Heat dissipation device and electrical equipment

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device and electrical equipment, which are used for heat dissipation of a module to be subjected to heat dissipation and comprise a surface heat pipe, a middle layer heat pipe, a heat dissipation substrate and heat dissipation fins. The heat dissipation substrate is provided with a first surface and a second surface which are opposite to each other; the surface heat pipe is arranged on the first surface of the heat dissipation substrate, the module to be cooled is arranged on the first surface of the heat dissipation substrate, and the module to be cooled is in contact with the surface heat pipe; the middle layer heat pipe is embedded in the heat dissipation substrate; and the radiating fins are connected to the second surface of the radiating substrate. Compared with the prior art, the heat pipe radiator solves the problems that in the prior art, a heat pipe radiator is poor in temperature equalization characteristic and cannot fully utilize the arrangement of the heat conduction area of the heat dissipation substrate, the heat pipes are inserted in the heat dissipation substrate to assist heat transfer, and the temperature equalization characteristic and the heat dissipation effect of the heat dissipation substrate are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and in particular relates to a heat dissipation device and an electrical device. Background Art

[0002] As the core component of the power inverter, the heat dissipation of the IGBT power module directly determines the output and reliability of the IGBT. The common heat dissipation methods of power IGBT at present mainly include liquid cooling plate cooling, air cooling radiator cooling and two-phase flow cooling. Among them, the air cooling radiator has relatively low reliability and cost, and has become the mainstream heat dissipation solution.

[0003] As the power level of the inverter continues to increase, the IGBT specifications continue to increase, and its losses continue to increase. At this time, the heat dissipation bottleneck of the air-cooled radiator gradually emerges, making the application of heat pipe radiators more and more extensive. However, the temperature uniformity of the heat pipe radiator is poor, and it cannot fully utilize the heat conduction area of ​​the radiator substrate, resulting in cost waste.

[0004] For example, the prior art CN217241238U discloses a heat pipe cooling device, which directly contacts the power device through the heat pipe embedded on the surface of the heat dissipation device for heat conduction and then dissipates heat through the heat dissipation fins. However, due to the different heat transfer efficiencies between the heat pipe and the heat dissipation substrate, this solution has the problem of poor overall temperature uniformity as mentioned above, which makes it impossible to fully utilize the heat conduction area of ​​the heat dissipation substrate and reduces the heat dissipation efficiency. The prior art CN219981405U discloses a radiator and electrical equipment, which improves the design of the surface heat pipe, adjusts the temperature uniformity on the surface of the heat dissipation substrate to a certain extent, and improves the heat dissipation efficiency, but there is still uneven heat transfer inside the heat dissipation substrate, and the overall temperature uniformity still needs to be improved.

[0005] Therefore, it is necessary to improve the structure of the heat pipe radiator, especially the arrangement of the heat pipes and the heat dissipation substrate, so that the overall temperature uniformity of the heat pipe radiator can be further improved and the heat conduction area of ​​the heat dissipation substrate can be fully utilized to obtain better heat dissipation efficiency. Utility Model Content

[0006] The purpose of the present invention is to provide a heat dissipation device and an electrical device in order to solve at least one of the above problems, so as to solve the problem that the temperature uniformity characteristics of the heat pipe radiator in the prior art are poor and the heat conduction area of ​​the heat dissipation substrate cannot be fully utilized. This solution achieves the improvement of the temperature uniformity characteristics of the heat dissipation substrate and the improvement of the heat dissipation effect by inserting a heat pipe inside the heat dissipation substrate to assist heat transfer.

[0007] The purpose of the utility model is achieved through the following technical solutions:

[0008] The first aspect of the utility model discloses a heat dissipation device for dissipating heat from a module to be dissipated, comprising a surface heat pipe, an intermediate layer heat pipe, a heat dissipation substrate and heat dissipation fins;

[0009] The heat dissipation substrate has a first surface and a second surface opposite to each other;

[0010] The surface heat pipe is arranged on the first surface of the heat dissipation substrate, the module to be cooled is arranged on the first surface of the heat dissipation substrate, and the module to be cooled is in contact with the surface heat pipe;

[0011] The intermediate layer heat pipe is buried inside the heat dissipation substrate;

[0012] The heat dissipation fins are connected to the second surface of the heat dissipation substrate.

[0013] The provision of the middle layer heat pipe can help accelerate the heat transfer of the heat dissipation substrate, thereby improving the temperature uniformity and heat transfer efficiency of the heat dissipation substrate, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0014] Preferably, a mounting groove is provided on the first surface of the heat dissipation substrate, and the surface heat pipe is embedded in the mounting groove. The surface heat pipe is flush with the first surface of the heat dissipation substrate so that it can contact and exchange heat with the module to be cooled.

[0015] Preferably, a thermal interface material is filled between the module to be cooled and the surface heat pipe. The use of the thermal interface material can eliminate the contact thermal resistance between the surface heat pipe and the module to be cooled.

[0016] Preferably, a mounting hole is provided on the side wall of the heat dissipation substrate, and the intermediate layer heat pipe is inserted into the mounting hole.

[0017] Preferably, a thermal interface material is filled between the intermediate layer heat pipe and the heat dissipation substrate. The use of the thermal interface material can eliminate the contact thermal resistance between the intermediate layer heat pipe and the heat dissipation substrate.

[0018] Preferably, the surface heat pipe and the intermediate layer heat pipe are arranged vertically. The non-codirectional arrangement can basically cover the entire heat dissipation substrate with less material, so that better heat transfer effect and temperature uniformity can be achieved at a lower cost.

[0019] Preferably, the module to be cooled is mounted on the first surface of the cooling substrate by means of threaded connection.

[0020] Preferably, the heat dissipation fins are connected to the heat dissipation substrate by means of tooth scraping, tooth inserting or welding.

[0021] The second aspect of the utility model discloses an electrical device, which uses any of the above-mentioned heat dissipation devices to dissipate heat from a module to be dissipated, wherein the module to be dissipated includes an IGBT module.

[0022] Preferably, the electrical equipment includes a wind power converter, an energy storage PCS and a photovoltaic inverter.

[0023] Compared with the prior art, the utility model has the following beneficial effects:

[0024] 1. The heat dissipation device of this solution makes the heat dissipation substrate have better temperature uniformity characteristics through the middle layer heat pipe;

[0025] 2. Compared with conventional air-cooled radiators, the heat dissipation capacity of this heat dissipation device is significantly improved, and the applicable IGBT power level is higher;

[0026] 3. This cooling solution can be directly compatible with and replace the original air-cooled radiator solution, ensuring product consistency at a very low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic cross-sectional structural diagram of a heat dissipation device;

[0028] Figure 2 is a schematic diagram of the top view of the heat dissipation device;

[0029] In the figure: 1- surface heat pipe; 2- middle layer heat pipe; 3- heat dissipation substrate; 4- heat dissipation fins; 5- module to be cooled. DETAILED DESCRIPTION

[0030] The utility model is described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Example

[0032] A heat dissipation device, used for heat dissipation of a module 5 to be cooled, such as Figure 1 and Figure 2 As shown, it includes a surface heat pipe 1, an intermediate layer heat pipe 2, a heat dissipation substrate 3 and a heat dissipation fin 4;

[0033] The heat dissipation substrate 3 has a first surface and a second surface opposite to each other;

[0034] The surface heat pipe 1 is arranged on the first surface of the heat dissipation substrate 3, and the module to be cooled 5 is arranged on the first surface of the heat dissipation substrate 3, and the module to be cooled 5 is in contact with the surface heat pipe 1;

[0035] The intermediate layer heat pipe 2 is buried inside the heat dissipation substrate 3;

[0036] The heat dissipation fins 4 are connected to the second surface of the heat dissipation substrate 3 .

[0037] More specifically, in this embodiment:

[0038] The heat dissipation device is a double-layer heat pipe radiator, including a heat dissipation substrate 3, a surface heat pipe 1 embedded in the first surface of the heat dissipation substrate 3, an intermediate layer heat pipe 2 inserted into the heat dissipation substrate 3, and heat dissipation fins 4 connected to the second surface of the heat dissipation substrate 3. The first surface and the second surface of the heat dissipation substrate 3 are a pair of opposite surfaces.

[0039] The first surface of the heat dissipation substrate 3 is milled with grooves to accommodate the surface heat pipe 1, and the groove size and properties are controlled so that the surface heat pipe 1 is flush with the first surface of the heat dissipation substrate 3 to ensure effective contact; the side surfaces on both sides of the heat dissipation substrate 3 are punched respectively to accommodate the middle layer heat pipe 2.

[0040] like Figure 1 and Figure 2 As shown, the surface heat pipe 1 in this embodiment is arranged along the width direction of the heat dissipation substrate 3, and is divided into 3 groups, each group includes 3 parallel surface heat pipes 1, which can directly contact 6 heat dissipation modules 5 for heat transfer; the middle layer heat pipe 2 is arranged along the length direction of the heat dissipation substrate 3, and is inserted into the openings on the two side surfaces of the heat dissipation substrate 3, which can strengthen the heat transfer from the first surface to the second surface inside the heat dissipation substrate 3, thereby providing a better overall temperature uniformity characteristic, and the middle layer heat pipe 2 is also arranged in an interval manner according to the width of the heat dissipation substrate 3, forming a vertical staggered structure with the surface heat pipe 1, so as to form a staggered heat exchange network, which can make full use of the overall heat conduction area of ​​the heat dissipation substrate 3. According to the thickness of the heat dissipation substrate 3, the middle layer heat pipe 2 can also be arranged in multiple layers in the thickness direction to obtain a good overall temperature uniformity characteristic when the heat dissipation substrate 3 is thicker.

[0041] Thermal interface materials are filled between the surface heat pipe 1 and the module to be cooled 5, as well as between the heat dissipation substrate 3 and the middle layer heat pipe 2, to eliminate contact thermal resistance. At the same time, the thermal interface materials filled between the heat dissipation substrate 3 and the middle layer heat pipe 2 can also play a role of fixing and limiting.

[0042] The heat dissipation module 5 is fixed to the first surface of the heat dissipation substrate 3 by bolts to avoid slippage and poor contact.

[0043] The heat dissipation fins 4 are connected to the second surface of the heat dissipation substrate 3 , and the connection can be achieved by scraping teeth, inserting teeth, welding, etc.

[0044] The module to be cooled 5 may be a heat generating module such as an IGBT module or an IGBT power module.

[0045] This solution proposes a double-layer heat pipe air-cooled radiator solution, in which two layers of heat pipes are set in the heat dissipation substrate 3 of the conventional heat pipe radiator. One layer of heat pipes is in contact with the IGBT module on the substrate surface to directly dissipate heat for the IGBT module, and the other layer of heat pipes is located inside the heat dissipation substrate 3 to improve the temperature uniformity of the surface of the heat dissipation substrate 3, so that the overall temperature of the radiator surface is reduced and the temperature uniformity effect is achieved. Therefore, the heat dissipation device of this solution can be used for IGBT heat dissipation of higher power levels, and can be used as heat dissipation for electrical equipment in new energy power generation systems such as wind power converters, energy storage PCS, and photovoltaic inverters.

[0046] The above description of the embodiments is to facilitate the understanding and use of the utility model by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the utility model is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the utility model without departing from the scope of the utility model should be within the scope of protection of the utility model.

Claims

1. A heat dissipation device, used for heat dissipation of a module (5) to be cooled, characterized in that: It comprises a surface heat pipe (1), an intermediate layer heat pipe (2), a heat dissipation substrate (3) and heat dissipation fins (4); The heat dissipation substrate (3) has a first surface and a second surface that are opposite to each other; The surface heat pipe (1) is arranged on the first surface of the heat dissipation substrate (3), the module to be cooled (5) is arranged on the first surface of the heat dissipation substrate (3), and the module to be cooled (5) is in contact with the surface heat pipe (1); The intermediate layer heat pipe (2) is buried inside the heat dissipation substrate (3); The heat dissipation fins (4) are connected to the second surface of the heat dissipation substrate (3).

2. A heat dissipation device according to claim 1, characterized in that: The first surface of the heat dissipation substrate (3) is provided with a mounting groove, and the surface heat pipe (1) is embedded in the mounting groove.

3. A heat dissipation device according to claim 1, characterized in that: Thermal interface material is filled between the module to be cooled (5) and the surface heat pipe (1).

4. The heat dissipation device according to claim 1, characterized in that: The side wall of the heat dissipation substrate (3) is provided with a mounting hole, and the intermediate layer heat pipe (2) is inserted into the mounting hole.

5. The heat dissipation device according to claim 1, characterized in that: Thermal interface material is filled between the intermediate layer heat pipe (2) and the heat dissipation substrate (3).

6. The heat dissipation device according to claim 1, characterized in that: The surface heat pipe (1) and the intermediate layer heat pipe (2) are arranged vertically.

7. The heat dissipation device according to claim 1, characterized in that: The module to be cooled (5) is mounted on the first surface of the cooling substrate (3) by means of threaded connection.

8. The heat dissipation device according to claim 1, characterized in that: The heat dissipation fins (4) are connected to the heat dissipation substrate (3) by means of tooth scraping, tooth inserting or welding.

9. An electrical device, characterized in that: A heat dissipation device as claimed in any one of claims 1 to 8 is used to dissipate heat from a module to be dissipated (5), wherein the module to be dissipated (5) comprises an IGBT module.

10. An electrical device according to claim 9, characterized in that: The electrical equipment includes a wind power converter, an energy storage PCS and a photovoltaic inverter.

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