Downward pressing mechanism and grinding device

Abstract

The utility model relates to the technical field of wafer processing, and discloses a pressing mechanism and a grinding device.The pressing mechanism is used for pressing and fixing a wafer and comprises a fixing piece, a connecting piece, a lifting driving piece and a pressing piece; the connecting piece is connected to the fixing piece; the lifting driving piece is connected to the connecting piece; the pressing piece is connected to the lifting driving piece, and the lower end of the pressing piece is provided with a lower pressing surface; according to the pressing mechanism, the pressing face can abut against the top face of the wafer through the lifting driving piece and the pressing piece so as to press and fix the wafer, the wafer can be prevented from deviating in the grinding process, constant positioning of the wafer can be kept in the grinding process of the wafer, and the grinding effect of the wafer can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a pressing mechanism and a grinding device. Background Art

[0002] The six sides of the square wafer are all coated. In some cases, it is necessary to grind and remove the coating on the four sides of the wafer while retaining the coating on the upper and lower surfaces. Since the wafer size (5mm×5mm×1mm, 5mm×5mm×2.5mm, 6mm×8mm×2mm, etc.) is small and the specifications are different, most of the wafers are currently ground on sandpaper or grinding wheels by hand. This manual grinding method cannot keep the wafer in a constant position during the grinding process, which reduces the grinding effect of the wafer. Utility Model Content

[0003] Aiming to solve at least one of the technical problems existing in the prior art, the utility model provides a pressing mechanism and a grinding device including the pressing mechanism, wherein the pressing mechanism can keep the wafer in a constant position during the grinding process of the wafer, which is beneficial to improving the grinding effect of the wafer.

[0004] In order to achieve the above-mentioned purpose, the utility model provides a pressing mechanism for pressing and fixing a wafer, comprising a fixing member, a connecting member, a lifting driving member and a pressing member; the connecting member is connected to the fixing member; the lifting driving member is connected to the connecting member; the pressing member is connected to the lifting driving member, the lower end of the pressing member has a pressing surface, and the lifting driving member can drive the pressing member to descend so that the pressing surface abuts against the top surface of the wafer;

[0005] The area of ​​the top surface of the wafer is larger than the area of ​​the pressing surface, and when the center line of the wafer coincides with the center line of the pressing surface, the projection of the wafer at least covers the projection of the pressing surface along the extension direction of the center line of the wafer.

[0006] In some embodiments, an elastic buffer component is further included, and the pressing member is connected to the lifting drive member through the elastic buffer component.

[0007] In some embodiments, the elastic buffer assembly includes a fixed seat, a connecting rod, a first connecting block, a limit block and an elastic member, the fixed seat is connected to the connecting member and is provided with a limit channel that passes through the fixed seat from top to bottom, the connecting rod is inserted into the limit channel, the pressing member is connected to the lower end of the connecting rod and is located below the fixed seat, the first connecting block is connected to the upper end of the connecting rod and is located above the fixed seat, the lifting drive member is connected to the upper end of the first connecting block, the limit block is sleeved on the connecting rod and is located in the limit channel, the upper end of the elastic member is connected to the lower end of the limit block, and the lower end of the elastic member is connected to the inner wall of the limit channel.

[0008] In some embodiments, there are multiple elastic members, and the multiple elastic members are distributed in sequence and at intervals around the axis of the connecting rod.

[0009] In some embodiments, a pressure sensor is further included, and the lifting drive member is connected to the upper end of the first connecting block through the pressure sensor.

[0010] In some embodiments, the elastic buffer assembly further includes a second connecting block, the second connecting block is connected to the lower end of the connecting rod and is located below the fixing seat, and the pressing piece is detachably connected to the lower end of the second connecting block.

[0011] In some embodiments, the lower end of the connecting rod is connected to the center of the second connecting block, and a positioning hole is provided in the center of the second connecting block, which passes through the second connecting block from top to bottom. The second connecting block also has a plurality of first connecting holes distributed around the positioning hole; the pressing piece includes a first connecting part, a positioning column, a second connecting part and a pressing rod, the first connecting part has a plurality of second connecting holes corresponding to the plurality of first connecting holes, the positioning column is connected to the upper end of the first connecting part and can be embedded in the positioning hole, the second connecting part is connected to the lower end of the first connecting part, the pressing rod is connected to the lower end of the second connecting part, and the lower end surface of the pressing rod is the lower pressing surface.

[0012] In some embodiments, the elastic buffer assembly further includes a limit cover, which is connected to the upper end of the fixing member and covers the upper end opening of the limit channel, and the limit cover is provided with a first through hole for the connecting rod to pass through.

[0013] In some embodiments, a spray assembly is further included, and the spray assembly includes a water pipe and a spray head. The water pipe is passed through the fixing member, and the spray head is connected to one end of the water pipe and is located on one side of the pressing member.

[0014] The utility model also provides a grinding device, comprising the pressing mechanism described in any one of the above items, and also comprising a workbench, a supporting member and a grinding mechanism, wherein the fixing member is connected to the workbench, the supporting member is connected to the workbench and is located below the pressing member, the upper end of the supporting member is provided with a supporting surface, the wafer is placed on the supporting surface, and the grinding mechanism comprises a grinding unit, the grinding unit is connected to the top of the workbench and is located on one side of the supporting member; wherein the area of ​​the bottom surface of the wafer is larger than the area of ​​the supporting surface, and when the center line of the wafer coincides with the center line of the supporting surface, the projection of the wafer at least covers the supporting surface along the extension direction of the center line of the wafer.

[0015] Compared with the prior art, the pressing mechanism provided by the embodiment of the utility model has the following beneficial effects: the pressing member is driven downward by the lifting drive member, so that the pressing surface can be abutted against the top surface of the wafer to press and fix the wafer, thereby maintaining a constant positioning of the wafer during the wafer grinding process, which is beneficial to improving the grinding effect of the wafer. After the grinding is completed, the lifting drive member drives the pressing member to rise back to its original position and makes the pressing surface leave the top surface of the wafer, and the pressing member releases the wafer; at the same time, by limiting the area of ​​the wafer to be larger than the area of ​​the pressing surface, the side of the wafer can be in a protruding state relative to the pressing surface, so that the grinding mechanism can directly approach and contact the side of the wafer to grind the side of the wafer, which is convenient for rapid grinding of the side of the wafer and is beneficial to improving the grinding efficiency of the wafer.

[0016] Compared with the prior art, the grinding device provided by the embodiment of the utility model has the following beneficial effects: by arranging the supporting member below the pressing member and providing a supporting surface for placing the wafer on the supporting member, when the lifting drive member drives the pressing member to abut the lower pressing surface against the top surface of the wafer, the lower pressing surface and the supporting surface can clamp and fix the wafer and firmly fix the wafer in the position to be ground, thereby ensuring that the wafer will not shift during the grinding process and improving the grinding effect of the wafer. At the same time, by limiting the area of ​​the wafer to be larger than the area of ​​the supporting surface, the side of the wafer can be in a protruding state relative to the supporting surface, so that the grinding mechanism can directly approach and contact the side of the wafer to grind the side of the wafer, which is convenient for rapid grinding of the side of the wafer. Therefore, the grinding device provided by the embodiment of the utility model can improve the grinding effect and grinding efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a pressing mechanism provided by an embodiment of the utility model;

[0018] Figure 2 is an exploded view of the elastic buffer assembly provided by an embodiment of the utility model;

[0019] Figure 3It is a schematic diagram of the structure when the pressing piece provided by the embodiment of the utility model abuts against the wafer;

[0020] Figure 4 It is a schematic diagram of the structure of the grinding device provided by the embodiment of the utility model;

[0021] Figure 5 yes Figure 4 A magnified schematic diagram of point A;

[0022] Figure 6 It is a structural schematic diagram of a bearing member provided in an embodiment of the utility model.

[0023] In the figure, 1. fixing member;

[0024] 2. Connectors;

[0025] 3. Lifting drive member; 31. Module body; 32. Slider;

[0026] 4. Pressing piece; 41. First connecting part; 42. Positioning column; 43. Second connecting part; 44. Pressing rod; 411. Second connecting hole; 441. Lower pressing surface;

[0027] 5. elastic buffer assembly; 51. fixing seat; 52. connecting rod; 53. first connecting block; 54. limiting block; 55. elastic member; 56. second connecting block; 57. limiting cover; 511. limiting channel; 561. positioning hole; 562. first connecting hole;

[0028] 6. Pressure sensor;

[0029] 7. Sprinkler assembly; 71. Water pipe; 72. Sprinkler head;

[0030] 100, wafer; 200, workbench; 300, pressing mechanism; 400, bearing member; 500, grinding mechanism; 600, frame; 700, conveying mechanism; 800, water tank; 401, bearing rod; 402, connecting part; 501, grinding unit; 4011, bearing surface; 4012, adsorption hole; 5011, grinding drive member; 5012, grinding wheel. DETAILED DESCRIPTION

[0031] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0036] like Figure 1-3As shown, a preferred pressing mechanism of the embodiment of the utility model is used to press and fix the chip 100, including a fixing member 1, a connecting member 2, a lifting drive member 3 and a pressing member 4; the connecting member 2 is connected to the fixing member 1; the lifting drive member 3 is connected to the connecting member 2; the pressing member 4 is connected to the lifting drive member 3, and the lower end of the pressing member 4 has a pressing surface 441, and the lifting drive member 3 can drive the pressing member 4 to descend so that the pressing surface 441 abuts against the top surface of the chip 100; wherein, the area of ​​the top surface of the chip 100 is larger than the area of ​​the pressing surface 441, and when the center line of the chip 100 coincides with the center line of the pressing surface 441, along the extension direction of the center line of the chip 100, the projection of the chip 100 at least covers the projection of the pressing surface 441.

[0037] Based on this technical solution, the lifting drive member 3 drives the pressing member 4 to descend, so that the lower pressing surface 441 can be abutted against the top surface of the wafer 100 to press and fix the wafer 100, so that the constant positioning of the wafer 100 can be maintained during the grinding process of the wafer 100 to prevent the wafer 100 from being offset, which can be beneficial to improving the grinding accuracy of the grinding wheel for the wafer 100 and improving the grinding effect of the wafer 100. After the grinding is completed, the lifting drive member 3 drives the pressing member 4 to rise back to its original position and make the lower pressing surface 441 leave the top surface of the wafer 100, and the pressing member 4 releases the wafer 100; at the same time, by limiting the area of ​​the wafer 100 to be larger than the area of ​​the lower pressing surface 441, the side surface of the wafer 100 can be protruded relative to the lower pressing surface 441, so that the grinding wheel can directly approach and contact the side surface of the wafer 100 to grind the side surface of the wafer 100, which is beneficial to improving the grinding speed of the grinding wheel for the side surface of the wafer 100 and improving the grinding efficiency of the wafer.

[0038] In this embodiment, there are multiple connecting members 2, multiple lifting drive members 3, and multiple pressing members 4. The multiple lifting drive members 3 are respectively connected to the fixing member 1 through the multiple connecting members 2, and the multiple lifting drive members 3 are respectively connected to the multiple pressing members 4.

[0039] In this embodiment, the extension direction of the center line of the wafer 100 is the Z-axis direction.

[0040] The wafer 100 is a square wafer 100 , and the shape and size of the top surface of the wafer 100 are substantially consistent with the shape and size of the bottom surface of the wafer 100 .

[0041] In this embodiment, the lifting drive component 3 is a lifting linear module, which includes a module body 31 and a slider 32 . The lifting module is connected to the slider 32 and can drive the slider 32 to rise or fall. The pressure component 4 is connected to the slider 32 .

[0042] In some other embodiments, the lifting drive member 3 may also be any other device that can drive the pressing member 4 to rise or fall, such as a lifting cylinder, a lifting hydraulic cylinder, a motor, etc., which is not limited here.

[0043] See also Figure 1 The pressing mechanism provided in the embodiment of the utility model further includes a spray assembly 7, which includes a water pipe 71 and a spray head 72. The water pipe 71 is passed through the fixing member 1, and the spray head 72 is connected to one end of the water pipe 71 and is located on one side of the pressing member 4. The spray assembly 7 can be used to spray water on the wafer 100 during the grinding process of the wafer 100. The water spraying process can lubricate the wafer 100 to improve the grinding effect of the wafer 100, and can also take away the debris generated during the grinding process of the wafer 100.

[0044] See also Figure 1-Figure 2 The pressing mechanism provided in the embodiment of the utility model further includes an elastic buffer component 5, and the pressing member 4 is connected to the lifting driving member 3 through the elastic buffer component 5. The elastic buffer component 5 can play a buffering role in the process of the pressing member 4 contacting the wafer 100, thereby improving the precision and stability of the pressure applied by the pressing member 4 on the wafer 100.

[0045] Specifically, the elastic buffer component 5 is connected to the lower end of the slider 32 , and the pressing piece 4 is connected to the lower end of the elastic buffer component 5 .

[0046] The elastic buffer assembly 5 includes a fixed seat 51, a connecting rod 52, a first connecting block 53, a limit block 54 and an elastic member 55. The fixed seat 51 is connected to the connecting member 2 and is provided with a limit channel 511 that passes through the fixed seat 51 from top to bottom. The connecting rod 52 is arranged in the limit channel 511. The pressing member 4 is connected to the lower end of the connecting rod 52 and is located below the fixed seat 51. The first connecting block 53 is connected to the upper end of the connecting rod 52 and is located above the fixed seat 51. The lifting drive member 3 is connected to the upper end of the first connecting block 53. The limit block 54 is sleeved on the connecting rod 52 and is located in the limit channel 511. The upper end of the elastic member 55 is connected to the lower end of the limit block 54, and the lower end of the elastic member 55 is connected to the inner wall of the limit channel 511.

[0047] In this embodiment, the lower end of the fixing seat 51 is connected to the connecting member 2, and the connecting member 2 covers the lower end opening of the limiting channel 511 and is provided with a second through hole for the connecting rod 52 to pass through. It can be understood that when the connecting member 2 covers the lower end opening of the limiting channel 511, the wall surface of the connecting member 2 facing the fixing seat 51 and located in the limiting channel 511 should also be considered as the inner wall of the limiting channel 511.

[0048] In this embodiment, a positioning groove is formed on the inner wall of the limiting channel 511 , and the lower end of the elastic member 55 is connected to the positioning groove.

[0049] There are multiple elastic members 55, and the multiple elastic members 55 are sequentially spaced and distributed around the axis of the connecting rod 52. The multiple elastic members 55 are sequentially distributed around the axis of the connecting rod 52 to reduce the mutual influence between the elastic members 55, so that each elastic member 55 can work independently, so as to better play their respective roles, improve the overall performance and stability of the elastic buffer assembly 5, make the elastic buffer assembly 5 more reliable and durable, and then make the elastic buffer member better play a buffering role in the process of the pressing member 4 contacting the wafer 100, and further improve the precision and stability of the pressure applied by the pressing member 4 on the wafer 100.

[0050] The elastic buffer assembly 5 further includes a second connecting block 56, which is connected to the lower end of the connecting rod 52 and is located below the fixing seat 51, and the pressing piece 4 is detachably connected to the lower end of the second connecting block 56. The second connecting block 56 is adopted and the pressing piece 4 is detachably connected to the second connecting block 56, which facilitates the disassembly and installation of the pressing piece 4, so that different pressing pieces 4 can be replaced according to different size specifications of the wafer 100 to adapt to the wafer 100, thereby expanding the application range of the pressing mechanism 300.

[0051] The elastic buffer assembly 5 further includes a limit cover 57, which is connected to the upper end of the fixing seat 51 and covers the upper end opening of the limit channel 511. The limit cover 57 is provided with a first through hole 571 for the connecting rod 52 to pass through. The limit cover 57 is used to cover the upper end opening of the limit channel 511, which can not only protect the structure in the limit channel 511, but also prevent the limit block 54 from escaping from the limit channel 511 through the upper end opening of the limit channel 511.

[0052] See also Figure 1-Figure 2 The pressing mechanism provided in the embodiment of the utility model further includes a pressure sensor 6, and the lifting drive member is connected to the upper end of the first connection block through the pressure sensor. The pressure sensor 6 can detect the pressure applied by the pressing member 4 to the wafer 100 when the pressing member 4 contacts the wafer 100, so that the pressing member 4 can accurately apply pressure to the wafer 100, thereby ensuring that the pressing member 4 can both press and fix the wafer 100 and not damage the wafer 100.

[0053] Specifically, the pressure sensor 6 is connected to the upper end of the first connection block 53 and is located between the first connection block 53 and the lifting drive member 3 .

[0054] See also Figure 2-Figure 3The lower end of the connecting rod 52 provided in the embodiment of the utility model is connected to the center of the second connecting block 56. The center of the second connecting block 56 is provided with a positioning hole 561 that penetrates the second connecting block 56 from top to bottom. The second connecting block 56 is also provided with a plurality of first connecting holes 562 distributed around the positioning hole 561. The positioning hole 561 is used to facilitate the alignment of the connecting rod 52 and the second connecting block 56, thereby ensuring that the connecting rod 52 can be connected to the center of the upper end of the second connecting block 56.

[0055] The pressing piece 4 includes a first connection part 41, a positioning column 42, a second connection part 43 and a pressing rod 44. The first connection part 41 is provided with a plurality of second connection holes 411 respectively corresponding to the plurality of first connection holes 562. The positioning column 42 is connected to the upper end of the first connection part 41 and can be embedded in the positioning hole 561. The second connection part 43 is connected to the lower end of the first connection part 41. The pressing rod 44 is connected to the lower end of the second connection part 43. The lower end face of the pressing rod 44 is a lower pressing face 441. The positioning column 42 and the positioning hole 561 can facilitate the quick centering of the pressing piece 4 and the second connection block 56, and facilitate the quick installation between the pressing rod 44 and the second connection block 56.

[0056] The pressing piece 4 is detachably connected to the lower end of the second connecting block 56 by sequentially passing the fastener through the first connecting hole 562 and the second connecting hole 411 .

[0057] In this embodiment, the connecting rod 52 is a round rod structure.

[0058] In this embodiment, the second connecting block 56 is a cylindrical structure.

[0059] In this embodiment, the first connecting portion 41 is a cylindrical structure.

[0060] In this embodiment, the second connection portion 43 is in a cylindrical structure, the axis of the second connection portion 43 coincides with the axis of the first connection portion 41 , and the diameter of the second connection portion 43 is smaller than the diameter of the first connection portion 41 .

[0061] In this embodiment, the pressing rod 44 is in a round rod shape.

[0062] In some other embodiments, the pressure rod 44 may also be a square rod-shaped structure.

[0063] See also Figure 4-Figure 6The embodiment of the utility model also provides a grinding device, including any one of the above-mentioned pressing mechanisms 300, and also including a workbench 200, a carrier 400 and a grinding mechanism 500, wherein the fixing member 1 is connected to the workbench 200, the carrier 400 is connected to the workbench 200 and is located below the pressing member 4, a bearing surface is provided at the upper end of the carrier 400, and the wafer 100 is placed on the bearing surface 4011, and the grinding mechanism 500 includes a grinding unit 501, and the grinding unit 501 is connected to the top of the workbench 200 and is located on one side of the carrier 400; wherein the area of ​​the bottom surface of the wafer 100 is larger than the area of ​​the bearing surface 4011, and when the center line of the wafer 100 coincides with the center line of the bearing surface, along the extension direction of the center line of the wafer 100, the projection of the wafer 100 at least covers the bearing surface 4011.

[0064] The grinding device also includes a frame 600, a conveying mechanism 700 and a water tank 800. The frame 600 is connected to the workbench 200, the fixing member 1 is connected to the workbench 200 through the frame 600, the conveying mechanism 700 is connected to the workbench 200, the conveying mechanism 700 is connected to the supporting member 400 and can drive the supporting member 400 to move along the first horizontal direction, and the end of the water pipe 71 away from the sprinkler head 72 is connected to and communicated with the water tank 800 through a water pump.

[0065] In this embodiment, the first horizontal direction is the Y-axis direction.

[0066] The bearing member 400 includes a bearing rod 401 . The upper end surface of the bearing rod 401 is a bearing surface 4011 . The bearing surface 4011 is provided with adsorption holes 4012 that penetrate the bearing member 400 from top to bottom.

[0067] The carrier 400 further includes a connecting plate 402 , the carrier rod 401 is connected to the upper end of the connecting plate 402 , and the connecting plate 402 is connected to the conveying mechanism 700 .

[0068] The grinding unit 501 includes a grinding drive 5011 and a grinding wheel 5012. The output end of the grinding drive 5011 is connected to the grinding wheel 5012 and can drive the grinding wheel 5012 to rotate around its own central axis.

[0069] The working process of the grinding device is as follows: placing the wafer 100 on the carrying surface of the carrier 400, completing the loading of the wafer 100, and then suctioning the wafer 100 through the adsorption hole to adsorb and fix the wafer 100 on the carrying surface to achieve fixed positioning of the wafer 100 on the carrier 400, and then driving the carrier 400 to move along the first horizontal direction through the conveying component to convey the carrier 400 to the position of the grinding mechanism 500, and then driving the pressing plate to descend through the pressing mechanism 300 to press and fix the wafer 100 to maintain the constant positioning of the wafer 100, the grinding unit 501 drives the grinding wheel 5012 to approach and contact the side of the wafer 100 to grind the side of the wafer 100, and after the grinding is completed, the pressing mechanism 300 and the grinding wheel 501 2 returns to its original position, the conveying assembly drives the adsorbent to return to its original position along the first horizontal direction, the adsorption hole stops sucking air, and then the wafer 100 is removed from the adsorbent to complete the unloading of the wafer 100; during the side grinding process of the wafer 100, the spray assembly 7 sprays water on the wafer 100, and the water spraying can not only lubricate the wafer 100 to improve the grinding efficiency of the wafer 100, but also take away the debris generated during the grinding process of the wafer 100 to keep the adsorbent clean. Therefore, the grinding device provided by the utility model can realize the integration and automation of fixed positioning, conveying, downward positioning, grinding and spraying of the wafer 100 through the conveying mechanism 700, the pressing mechanism 300 and the grinding mechanism 500, thereby improving the grinding efficiency and grinding effect of the wafer 100.

[0070] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A pressing mechanism for pressing and fixing a wafer, characterized in that: include: Fixings; A connecting member connected to the fixing member; A lifting drive member, the lifting drive member is connected to the connecting member; A pressing member, the pressing member is connected to the lifting driving member, the lower end of the pressing member has a lower pressing surface, and the lifting driving member can drive the pressing member to descend so that the lower pressing surface abuts against the top surface of the wafer; The area of ​​the top surface of the wafer is larger than the area of ​​the pressing surface, and when the center line of the wafer coincides with the center line of the pressing surface, the projection of the wafer at least covers the projection of the pressing surface along the extension direction of the center line of the wafer.

2. The pressing mechanism according to claim 1, characterized in that: It also includes an elastic buffer component, and the pressing member is connected to the lifting drive member through the elastic buffer component.

3. The pressing mechanism according to claim 2, characterized in that: The elastic buffer assembly includes a fixed seat, a connecting rod, a first connecting block, a limit block and an elastic member. The fixed seat is connected to the connecting member and is provided with a limit channel that passes through the fixed seat from top to bottom. The connecting rod is arranged in the limit channel. The pressing member is connected to the lower end of the connecting rod and is located below the fixed seat. The first connecting block is connected to the upper end of the connecting rod and is located above the fixed seat. The lifting drive member is connected to the upper end of the first connecting block. The limit block is sleeved on the connecting rod and is located in the limit channel. The upper end of the elastic member is connected to the lower end of the limit block, and the lower end of the elastic member is connected to the inner wall of the limit channel.

4. The pressing mechanism according to claim 3, characterized in that: There are multiple elastic members, and the multiple elastic members are distributed in sequence and at intervals around the axis of the connecting rod.

5. The pressing mechanism according to claim 3, characterized in that: It also includes a pressure sensor, and the lifting drive member is connected to the upper end of the first connecting block through the pressure sensor.

6. The pressing mechanism according to claim 3, characterized in that: The elastic buffer assembly also includes a second connecting block, which is connected to the lower end of the connecting rod and is located below the fixing seat, and the pressing piece is detachably connected to the lower end of the second connecting block.

7. The pressing mechanism according to claim 6, characterized in that: The lower end of the connecting rod is connected to the center of the second connecting block, the center of the second connecting block is provided with a positioning hole penetrating the second connecting block from top to bottom, and the second connecting block is further provided with a plurality of first connecting holes distributed around the positioning hole; The pressing piece includes a first connecting part, a positioning column, a second connecting part and a pressing rod. The first connecting part is provided with a plurality of second connecting holes corresponding to the plurality of first connecting holes respectively. The positioning column is connected to the upper end of the first connecting part and can be embedded in the positioning hole. The second connecting part is connected to the lower end of the first connecting part. The pressing rod is connected to the lower end of the second connecting part. The lower end surface of the pressing rod is the lower pressing surface.

8. The pressing mechanism according to claim 3, characterized in that: The elastic buffer assembly also includes a limit cover, which is connected to the upper end of the fixing member and covers the upper end opening of the limit channel. The limit cover is provided with a first through hole for the connecting rod to pass through.

9. The pressing mechanism according to claim 1, characterized in that: It also includes a spray assembly, which includes a water pipe and a spray head. The water pipe is passed through the fixing member, and the spray head is connected to one end of the water pipe and is located on one side of the pressing member.

10. A grinding device, characterized in that: The method comprises a pressing mechanism according to any one of claims 1 to 9, and further comprises a workbench, a bearing member and a grinding mechanism, wherein the fixing member is connected to the workbench, the bearing member is connected to the workbench and is located below the pressing member, the upper end of the bearing member is provided with a bearing surface, the wafer is placed on the bearing surface, and the grinding mechanism comprises a grinding unit, the grinding unit is connected to the top of the workbench and is located on one side of the bearing member; The area of ​​the bottom surface of the chip is larger than the area of ​​the carrying surface, and when the center line of the chip coincides with the center line of the carrying surface, the projection of the chip at least covers the carrying surface along the extension direction of the center line of the chip.

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