method according to claim 1, characterized in that, The method further includes removing chips through the gap during the cutting process.
6. A workpiece coating method, characterized in that, The method includes: Obtain the target workpiece; wherein the target workpiece is obtained by cutting using the method described in any one of claims 1-5; The target workpiece is coated.
7. The method according to claim 6, characterized in that, The coating process for the target workpiece includes: The target workpiece is cleaned, and a coating is applied to the cleaned target workpiece.
8. A laser cutting device, characterized in that, The laser cutting device includes a laser source and a control module, wherein the control module is used to control the laser source to cut the workpiece to be cut according to the laser cutting method as described in any one of claims 1-5.
9. A workpiece coating apparatus, characterized in that, The workpiece coating apparatus includes a coating assembly for coating a workpiece according to the workpiece coating method as described in any one of claims 6-7.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium is used to store a computer program, which, when executed by a processor, is used to implement the method as described in any one of claims 1-7.