Five-edge spoke type flexible temperature and pressure dual-mode sensor

Abstract

The utility model discloses a pentagonal spoke type flexible temperature and pressure dual-mode sensor, and belongs to the field of flexible wearable electronics. The sensor mainly comprises a flexible substrate layer and a flexible packaging layer, wherein the upper surface of the substrate layer is provided with five transversely distributed metal temperature-sensitive films as temperature detection units; a longitudinally distributed metal temperature-sensitive film is used as a pressure detection unit; the flexible substrate layer is provided with a cavity and is in sealed connection with the packaging layer. The uniform distribution of the pentagonal radiation type temperature-sensitive film can effectively disperse the pressure, reduces the measurement error caused by local stress concentration, and is high in structural stability. The temperature-sensitive film is processed and manufactured by adopting the MEMS technology, has the advantages of light weight, low manufacturing cost, simple manufacturing process and the like, and can be widely applied to the fields of wearable electronic equipment and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible wearable electronics, in particular to a five-sided spoke type flexible temperature and pressure dual-mode sensor. Background Art

[0002] Flexible wearable electronic technology is an emerging electronic technology that transforms traditional rigid electronic devices into flexible, lightweight and comfortable wearable devices. The core part is flexible sensing technology, such as temperature sensing technology and pressure sensing technology. With the continuous improvement of actual needs, single-mode sensitive sensors cannot meet market demand, and dual-mode and multi-mode sensors are constantly developing. Among them, temperature and pressure, two common physical quantities, have gradually become the focus of attention in the field of sensing. Temperature sensing technology can be roughly divided into thermal resistor type and thermocouple type, and pressure sensing technology can be roughly divided into piezoelectric type, piezoresistive type, resonant type and capacitive type. The sensitive materials selected for sensing technologies with different working principles are different. In the actual manufacturing process, one or more sensitive materials with good compatibility will be selected. For example, in the Chinese patent application: A flexible temperature and pressure sensor (patent application number CN202211096352.2), the sensor is composed of a multi-level microstructure with a complex structure. The electrode film material is indium tin oxide, and the dielectric layer material is a polydimethylsiloxane mixture. Its manufacturing process is complex and the cost is high. Therefore, how to simultaneously ensure the good flexibility of the flexible substrate and the compatibility of sensitive materials is a difficult problem that needs to be urgently solved in the current flexible temperature and pressure integrated sensors.

[0003] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to those skilled in the art. Utility Model Content

[0004] The utility model aims to provide a five-sided spoke type flexible temperature and pressure dual-mode sensor to solve the technical problems existing in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The utility model provides a five-sided spoke type flexible temperature and pressure dual-mode sensor, comprising a flexible substrate layer and a flexible packaging layer, wherein:

[0007] The flexible substrate layer is provided with a rectangular cavity, the height of the cavity is the same as the thickness of the flexible substrate, and the cavity penetrates the substrate layer so that the working gas in the cavity is connected to the outside world; a metal temperature-sensitive film with a patterned electrode is provided on its surface, which is divided into two types of metal temperature-sensitive films with patterned electrodes, namely, horizontally distributed and vertically distributed. Five metal temperature-sensitive films with horizontal distribution are used as temperature detection units, and one metal temperature-sensitive film with vertical distribution is used in conjunction with the packaging layer as a pressure detection unit;

[0008] The flexible packaging layer maintains a sealed connection with the substrate layer;

[0009] The parallel direction of the longitudinally distributed temperature-sensitive film at the center position of the upper surface of the flexible packaging layer is defined as the Y direction, the vertical direction is the X direction, and the height direction is the Z direction; a transversely distributed temperature-sensitive film is placed directly above the longitudinally distributed temperature-sensitive film, and its parallel direction is the X direction. A regular pentagon is made with its center as an endpoint, and the other four endpoints are the centers of the other four transversely distributed temperature-sensitive films. The five transversely distributed temperature-sensitive films are distributed in a ring array to form a five-sided spoke structure.

[0010] Furthermore, the flexible encapsulation layer is made of silica gel; the flexible substrate layer is made of polyimide, and the patterned electrode metal temperature-sensitive film material on its surface is a multilayer metal material composed of Cr / Pt. These materials have good characteristics of low stress, good adhesion, uniform thickness, and good weldability. The temperature coefficient of resistance of platinum is relatively stable and has good linearity, which is conducive to achieving high-precision temperature and pressure measurement, can work normally in a high temperature environment, and is suitable for some application scenarios with large temperature changes.

[0011] Furthermore, the thickness of the patterned electrode metal temperature-sensitive film is h, 0.1μm≤h≤2μm. A thinner thickness has the advantages of less stress, better adhesion, and better weldability. Since the thickness of the metal film is small, its internal stress is also reduced accordingly, which is crucial to maintaining the stability and reliability of the MEMS device. The thin metal film has good adhesion, which can ensure a firm bond between the metal film and the substrate or other metal layers to avoid falling off or delamination. The thin metal film has good weldability, which facilitates the connection of the MEMS device with other electronic components and improves the reliability of the overall circuit.

[0012] Furthermore, the flexible encapsulation layer is a cylinder with a radius of R1, 3mm≤R1≤8mm, and a thickness of H1, 1mm≤H1≤5mm. The cylindrical sensor shape makes its structure more compact, reduces the volume of the invalid part, and reduces the interference with temperature and pressure detection. Improving the detection accuracy and sensitivity of the sensor helps to reduce the weight of the entire sensor, making it less burdensome on the object to be detected in application, and can better fit the surface of the object to be detected, ensuring the accurate transmission and detection of pressure and temperature, and facilitating the rapid transfer of heat, thereby improving the response speed and accuracy of temperature detection.

[0013] Furthermore, the flexible substrate layer is a cylinder with a radius of R2, 3mm≤R2≤8mm, and a thickness of H2, 3mm≤H2≤6mm. The shape of the substrate layer is consistent with that of the packaging layer, so that the overall structure of the sensor is simple and the proportion of invalid parts is reduced. The power consumed during operation is low, which helps to extend battery life or reduce overall energy consumption, facilitates the rapid transfer and exchange of heat, and improves the accuracy and timeliness of temperature detection.

[0014] By adopting the above technical solution, the utility model has the following beneficial effects:

[0015] 1. The utility model is multifunctional and can detect temperature and pressure at the same time. Since it is made of flexible materials, it can be applied to curved surface measurement and has wider adaptability. It is widely used in the fields of medical equipment and smart wearables.

[0016] 2. The utility model proposes a five-sided spoke flexible temperature and pressure dual-mode sensor, which inherits the advantages of MEMS process such as simple structure, low cost and low power consumption.

[0017] 3. The utility model proposes a five-sided spoke flexible temperature and pressure dual-mode sensor. Compared with the prior art, the designed structure has strong stability and the pentagonal spokes are evenly distributed, which means that the force distribution between the spokes is also more even. When sensing pressure, the even distribution of the pentagonal resistance wire can effectively disperse these forces, reducing the measurement error caused by local stress concentration, thereby improving the stability and accuracy of the entire sensor structure.

[0018] 4. The utility model proposes a five-sided spoke flexible temperature and pressure dual-mode sensor, which has good heat dissipation performance in practical applications, and its five-sided spoke shape is conducive to sensing temperature changes. By more effectively dissipating heat, the thermal sensing range of the temperature sensor can be increased. It helps to disperse heat throughout the sensor area, making the temperature reading more uniform, reducing errors caused by hot spots and local overheating, and further improving accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the three-dimensional structure of a five-spoke flexible temperature and pressure dual-mode sensor provided in an embodiment of the utility model;

[0021] Figure 2A schematic diagram of the three-dimensional structure of a five-sided spoke flexible temperature and pressure dual-mode sensor packaging layer provided in an embodiment of the utility model;

[0022] Figure 3 A top view of a five-sided spoke flexible temperature and pressure dual-mode sensor provided in an embodiment of the utility model;

[0023] Figure 4 for Figure 3 AA section view;

[0024] Figure 5 A schematic diagram of a five-sided spoke flexible temperature and pressure dual-mode sensor substrate cavity provided in an embodiment of the utility model;

[0025] Figure 6 A top view of a metal temperature-sensitive film distributed laterally on the surface of a substrate layer of a five-sided spoke flexible temperature-pressure dual-mode sensor provided by an embodiment of the utility model;

[0026] Figure 7 A top view of a longitudinally distributed metal temperature-sensitive film on the surface of a substrate layer of a five-sided spoke-type flexible temperature-pressure dual-mode sensor provided by an embodiment of the utility model;

[0027] Figure 8 A circuit schematic diagram of a five-sided spoke flexible temperature and pressure dual-mode sensor provided in an embodiment of the utility model;

[0028] Fig. 9 A flowchart of the manufacturing process of a five-spoke flexible temperature and pressure dual-mode sensor provided in an embodiment of the utility model.

[0029] Icon: 1-flexible packaging layer, 2-flexible substrate layer, 3-longitudinal distribution metal film, 4-lateral distribution metal film, 5-lateral cavity, 6-longitudinal cavity. DETAILED DESCRIPTION

[0030] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0032] Combination Figure 1-7As shown, this embodiment provides a five-sided spoke flexible temperature and pressure dual-mode sensor, including a packaging layer 1, a flexible substrate layer 2, a longitudinally distributed metal film 3, a transversely distributed metal film 4, a transversely distributed cavity 5, and a longitudinally distributed cavity 6. The flexible substrate layer 2 is provided with a rectangular cavity, the cavity height is the same as the thickness of the flexible substrate, and the substrate layer is penetrated so that the working gas in the cavity is connected to the outside world; a metal temperature-sensitive film with a patterned electrode is provided on its surface, which is divided into two types of metal temperature-sensitive films with patterned electrodes, namely, transversely distributed and longitudinally distributed. Five transversely distributed metal temperature-sensitive films are used as temperature detection units, and one longitudinally distributed metal temperature-sensitive film is used in conjunction with the packaging layer as a pressure detection unit;

[0033] The flexible packaging layer maintains a hermetically sealed connection with the substrate layer;

[0034] The parallel direction of the longitudinally distributed temperature-sensitive film at the center position of the upper surface of the flexible packaging layer is defined as the Y direction, the vertical direction is the X direction, and the height direction is the Z direction; a transversely distributed temperature-sensitive film is placed directly above the longitudinally distributed temperature-sensitive film, with its parallel direction being the X direction, and a regular pentagon is made with its center as an endpoint, and the other four endpoints are the centers of the other four transversely distributed temperature-sensitive films. The five transversely distributed temperature-sensitive films are distributed in a ring array to form a five-sided spoke structure.

[0035] In this embodiment, the flexible encapsulation layer 1 is made of silica gel; the flexible substrate layer 2 is made of polyimide, and the patterned electrode metal temperature-sensitive film material on its surface is a multilayer metal material composed of Cr / Pt. The thickness of the patterned electrode metal temperature-sensitive film is h, 0.1μm≤h≤2μm. The thinner temperature-sensitive film thickness helps to maintain the flexibility of the entire sensor, so that it can better adapt to complex deformations such as bending and twisting, and is suitable for various application scenarios of flexible electronic devices. It can respond to changes in pressure and temperature more quickly, and improve the response speed and sensitivity of the sensor.

[0036] In this embodiment, the flexible encapsulation layer 1 is a cylinder with a radius of R1, 3mm≤R1≤8mm, and a thickness of H1, 1mm≤H1≤5mm. The flexible substrate layer 2 is a cylinder with a radius of R2, 3mm≤R2≤8mm, and a thickness of H2, 3mm≤H2≤6mm, and the thickness of the cavity is consistent with that of the substrate layer H2. This size design has better flexibility and bendability, and is more easily adapted to surfaces of different shapes and degrees of curvature. It is suitable for various complex application scenarios, can respond more sensitively to changes in pressure and temperature, improve the detection accuracy and sensitivity of the sensor, and help reduce the weight of the entire sensor.

[0037] Combination Figure 3As shown, the temperature sensing technology of the utility model adopts a thermal resistor type, which is based on the metal thermal effect for temperature measurement, that is, the property that the resistance of the metal resistor changes with the change of temperature. Therefore, as long as the resistance change of the temperature-sensitive thermal resistor is detected, the temperature can be detected. Among them, the measurement accuracy of the platinum metal thermal resistor is the highest. The five laterally distributed temperature-sensitive films 4 set on the surface of the substrate layer are all made of multi-layer metal materials containing platinum to ensure the detection accuracy. Since a constant voltage is passed through it, the current change can be measured by the instrument, and then the resistance change can be calculated. The input temperature is proportional to the detected resistance, which is the measurement principle of the temperature detection unit.

[0038] Combination Figure 3 As shown, the pressure sensing technology of the utility model adopts a combination of thermal resistors and organic high molecular polymers with good thermal conductivity, taking into account the flexibility of the sensor and the compatibility of sensitive materials. The working principle of the longitudinally distributed temperature-sensitive film 3 in the pressure sensing technology is consistent with the above-mentioned transversely distributed temperature-sensitive film 4. Its characteristics are that when there is no pressure input, the resistance value of the temperature-sensitive film 3 remains unchanged, and a temperature difference is generated between the temperature-sensitive film 3 and the temperature-sensitive film 4. When there is pressure input, the thickness and porosity of the organic high molecular polymer 1 with good thermal conductivity decrease, and its thermal conductivity increases, absorbing the heat on the surface of the tightly connected longitudinally distributed temperature-sensitive film 3, and its temperature decreases. The temperature difference between the temperature-sensitive film 3 and the temperature-sensitive film 4 changes, and the change in the temperature of the temperature-sensitive film 3 and the temperature-sensitive film 4 causes the resistance of the two resistors to change, which is converted into an output voltage through the Wheatstone bridge principle. Therefore, the input pressure is inversely proportional to the detected voltage, so as to achieve the purpose of detecting pressure. This is the measurement principle of the pressure detection unit.

[0039] Combination Figure 8 As shown, the circuit principle diagram of the utility model, wherein R is a balancing resistor, R a is the equivalent resistance of five laterally distributed metal films in series, R b is the equivalent resistance of the longitudinally distributed metal film. These four resistors form a Wheatstone bridge, connected to a differential amplifier, V cc is the input power supply voltage, V out is the output voltage.

[0040] Combination Fig. 9 As shown, the manufacturing method of the five-sided spoke flexible temperature and pressure dual-mode sensor of the present application mainly includes the following steps:

[0041] Step 1, selecting flexible polymer polyimide (PI) as the substrate layer material and manufacturing it into the designed size;

[0042] Step 2: according to the designed size, the corresponding part of the substrate layer is opened to manufacture the cavity structure distributed horizontally and vertically;

[0043] Step 3: Using MEMS process technology, apply temperature sensitive materials to the surface of the substrate layer to prepare metal temperature sensitive films distributed laterally and vertically;

[0044] Step 4: Prepare silica gel on the substrate layer to achieve a sealed connection as a packaging layer;

[0045] Step 5: Verify the airtightness of the sensor substrate layer and the packaging layer to protect the sensor and ensure its normal operation.

[0046] In summary, compared with the prior art, the five-sided spoke flexible temperature and pressure dual-mode sensor prepared by the utility model has good compatibility of the two modal sensitive mechanisms of temperature and pressure. The metal temperature-sensitive film serves as both a temperature detection unit and a pressure detection unit, and the sensitive material remains consistent, which further reduces the preparation cost of the sensor and ensures the repeatability of the preparation. At the same time, it is easy to integrate with other sensing technologies or systems to achieve a multifunctional combination. It is suitable for many fields such as medical, smart wearable, automotive electronics, etc., showing broad application prospects.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A five-sided spoke flexible temperature and pressure dual-mode sensor, characterized in that: It includes a flexible substrate layer and a flexible packaging layer, wherein: The flexible substrate layer is provided with a rectangular cavity, the height of the cavity is the same as the thickness of the flexible substrate, and the cavity penetrates the substrate layer so that the working gas in the cavity is connected to the outside world; a metal temperature-sensitive film with a patterned electrode is provided on its surface, which is divided into two types of metal temperature-sensitive films with patterned electrodes, namely, horizontally distributed and vertically distributed. Five metal temperature-sensitive films with horizontal distribution are used as temperature detection units, and one metal temperature-sensitive film with vertical distribution is used in conjunction with the packaging layer as a pressure detection unit; The flexible packaging layer maintains a sealed connection with the substrate layer; The parallel direction of the longitudinally distributed temperature-sensitive film at the center position of the upper surface of the flexible packaging layer is defined as the Y direction, the vertical direction is the X direction, and the height direction is the Z direction; a transversely distributed temperature-sensitive film is placed directly above the longitudinally distributed temperature-sensitive film, and its parallel direction is the X direction. A regular pentagon is made with its center as an endpoint, and the other four endpoints are the centers of the other four transversely distributed temperature-sensitive films. The five transversely distributed temperature-sensitive films are distributed in a ring array to form a five-sided spoke structure.

2. The five-sided spoke flexible temperature and pressure dual-mode sensor according to claim 1, characterized in that: The flexible packaging layer is made of silica gel; the flexible substrate layer is made of polyimide, and the patterned electrode metal temperature-sensitive film material on the surface is a multi-layer metal material composed of Cr / Pt.

3. The five-sided spoke flexible temperature and pressure dual-mode sensor according to claim 1, characterized in that: The thickness of the patterned electrode metal temperature-sensitive film is h, 0.1 μm≤h≤2 μm.

4. The five-sided spoke flexible temperature and pressure dual-mode sensor according to claim 1, characterized in that: The flexible packaging layer is a cylinder with a radius of R1, 3mm≤R1≤8mm, and a thickness of H1, 1mm≤H1≤5mm.

5. The five-sided spoke flexible temperature and pressure dual-mode sensor according to claim 1, characterized in that: The flexible substrate layer is a cylinder with a radius of R2, 3mm≤R2≤8mm, and a thickness of H2, 3mm≤H2≤6mm.

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