Electroplating liquid circulating system for manufacturing conductive metal film

Through the electroplating solution circulation system for conductive metal film manufacturing, the problem of high cost of copper dissolved tanks in the conductive metal film production line is solved, the recycling of copper sulfate solution is realized, the production cost and equipment demand is reduced, and the comprehensive utilization of production equipment is improved. Rate.

CN222119456UActive Publication Date: 2024-12-06SHENZHEN LEIYU TECH CO LTD
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Patent Information

Application Number
CN202420014915.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-03
Publication Date
2024-12-06
Estimated Expiration
2034-01-03

AI Technical Summary

Technical Problem

In the existing conductive metal film production lines, the price of copper dissolved tanks is high and additional equipment is required for installation of copper dissolved tank systems, resulting in higher copper dissolved costs and increased production costs.

Method used

Design an electroplating solution circulation system for the manufacturing of conductive metal films. Through the connection between the horizontal line of the conductive metal film and the mixing dilution tank, the mixing of high-concentration copper sulfate solution and low-concentration copper sulfate solution can be achieved, and the concentration that meets the production needs is obtained and the storage is carried out. Liquid tanks, filter pumps, temperature control devices and metal ion online detection devices are recycled to reduce equipment purchase and site demand.

Benefits of technology

The recycling of copper sulfate solution has been realized, the cost of dissolved copper and production costs have been reduced, the comprehensive utilization rate of production equipment has been improved, and the demand for equipment purchase has been reduced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an electroplating liquid circulating system for manufacturing a conductive metal film in the field of conductive metal film production, which comprises a plurality of conductive metal film clip lines, a conductive metal film horizontal line and a mixing and diluting tank, and a first output port of each conductive metal film clip line is connected with a first input port of the mixing and diluting tank; the second output port of each conductive metal film clip wire is connected with the input port of the conductive metal film horizontal line, the output port of the conductive metal film horizontal line is connected with the second input port of the mixing and diluting tank, and the output port of the mixing and diluting tank is connected with the input ports of the plurality of conductive metal film clip wires. The problems that in an existing conductive metal film clip wire, the price of a copper dissolving tank is high, additional equipment needs to be purchased when a copper dissolving tank system is additionally installed, and the production cost is increased are solved, the conductive metal film clip wire does not need to be additionally provided with the copper dissolving tank system, the comprehensive utilization rate of production equipment is increased, and the copper dissolving cost and the production cost are reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of conductive metal film production, in particular to an electroplating liquid circulation system for conductive metal film production. Background Art

[0002] Conductive metal film is a polymer material with copper or aluminum layers plated on the top and bottom surfaces of substrates such as PET and PP. It has a sandwich structure and is also called a composite thin film current collector. It is a type of material with many good properties and is widely used in lithium-ion batteries, mainly as a battery current collector in lithium-ion batteries.

[0003] Among the existing production lines for conductive metal films, there are clip lines that use conductive clips to conduct electricity to produce conductive metal films. In the clip line, copper dissolution is a process in the production of conductive metal films. Providing copper sulfate solution for copper foil production is a very critical process, and the concentration of copper sulfate required for the production of the clip line is relatively low, so it is necessary to add a copper dissolving tank system to the production line. The high-temperature, high-concentration copper sulfate solution in the copper dissolving tank needs to be diluted after being filtered by the filter tank to obtain a copper sulfate solution with a concentration that meets the requirements of the production of the clip line. However, the price of the copper dissolving tank is relatively high, and the installation of the copper dissolving tank system requires the purchase of additional equipment, resulting in a high copper dissolution cost and increased production costs.

[0004] The above defects need to be solved urgently. Utility Model Content

[0005] In order to solve the problem that in the existing conductive metal film clip line, the price of the copper dissolving tank is relatively high, and the installation of a copper dissolving tank system requires the purchase of additional equipment, resulting in high copper dissolving costs and increased production costs, the utility model provides a plating liquid circulation system for conductive metal film manufacturing.

[0006] The technical solution of the utility model is as follows:

[0007] A plating liquid circulation system for manufacturing conductive metal film, comprising a plurality of conductive metal film clip lines, a conductive metal film horizontal line, and a mixing and dilution tank, wherein the first output port of each conductive metal film clip line is connected to the first input port of the mixing and dilution tank, the second output port of each conductive metal film clip line is connected to the input port of the conductive metal film horizontal line, the output port of the conductive metal film horizontal line is connected to the second input port of the mixing and dilution tank, and the output port of the mixing and dilution tank is respectively connected to the input ports of a plurality of the conductive metal film clip lines.

[0008] According to the utility model of the above scheme, a liquid storage tank is provided between the conductive metal film horizontal line and the mixing and dilution tank, the output port of the conductive metal film horizontal line is connected to the input port of the liquid storage tank, and the output port of the liquid storage tank is connected to the second input port of the mixing and dilution tank.

[0009] Furthermore, a first filter pump is provided between the liquid storage tank and the mixing and dilution tank, the output port of the liquid storage tank is connected to the input port of the first filter pump, and the output port of the first filter pump is connected to the second input port of the mixing and dilution tank.

[0010] According to the above scheme of the utility model, each output port of the conductive metal film clip line is provided with a second filter pump, the output port of the conductive metal film clip line is connected to the input port of the second filter pump, the first output port of the second filter pump is connected to the first input port of the mixing and dilution tank, and the second output port of the second filter pump is connected to the input port of the conductive metal film horizontal line.

[0011] The utility model according to the above solution further comprises a temperature control device, and the temperature control device is connected to the mixing and dilution tank.

[0012] Furthermore, the temperature control device is a hot and cold coil.

[0013] The utility model according to the above solution further comprises a metal ion online detection device, and the metal ion online detection device is connected to the mixing and dilution tank.

[0014] The utility model according to the above solution further comprises a sulfuric acid supplement device, and the sulfuric acid supplement device is connected to the third input port of the mixing and dilution tank.

[0015] According to the utility model of the above scheme, the electroplating anode of the conductive metal film clip wire is an insoluble anode.

[0016] According to the utility model of the above scheme, the electroplating anode of the horizontal line of the conductive metal film is a titanium basket, and a plurality of copper balls are arranged in the titanium basket.

[0017] The utility model according to the above scheme has the following beneficial effects:

[0018] In the above-mentioned electroplating liquid circulation system for manufacturing conductive metal film, the high-concentration copper sulfate solution of the conductive metal film horizontal line and the low-concentration copper sulfate solution of the conductive metal film clip line are mixed in a mixing and dilution tank to obtain a copper sulfate solution of a concentration that meets the production requirements. The mixed copper sulfate solution is delivered to a number of conductive metal film clip lines via a conveying pipeline, and then the subsequent conductive metal film is manufactured. That is, the conductive metal film horizontal line can not only be used as an electroplating production line, but also has a strong copper sulfate solution generation function, and can be used as a supply source of copper sulfate solution for the conductive metal film clip line, realizing multiple uses of one machine and recycling of electroplating solution. The conductive metal film clip line does not need to be equipped with a copper dissolving tank system, which greatly reduces the purchase of equipment, site requirements, etc., improves the comprehensive utilization rate of production equipment, and reduces copper dissolving costs and production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a connection diagram of the utility model.

[0020] In the figure, 1. conductive metal film clamp line; 2. conductive metal film horizontal line; 3. mixing and dilution tank; 4. liquid storage tank; 5. metal ion online detection device; 6. temperature control device; 7. sulfuric acid replenishing device; 8. first filter pump; 9. second filter pump. DETAILED DESCRIPTION

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0022] like Figure 1 As shown, the utility model provides an electroplating liquid circulation system for manufacturing a conductive metal film, comprising a plurality of conductive metal film clip lines 1, a conductive metal film horizontal line 2, and a mixing and dilution tank 3, wherein a first output port of each conductive metal film clip line 1 is connected to a first input port of the mixing and dilution tank 3 via a conveying pipeline, a second output port of each conductive metal film clip line 1 is connected to an input port of the conductive metal film horizontal line 2 via a conveying pipeline, an output port of the conductive metal film horizontal line 2 is connected to a second input port of the mixing and dilution tank 3 via a conveying pipeline, and an output port of the mixing and dilution tank 3 is respectively connected to input ports of a plurality of conductive metal film clip lines 1 via conveying pipelines.

[0023] In a specific embodiment, the conductive metal film clip line 1 includes a plating tank, a conveyor belt and a conductive clip. The conveyor belt drives the conductive clip to move. The conductive clip is connected to the negative pole of the power supply so that the current can flow through the conductive clip to reach the conductive base film. The conductive clip clamps the conductive base film and conveys the conductive base film to the plating tank for electroplating. The conductive clip is in an open state before entering the plating tank, and then switches from the open state to a closed state to clamp the conductive base film; then the conductive clip enters the plating tank driven by the conveyor belt and moves in the plating tank. At this time, the conductive clip is always in a clamping state. When the conductive clip leaves the plating tank while clamping the conductive base film, the conductive clip switches from the clamping state to the open state to release the clamping of the conductive base film.

[0024] In a specific embodiment, the conductive metal film horizontal line 2 includes a plating tank, which contains an electrolyte containing metal ions, and a plurality of guide rollers are provided in the plating tank. By applying current to the plating tank, the conductive base film moves in the plating tank through the guide rollers. The conductive base film is connected to the negative pole of the power supply, so that the metal adheres to the surface of the conductive base film.

[0025] In this embodiment, the conductive metal film clip line 1 is an acid plating production line, which uses a conductive clip for conductive production line. The electroplating anode of the conductive metal film clip line 1 is an insoluble anode. When current passes through the insoluble anode, it does not dissolve itself and only undergoes oxidation reaction, so the anode current is not restricted. The insoluble anode produces hydroxide ions in the electrolyte solution for oxidation, and an oxide film is easily formed on the surface without dissolving. Only oxygen is released and acid is generated, which can keep the metal ion concentration in the electroplating solution at a stable level. In addition, the insoluble anode is dimensionally stable, which is beneficial to the use and electroplating of the inner wall of the pipe. At the same time, the use of insoluble anodes in electroplating can avoid the generation of anode mud. The insoluble anode can be used to slow down the dissolution rate of the soluble anode, reduce the metal concentration of the electroplating solution, and improve the distribution of the coating thickness.

[0026] In this embodiment, the conductive metal film horizontal line 2 is an acid plating production line, and its electroplating anode is a titanium basket, and a plurality of copper balls are arranged in the titanium basket. Under normal production conditions, the copper sulfate concentration of the conductive metal film horizontal line 2 is usually 4 times the required value of the conductive metal film clamp line 1. Therefore, the conductive metal film horizontal line 2 can be used as a supply source of copper sulfate solution for the conductive metal film clamp line 1. In addition, one conductive metal film horizontal line 2 can supply 2 to 3 conductive metal film clamp lines 1 at the same time.

[0027] In the utility model, the mixing and dilution tank 3 controls the concentration of copper sulfate of the conductive metal film clip line 1, and the high-concentration copper sulfate solution of the conductive metal film horizontal line 2 and the low-concentration copper sulfate solution of the conductive metal film clip line 1 are mixed in the mixing and dilution tank 3 to obtain a copper sulfate solution with a concentration that meets the production requirements. The mixed copper sulfate solution is delivered to a number of conductive metal film clip lines 1 through a conveying pipeline, and then the subsequent conductive metal film is manufactured. That is, the conductive metal film horizontal line 2 can not only be used as an electroplating production line, but also has a strong copper sulfate solution generation function, and can be used as a supply source of copper sulfate solution for the conductive metal film clip line 1, realizing one machine with multiple uses and recycling of electroplating solution. The conductive metal film clip line 1 does not need to be equipped with a copper dissolving tank system, which greatly reduces the purchase of equipment, site requirements, etc., improves the comprehensive utilization rate of production equipment, and reduces copper dissolving costs and production costs.

[0028] In this embodiment, a liquid storage tank 4 is provided between the conductive metal film horizontal line 2 and the mixing and diluting tank 3, and the output port of the conductive metal film horizontal line 2 is connected to the input port of the liquid storage tank 4 through a delivery pipeline, and the output port of the liquid storage tank 4 is connected to the second input port of the mixing and diluting tank 3 through a delivery pipeline. The liquid storage tank 4 can store the copper sulfate solution from the conductive metal film horizontal line 2 to improve the supply and dispatching capacity of the copper sulfate solution of the conductive metal film clip line 1. Of course, the liquid storage tank 4 can also be eliminated, and in actual design, the liquid storage tank 4 can be designed according to actual needs.

[0029] In this embodiment, the electroplating solution circulation system for manufacturing the conductive metal film further includes a metal ion online detection device 5 and a temperature control device 6. The metal ion online detection device 5 and the temperature control device 6 are both connected to the mixing and dilution tank 3. By setting the mixing and dilution tank 3, the metal ion online detection device 5 detects the copper ions in the mixing and dilution tank 3, so that the ratio of the copper sulfate concentration in the mixed solution to the required value of the electroplating copper sulfate concentration is 1:1 to 2:1, and the temperature control device 6 controls the solution temperature in the mixing and dilution tank 3 at 20°C to 35°C, which can not only reduce the precipitation of high-concentration copper sulfate from the storage tank 4 in the pipeline due to the sudden drop in temperature, but also prevent the brightener in the electroplating solution from being impacted by high temperature, thereby reducing the loss of brightener. In addition, the temperature control device 6 can be designed as a hot and cold coil. Of course, in actual design, the structure of the temperature control device 6 can be designed according to actual needs.

[0030] In this embodiment, the electroplating solution circulation system for manufacturing the conductive metal film further comprises a sulfuric acid replenishing device 7 , which is connected to the third input port of the mixing and dilution tank 3 , and the sulfuric acid replenishing device 7 replenishes the sulfate ions in the mixing and dilution tank 3 .

[0031] In this embodiment, a first filter pump 8 is provided between the liquid storage tank 4 and the mixing and diluting tank 3, and the output port of the liquid storage tank 4 is connected to the input port of the first filter pump 8 through a delivery pipeline, and the output port of the first filter pump 8 is connected to the second input port of the mixing and diluting tank 3 through a delivery pipeline. The first filter pump 8 can filter the solution overflowing from the conductive metal film horizontal line 2, remove impurities in the solution, and also filter out macromolecular substances, and the brightener belongs to a mixture composed of macromolecular substances, that is, the first filter pump 8 can filter out the brightener in the solution.

[0032] In this embodiment, the output port of each conductive metal film clip line 1 is provided with a second filter pump 9, and the output port of each conductive metal film clip line 1 is connected to the input port of the second filter pump 9 through a delivery pipeline, and the first output port of the second filter pump 9 is connected to the first input port of the mixing and dilution tank 3 through a delivery pipeline, and the second output port of the second filter pump 9 is connected to the input port of the conductive metal film horizontal line 2 through a delivery pipeline. The second filter pump 9 can filter the solution overflowing from the conductive metal film clip line 1, remove impurities in the solution, and also filter out macromolecular substances, and the brightener belongs to a mixture of macromolecular substances, that is, the second filter pump 9 can filter out the brightener in the solution.

[0033] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0034] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A plating solution circulation system for manufacturing a conductive metal film, characterized in that: It includes several conductive metal film clip lines, conductive metal film horizontal lines, and a mixing and dilution tank. The first output port of each conductive metal film clip line is connected to the first input port of the mixing and dilution tank, the second output port of each conductive metal film clip line is connected to the input port of the conductive metal film horizontal line, the output port of the conductive metal film horizontal line is connected to the second input port of the mixing and dilution tank, and the output port of the mixing and dilution tank is respectively connected to the input ports of several conductive metal film clip lines.

2. The electroplating solution circulation system for manufacturing a conductive metal film according to claim 1, characterized in that: A liquid storage tank is provided between the conductive metal film horizontal line and the mixing and dilution tank, the output port of the conductive metal film horizontal line is connected to the input port of the liquid storage tank, and the output port of the liquid storage tank is connected to the second input port of the mixing and dilution tank.

3. The electroplating solution circulation system for manufacturing a conductive metal film according to claim 2, characterized in that: A first filter pump is provided between the liquid storage tank and the mixing and dilution tank, the output port of the liquid storage tank is connected to the input port of the first filter pump, and the output port of the first filter pump is connected to the second input port of the mixing and dilution tank.

4. The electroplating solution circulation system for manufacturing a conductive metal film according to claim 1, characterized in that: Each output port of the conductive metal film clip line is provided with a second filter pump, the output port of the conductive metal film clip line is connected to the input port of the second filter pump, the first output port of the second filter pump is connected to the first input port of the mixing and dilution tank, and the second output port of the second filter pump is connected to the input port of the conductive metal film horizontal line.

5. The electroplating solution circulation system for producing a conductive metal thin film according to any one of claims 1 to 4, characterized in that: It also includes a temperature control device, which is connected to the mixing and dilution tank.

6. The electroplating solution circulation system for manufacturing a conductive metal film according to claim 5, characterized in that: The temperature control device is a hot and cold coil.

7. The electroplating solution circulation system for producing a conductive metal thin film according to any one of claims 1 to 4 or 6, characterized in that: It also includes a metal ion online detection device, which is connected to the mixing and dilution tank.

8. The electroplating solution circulation system for producing a conductive metal thin film according to any one of claims 1 to 4 or 6, characterized in that: It also includes a sulfuric acid supplement device, which is connected to the third input port of the mixing and dilution tank.

9. The electroplating solution circulation system for producing a conductive metal thin film according to any one of claims 1 to 4 or 6, characterized in that: The electroplating anode of the conductive metal film clip wire is an insoluble anode.

10. The electroplating solution circulation system for producing a conductive metal thin film according to any one of claims 1 to 4 or 6, characterized in that: The electroplating anode of the horizontal line of the conductive metal film is a titanium basket, and a plurality of copper balls are arranged in the titanium basket.