A high-speed die bonding machine with double dispensing heads

Abstract

The present application relates to a high-speed crystal bonding machine with double glue dispensing heads, which belongs to the field of crystal bonding technology. In the related technical means, since the time of glue dispensing in a single cycle is usually longer than the time of movement of the crystal welding head in a single cycle, the crystal bonding efficiency of the whole equipment cannot be further improved. The present application provides a high-speed crystal bonding machine with double glue dispensing heads, which includes a frame, a bracket feeding mechanism, a bracket glue dispensing mechanism, a bracket docking mechanism, a chip feeding mechanism, a welding head crystal bonding mechanism and a bracket unloading mechanism. The bracket glue dispensing mechanism receives and accommodates the crystal bonding bracket and performs glue dispensing. The bracket docking mechanism transfers the crystal bonding bracket that has completed the glue dispensing operation to the crystal bonding preparation position. The welding head crystal bonding mechanism absorbs the chip from the chip feeding mechanism and transfers it to the crystal bonding bracket on the bracket docking mechanism for crystal bonding. The glue dispensing action and the crystal bonding action are separated by the bracket docking mechanism, so that the time of the two actions can overlap, thereby improving the working efficiency of the double glue dispensing head high-speed crystal bonding machine.

Description

Technical Field

[0001] The present application relates to the technical field of crystal bonding, and in particular to a high-speed crystal bonding machine with double dispensing heads. Background Art

[0002] Crystal bonding is a processing method that uses colloid to bond the chip to the designated area of ​​the crystal bonding bracket to form an electrical path. The usual crystal bonding method is that the feeding mechanism transfers the crystal bonding bracket to the working position on the fixture, and the dispensing mechanism first dispenses glue at the position where the crystal bonding bracket needs to be bonded to the chip. Then the crystal retrieval welding head moves from the origin position to the position to absorb the chip, and the chip is placed on the expander chip plate supported by the blue film. After the crystal retrieval welding head is in place, the suction nozzle moves downward, and the ejector moves upward to lift the chip. The crystal retrieval welding head returns to the origin position after picking up the chip, and then moves from the origin position to the crystal bonding position. After the suction nozzle fixes the chip downward, the crystal retrieval welding head returns to the origin position again. This is a complete crystal bonding process.

[0003] With regard to the above technical means, glue is dispensed once and then crystal bonding is performed. During the crystal bonding process according to this cycle, since the glue dispensing time in a single cycle is usually longer than the movement time of the crystal welding head in a single cycle, the crystal bonding efficiency of the entire equipment cannot be further improved. Summary of the invention

[0004] In order to improve the die bonding efficiency of the equipment, the present application provides a high-speed die bonding machine with double dispensing heads.

[0005] The present application provides a dual-dispensing head high-speed die bonding machine, which adopts the following technical solution.

[0006] A high-speed die bonding machine with double dispensing heads, comprising:

[0007] frame;

[0008] A bracket loading mechanism, used for accommodating a plurality of die-bonding brackets, wherein the bracket loading mechanism is arranged on the side of the frame;

[0009] A bracket dispensing mechanism, used for receiving and accommodating the solid crystal bracket transferred by the bracket feeding mechanism and dispensing glue on the solid crystal bracket, the bracket dispensing mechanism includes a bracket placement seat for placing the solid crystal bracket, a plurality of dispensing welding heads for simultaneously dispensing glue on the solid crystal bracket on the bracket placement seat, a dispensing mounting seat for installing the dispensing welding heads, and a dispensing driving assembly for driving the dispensing welding heads to move along the X-axis and the Y-axis, the plurality of dispensing welding heads are located directly above the bracket placement seat, the bracket placement seat and the dispensing mounting seat are both installed on the upper surface of the frame, and the dispensing driving assembly is installed on the dispensing mounting seat;

[0010] A bracket docking mechanism, comprising a bracket docking position and a die-bonding preparation position, wherein the bracket docking mechanism of the bracket docking position is used to receive the die-bonding bracket on the bracket placement seat, and the bracket docking mechanism is arranged on the upper surface of the frame;

[0011] A chip feeding mechanism, mounted on the upper surface of the frame for carrying chips;

[0012] A bonding head crystal bonding mechanism, used for sucking the chip from the chip feeding mechanism and transferring it to the crystal bonding bracket on the bracket docking mechanism located at the crystal bonding preparation position for crystal bonding;

[0013] The bracket unloading mechanism is used to receive and accommodate a plurality of crystal bonding brackets on the bracket docking mechanism that have completed the crystal bonding operation. The bracket unloading mechanism is arranged on the side of the frame.

[0014] By adopting the above technical solution, a plurality of crystal bonding brackets are accommodated in the bracket feeding mechanism, the bracket dispensing mechanism receives and accommodates the crystal bonding brackets transferred by the bracket feeding mechanism and dispenses glue on the crystal bonding brackets, and a plurality of dispensing welding heads are arranged in the bracket dispensing mechanism, so that the crystal bonding brackets can be quickly dispensed. After all the crystal bonding brackets are dispensed, the bracket docking mechanism transfers the crystal bonding brackets that have completed the dispensing operation on the bracket placement seat to the crystal bonding preparation position. The welding head crystal bonding mechanism absorbs the chip from the chip feeding mechanism and transfers it to the crystal bonding bracket on the bracket docking mechanism located at the crystal bonding preparation position for crystal bonding. The bracket unloading mechanism accommodates the crystal bonding bracket that has completed the crystal bonding operation, and the dispensing action and the crystal bonding action are separated by the bracket docking mechanism, so that the time of the two actions can overlap, thereby improving the working efficiency of the dual dispensing head high-speed crystal bonding machine.

[0015] Optionally, the dispensing drive assembly includes an X-axis motion module installed on the upper surface of the dispensing mounting base and multiple Y-axis motion modules installed above the X-axis motion module, and the number of the Y-axis motion modules is the same as the number of the dispensing welding heads and corresponds one to one.

[0016] By adopting the above technical solution, the number of Y-axis motion modules is the same as the number of dispensing welding heads and corresponds one to one. Multiple Y-axis motion modules slide on the X-axis motion module, so that the dispensing drive assembly can share one X-axis motion module for multiple dispensing welding heads, thereby improving the space utilization of the dispensing drive assembly.

[0017] Optionally, the bracket dispensing mechanism further includes a dispensing monitoring camera, which is mounted on the dispensing mounting seat and is located directly above the bracket placement seat.

[0018] By adopting the above technical solution, the dispensing monitoring camera is installed on the dispensing mounting seat and is located directly above the bracket placement seat, so that the dispensing status can be observed, so that the dual dispensing head high-speed crystal bonding machine can monitor the dispensing quality during the dispensing process in real time and improve the stability of the crystal bonding quality.

[0019] Optionally, the bracket docking mechanism includes an XY motion module arranged on the upper surface of the frame and a bracket docking platform arranged above the XY motion module, the length direction of the bracket docking platform is parallel to the length direction of the bracket placement seat, the XY motion module drives the bracket docking platform to move on the upper surface of the frame, and when the bracket docking platform is docked with the bracket placement seat, the bracket docking platform is in the bracket docking position.

[0020] By adopting the above technical solution, the XY motion module drives the bracket docking platform to move on the upper surface of the frame. When the bracket docking platform is docked with the bracket placement seat, the bracket docking platform is in the bracket docking position, and the crystal bonding bracket can be transferred from the bracket placement seat to the bracket docking platform. After the docking is completed, the bracket docking platform moves to the crystal bonding preparation position ready for crystal bonding, thereby facilitating the subsequent crystal bonding work.

[0021] Optionally, the welding head crystal bonding mechanism includes a motor mounting seat, a crystal retrieval welding head and a welding head driving assembly, the motor mounting seat is installed on the upper surface of the frame, the welding head driving assembly is installed on the motor mounting seat, and the crystal retrieval welding head is installed on the welding head driving assembly, and the welding head driving assembly drives the crystal retrieval welding head to absorb the chip from the chip feeding mechanism and transfer it to the crystal bonding bracket of the bracket docking mechanism located at the crystal bonding preparation position and reciprocate.

[0022] By adopting the above technical solution, the motor mounting seat is arranged on the upper surface of the frame, and the welding head driving assembly drives the crystal retrieval welding head to absorb the chip from the chip feeding mechanism and transfer it to the crystal bonding bracket. At this time, the bracket docking mechanism is located in the crystal bonding preparation position. After the crystal bonding is completed, the crystal retrieval welding head returns to the top of the chip feeding mechanism and reciprocates. The bracket docking mechanism separates the dispensing action and the crystal bonding action, so that the time of the two actions can overlap, thereby improving the working efficiency of the dual dispensing head high-speed crystal bonding machine.

[0023] Optionally, the bracket loading mechanism includes a loading column, a first material loading and conveying rack fixedly arranged on the side of the loading column, a second material loading and conveying rack fixedly arranged on the side of the loading column, and a bracket transfer assembly slidably arranged on the side of the loading column, and the first material loading and conveying rack is located directly above the second material loading and conveying rack.

[0024] By adopting the above technical solution, the bracket loading mechanism is equipped with a first material placement and conveying rack and a second material placement and conveying rack, so that the accommodating capacity of the bracket loading mechanism is improved, thereby ensuring that the double-dispensing glue head high-speed crystal bonding machine has a certain cache capacity without the need to continuously perform loading operations on the double-dispensing glue head high-speed crystal bonding machine.

[0025] Optionally, a bracket pushing arm for pushing the crystal bonding bracket on the first material loading and conveying rack to the bracket placement seat is provided on the upper surface of the first material loading and conveying rack, and the bracket pushing arm moves along the length direction of the first material loading and conveying rack.

[0026] By adopting the above technical solution, when the bracket ejection arm moves along the length direction on the first material loading and conveying rack, the bracket ejection arm can transfer the solid crystal bracket on the first material loading and conveying rack to the bracket placement seat, thereby facilitating the glue dispensing welding head to dispense glue on the solid crystal bracket.

[0027] Optionally, the chip feeding mechanism includes an X-axis feeding module, a Y-axis feeding module arranged on the upper surface of the X-axis feeding module, and a chip supply tray arranged on the Y-axis feeding module, and the X-axis feeding module and the Y-axis feeding module drive the chip supply tray to move in the X-axis and Y-axis directions.

[0028] By adopting the above technical solution, the X-axis feeding module is arranged on the frame, and the Y-axis feeding module is arranged on the upper surface of the X-axis feeding module. The chip feeding tray is driven to move in the X-axis and Y-axis directions by the X-axis feeding module and the Y-axis feeding module, so that the bonding head crystal bonding mechanism can absorb chips from different positions in the chip feeding tray.

[0029] In summary, the present application includes at least one of the following beneficial technical effects:

[0030] 1. High efficiency of crystal bonding. The welding head driving assembly drives the crystal retrieval welding head to suck the chip from the chip feeding mechanism and transfer it to the crystal bonding bracket. At this time, the bracket docking mechanism is located in the crystal bonding preparation position. After the crystal bonding is completed, the crystal retrieval welding head returns to the top of the chip feeding mechanism and reciprocates, thereby quickly performing crystal bonding operations on the crystal bonding bracket. After all the dispensing of the crystal bonding bracket is completed, the bracket docking mechanism transfers the crystal bonding bracket that has completed the dispensing operation on the bracket placement seat to the crystal bonding preparation position. The welding head crystal bonding mechanism sucks the chip from the chip feeding mechanism and transfers it to the crystal bonding bracket on the bracket docking mechanism located in the crystal bonding preparation position for crystal bonding. The bracket unloading mechanism accommodates the crystal bonding bracket that has completed the crystal bonding operation, and the dispensing action and the crystal bonding action are separated by the bracket docking mechanism, so that the time of the two actions can overlap, thereby improving the working efficiency of the dual dispensing head high-speed crystal bonding machine.

[0031] 2. High equipment throughput. The bracket loading mechanism is provided with a first material placement and conveying rack and a second material placement and conveying rack, so that the accommodating capacity of the bracket loading mechanism is improved, thereby ensuring that the dual-dispensing head high-speed die bonding machine has a certain buffer capacity, and there is no need to continuously perform material loading operations on the dual-dispensing head high-speed die bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of a high-speed die-bonding machine with double dispensing heads in an embodiment of the present application;

[0033] Figure 2 It is a structural schematic diagram of the bracket dispensing mechanism in the embodiment of the present application;

[0034] Figure 3 It is a schematic diagram of the structure of the chip feeding mechanism and the bonding head crystal bonding mechanism in the embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100, rack; 200, bracket loading mechanism; 210, loading column; 220, first material feeding and conveying rack; 221, bracket ejection arm; 230, second material feeding and conveying rack; 240, bracket transfer assembly; 241, conveyor belt; 242, conveyor pallet; 300, bracket dispensing mechanism; 310, bracket placement seat; 320, dispensing welding head; 330, dispensing mounting seat; 340, dispensing drive assembly; 341, X-axis motion module Group; 342, Y-axis motion module; 350, dispensing monitoring camera; 400, bracket docking mechanism; 410, XY motion module; 420, bracket docking table; 500, chip feeding mechanism; 510, X-axis feeding module; 520, Y-axis feeding module; 530, chip feeding tray; 600, welding head solid crystal mechanism; 610, motor mounting seat; 620, crystal removal welding head; 630, welding head driving assembly; 700, bracket unloading mechanism. DETAILED DESCRIPTION

[0037] The present application is further described in detail below in conjunction with the accompanying drawings.

[0038] The embodiment of the present application discloses a high-speed die bonding machine with dual dispensing heads.

[0039] Reference Figure 1A high-speed crystal bonding machine with double dispensing heads includes a frame 100, a support feeding mechanism 200, a support dispensing mechanism 300, a support docking mechanism 400, a chip feeding mechanism 500, a welding head crystal bonding mechanism 600, and a support unloading mechanism 700. The support feeding mechanism 200 is used to accommodate a plurality of crystal bonding supports, the support dispensing mechanism 300 is used to receive and accommodate the crystal bonding supports transferred by the support feeding mechanism 200 and to dispense glue on the crystal bonding supports, the support docking mechanism 400 is used to receive the crystal bonding supports on the support placement seat 310, the chip feeding mechanism 500 is used to carry the chip, the welding head crystal bonding mechanism 600 is used to absorb the chip from the chip feeding mechanism 500 and transfer it to the crystal bonding supports on the support docking mechanism 400 for crystal bonding, and the support unloading mechanism 700 is used to receive and accommodate a plurality of crystal bonding supports on the support docking mechanism 400 that have completed the crystal bonding operation. The frame 100 is generally in the shape of a rectangular parallelepiped, wherein the bracket loading mechanism 200 and the bracket unloading mechanism 700 are arranged on two opposite sides of the frame 100, and the bracket dispensing mechanism 300, the bracket docking mechanism 400, the chip feeding mechanism 500 and the welding head solid crystal mechanism 600 are arranged on the upper surface of the frame 100.

[0040] Reference Figure 1 The bracket loading mechanism 200 includes a loading column 210, a first material loading and conveying rack 220 and a second material loading and conveying rack 230. The loading column 210 is fixedly installed on the side of the frame 100, and the first material loading and conveying rack 220 and the second material loading and conveying rack 230 are both installed on the side of the loading column 210, and the first material loading and conveying rack 220 is located directly above the second material loading and conveying rack 230. The bottom of the first material loading and conveying rack 220 and the second material loading and conveying rack 230 is provided with a support transfer assembly 240. In this embodiment, the support transfer assembly 240 includes a conveyor belt 241 for horizontally transmitting the solid crystal support, a conveyor drive motor for driving the conveyor belt 241 to rotate, and a conveyor pallet 242 for transferring the solid crystal support on the second material loading and conveying rack 230 to the first material loading and conveying rack 220. The conveyor belt 241 is respectively provided on the upper surface of the first material loading and conveying rack 220 and the second material loading and conveying rack 230, and the conveyor drive motor is fixedly installed on the bottom of the first material loading and conveying rack 220 and the second material loading and conveying rack 230. The overall structure of the support unloading mechanism 700 is the same as that of the support loading mechanism 200, which will not be described in detail here.

[0041] Reference Figure 1By storing the crystal bonding bracket on the first material loading and conveying rack 220 and the second material loading and conveying rack 230, the conveying pallet 242 can transfer the crystal bonding bracket on the second material loading and conveying rack 230 to the first material loading and conveying rack 220, so that the accommodating capacity of the bracket feeding mechanism 200 is improved, thereby ensuring that the dual-dispensing head high-speed crystal bonding machine has a certain buffering capacity, and there is no need to continuously perform feeding operations on the dual-dispensing head high-speed crystal bonding machine. In order to facilitate the dispensing welding head 320 to dispense glue on the crystal bonding bracket, a bracket push-out arm 221 is provided on the upper surface of the first material loading and conveying rack 220. The bracket push-out arm 221 is generally arranged in a "U" shape. The bracket push-out arm 221 is used to push out the crystal bonding bracket on the first material loading and conveying rack 220, and the bracket push-out arm 221 can move along the guide rail arranged on the upper surface of the first material loading and conveying rack 220, so as to facilitate the automatic pushing out of the crystal bonding bracket on the first material loading and conveying rack 220 in sequence, thereby improving the feeding efficiency.

[0042] Reference Figure 1 and Figure 2 The support dispensing mechanism 300 includes a support placement seat 310, a dispensing welding head 320, a dispensing mounting seat 330 and a dispensing driving assembly 340. The support placement seat 310 is used to place a solid crystal support. The support placement seat 310 and the dispensing mounting seat 330 are fixedly installed on the upper surface of the frame 100 in a front-to-back manner. The dispensing driving assembly 340 is installed on the dispensing mounting seat 330 and drives the dispensing welding head 320 to move. A plurality of dispensing welding heads 320 are located directly above the support placement seat 310. The dispensing driving assembly 340 includes an X-axis motion module 341 installed on the upper surface of the dispensing mounting seat 330 and a plurality of Y-axis motion modules 342 installed above the X-axis motion module 341, so that the dispensing driving assembly 340 can share one X-axis motion module 341 with a plurality of dispensing welding heads 320, thereby improving the space utilization rate of the dispensing driving assembly 340. The number of Y-axis motion modules 342 is the same as the number of dispensing welding heads 320 and corresponds one to one. A dispensing monitoring camera 350 is also arranged on the side of the dispensing welding head 320 and the dispensing monitoring camera 350 is located directly above the bracket placement seat 310, so that the dispensing status can be observed, so that the dual dispensing head high-speed crystal bonding machine can monitor the dispensing quality during the dispensing process in real time and improve the stability of the crystal bonding quality.

[0043] Reference Figure 1, the bracket docking mechanism 400 is used to receive the die-bonding bracket on the bracket placement seat 310. The bracket docking mechanism 400 includes an XY motion module 410 disposed on the upper surface of the frame 100 and a bracket docking platform 420 disposed above the XY motion module 410. The structure of the bracket docking platform 420 is substantially the same as that of the bracket placement seat 310, and the bracket docking platform 420 and the bracket placement seat 310 are both provided with belts for transporting the die-bonding bracket, and the length direction of the bracket docking platform 420 is parallel to the length direction of the bracket placement seat 310. The XY motion module 410 drives the bracket docking platform 420 to move on the upper surface of the frame 100. When the bracket docking platform 420 docks with the bracket placement seat 310, the bracket docking platform 420 is in the bracket docking position. After the die-bonding bracket after dispensing is transferred from the bracket placement seat 310 to the bracket docking platform 420 by the belt, the XY motion module 410 drives the bracket docking platform 420 to retreat to the initial position to wait for die bonding, and this position is the die bonding preparation position. After the docking is completed, the support docking platform 420 moves to a die-bonding preparation position for preparing for the die-bonding operation, thereby facilitating the subsequent die-bonding operation.

[0044] Reference Figure 1 and Figure 3 The chip feeding mechanism 500 includes an X-axis feeding module 510, a Y-axis feeding module 520 disposed on the upper surface of the X-axis feeding module 510, and a chip feeding tray 530 disposed on the Y-axis feeding module 520. The chip feeding tray 530 is generally in the shape of a disk, and a blue film for loading chips is tightly mounted on the chip feeding tray 530. The X-axis feeding module 510 and the Y-axis feeding module 520 drive the chip feeding tray 530 to move in the X-axis and Y-axis directions, so that the bonding head bonding mechanism 600 can absorb chips from different positions in the chip feeding tray 530. In order to facilitate the angle correction of the chip, the chip feeding tray 530 is rotatably matched with the mounting seat on the upper surface of the Y-axis feeding module 520, and a belt is arranged on the side of the chip feeding tray 530, and a correction motor for driving the belt to rotate is arranged on the mounting seat on the upper surface of the Y-axis feeding module 520, so as to facilitate the angle correction of the chips on the chip feeding tray 530.

[0045] Reference Figure 1 and Figure 3The welding head crystal bonding mechanism 600 includes a motor mounting seat 610, a crystal welding head 620 and a welding head driving assembly 630. In this embodiment, the welding head driving assembly 630 is a driving motor that drives the crystal welding head 620 to reciprocate in the θ-axis direction and to reciprocate in the Z-axis direction. The motor mounting seat 610 is mounted on the upper surface of the frame 100, the welding head driving assembly 630 is mounted on the motor mounting seat 610, and the crystal welding head 620 is mounted on the welding head driving assembly 630. The welding head driving assembly 630 drives the crystal welding head 620 to absorb the chip from the chip feeding mechanism 500 and transfer it to the crystal bonding bracket of the bracket docking mechanism 400 located at the crystal bonding preparation position and reciprocate, thereby completing the crystal bonding process.

[0046] The implementation principle of a high-speed crystal bonding machine with double dispensing heads in the embodiment of the present application is as follows: a plurality of crystal bonding brackets are accommodated in the bracket feeding mechanism 200, the bracket dispensing mechanism 300 receives and accommodates the crystal bonding brackets transferred by the bracket feeding mechanism 200 and dispenses glue on the crystal bonding brackets, and a plurality of dispensing welding heads 320 are arranged in the bracket dispensing mechanism 300, and the welding head driving assembly 630 drives the crystal taking welding head 620 to absorb the chip from the chip feeding mechanism 500 and transfer it to the crystal bonding bracket, at which time the bracket docking mechanism 400 is located in the crystal bonding preparation position, and the crystal taking welding head 620 returns to the top of the chip feeding mechanism 500 and reciprocates after the crystal bonding is completed, so as to quickly perform the crystal bonding operation on the crystal bonding bracket. After all the dispensing of the crystal bonding brackets is completed, the bracket docking mechanism 400 transfers the crystal bonding brackets that have completed the dispensing operation on the bracket placement seat 310 to the crystal bonding preparation position. The welding head crystal bonding mechanism 600 sucks the chip from the chip feeding mechanism 500 and transfers it to the crystal bonding bracket on the bracket docking mechanism 400 located at the crystal bonding preparation position for crystal bonding. The bracket unloading mechanism 700 accommodates the crystal bonding bracket that has completed the crystal bonding operation, and the bracket docking mechanism 400 separates the dispensing action and the crystal bonding action, so that the time of the two actions can overlap, thereby improving the working efficiency of the dual dispensing head high-speed crystal bonding machine.

[0047] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Among them, the same parts are represented by the same figure marks. It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the above description refer to the directions in the drawings, and the words "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively. Therefore: All equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A high-speed die bonding machine with double dispensing heads, characterized in that: include: Rack(100); A bracket loading mechanism (200) is used to accommodate a plurality of die-bonding brackets, and the bracket loading mechanism (200) is arranged on a side of the frame (100); A support glue dispensing mechanism (300) is used to receive and accommodate the crystal bond support transferred by the support feeding mechanism (200) and to dispense glue on the crystal bond support. The support glue dispensing mechanism (300) comprises a support placement seat (310) for placing the crystal bond support, a plurality of glue dispensing welding heads (320) for simultaneously dispensing glue on the crystal bond support on the support placement seat (310), a glue dispensing mounting seat (330) for mounting the glue dispensing welding heads (320), and a glue dispensing driving assembly (340) for driving the glue dispensing welding heads (320) to move along the X-axis and the Y-axis. The plurality of glue dispensing welding heads (320) are located directly above the support placement seat (310). The support placement seat (310) and the glue dispensing mounting seat (330) are both mounted on the upper surface of the frame (100), and the glue dispensing driving assembly (340) is mounted on the glue dispensing mounting seat (330). A bracket docking mechanism (400), the bracket docking mechanism (400) moves between a bracket docking position and a die-bonding preparation position, the bracket docking mechanism (400) located at the bracket docking position is used to receive the die-bonding bracket on the bracket placement seat (310), and the bracket docking mechanism (400) is arranged on the upper surface of the frame (100); A chip feeding mechanism (500) is installed on the upper surface of the frame (100) to carry chips; A welding head crystal bonding mechanism (600) is used to absorb the chip from the chip feeding mechanism (500) and transfer it to the crystal bonding bracket on the bracket docking mechanism (400) located at the crystal bonding preparation position for crystal bonding; a bracket unloading mechanism (700) for receiving and accommodating a plurality of crystal bonding brackets on the bracket docking mechanism (400) that have completed the crystal bonding operation, wherein the bracket unloading mechanism (700) is arranged on the side of the frame (100); the bracket unloading mechanism (700) has the same overall structure as the bracket loading mechanism (200); The support loading mechanism (200) comprises a loading column (210), a first material loading and conveying frame (220) fixedly arranged on the side of the loading column (210), a second material loading and conveying frame (230) fixedly arranged on the side of the loading column (210), and a support transfer assembly (240) slidably arranged on the side of the loading column (210), wherein the first material loading and conveying frame (220) is located directly above the second material loading and conveying frame (230); the support transfer assembly (240) comprises a conveying belt (241) for horizontally transmitting the crystal bonding support, a conveying drive motor for driving the conveying belt (241) to rotate, and a conveying pallet (242) for transferring the crystal bonding support on the second material loading and conveying frame (230) to the first material loading and conveying frame (220); The upper surface of the first material placement and conveying rack (220) is provided with a bracket pushing arm (221) for pushing the crystal bonding bracket on the first material placement and conveying rack (220) to the bracket placement seat (310), and the bracket pushing arm (221) moves along the length direction of the first material placement and conveying rack (220); After all the glue dispensing of the crystal bonding brackets is completed, the bracket docking mechanism (400) transfers the crystal bonding brackets on the bracket placement seat (310) that have completed the glue dispensing operation to the crystal bonding preparation position; the welding head crystal bonding mechanism (600) absorbs the chip from the chip feeding mechanism (500) and transfers it to the crystal bonding bracket on the bracket docking mechanism (400) located at the crystal bonding preparation position for crystal bonding.

2. A high-speed die bonding machine with dual dispensing heads according to claim 1, characterized in that: The dispensing drive assembly (340) includes an X-axis motion module (341) installed on the upper surface of the dispensing mounting seat (330) and a plurality of Y-axis motion modules (342) installed above the X-axis motion module (341), and the number of the Y-axis motion modules (342) is the same as the number of the dispensing welding heads (320) and corresponds one to one.

3. A high-speed die bonding machine with dual dispensing heads according to claim 2, characterized in that: The support glue dispensing mechanism (300) further comprises a glue dispensing monitoring camera (350), wherein the glue dispensing monitoring camera (350) is mounted on the glue dispensing mounting seat (330) and is located directly above the support placement seat (310).

4. A high-speed die bonding machine with dual dispensing heads according to claim 1, characterized in that: The support docking mechanism (400) comprises an XY motion module (410) arranged on the upper surface of the frame (100) and a support docking platform (420) arranged above the XY motion module (410); the length direction of the support docking platform (420) is parallel to the length direction of the support placement seat (310); the XY motion module (410) drives the support docking platform (420) to move on the upper surface of the frame (100); when the support docking platform (420) is docked with the support placement seat (310), the support docking platform (420) is in a support docking position.

5. The high-speed die bonding machine with dual dispensing heads according to claim 1, characterized in that: The welding head crystal bonding mechanism (600) comprises a motor mounting seat (610), a crystal welding head (620) and a welding head driving assembly (630), wherein the motor mounting seat (610) is mounted on the upper surface of the frame (100), the welding head driving assembly (630) is mounted on the motor mounting seat (610), the crystal welding head (620) is mounted on the welding head driving assembly (630), and the welding head driving assembly (630) drives the crystal welding head (620) to absorb the chip from the chip feeding mechanism (500) and transfer it to the crystal bonding bracket of the bracket docking mechanism (400) located at the crystal bonding preparation position and reciprocate.

6. A high-speed die bonding machine with dual dispensing heads according to claim 1, characterized in that: The chip feeding mechanism (500) comprises an X-axis feeding module (510), a Y-axis feeding module (520) arranged on the upper surface of the X-axis feeding module (510), and a chip feeding tray (530) arranged on the Y-axis feeding module (520); the X-axis feeding module (510) and the Y-axis feeding module (520) drive the chip feeding tray (530) to move in the X-axis and Y-axis directions.

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