Wireless module supporting high-speed data transmission

By adopting the built-in high-speed data processing algorithm and optimized circuit design of the main control chip in wireless modules, the problem of insufficient speed and anti-interference capability of traditional modules in high bandwidth and low delay communication scenarios is solved, and high-speed data transmission and high-speed Stability, meet modern communication needs.

CN222128064UActive Publication Date: 2024-12-06SHENZHEN BILIAN ELECTRONICS LTD
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Patent Information

Application Number
CN202420858782.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-23
Publication Date
2024-12-06
Estimated Expiration
2034-04-23

AI Technical Summary

Technical Problem

Traditional wireless modules cannot meet the needs of data transmission speed and anti-interference capabilities when facing modern high bandwidth, low latency and high reliability communication scenarios.

Method used

A wireless module supporting high-speed data transmission was designed, using the main control chip built-in high-speed data processing algorithm and modem demodulation function, and the module is improved by optimizing circuit design and selecting high-performance components, combined with reasonable layout and wiring. stability and anti-interference ability.

Benefits of technology

It has achieved the transmission speed of hundreds of Mbps or even Gbps, with good stability, strong anti-interference ability and low power consumption, meeting the communication needs of smart devices for high-speed data transmission, and providing support for the development of wireless communication technology.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a wireless module supporting high-speed data transmission, comprising a transmission assembly, the transmission assembly comprises a housing, a support column, a positioning column, a mainboard, a positioning hole, a main control chip, a radio frequency chip, a power amplifier, a low noise amplifier and an antenna connection module; supporting columns are welded to the four corners of the inner bottom wall of the shell correspondingly, and positioning columns are welded to the centers of the tops of the four supporting columns correspondingly. According to the wireless module, high-speed data transmission is supported through a high-speed data processing algorithm and a modulation and demodulation function built in the main control chip, the transmission speed can reach hundreds of Mbps or even Gbps, and meanwhile, the stability and the anti-interference capability of the wireless module are improved through circuit design optimization, high-performance component selection and reasonable layout and wiring; the high-speed data transmission system is high in transmission speed, good in stability, high in anti-interference capability and low in power consumption, so that the communication requirements of different intelligent devices for high-speed data transmission are met, and powerful support is provided for development of the wireless communication technology.
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Description

Technical Field

[0001] The utility model relates to the technical field of wireless communications, and in particular to a wireless module supporting high-speed data transmission. Background Art

[0002] Wireless communication is a communication method that uses the ability of electromagnetic wave signals to propagate in free space to exchange information. In recent years, wireless communication technology has been the fastest growing and most widely used in the field of information and communications. Wireless communication achieved while on the move is also commonly referred to as mobile communication, and the two are collectively referred to as wireless mobile communication. With the rapid development of wireless communication technology, various smart devices have increasingly higher requirements for data transmission speeds.

[0003] With the continuous advancement of wireless communication technology and the increasing popularity of smart devices, the requirements for data transmission speed, stability, and anti-interference capabilities are also constantly increasing. Although traditional wireless modules have met the basic needs of wireless communication to a certain extent, they are gradually unable to meet the needs of modern communication scenarios with high bandwidth, low latency, and high reliability. To this end, a wireless module that supports high-speed data transmission is proposed. Utility Model Content

[0004] In view of this, the present invention hopes to provide a wireless module that supports high-speed data transmission to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0005] The technical solution of the embodiment of the utility model is implemented as follows: a wireless module supporting high-speed data transmission includes a transmission component, wherein the transmission component includes a housing, a support column, a positioning column, a main board, a positioning hole, a main control chip, a radio frequency chip, a power amplifier, a low-noise amplifier, a filter and an antenna connection module;

[0006] Support columns are welded to the four corners of the inner bottom wall of the shell, and positioning columns are welded to the top centers of the four support columns. Positioning holes are opened at the four corners of the upper surface of the mainboard, and the outer walls of the positioning columns are fitted and connected to the inner walls of the positioning holes. A main control chip is arranged at the center of the upper surface of the mainboard, and a radio frequency chip is arranged on the side of the upper surface of the mainboard close to the main control chip. The radio frequency chip and the main control chip are electrically connected. A power amplifier and a low noise amplifier are respectively arranged on the upper and lower parts of the upper surface of the mainboard close to the radio frequency chip. The input end of the power amplifier is electrically connected to the output end of the radio frequency chip, and the output end of the low noise amplifier is electrically connected to the input end of the radio frequency chip. A filter is arranged on the other side of the upper surface of the mainboard close to the main control chip. The power amplifier and the low noise amplifier are both electrically connected to the antenna connection module through the filter.

[0007] Further preferably, a through groove is provided on one side of the inner wall of the shell, one side of the outer wall of the antenna connection module is fixedly connected to the inner wall of the through groove, the other side of the inner wall of the shell is fixedly connected to a power supply, and a power management module is provided in the middle of the upper surface of the power supply.

[0008] Further preferably, a side of the antenna connection module away from the main control chip is provided with a plurality of plug holes, and the inner side walls of the plurality of plug holes are rotatably connected to wireless transmission antennas.

[0009] Further preferably, a charging socket is provided in the middle of one side of the shell close to the power management module.

[0010] Further preferably, an external device connection module is provided on the upper surface of the power supply near the front of the power management module, the external device connection module is electrically connected to the main control chip, and a USB port and a Type-C port are provided on the front of one side of the shell near the power management module.

[0011] Further preferably, heat dissipation grooves are provided in the middle of the front surface and the rear surface of the shell, and dustproof nets are fixedly connected to the inner side walls of the two heat dissipation grooves.

[0012] Further preferably, a clamping frame is clamped on the top of the inner side wall of the shell, a cover plate is fixedly connected to the top of the clamping frame, and the lower surface of the cover plate is closely connected to the outer side of the clamping frame and is connected to the upper surface of the shell.

[0013] Further preferably, a screw hole is provided at the center of the upper surface of the positioning column, and a screw is threadedly connected to the inner side wall of the screw hole.

[0014] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0015] This utility model supports high-speed data transmission through the high-speed data processing algorithm and modulation and demodulation functions built into the main control chip. The transmission speed can reach hundreds of Mbps or even Gbps level. At the same time, through optimized circuit design, selection of high-performance components and reasonable layout and wiring, the stability and anti-interference ability of the wireless module are improved; not only the transmission speed is fast and the stability is good, but also the anti-interference ability is strong and the power consumption is low, thereby meeting the communication needs of different smart devices for high-speed data transmission and providing strong support for the development of wireless communication technology.

[0016] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a structural diagram from one perspective of the present utility model;

[0019] Figure 2 This is a structural diagram from another perspective of the present utility model;

[0020] Figure 3 This is the structure diagram of the main control chip and filter of the utility model;

[0021] Figure 4 This is a structural diagram of the housing and positioning column of the utility model.

[0022] Figure markings: 1. Transmission component; 11. Shell; 12. Support column; 13. Positioning column; 14. Mainboard; 15. Positioning hole; 16. Main control chip; 17. Radio frequency chip; 18. Power amplifier; 19. Low noise amplifier; 20. Filter; 21. Antenna connection module; 22. Through slot; 23. Power supply; 24. Power management module; 25. Plug hole; 26. Wireless transmission antenna; 27. Charging socket; 28. External device connection module; 29. ​​USB socket; 30. Type-C socket; 31. Heat dissipation slot; 32. Dust net; 33. Snap-in frame; 34. Cover; 35. Screw hole; 36. Screw. DETAILED DESCRIPTION

[0023] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0024] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0025] like Figure 1 As shown in FIG-4 , an embodiment of the present invention provides a wireless module supporting high-speed data transmission, including a transmission component 1, which includes a housing 11, a support column 12, a positioning column 13, a mainboard 14, a positioning hole 15, a main control chip 16, a radio frequency chip 17, a power amplifier 18, a low-noise amplifier 19, a filter 20, and an antenna connection module 21;

[0026] Support columns 12 are welded to the four corners of the inner bottom wall of the shell 11, and positioning columns 13 are welded to the top centers of the four support columns 12. Positioning holes 15 are opened at the four corners of the upper surface of the main board 14, and the outer walls of the positioning columns 13 are fitted and connected to the inner walls of the positioning holes 15. A main control chip 16 is arranged at the center of the upper surface of the main board 14, and a radio frequency chip 17 is arranged on the side of the upper surface of the main board 14 close to the main control chip 16. The radio frequency chip 17 and the main control chip 16 are electrically connected. A power amplifier 18 and a low noise amplifier 19 are respectively arranged on the upper and lower parts of the upper surface of the main board 14 close to the radio frequency chip 17. The input end of the power amplifier 18 is electrically connected to the output end of the radio frequency chip 17, and the output end of the low noise amplifier 19 is electrically connected to the input end of the radio frequency chip 17. A filter 20 is arranged on the other side of the upper surface of the main board 14 close to the main control chip 16. The power amplifier 18 and the low noise amplifier 19 are electrically connected to the input end of the radio frequency chip 17. The sound amplifiers 19 are electrically connected to the antenna connection module 21 through the filter 20. The support of the main board 14 by the support column 12 creates a heat dissipation gap between the main board 14 and the inner bottom wall of the shell 11, thereby facilitating heat dissipation from the bottom of the main board 14. The main control chip 16 performs data processing tasks and communicates with external devices, and the main control chip 16 has built-in high-speed data processing algorithms and modulation and demodulation functions to achieve high-speed data transmission. The circuit layout optimization and component selection of the RF chip 17, power amplifier 18, low-noise amplifier 19 and filter 20 improve the signal stability and anti-interference ability of the module. The RF chip 17 is used for bidirectional conversion between digital signals and RF signals. The power amplifier 18 is used to amplify RF signals for transmission. The low-noise amplifier 19 is used to amplify received weak RF signals. The filter 20 is used to filter out clutter and interference in the signal.

[0027] In one embodiment, specifically: a through slot 22 is provided on one side of the inner wall of the shell 11, one side of the outer wall of the antenna connection module 21 is fixedly connected to the inner wall of the through slot 22, and the other side of the inner wall of the shell 11 is fixedly connected to a power supply 23, and a power management module 24 is provided in the middle of the upper surface of the power supply 23. The power management module 24 stabilizes the electric energy provided by the power supply 23 to power each chip in the wireless module, thereby ensuring the normal operation of the wireless module, and the power management module 24 includes an energy-saving mechanism, which can reduce power consumption when the wireless module is idle or under low load.

[0028] In one embodiment, specifically: a plurality of plug holes 25 are provided on the side of the antenna connection module 21 away from the main control chip 16, and the inner side walls of the plurality of plug holes 25 are rotatably connected to wireless transmission antennas 26. The plurality of wireless transmission antennas 26 connected through the antenna connection module 21 realize the transmission and reception of wireless signals.

[0029] In one embodiment, specifically: a charging socket 27 is provided in the middle of one side of the housing 11 close to the power management module 24 , and the charging socket 27 is used to connect an external power source to charge the power supply 23 .

[0030] In one embodiment, specifically: an external device connection module 28 is provided on the upper surface of the power supply 23 near the front of the power management module 24, and the external device connection module 28 is electrically connected to the main control chip 16. A USB port 29 and a Type-C port 30 are provided on the front of one side of the shell 11 near the power management module 24. The USB port 29 or the Type-C port 30 facilitates the connection of external devices, thereby facilitating the connection between the external device and the external device connection module 28.

[0031] In one embodiment, specifically: a heat dissipation groove 31 is opened in the middle of the front surface and the rear surface of the shell 11, and the inner walls of the two heat dissipation grooves 31 are fixedly connected with a dustproof net 32. The heat dissipation groove 31 facilitates the dissipation of heat inside the shell 11, thereby preventing the high temperature inside the shell 11 from causing data transmission interruption. The dustproof net 32 ​​inside the heat dissipation groove 31 prevents dust from entering the shell 11 and causing damage to internal electronic components.

[0032] In one embodiment, specifically: a snap-on frame 33 is snapped onto the top of the inner wall of the shell 11, a cover 34 is fixedly connected to the top of the snap-on frame 33, and the lower surface of the cover 34 is close to the outer side of the snap-on frame 33 and is attached to the upper surface of the shell 11. The cover 34 protects the electronic components inside the shell 11, thereby extending the service life of the wireless module.

[0033] In one embodiment, specifically: a screw hole 35 is opened at the center of the upper surface of the positioning column 13, and the inner wall of the screw hole 35 is threadedly connected with a screw 36, and the main board 14 is fixed by the screw 36 threaded inside the screw hole 35, thereby increasing the firmness of the connection between the main board 14 and the positioning column 13.

[0034] When the present invention is in operation: the external device is connected to the external device connection module 28 through the USB port 29 or the Type-C port 30, and communicates with the main control chip 16 through the external device connection module 28, sending data to the main control chip 16 for processing, and the main control chip 16 sends the processed digital signal to the RF chip 17, the RF chip 17 converts the digital signal into a RF signal, and amplifies the power of the transmitted signal through the power amplifier 18, the amplified signal passes through the filter 20 to filter out stray signals and interference signals, and is then transmitted through the wireless transmission antenna 26 connected to the antenna connection module 21; when the wireless module receives a wireless signal, the wireless transmission antenna 26 sends the signal to the filter 20 through the antenna connection module 21 for filtering processing, the filtered signal passes through the low-noise amplifier 19 to amplify the power of the received signal, and then sends it to the RF chip 17 for conversion from RF signal to digital signal, the converted digital signal is sent to the main control chip 16 for processing, and the processing result is transmitted to the external device through the USB port 29 or the Type-C port 30 connected to the external device connection module 28.

[0035] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope of protection of the claims.

Claims

1. A wireless module supporting high-speed data transmission, characterized in that: The invention comprises a transmission component (1), wherein the transmission component (1) comprises a housing (11), a support column (12), a positioning column (13), a main board (14), a positioning hole (15), a main control chip (16), a radio frequency chip (17), a power amplifier (18), a low noise amplifier (19), a filter (20) and an antenna connection module (21); Support columns (12) are welded to the four corners of the inner bottom wall of the shell (11), and positioning columns (13) are welded to the top centers of the four support columns (12). Positioning holes (15) are opened at the four corners of the upper surface of the main board (14), and the outer walls of the positioning columns (13) are closely connected to the inner walls of the positioning holes (15). A main control chip (16) is arranged at the center of the upper surface of the main board (14), and a radio frequency chip (17) is arranged on one side of the upper surface of the main board (14) close to the main control chip (16). The radio frequency chip (17) is electrically connected to the main control chip (16). A power amplifier (18) and a low noise amplifier (19) are respectively arranged on the upper and lower parts of the upper surface of the board (14) close to the radio frequency chip (17); the input end of the power amplifier (18) is electrically connected to the output end of the radio frequency chip (17); the output end of the low noise amplifier (19) is electrically connected to the input end of the radio frequency chip (17); a filter (20) is arranged on the other side of the upper surface of the main board (14) close to the main control chip (16); and the power amplifier (18) and the low noise amplifier (19) are both electrically connected to the antenna connection module (21) through the filter (20).

2. A wireless module supporting high-speed data transmission according to claim 1, characterized in that: A through slot (22) is provided on one side of the inner wall of the shell (11); one side of the outer wall of the antenna connection module (21) is fixedly connected to the inner wall of the through slot (22); the other side of the inner wall of the shell (11) is fixedly connected to a power supply (23); and a power management module (24) is provided in the middle of the upper surface of the power supply (23).

3. A wireless module supporting high-speed data transmission according to claim 2, characterized in that: A plurality of plug holes (25) are provided on a side of the antenna connection module (21) away from the main control chip (16), and the inner side walls of the plurality of plug holes (25) are all rotatably connected to wireless transmission antennas (26).

4. The wireless module supporting high-speed data transmission according to claim 2, characterized in that: A charging socket (27) is provided in the middle of one side of the housing (11) close to the power management module (24).

5. A wireless module supporting high-speed data transmission according to claim 4, characterized in that: An external device connection module (28) is provided on the upper surface of the power supply (23) near the front of the power management module (24), and the external device connection module (28) is electrically connected to the main control chip (16). A USB port (29) and a Type-C port (30) are provided on the front of one side of the housing (11) near the power management module (24).

6. The wireless module supporting high-speed data transmission according to claim 1, characterized in that: A heat dissipation groove (31) is provided in the middle of the front surface and the rear surface of the shell (11), and dustproof nets (32) are fixedly connected to the inner side walls of the two heat dissipation grooves (31).

7. A wireless module supporting high-speed data transmission according to claim 6, characterized in that: A clamping frame (33) is clamped on the top of the inner wall of the shell (11), a cover plate (34) is fixedly connected to the top of the clamping frame (33), and a lower surface of the cover plate (34) is closely connected to the outer side of the clamping frame (33) and is attached to the upper surface of the shell (11).

8. The wireless module supporting high-speed data transmission according to claim 7, characterized in that: A screw hole (35) is provided at the center of the upper surface of the positioning column (13), and a screw (36) is threadedly connected to the inner wall of the screw hole (35).