LED light source sealing structure

Abstract

The utility model relates to the technical field of LED sealing, in particular to an LED light source sealing structure which comprises a support, a protective layer, a wafer, a positive electrode conductor and a negative electrode conductor, the support is provided with a groove, and the protective layer covers the outer side of one side, used for installing the wafer, of the support; the positive electrode conductor and the negative electrode conductor are bent from the groove to one side, far away from the groove, of the support to form a convex structure, and the wafer is mounted on the positive electrode conductor or the negative electrode conductor in the groove; and the position of the protective layer, which is opposite to the wafer, is in a spherical shape protruding towards one side far away from the wafer. According to the utility model, the protection layer covers the outer side of the support and wraps the side, where the wafer is installed, of the support, water vapor cannot directly permeate into the support from the interface of the support and the protection layer, and the risk that the wafer is affected with damp is reduced; and the position of the protective layer, which directly faces the wafer, is spherical and plays a role in gathering light, so that the light emitted by the wafer is brighter.

Description

Technical Field

[0001] The utility model relates to the technical field of LED sealing, in particular to a LED light source sealing structure. Background Art

[0002] LED moisture resistance has always been an important factor affecting the performance of display screens. In humid climates, large batches of dead and damaged LEDs are prone to occur. Figure 1 As shown, the traditional SMD LED will be covered with a layer of epoxy resin inside the reflective cup of the bracket as a protective layer, but there is a possibility of moisture penetration at the cross section. Utility Model Content

[0003] The utility model solves the problems in the related technology and proposes a sealing structure for an LED light source, in which a protective layer covers the outer side of a bracket, thereby wrapping the side of the bracket on which a chip is installed, and water vapor cannot directly penetrate from the interface between the bracket and the protective layer, thereby reducing the risk of the chip getting damp; the protective layer is spherical at the position facing the chip, thereby gathering the light and making the light emitted by the chip brighter.

[0004] In order to solve the above technical problems, the utility model is realized through the following technical solutions: a LED light source sealing structure, including a bracket, a protective layer, a chip, at least one group of positive conductors and negative conductors, the bracket is provided with a groove, the protective layer covers the outer side of the bracket for installing the chip; the positive conductor and the negative conductor are bent from the groove to the side of the bracket away from the groove to form a "convex" shape structure, and the chip is installed on the positive conductor or the negative conductor located in the groove; the position of the protective layer facing the chip is a sphere that bulges toward the side away from the chip.

[0005] As a preferred solution, the cross-sectional shapes of the bracket are a first rectangular portion, a trapezoidal portion, a second rectangular portion and a third rectangular portion in sequence, the groove is opened on the first rectangular portion, and the protective layer covers the outside of the first rectangular portion and the trapezoidal portion.

[0006] As a preferred solution, the groove is in a truncated cone shape.

[0007] As a preferred solution, the material of the protective layer is epoxy resin.

[0008] As a preferred solution, the material of the bracket is PPA.

[0009] As a preferred embodiment, there are three groups of positive electrode conductors and three groups of negative electrode conductors.

[0010] As a preferred solution, the positive conductor and the negative conductor both include an electrode layer and pins, and the chip is arranged on the electrode layer of the positive conductor or the negative conductor.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows: the protective layer of the utility model covers the outer side of the bracket, thereby wrapping the side of the bracket where the chip is installed, and water vapor cannot directly penetrate from the interface between the bracket and the protective layer, thereby reducing the risk of the chip getting damp; the protective layer is spherical at the position facing the chip, thereby gathering the light and making the light emitted by the chip brighter. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the LED packaging structure of the prior art of the utility model;

[0013] Figure 2 It is a schematic diagram of the overall structure of the utility model.

[0014] In the figure:

[0015] 1. Bracket, 101. Groove, 2. Protective layer, 3. Wafer, 4. Positive conductor, 5. Negative conductor. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0017] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0018] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0019] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0020] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0021] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0022] like Figure 2 As shown, a sealing structure of an LED light source includes a bracket 1, a protective layer 2, a chip 3, at least one group of positive conductors 4 and negative conductors 5, a groove 101 is opened on the bracket 1, and the protective layer 2 covers the outer side of the bracket 1 for installing the chip 3, thereby wrapping the side of the bracket 1 where the chip 3 is installed, and water vapor cannot directly penetrate from the interface between the bracket 1 and the protective layer 2, thereby reducing the risk of the chip 3 getting damp; the positive conductor 4 and the negative conductor 5 are bent from the groove 101 to the side of the bracket 1 away from the groove 101 to form a "convex" shape structure, and the chip 3 is installed on the positive conductor 4 or the negative conductor 5 located in the groove 101; the position of the protective layer 2 facing the chip 3 is a sphere that bulges toward the side away from the chip 3, thereby gathering the light, making the light emitted by the chip 3 brighter.

[0023] In one embodiment, the cross-sectional shapes of the bracket 1 are a first rectangular portion, a trapezoidal portion, a second rectangular portion and a third rectangular portion, respectively, and the lengths of the first rectangular portion, the second rectangular portion and the third rectangular portion increase successively; the groove 101 is opened on the first rectangular portion and the corner of the first rectangular portion away from the trapezoidal portion is rounded, and the protective layer 2 covers the outside of the first rectangular portion and the trapezoidal portion and is flush with the outer side of the second rectangular portion.

[0024] In one embodiment, the groove 101 is in the shape of a truncated cone.

[0025] In one embodiment, the material of the protection layer 2 is epoxy resin.

[0026] In one embodiment, the material of the bracket 1 is PPA.

[0027] In one embodiment, there are three groups of positive electrode conductors 4 and three groups of negative electrode conductors 5 .

[0028] In one embodiment, both the positive conductor 4 and the negative conductor 5 include an electrode layer and a pin, and the chip 3 is disposed on the electrode layer of the positive conductor 4 or the negative conductor 5 .

[0029] The above are preferred implementation modes of the present invention. Technicians in the field to which the present invention belongs can also change and modify the above implementation modes. Therefore, the present invention is not limited to the above specific implementation modes. Any obvious improvements, substitutions or modifications made by technicians in this field on the basis of the present invention belong to the protection scope of the present invention.

Claims

1. A LED light source sealing structure, characterized in that: It includes a bracket, a protective layer, a chip, and at least one group of positive conductors and negative conductors. The bracket is provided with a groove, and the protective layer covers the outer side of the bracket for mounting the chip. The positive conductor and the negative conductor are bent from the groove to the side of the bracket away from the groove to form a "convex" shape structure, and the chip is mounted on the positive conductor or the negative conductor located in the groove; the position of the protective layer facing the chip is a sphere that bulges toward the side away from the chip.

2. The LED light source sealing structure according to claim 1, characterized in that: The cross-sectional shapes of the bracket are a first rectangular portion, a trapezoidal portion, a second rectangular portion and a third rectangular portion in sequence. The groove is opened on the first rectangular portion, and the protective layer covers the outside of the first rectangular portion and the trapezoidal portion.

3. The LED light source sealing structure according to claim 1, characterized in that: The groove is in the shape of a truncated cone.

4. The LED light source sealing structure according to claim 1, characterized in that: The material of the protective layer is epoxy resin.

5. The LED light source sealing structure according to claim 1, characterized in that: The material of the bracket is PPA.

6. The LED light source sealing structure according to claim 1, characterized in that: There are three groups of positive electrode conductors and three groups of negative electrode conductors.

7. The LED light source sealing structure according to claim 6, characterized in that: The positive conductor and the negative conductor both include an electrode layer and a pin, and the chip is arranged on the electrode layer of the positive conductor or the negative conductor.

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