Pipeline improvement device for small circulation temperature control system

Abstract

The utility model discloses a pipeline improvement device for a minor cycle temperature control system, and relates to the technical field of glass fiber production. A drainage pipe on the rear side is connected with a first backflow pipeline through a water pump, a drainage pipe on the front side is connected with a first inflow pipeline, and the other end of the first backflow pipeline and the other end of the first inflow pipeline are connected with a second backflow pipeline and a second inflow pipeline in a penetrating mode respectively. And the backflow pipeline II and the inflow pipeline II are respectively communicated and connected with a small circulation tank through a backflow guide pipe and an inflow guide pipe. The circulating pipeline is independent, convenient and fast, and convenient to use, and enables the oil temperature of the impregnating compound to be in a controllable state all the time, so that the quality of the impregnating compound is ensured, the problems of film-forming agent precipitation, demulsification and the like caused by the temperature are avoided, the wire drawing yield and the product quality are improved, and subsequent processing and composite material processing technologies are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of glass fiber production, in particular to a pipeline improvement device for a small circulation temperature control system. Background Art

[0002] Sizing is very important for the production and application of glass fiber. It can effectively change some performance defects of glass fiber and give glass fiber better use and processing performance. Temperature has a great influence on the stability and performance of sizing. The temperature control of small circulation sizing is mainly controlled by circulating water temperature.

[0003] At present, the pipeline for controlling the temperature of the impregnating agent by water temperature is single and can only pass cold water or hot water. In the summer when the temperature is high, cold water can be passed to control the oil temperature of the direct yarn and the ply yarn within its standard range. However, in winter, due to the difference in their process positions, the direct yarn needs to pass hot water to increase the oil temperature, while the ply yarn needs to pass cold water to lower the oil temperature to meet its process standards. The existing pipeline device cannot control both of them within their process standard range at the same time.

[0004] Therefore, a pipeline improvement device for a small circulation temperature control system is proposed. Utility Model Content

[0005] The purpose of the utility model is to solve the problems existing in the prior art and provide a pipeline improvement device for a small circulation temperature control system.

[0006] In order to achieve the above-mentioned purpose, the utility model specifically adopts the following technical solutions:

[0007] A pipeline improvement device for a small circulation temperature control system comprises a wet film water tank, two drainage pipes are arranged on the outside of the wet film water tank, the drainage pipe on the rear side is connected to a return pipe 1 through a water pump, the drainage pipe on the front side is connected to an inflow pipe 1, the other ends of the return pipe 1 and the inflow pipe 1 are respectively connected with a return pipe 2 and an inflow pipe 2, and the return pipe 2 and the inflow pipe 2 are respectively connected with a small circulation tank through a return conduit and an inflow conduit;

[0008] The other ends of the return pipe 2 and the inlet pipe 2 are respectively provided with the original return water valve and the original inlet water valve, two heat exchange plates are mirror-arranged on the outer wall surface of the inlet pipe 1, a semiconductor refrigeration plate is arranged on the side of the heat exchange plate away from the inlet pipe 1, and two fastening components for limiting and fixing the heat exchange plate are arranged on the outer wall surface of the inlet pipe 1, and an accelerated cooling mechanism is arranged between the two groups of fastening components.

[0009] Furthermore, the semiconductor refrigeration plate includes a cooling surface and a heating surface, the cooling surface is connected to the outer wall surface of the heat exchange plate, and the accelerated cooling mechanism is connected to the heating surface.

[0010] Furthermore, each group of the fastening components includes two mounting blocks, and two semi-circular mounting blocks are mirror-imaged on the outer wall surface of the inlet pipe. Positioning plates are fixedly installed at both ends of each mounting block, and each positioning plate is provided with a threaded through hole, and the same bolt is provided between the two corresponding threaded through holes above and below.

[0011] Furthermore, a high temperature resistant protective pad is bonded to the inner wall surface of the mounting block.

[0012] Furthermore, the accelerated cooling mechanism includes a fixed block, and two fixed blocks are installed on the side wall of the positioning plate away from the semiconductor refrigeration plate. A plurality of fixed grooves are vertically equidistantly provided on the fixed block, and heat sinks located at the upper and lower ends of the heating surface are inserted between the two corresponding fixed grooves on the left and right.

[0013] Furthermore, a same supporting cross column is inserted between the two left-right symmetrical fixing grooves, a plurality of fans with wind directions toward the heat sink are equidistantly arranged on the supporting cross column, and a motor for driving the fans is arranged inside the supporting cross column.

[0014] The beneficial effects of the utility model are as follows:

[0015] 1. The utility model closes the original water return valve and the original water inlet valve, and opens the water pump at the same time to transport the water inside the wet film water tank to the small circulation tank, so that the water can contact the outer wall surface of the storage barrel, thereby absorbing a part of the temperature of the impregnating agent, reducing the oil temperature of the impregnating agent, so that the oil temperature of the impregnating agent can always be within the temperature range suitable for direct yarn and plied yarn processing, and then the excess water inside the small circulation tank can float up and flow back to the inside of the wet film water tank through the inlet conduit. In the process of water returning to the wet film water tank, the heat exchange plate arranged can transfer the water temperature inside the inlet conduit, so that the semiconductor The refrigeration plate can transfer the heat of the water to the accelerated cooling mechanism, so that the heat of the water returning to the wet film water tank can be absorbed, avoiding excessive changes in the water temperature inside the wet film water tank, and reducing the oil temperature of the impregnating agent to a temperature range suitable for direct yarn and ply yarn, while also preventing the wet film from freezing in winter; the circulation pipeline in this device is independent and convenient, and easy to use, so that the oil temperature of the impregnating agent is always in a controllable state, thereby ensuring the quality of the impregnating agent, avoiding problems such as precipitation and demulsification of the film-forming agent due to temperature, improving the drawing output and product quality, and facilitating subsequent processing and composite material processing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front perspective schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the explosion of the structure of the accelerated cooling mechanism of the utility model;

[0018] Figure 3 This is an exploded schematic diagram of the structure of the fastening assembly of the utility model;

[0019] Figure numerals: 1. wet film water tank; 2. small circulation tank; 3. water pump; 4. return pipe one; 5. inlet pipe one; 6. original return valve; 7. original inlet valve; 8. return duct; 9. inlet duct; 10. fastening assembly; 101. mounting block; 102. positioning plate; 103. bolt; 105. protective pad; 11. semiconductor refrigeration plate; 1101. cooling surface; 1102. heating surface; 12. accelerated cooling mechanism; 1201. fixing block; 1202. supporting cross column; 1203. heat sink; 1204. fan; 13. return pipe two; 14. inlet pipe two; 16. heat exchange plate. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0024] like Figures 1 to 3As shown, a pipeline improvement device for a small circulation temperature control system comprises a wet film water tank 1, two drainage pipes are arranged on the outside of the wet film water tank 1, the drainage pipe on the rear side is connected to a return pipe 1 4 through a water pump 3, the drainage pipe on the front side is connected to an inlet pipe 1 5, the other ends of the return pipe 1 4 and the inlet pipe 1 5 are respectively connected with a return pipe 2 13 and an inlet pipe 2 14, the return pipe 2 13 and the inlet pipe 2 14 are respectively connected with a small circulation tank 2 through a return conduit 8 and an inlet conduit 9, the small circulation tank 2 is provided with a barrel for placing an infiltrant inside, and the other ends of the return pipe 2 13 and the inlet pipe 2 14 are respectively provided with a control The original return valve 6 and the original inlet valve 7 for controlling the water capacity inside the pipeline are mirror-set on the outer wall of the inlet pipeline 5 for absorbing heat from the water transported inside the inlet pipeline 5. The inner wall of the heat exchange plate 16 is an arc-shaped structure, and the outer wall of the heat exchange plate 16 is a square. A semiconductor cooling plate 11 for transferring heat from the heat exchange plate 16 is arranged on the side of the heat exchange plate 16 away from the inlet pipeline 5. A fastening assembly 10 for limiting and fixing the heat exchange plate 16 is mirror-set on the outer wall of the inlet pipeline 5. An accelerated cooling mechanism 12 for transferring heat from one end of the semiconductor cooling plate 11 is arranged between the two fastening assemblies 10;

[0025] Specifically, by closing the original return valve 6 and the original water inlet valve 7 and opening the water pump 3 at the same time, the water inside the wet film water tank 1 can be transported to the small circulation tank 2, so that the water can contact the outer wall surface of the containing barrel, thereby absorbing a part of the temperature of the wetting agent and reducing the oil temperature of the wetting agent. Then, the excess water inside the small circulation tank 2 can float up and flow back to the wet film water tank 1 through the inlet conduit 9. In the process of water returning to the wet film water tank 1, the heat exchange plate 16 arranged can transfer the water temperature inside the inlet pipe 5, so that the semiconductor refrigeration sheet 11 can transfer the heat of the water to the accelerated cooling mechanism 12, so that the water returning to the wet film water tank 1 can be heat-absorbed, avoiding excessive changes in the water temperature inside the wet film water tank 1, and reducing the oil temperature of the wetting agent to a temperature range suitable for direct yarn and strand yarn, while preventing the wet film from freezing in winter.

[0026] like Figure 3 As shown, the semiconductor refrigeration sheet 11 includes a cooling surface 1101 and a heating surface 1102, the cooling surface 1101 is connected to the outer wall surface of the heat exchange plate 16, and the accelerated cooling mechanism 12 is connected to the heating surface 1102;

[0027] Specifically, the heat adsorbed on the heat exchange plate 16 can be transferred to the heating surface 1102 through the provided cooling surface 1101, so that the heating surface 1102 can transfer the heat to the accelerated cooling mechanism 12, thereby achieving the purpose of cooling the heat exchange plate 16, and further playing a role in heat dissipation and cooling the temperature of the water transported inside the inlet pipe 5, so that the water temperature flowing into the wet film water tank 1 can always be within a reasonable temperature range.

[0028] like Figure 3 As shown, each group of the fastening components 10 includes two mounting blocks 101, and two semi-circular mounting blocks 101 are mirror-imaged on the outer wall surface of the inlet pipe 15, and positioning plates 102 are fixedly installed at both ends of each mounting block 101, and each positioning plate 102 is provided with a threaded through hole, and the same bolt 103 is provided between the two corresponding threaded through holes above and below;

[0029] Specifically, by mirror-mounting two upper and lower corresponding mounting blocks 101 on the outer wall surface of the inlet pipe 5, and then threading the bolts 103 into the two upper and lower corresponding threaded through holes, the two mounting blocks 101 can be fixedly mounted on the outer wall surface of the inlet pipe 5. At the same time, with the cooperation of the left and right fastening components 10, the left and right ends of the heat exchange plate 16 can be clamped and fixed, thereby ensuring that the heat exchange plate 16 can have an adsorption treatment effect on the temperature on the wall of the inlet pipe 5.

[0030] like Figure 3 As shown, a high temperature resistant protective pad 105 is bonded to the inner wall surface of the mounting block 101;

[0031] Specifically, the protective pad 105 can prevent the mounting block 101 from directly contacting the inlet pipe 101 and causing extrusion and wear thereon, and can also enhance the firmness of the direct connection between the two mounting blocks 101.

[0032] like Figure 2 As shown, the accelerated cooling mechanism 12 includes a fixed block 1201, and two fixed blocks 1201 are installed on the wall surface of the positioning plate 102 away from the semiconductor cooling plate 11. A plurality of fixed grooves are vertically and equidistantly provided on the fixed block 1201, and heat sinks 1203 located at the upper and lower ends of the heating surface 1102 are inserted between the two corresponding fixed grooves on the left and right;

[0033] Specifically, the heat transferred from the heating surface 1102 can be dissipated by the heat sink 1203, thereby ensuring the normal heat transfer function of the semiconductor refrigeration plate 11. In addition, the multiple fixing grooves are convenient for selecting a suitable heat sink 1203 according to the size of the semiconductor refrigeration plate 11, thereby improving the tightness and stability of the direct fit between the heat sink 1203 and the heating surface 1102.

[0034] like Figure 2 As shown, a same support column 1202 is inserted between two corresponding fixing slots on the left and right, and a plurality of fans 1204 with wind directions toward the heat sink 1203 are evenly arranged on the support column 1202, and a motor for driving the fans 1204 is arranged inside the support column 1202

[0035] Specifically, the fan 1204 can dissipate heat from the heat sink 1203 , so that the heat sink 1203 can be in a low-temperature state, further ensuring the heat dissipation effect of the heat sink 1203 on the heating surface 1102 .

[0036] When in use, the user can add water of appropriate temperature to the inside of the wet film water tank 1, and then when the temperature of the impregnating agent rises significantly after passing through the wire drawing oiling roller during the production process, the original return valve 6 and the original water inlet valve 7 can be closed at the same time, and then the water pump 3 is opened to allow the water of appropriate temperature whose temperature inside the wet film water tank 1 is lower than the temperature of the impregnating agent to flow through the return pipe 1 4 to the inside of the return pipe 2 13, so that under the conveying action of the return pipe 8, the water can be conveyed to the inside of the small circulation tank 2, so that the water used for cooling can contact the outer wall surface of the holding barrel, so that part of the temperature of the impregnating agent can be absorbed, so that the oil temperature of the impregnating agent can always be within the temperature range suitable for direct yarn and plied yarn processing, and then the excess water inside the small circulation tank 2 will float up and be discharged from the inlet pipe 9 (when hot water and cold water meet, the hot water will float up due to the density difference), and then the water with higher temperature can pass through the inlet pipe The heat is transported to the inlet pipe 15 by the second 14. At this time, the heat exchange plate 16 arranged on the outer wall of the inlet pipe 15 can absorb heat and then transfer the heat to the cooling surface 1101. The cooling surface 1101 can transfer the excess heat to the heating surface 1102 at one end in contact with the heat sink 1203, so as to release the heat of the water transported inside the inlet pipe 15, so that the water of suitable temperature can flow back to the inside of the wet film water tank 1, which not only achieves the purpose of cooling the impregnant, but also can prevent the temperature inside the wet film water tank 1 from changing too much under the action of water circulation, but also can prevent the wet film from freezing in winter (the wet film is a RO membrane tested with water, which contains water inside). The circulation pipeline in this device is independent and convenient, easy to use, so that the impregnant oil temperature is always in a controllable state, thereby ensuring the quality of the impregnant and avoiding the problems of film-forming agent precipitation and demulsification due to temperature. The wire drawing output and product quality are improved, and the post-processing and composite material processing technology are convenient.

[0037] In summary: by closing the original return valve 6 and the original water inlet valve 7 and opening the water pump 3 at the same time, the water inside the wet film water tank 1 can be transported to the small circulation tank 2, so that the water can contact the outer wall surface of the storage barrel, thereby absorbing a part of the temperature of the impregnating agent, reducing the oil temperature of the impregnating agent, so that the oil temperature of the impregnating agent can always be within the temperature range suitable for the processing of direct yarn and plied yarn, and then the excess water inside the small circulation tank 2 can float up and flow back to the inside of the wet film water tank 1 through the inlet conduit 9. In the process of water returning to the wet film water tank 1, the heat exchange plate 16 arranged can transfer the water temperature inside the inlet conduit 5, so that the semiconductor refrigeration sheet 11 can transfer the heat of the water to the accelerated cooling mechanism 12, so that the heat of the water returning to the wet film water tank 1 can be absorbed, avoiding excessive changes in the water temperature inside the wet film water tank 1, and reducing the oil temperature of the impregnating agent to a temperature range suitable for direct yarn and plied yarn, while preventing the wet film from freezing in winter;

[0038] The circulation pipeline is independent and convenient, easy to use, so that the oil temperature of the impregnating agent is always in a controllable state, thereby ensuring the quality of the impregnating agent, avoiding the problems of film-forming agent precipitation and demulsification due to temperature, improving the wire drawing output and product quality, and facilitating the subsequent processing and composite material processing technology.

[0039] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and the specification only describe the principles of the utility model. The utility model may be subject to various changes and improvements without departing from the spirit and scope of the utility model. These changes and improvements fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A pipeline improvement device for a small circulation temperature control system, characterized in that: The invention comprises a wet film water tank (1), wherein two drainage pipes are arranged on the outside of the wet film water tank (1), the drainage pipe on the rear side is connected to a return pipe (4) via a water pump (3), the drainage pipe on the front side is connected to an inlet pipe (5), the other ends of the return pipe (4) and the inlet pipe (5) are respectively connected to a return pipe (13) and an inlet pipe (14), and the return pipe (13) and the inlet pipe (14) are respectively connected to a small circulation tank (2) via a return conduit (8) and an inlet conduit (9); The other ends of the return pipe 2 (13) and the inlet pipe 2 (14) are respectively provided with an original return valve (6) and an original inlet valve (7); a heat exchange plate (16) is provided on the outer wall surface of the inlet pipe 1 (5); a semiconductor cooling plate (11) is provided on the side of the heat exchange plate (16) away from the inlet pipe 1 (5); two fastening components (10) for limiting and fixing the heat exchange plate (16) are provided on the outer wall surface of the inlet pipe 1 (5); and an accelerated cooling mechanism (12) is provided between the two sets of fastening components (10).

2. A pipeline improvement device for a small circulation temperature control system according to claim 1, characterized in that: The semiconductor refrigeration plate (11) comprises a refrigeration surface (1101) and a heating surface (1102); the refrigeration surface (1101) is connected to the outer wall surface of the heat exchange plate (16); and the heating surface (1102) is connected to the accelerated cooling mechanism (12).

3. The pipeline improvement device for a small circulation temperature control system according to claim 1, characterized in that: Each group of the fastening components (10) comprises two mounting blocks (101), and two semi-circular mounting blocks (101) are mirror-imaged on the outer wall surface of the inlet pipe (5), and positioning plates (102) are fixedly mounted at both ends of each mounting block (101), and each positioning plate (102) is provided with a threaded through hole, and a same bolt (103) is provided between two corresponding threaded through holes at the upper and lower ends.

4. A pipeline improvement device for a small circulation temperature control system according to claim 3, characterized in that: A high temperature resistant protective pad (105) is bonded to the inner wall surface of the mounting block (101).

5. The pipeline improvement device for a small circulation temperature control system according to claim 3, characterized in that: The accelerated cooling mechanism (12) comprises a fixed block (1201), two fixed blocks (1201) are installed on a side wall of the positioning plate (102) away from the semiconductor cooling plate (11), a plurality of fixed grooves are vertically equidistantly provided on the fixed block (1201), and heat sinks (1203) located at the upper and lower ends of the heating surface (1102) are inserted between two corresponding fixed grooves on the left and right.

6. A pipeline improvement device for a small circulation temperature control system according to claim 5, characterized in that: A same supporting cross column (1202) is inserted between the two corresponding fixing grooves on the left and right sides, a plurality of fans (1204) with wind directions toward the heat sink (1203) are equidistantly arranged on the supporting cross column (1202), and a motor for driving the fans (1204) is arranged inside the supporting cross column (1202).

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