Die bonder with die bonding range convenient to adjust

Abstract

The utility model discloses a die bonder capable of conveniently adjusting a die bonding range, which relates to the technical field of die bonders and comprises a connecting seat, a push block is slidably connected onto the connecting seat, a positioning camera is mounted at the bottom end of the push block, a plurality of inserting shafts are inserted into the connecting seat, one end of each inserting shaft is rotatably connected with a pulley, and the other end of each inserting shaft is rotatably connected with a rotating shaft. A plurality of sliding grooves are formed in the pushing block, the sliding wheels are connected to the sliding grooves in a sliding mode, the other end of the inserting shaft is fixedly connected with a connecting rod, a suction nozzle is installed at the end of the connecting rod, one end of the suction nozzle is fixedly connected with an installing block, and a positioning rod is connected to the installing block in an inserted mode. According to the utility model, the connection seat, the push block, the positioning camera, the insertion shaft, the pulley, the chute, the connection rod, the first spring, the suction nozzle, the installation block, the positioning rod, the second spring, the installation seat and the second cylinder are arranged to form a wafer fixing structure adaptive to different sizes, an existing die bonder is replaced, the wafer fixing structure is adaptive to different sizes, and the die bonding efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to a crystal bonding machine with an easily adjustable crystal bonding range. Background Art

[0002] A die bonder is a mechanical device for fixing crystals and semiconductor packaging. It can transfer and bond the wafer on the blue film to the substrate to complete chip mounting. In the prior art, a swing-arm die bonder generally uses a swing arm to adsorb the target wafer on the feed tray, and then moves it to the substrate to bond the die. During use, a traditional swing-arm die bonder generally uses multiple swing arms to move the wafer to a common point and then positions it with a visual camera for bonding. The die bonding method is relatively complicated, and the efficiency of bonding is poor for wafers of different sizes.

[0003] For example, the Chinese patent publication number CN220138255U discloses a crystal bonding machine with an easily adjustable crystal bonding range, including a working platform, and also including: a crystal bonding bracket, the crystal bonding bracket is arranged on the top of the working platform; a crystal bonding platform, the crystal bonding platform is arranged on the top of the working platform, a crystal supply mechanism, the crystal supply mechanism is arranged on the working platform, a bonding head mechanism, a crystal bonding camera assembly, the crystal bonding camera assembly is arranged on the crystal bonding bracket, the crystal bonding camera assembly includes a first visual camera, the first visual camera is fixedly connected to the crystal bonding bracket, and the first visual camera is located at the center position of the two bonding head mechanisms, and the second visual cameras are respectively arranged on both sides of the first visual camera and at the corresponding positions of the bonding head mechanisms. The utility model can change the size of the crystal bonding range by switching the first visual camera and the second visual camera, thereby meeting the crystal bonding needs of different crystal bonding ranges.

[0004] Although the above structure improves the range of die bonding by cooperating with multiple visual cameras, its efficiency in die bonding for wafers of different sizes is poor and its practicality is low. Therefore, the present application provides a die bonding machine with an easily adjustable die bonding range to meet the needs. Utility Model Content

[0005] The main purpose of the utility model is to provide a crystal bonding machine with an easily adjustable crystal bonding range, which can effectively solve the problems of complex structure and poor crystal bonding efficiency of existing crystal bonding machines mentioned in the background technology, and achieve the purpose of simplifying the structure, adapting to wafers of different sizes, and improving the crystal bonding efficiency.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a crystal bonding machine with an easily adjustable crystal bonding range, comprising a connecting seat, a push block slidably connected to the connecting seat, a positioning camera installed at the bottom end of the push block, a plurality of plug shafts plugged into the connecting seat, one end of the plug shaft is rotatably connected to a pulley, a plurality of slide grooves are provided on the push block, and the pulley is slidably connected to the slide grooves, the other end of the plug shaft is fixedly connected to a connecting rod, a suction nozzle is installed at the end of the connecting rod, one end of the suction nozzle is fixedly connected to a mounting block, a positioning rod is plugged into the mounting block, and a driving unit for driving the push block to rise and fall and slide is provided on the connecting seat.

[0007] Preferably, a first spring is sleeved on the connecting rod, and one end of the first spring is in conflict with the connecting seat.

[0008] Preferably, a second spring is sleeved on the positioning rod, one end of the second spring is fixedly connected to the positioning rod, and the other end of the second spring is fixedly connected to the mounting block.

[0009] Preferably, the driving unit comprises a cover plate fixedly connected to the top end of the connecting seat, a first cylinder is mounted on the cover plate, and an output end of the first cylinder is fixedly connected to the pushing block.

[0010] Preferably, the push block is in the shape of an inverted truncated cone structure.

[0011] Preferably, one end of the connecting seat is slidably connected to a mounting seat, a second cylinder is mounted on the mounting seat, and an output end of the second cylinder is fixedly connected to the connecting seat.

[0012] Preferably, a guide rail is fixedly connected to the mounting seat, a guide groove is provided on the connecting seat, and the guide rail is slidably connected in the guide groove.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] By setting a connecting seat, a pushing block, a positioning camera, an inserting shaft, a pulley, a slide groove, a connecting rod, a first spring, a suction nozzle, a mounting block, a positioning rod, a second spring, a mounting seat, and a second cylinder, a wafer fixing structure adapted to different sizes is formed, which replaces the existing crystal bonding machine, is adapted to different sizes, and has a high crystal bonding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the three-dimensional structure of a die bonding machine with an easily adjustable die bonding range;

[0016] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the middle A area;

[0017] Figure 3 A partially cutaway three-dimensional structural schematic diagram of a die bonding machine for easy adjustment of the die bonding range.

[0018] In the figure: 1. connecting seat; 2. pushing block; 3. positioning camera; 4. plug-in shaft; 5. pulley; 6. slide groove; 7. connecting rod; 8. first spring; 9. suction nozzle; 10. mounting block; 11. positioning rod; 12. second spring; 13. cover plate; 14. first cylinder; 15. mounting seat; 16. second cylinder. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0020] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] Example 1: Reference Figure 1-3The shown embodiment comprises a crystal bonding machine with an adjustable crystal bonding range, comprising a connecting seat 1, a push block 2 being slidably connected to the connecting seat 1, the push block 2 being shaped as an inverted truncated cone structure, a positioning camera 3 being installed at the bottom end of the push block 2, the positioning camera 3 being a prior art and being used to monitor the position of the wafer, a plurality of plug shafts 4 being plugged into the connecting seat 1, one end of the plug shaft 4 being rotatably connected to a pulley 5, a plurality of slide grooves 6 being provided on the push block 2, and the pulley 5 being slidably connected to the slide groove 6, a connecting rod 7 being fixedly connected to the other end of the plug shaft 4, a first spring 8 being sleeved on the connecting rod 7, one end of the first spring 8 being in conflict with the connecting seat 1, a suction nozzle 9 being installed at the end of the connecting rod 7, one end of the suction nozzle 9 being fixedly connected to a mounting block 10, a positioning rod 11 being plugged into the mounting block 10, and a drive mechanism 2 for driving the wafer 10 is provided on the connecting seat 1. The driving unit for lifting and sliding the push block 2, when in use, drives the push block 2 to descend through the driving unit, and with the cooperation of the pulley 5 and the slide groove 6, drives the suction nozzles 9 and the positioning rods 11 on the multiple connecting rods 7 to move away from each other, so that the multiple positioning rods 11 move to the outside of the wafer, and then drives the connecting seat 1 to descend, so that the positioning rods 11 hit the placement table where the wafer is placed. The placement table is a prior art and is not drawn in the figure. Then, the driving unit drives the push block 2 to rise, and with the cooperation of the first spring 8, drives the multiple positioning rods 11 to move closer to each other, so that the positioning rods 11 hit the outside of the wafer, and then the wafer is adsorbed by the suction nozzle 9 to achieve the adsorption and fixation of wafers of different sizes, replacing the existing fixed structure, and can adapt to wafer structures of different sizes. It is easy to use and highly practical.

[0023] A second spring 12 is sleeved on the positioning rod 11, one end of the second spring 12 is fixedly connected to the positioning rod 11, and the other end of the second spring 12 is fixedly connected to the mounting block 10. Through the setting of the second spring 12, the resistance between the positioning rod 11 and the placement table is reduced to prevent excessive resistance, which facilitates the concentration of multiple positioning rods 11 in the middle and improves the efficiency of crystal bonding.

[0024] The driving unit includes a cover plate 13 fixedly connected to the top of the connecting seat 1, and a first cylinder 14 is installed on the cover plate 13. The output end of the first cylinder 14 is fixedly connected to the push block 2. The push block 2 is driven to move up and down by the first cylinder 14. The structure of the first cylinder 14 can be replaced by other structures as long as it can drive the push block 2 to move up and down.

[0025] One end of the connecting seat 1 is slidably connected to a mounting seat 15, and a second cylinder 16 is installed on the mounting seat 15. The output end of the second cylinder 16 is fixedly connected to the connecting seat 1, and a guide rail is fixedly connected to the mounting seat 15. A guide groove is provided on the connecting seat 1, and the guide rail is slidably connected in the guide groove. When it is necessary to adjust the height of the suction nozzle 9 and the positioning rod 11, the second cylinder 16 is started to drive the connecting seat 1 to rise and fall, thereby achieving the purpose of driving the suction nozzle 9 and the positioning rod 11 to rise and fall.

[0026] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A die bonding machine with an adjustable die bonding range, comprising a connection seat (1), characterized in that: The connecting seat (1) is slidably connected with a push block (2), a positioning camera (3) is installed at the bottom end of the push block (2), a plurality of plug shafts (4) are plugged into the connecting seat (1), one end of the plug shaft (4) is rotatably connected with a pulley (5), a plurality of slide grooves (6) are provided on the pushing block (2), and the pulley (5) is slidably connected to the slide groove (6), the other end of the plug shaft (4) is fixedly connected with a connecting rod (7), a suction nozzle (9) is installed at the end of the connecting rod (7), one end of the suction nozzle (9) is fixedly connected with a mounting block (10), a positioning rod (11) is plugged into the mounting block (10), and a driving unit for driving the pushing block (2) to rise and fall and slide is provided on the connecting seat (1).

2. A die bonding machine with an easily adjustable die bonding range according to claim 1, characterized in that: A first spring (8) is sleeved on the connecting rod (7), and one end of the first spring (8) is in contact with the connecting seat (1).

3. The die bonding machine with an easily adjustable die bonding range according to claim 1, characterized in that: A second spring (12) is sleeved on the positioning rod (11), one end of the second spring (12) is fixedly connected to the positioning rod (11), and the other end of the second spring (12) is fixedly connected to the mounting block (10).

4. The die bonding machine with an easily adjustable die bonding range according to claim 1, characterized in that: The driving unit comprises a cover plate (13) fixedly connected to the top end of the connecting seat (1), a first cylinder (14) is mounted on the cover plate (13), and an output end of the first cylinder (14) is fixedly connected to the push block (2).

5. The die bonding machine with an easily adjustable die bonding range according to claim 1, characterized in that: The push block (2) is in the shape of an inverted truncated cone structure.

6. The die bonding machine with an easily adjustable die bonding range according to claim 1, characterized in that: One end of the connecting seat (1) is slidably connected to a mounting seat (15), a second cylinder (16) is mounted on the mounting seat (15), and an output end of the second cylinder (16) is fixedly connected to the connecting seat (1).

7. The die bonding machine with an easily adjustable die bonding range according to claim 6, characterized in that: A guide rail is fixedly connected to the mounting seat (15), a guide groove is provided on the connecting seat (1), and the guide rail is slidably connected in the guide groove.

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