Tool beneficial to manually measuring wafer thickness of sapphire
By designing a tooling that includes supporting foot, tooling table, slot and bearing, the existing tooling has solved the problems of poor stability and inaccurate measurement in sapphire wafer thickness measurement, achieving higher measurement accuracy and tooling stability.
Patent Information
- Application Number
- CN202421173123.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-05-27
Smart Images
Figure CN222528596U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of wafer measurement technology, and in particular to a tooling that facilitates manual measurement of sapphire wafer thickness. Background Art
[0002] As the domestic LED and semiconductor cutting, grinding and polishing processing technology becomes increasingly mature, LED and semiconductors have encountered bottlenecks in different stages of improvement not only for material requirements, but also for processing technology requirements at all stages. The traditional imitation and learning have gradually transformed into independent research and development. The control of the wafer copper polishing temperature is mainly aimed at the wafer polishing process products in the total thickness deviation, curvature, warpage, LTV and other parameter control, which is another parameter requirement for improvement and breakthrough. The single-sided hard polishing method, on the one hand, in order to reduce the warpage of the wafer, on the other hand, in order to remove the damaged layer on the surface of the wafer and ensure the warpage of the wafer, requires a long repair time and a large amount of grinding to achieve the purpose of ensuring the flatness of the wafer. The high hardness and brittleness of sapphire bring many difficulties to material processing, especially surface nano-level polishing. In order to meet the requirements of ultra-smooth and damage-free surfaces of sapphire substrate materials put forward by the development of optoelectronic technology, the sapphire substrate must be finely polished. Sapphire wafers are widely used in military, aerospace, information, optics, superconductivity and other technical fields due to their excellent dielectric properties, chemical stability, thermal conductivity and high surface smoothness. They have become the best substrate and backing material for preparing high-temperature superconducting films, infrared optical materials, microelectronic devices, etc. In the measurement of sapphire wafer thickness, there are the following problems:
[0003] 1. The tooling that currently supports the micrometer is made of stainless steel, which has poor stability. When measuring sapphire wafers after grinding or polishing, it is easy to fall and smash the wafers, causing losses.
[0004] 2. After grinding or polishing, there is a lot of grinding liquid or polishing liquid remaining on the surface of the wafer and on the hands of the operator. The current tooling cannot protect the micrometer well, and it is easy for the grinding liquid, polishing liquid or water to enter the micrometer, resulting in inaccurate data or damage to the micrometer when measuring the wafer.
[0005] In view of this, it is necessary to provide a new tooling that is conducive to manual measurement of sapphire wafer thickness and can solve the above technical problems or effectively alleviate the above technical problems. Utility Model Content
[0006] The technical problem to be solved by the present disclosure is to provide a tooling that is conducive to manual measurement of sapphire wafer thickness. The tooling that is conducive to manual measurement of sapphire wafer thickness can not only improve the stability of the tooling, but also improve the accuracy of micrometer measurement.
[0007] In order to solve the above technical problems, the embodiment of the present disclosure provides a tooling that facilitates manual measurement of sapphire wafer thickness, including:
[0008] Supporting feet, used to support tooling;
[0009] A workbench, wherein a plurality of supporting feet are installed at the bottom of the workbench and arranged in a triangle;
[0010] A card slot, the card slot is arranged through the tooling table; and
[0011] The bearing is slidably arranged in the slot, and a micrometer is arranged on the bearing, and the micrometer slides in the slot through the bearing.
[0012] In some embodiments, the plurality of support feet are arranged in an isosceles triangle at the bottom of the workbench.
[0013] In some embodiments, a plurality of support foot insertion holes are provided on the workbench, and the support feet are inserted into the corresponding support foot insertion holes.
[0014] In some embodiments, a plurality of the support foot insertion holes are arranged in an isosceles triangle on the bottom surface of the workbench.
[0015] In some embodiments, each of the supporting feet is a supporting foot that is narrow at the top and wide at the bottom.
[0016] In some embodiments, a micrometer insertion hole is provided on the bearing to insert and fix the micrometer.
[0017] In some embodiments, the micrometer insertion hole is arranged at the center of the bearing.
[0018] In some embodiments, the workbench is circular.
[0019] In some embodiments, the tooling table is an aluminum alloy tooling table.
[0020] In some embodiments, a column is provided on the workbench to facilitate the operator's taking.
[0021] It can be seen from the above description of the present application that a plurality of support foot insertion holes are arranged on the tooling table and a plurality of support foot insertion holes are respectively provided with support feet, and the plurality of support feet are arranged on the tooling table in an isosceles triangle, thereby improving the stability of the tooling table and the accuracy of measuring the wafer thickness;
[0022] Moreover, a card slot is provided on the workbench, and a micrometer is slidably provided in the card slot, so that the micrometer can measure any point of the wafer, which is convenient for the operator to use and makes the measurement of the thickness of the wafer more accurate, thereby improving work efficiency. At the same time, a column is provided on the workbench for the operator to take it conveniently. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of a tooling for manually measuring the thickness of a sapphire wafer disclosed in an embodiment of the present disclosure;
[0025] Figure 2 It is a top view of a tooling for manually measuring the thickness of a sapphire wafer disclosed in an embodiment of the present disclosure.
[0026] Description of reference numerals:
[0027] 1. Support foot; 2. Workbench; 3. Slot; 4. Bearing; 5. Support foot insertion hole; 6. Micrometer insertion hole; 7. Column; 8. Micrometer. DETAILED DESCRIPTION
[0028] The specific implementation of the present application is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present application, and is not used to limit the present application.
[0029] Example
[0030] like Figure 1 and Figure 2 As shown, the basic implementation of the present application provides a tooling that is convenient for manually measuring the thickness of sapphire wafers, including: a supporting foot 1 for supporting the tooling; a tooling table 2, a plurality of supporting feet 1 are installed at the bottom of the tooling table 2, and are arranged in a triangle to improve the stability of the tooling table 2; a slot 3, the slot 3 is arranged on the tooling table 2; and a bearing 4, the bearing 4 is slidably arranged in the slot 3, a micrometer 8 is arranged on the bearing 4, and the micrometer 8 slides in the slot 3 through the bearing 4.
[0031] To facilitate understanding of the technical solution of the tooling for manual measurement of sapphire wafer thickness of the present application, the technical effects of the tooling for manual measurement of sapphire wafer thickness of the present application will be described in detail below with reference to the accompanying drawings.
[0032] like Figure 1As shown, the supporting foot 1 is used to support the tooling, and a tooling table 2 is installed on multiple supporting feet 1, and multiple supporting feet 1 are installed in a triangle at the bottom of the tooling table 2 to improve the stability of the tooling table 2. A slot 3 is also provided on the tooling table 2, and a bearing 4 is slidably provided in the slot 3. A micrometer 8 is provided on the bearing 4, and the micrometer 8 slides in the slot 3 through the bearing 4, which is convenient for the operator to measure the thickness of the wafer and improves the stability of the tooling.
[0033] like Figure 1 As shown, in some embodiments, multiple supporting feet 1 are arranged in an isosceles triangle at the bottom of the tooling table 2. The multiple supporting feet 1 are arranged in an isosceles triangle to increase the stability of the tooling table 2, prevent the tooling table from shaking, and improve the accuracy of measuring the wafer thickness.
[0034] like Figure 1 and Figure 2 As shown, in some embodiments, a plurality of supporting base insertion holes 5 are provided on the workbench 2, and a plurality of supporting bases 1 are respectively arranged in each supporting base insertion hole 5. The plurality of supporting bases 1 can be fixed in each supporting base insertion hole 5 by welding, thereby improving the stability of the workbench 2, preventing the workbench from shaking, and improving the accuracy of measuring the wafer thickness.
[0035] like Figure 1 and Figure 2 As shown, in some embodiments, a plurality of support foot insertion holes 5 are arranged on the tooling table 2 in the form of an isosceles triangle, which improves the stability of the tooling table 2, prevents the tooling table from shaking, and improves the accuracy of measuring the wafer thickness.
[0036] like Figure 1 and Figure 2 As shown, in some embodiments, each supporting foot 1 is a supporting foot 1 that is narrow at the top and wide at the bottom. Each supporting foot 1 can be inserted into each supporting foot insertion hole 5, which is convenient for disassembly and assembly of the supporting foot 1 and for use by the operator. At the same time, the narrow at the top and wide at the bottom make the workbench 2 more stable.
[0037] like Figure 1 and Figure 2 As shown, in some embodiments, a micrometer insertion hole 6 is provided on the bearing 4 for inserting and fixing the micrometer 8. At the same time, the bearing 4 is slidably set in the slot 3, which can drive the micrometer 8 in the micrometer insertion hole 6 to move, so that the operator can move the micrometer 8 to the specified position, and the micrometer 8 can measure any point of the wafer, which is convenient for the operator to use and makes the measurement of the thickness of the wafer more accurate, thereby improving work efficiency.
[0038] like Figure 1 and Figure 2As shown, in some embodiments, the micrometer insertion hole 6 is set at the center of the bearing 4, and the micrometer 8 is set at the center of the bearing 4, which is more stable and accurate during measurement.
[0039] like Figure 1 As shown, in some embodiments, the tooling table 2 may be circular, and the circular tooling table 2 may prevent the tooling table 2 from being damaged due to collision, thereby increasing the service life of the tooling table 2 .
[0040] like Figure 1 As shown, in some embodiments, the workbench 2 can be an aluminum alloy workbench, which reduces the weight of the workbench and improves the operator's efficiency.
[0041] like Figure 1 As shown, a column 7 is provided on the workbench 2 to facilitate the operator to take the workbench 2. The column 7 can be an aluminum alloy cylinder to reduce the weight of the column 7. At the same time, by holding the column 7, the operator can avoid the risk of smashing the wafer and improve stability.
[0042] In order to facilitate a deeper understanding of the technical concept and advantages of the tooling for manually measuring the thickness of sapphire wafers in this application, the following is combined with the attached Figure 1 and attached Figure 2 The present application describes a relatively preferred and comprehensive structural form of a tooling that is useful for manual measurement of sapphire wafer thickness.
[0043] The tooling table 2 is a circular tooling table 2, and a plurality of support foot insertion holes 5 are arranged on the tooling table 2. The plurality of support foot insertion holes 5 are arranged in an isosceles triangle on the tooling table 2, wherein the plurality of support foot insertion holes 5 are at least three, and a plurality of support feet 1 are respectively inserted into each support foot insertion hole 5, and each support foot 5 is a support foot 1 that is narrow at the top and wide at the bottom. By inserting into each support foot insertion hole 5, the stability of the tooling table 2 can be improved, thereby improving the measurement accuracy of the wafer thickness. A card slot 3 is arranged on the tooling table 2, A bearing 4 is slidably arranged in the slot 3, and the bearing 4 is connected to a micrometer 8. The micrometer 8 is driven to move to any position by the sliding bearing 4, so as to facilitate the measurement of various parts of the wafer and improve the accuracy of the measurement. A micrometer insertion hole 6 is arranged on the bearing 4, and the micrometer insertion hole 6 is used to insert the micrometer 8, wherein the micrometer insertion hole 6 is arranged at the center of the bearing 4. At the same time, a column 7 is arranged on the tooling table 2 for the convenience of the operator to take it. The column 7 and the tooling table 2 are both made of aluminum alloy to reduce the weight and facilitate the operator to use.
[0044] It can be seen from the above description of the present application that a plurality of support foot insertion holes 5 are provided on the tooling table 2 and a plurality of support foot insertion holes 5 are respectively provided with support feet 1, and a plurality of support feet 1 are provided on the tooling table 2 in an isosceles triangle, thereby improving the stability of the tooling table 2 and the accuracy of measuring the wafer thickness;
[0045] Moreover, a card slot 3 is provided on the workbench 2, and a micrometer 8 is slidably provided in the card slot 3, so that the micrometer can measure any point of the wafer, which is convenient for the operator to use and makes the measurement of the thickness of the wafer more accurate, thereby improving work efficiency. At the same time, a column 7 is provided on the workbench 2 for the operator to take it conveniently.
[0046] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.
[0047] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.
Claims
1. A tooling for manually measuring the thickness of sapphire wafers, characterized in that: include: A supporting foot (1) for supporting the tooling; A workbench (2), wherein a plurality of the supporting feet (1) are installed at the bottom of the workbench (2) and arranged in a triangle; A card slot (3), the card slot (3) being arranged through the tooling table (2); and A bearing (4), wherein the bearing (4) is slidably arranged in the slot (3), and a micrometer (8) is arranged on the bearing (4), and the micrometer (8) slides in the slot (3) through the bearing (4).
2. The tooling for manually measuring the thickness of sapphire wafer according to claim 1, characterized in that: The plurality of support feet (1) are arranged at the bottom of the tooling platform (2) in the form of an isosceles triangle.
3. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 1, characterized in that: The workbench (2) is provided with a plurality of support foot insertion holes (5), and the support foot (1) is inserted into the corresponding support foot insertion holes (5).
4. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 3, characterized in that: A plurality of the support foot insertion holes (5) are arranged in an isosceles triangle on the bottom surface of the tooling table (2).
5. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 1, characterized in that: Each of the supporting feet (1) is a supporting foot that is narrow at the top and wide at the bottom.
6. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 1, characterized in that: The bearing (4) is provided with a dial gauge insertion hole (6) for inserting and fixing the dial gauge (8).
7. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 6, characterized in that: The micrometer insertion hole (6) is arranged at the center of the bearing (4).
8. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 1, characterized in that: The tooling table (2) is circular.
9. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 1, characterized in that: The tooling table (2) is an aluminum alloy tooling table.
10. The tooling for facilitating manual measurement of sapphire wafer thickness according to claim 1, characterized in that: A column (7) is provided on the tooling table (2) for an operator to take the tooling table (2).