FPC (Flexible Printed Circuit) type piezoresistive sensor

Abstract

The utility model discloses an FPC (Flexible Printed Circuit) type piezoresistive sensor, which relates to the technical field of flexible sensing and comprises a first PET (Polyethylene Terephthalate) film and a second PET film which are used for bearing a circuit; the first silver paste circuit layer is printed at the bottom of the first PET film and is used for providing a plurality of basic circuits; the first solder mask layer is printed on a part of the first silver paste circuit layer and plays a role in insulation; the second silver paste circuit layer is printed between the basic circuits and is used for realizing conduction between the basic circuits; the second solder mask layer is printed at the bottoms of the first silver paste circuit layer and the second silver paste circuit layer to realize integral insulation of the circuit; the isolation ink layer is printed on the first PET film and the second solder mask layer and is used for isolating a circuit; the carbon paste layer is printed on the second PET film; and the glue layer is printed at the bottom of the first PET film to realize the bonding between the first PET film and the second PET film. And the carbon paste layer is contacted with the first silver paste circuit layer to form a loop so as to achieve a signal output function. The utility model has the characteristics of simple structure, convenient assembly, light and thin product and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible sensing, in particular to an FPC type piezoresistive sensor. Background Art

[0002] Pressure transducer is a device or apparatus that can sense pressure signals and convert them into usable output electrical signals according to certain rules. Pressure sensor is the most commonly used sensor in industrial practice. It is widely used in many industries such as water conservancy and hydropower, railway transportation, intelligent buildings, production automation, aerospace, military industry, petrochemical, oil wells, electricity, ships, machine tools, pipelines, etc.

[0003] At present, existing pressure sensors are usually composed of multiple complex components, including but not limited to elastic sensitive elements (such as metal diaphragms, bellows, etc.), signal conversion elements (such as piezoresistive chips, capacitor plates, etc.), and circuit connection parts, etc. In addition, during the manufacturing process, high-quality materials need to be selected, and fine processing and packaging and sealing, as well as strict testing and calibration are required, so the processing technology is cumbersome. Utility Model Content

[0004] The utility model aims to provide an FPC type piezoresistive sensor, which has the characteristics of simple structure, convenient assembly, relatively light and thin product, etc., and is implemented by using FPC, with low overall cost.

[0005] To achieve the above objectives, the present application proposes an FPC type piezoresistive sensor, comprising:

[0006] The first PET film and the second PET film are used to carry the circuit;

[0007] A first silver paste circuit layer, printed on the bottom of the first PET film, is used to provide a plurality of basic circuits;

[0008] The first solder resist layer is printed locally on the first silver paste circuit layer to play an insulating role;

[0009] The second silver paste circuit layer is printed between the basic circuits to achieve conduction between the basic circuits;

[0010] The second solder resist layer is printed on the bottom of the first silver paste circuit layer and the second silver paste circuit layer to achieve overall circuit insulation;

[0011] An isolation ink layer, printed on the first PET film and the second solder mask layer, is used to isolate the circuits;

[0012] The carbon paste layer is printed on the second PET film; when not conducting, the carbon paste layer only contacts the isolation ink layer; when conducting, the carbon paste layer contacts the first silver paste circuit layer and the isolation ink layer.

[0013] The glue layer is printed on the bottom of the first PET film to achieve bonding with the second PET film.

[0014] Furthermore, it also includes a foam patch attached to the bottom of the second PET film to play a cushioning role.

[0015] Furthermore, after the first silver paste circuit layer is printed on the bottom of the first PET film, the silver paste is dried by heating.

[0016] Furthermore, the first solder resist layer is printed on a part of the first silver paste circuit layer and then cured using a light curing machine.

[0017] Furthermore, after the second silver paste circuit layer is printed between the basic circuits, the silver paste is dried by heating.

[0018] Furthermore, the second solder resist layer is printed on the bottom of the first silver paste circuit layer and the second silver paste circuit layer and then cured using a light curing machine.

[0019] Furthermore, the thickness of the isolation ink layer is between 55-65 um.

[0020] Furthermore, after the carbon paste layer is printed on the second PET film, the carbon paste is dried by heating.

[0021] Furthermore, the carbon paste layer contacts the first silver paste circuit layer to form a loop, thereby achieving a signal output function.

[0022] Compared with the prior art, the above technical solution adopted by the utility model has the following advantages:

[0023] Simplified structure: Through the structural design of FPC, the piezoresistive sensor can get rid of the constraints of traditional mechanical structure and achieve a thinner and more flexible appearance. This design makes it easier to integrate the sensor into various electronic devices, meeting the needs of modern electronic products for lightweight and flexibility.

[0024] Easy to manufacture and maintain: The manufacturing process of FPC piezoresistive sensors is relatively simple and does not require complex machining and assembly steps. In addition, due to its simple structure, it is also more convenient to maintain.

[0025] Improved reliability: With good flexibility and bending resistance, it can maintain stable performance in complex working environments. At the same time, the electrical connection performance of FPC is more reliable, reducing the failure rate caused by connection problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is the exploded diagram of the FPC piezoresistive sensor;

[0028] Figure 2 It is the overall schematic diagram of the FPC type piezoresistive sensor;

[0029] Among them: 1. first PET film, 2. first silver paste circuit layer, 3. first solder mask layer, 4. second silver paste circuit layer, 5. second solder mask layer, 6. isolation ink layer, 7. glue layer, 8. carbon paste layer, 9. second PET film, 10. foam. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0032] In the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] It should be noted that, in the application, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] See also Figure 1-2 This embodiment provides an FPC type piezoresistive sensor, including:

[0035] The first PET film 1, preferably with a thickness of 0.18 mm, is used to carry the circuit;

[0036] The first silver paste circuit layer 2 is printed on the bottom of the first PET film and is used to provide a plurality of basic circuits;

[0037] The first solder resist layer 3 is printed locally on the first silver paste circuit layer to play an insulating role;

[0038] The second silver paste circuit layer 4 is printed between the basic circuits to achieve conduction between the basic circuits;

[0039] The second solder resist layer 5 is printed on the bottom of the first silver paste circuit layer and the second silver paste circuit layer to achieve overall circuit insulation;

[0040] An isolation ink layer 6, printed on the first PET film and the second solder resist layer, is used to isolate the circuits;

[0041] The glue layer 7 is printed on the bottom of the first PET film to achieve bonding with the second PET film.

[0042] The carbon paste layer 8 is printed on the second PET film; when not conducting, the carbon paste layer is only in contact with the isolation ink layer; when conducting, the carbon paste layer is in contact with the first silver paste circuit layer and the isolation ink layer.

[0043] The second PET film 9, preferably with a thickness of 0.18 mm, is used to carry the circuit;

[0044] The foam 10 is attached to the bottom of the second PET film to play a cushioning role.

[0045] In this embodiment, the above-mentioned FPC type piezoresistive sensor is manufactured as follows:

[0046] The first silver paste circuit layer is printed on the bottom of the first PET film, and the silver paste is dried by heating;

[0047] The first solder resist layer is printed locally on the first silver paste circuit layer and cured using a light curing machine to play an insulating role;

[0048] The second silver paste circuit layer is printed between the basic circuits, and the silver paste is dried by heating, at which time the entire circuit is fully conductive;

[0049] The second solder resist layer is printed on the bottom of the first silver paste circuit layer and the second silver paste circuit layer, and is cured using a light curing machine to play an overall insulating role.

[0050] The isolation ink layer is printed on the first PET film and the second solder mask layer, and the thickness of the isolation ink is controlled between 55-65um;

[0051] After the carbon paste layer is printed on the second PET film, the carbon paste is dried by heating;

[0052] The glue layer is printed on the bottom of the first PET film and cured at room temperature to achieve bonding between the first and second PET films.

[0053] The foam is attached to the bottom of the second PET film and acts as a buffer when subjected to pressure.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An FPC type piezoresistive sensor, characterized in that: include: The first PET film and the second PET film are used to carry the circuit; A first silver paste circuit layer, printed on the bottom of the first PET film, is used to provide a plurality of basic circuits; The first solder resist layer is printed locally on the first silver paste circuit layer to play an insulating role; The second silver paste circuit layer is printed between the basic circuits to achieve conduction between the basic circuits; The second solder resist layer is printed on the bottom of the first silver paste circuit layer and the second silver paste circuit layer to achieve overall circuit insulation; An isolation ink layer, printed on the first PET film and the second solder mask layer, is used to isolate the circuits; A carbon paste layer is printed on the second PET film; When not conducting, the carbon paste layer is only in contact with the isolation ink layer. When conducting, the carbon paste layer is in contact with the first silver paste circuit layer and the isolation ink layer. The glue layer is printed on the bottom of the first PET film to achieve bonding with the second PET film.

2. The FPC type piezoresistive sensor according to claim 1, characterized in that: It also includes foam, which is attached to the bottom of the second PET film to play a cushioning role.

3. The FPC type piezoresistive sensor according to claim 1, characterized in that: After the first silver paste circuit layer is printed on the bottom of the first PET film, the silver paste is dried by heating.

4. The FPC type piezoresistive sensor according to claim 1, characterized in that: The first solder resist layer is printed on a part of the first silver paste circuit layer and then cured using a light curing machine.

5. The FPC type piezoresistive sensor according to claim 1, characterized in that: After the second silver paste circuit layer is printed between the base circuits, the silver paste is dried by heating.

6. The FPC type piezoresistive sensor according to claim 1, characterized in that: The second solder resist layer is printed on the bottom of the first silver paste circuit layer and the second silver paste circuit layer and then cured using a light curing machine.

7. The FPC type piezoresistive sensor according to claim 1, characterized in that: The thickness of the isolation ink layer is between 55-65um.

8. The FPC type piezoresistive sensor according to claim 1, characterized in that: After the carbon paste layer is printed on the second PET film, the carbon paste is dried by heating.

9. The FPC type piezoresistive sensor according to claim 1, characterized in that: The carbon paste layer contacts the first silver paste circuit layer to form a loop, thereby achieving a signal output function.

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