Constant-temperature positioning detection equipment for semiconductor chilling plate

Abstract

The utility model discloses a constant temperature positioning detection device for a semiconductor chilling plate, which comprises an installation platform, a moving mechanism, a positioning mechanism and a detection mechanism, and is characterized in that the positioning mechanism is used for installing the semiconductor chilling plate to be detected and comprises a positioning base, a constant temperature platform, a magnetic attraction heat conduction plate and a containing tool which are sequentially stacked from bottom to top; the magnetic attraction heat conduction plate is detachably installed on the top of the constant-temperature platform in a magnetic attraction mode, and the containing tool is detachably installed on the top of the magnetic attraction heat conduction plate in a magnetic attraction mode. The containing tool is provided with a plurality of positioning holes, and the positioning holes are used for positioning and installing semiconductor chilling plates to be detected. The constant-temperature positioning detection equipment can effectively reduce the interference of human factors on the resistance detection result of the semiconductor chilling plate, and solves the technical problem of high misjudgment rate caused by poor contact between the semiconductor chilling plate and a resistance tester in the process of detecting the semiconductor chilling plate in a manual mode at present.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration piece detection, in particular to a constant temperature positioning detection device for a semiconductor refrigeration piece. Background Art

[0002] Semiconductor refrigerators are chips made using the Peltier effect of semiconductor materials that can produce cooling or heating effects. They have the characteristics of small size, compact structure, and easy control of cooling capacity. They are widely used in small refrigeration products such as wine refrigerators, hot and cold dual-purpose boxes for cars, and electronic ice cream machines.

[0003] The semiconductor refrigeration sheet includes a first substrate, a second substrate, and a crystal grain disposed between the first substrate and the second substrate. During the assembly process of the semiconductor refrigeration sheet, the electrical parameters (such as resistance, etc.) of the semiconductor refrigeration sheet are usually different due to the influence of the crystal grain preparation process and the semiconductor refrigeration sheet assembly process, that is, there is an error between the actual electrical parameters and the theoretical electrical parameters of the semiconductor refrigeration sheet. The application scenarios applicable to semiconductor refrigeration sheets with different electrical parameters are different. If the actual application parameters of the semiconductor refrigeration sheet are ignored, the working efficiency of the semiconductor refrigeration sheet will be affected and its service life will be shortened.

[0004] In the prior art, the resistance of semiconductor refrigeration chips is generally tested manually using a resistance tester. The testing method is to contact the two test leads on the resistance tester with the corresponding pins on the semiconductor refrigeration chip to be tested, so that the resistance value between the corresponding pins on the semiconductor refrigeration chip is displayed on the display screen of the resistance tester, so as to obtain the resistance value of the semiconductor refrigeration chip. However, in the process of manually testing semiconductor refrigeration chips, it is often impossible to detect or detect inaccurately due to poor contact between the semiconductor refrigeration chip and the resistance tester, or there are other human factors that interfere and cause misjudgment of the semiconductor refrigeration chip. If the semiconductor refrigeration chip is used in an application scenario that does not match its electrical parameters, it will affect the working efficiency of the semiconductor refrigeration chip and shorten its service life. Utility Model Content

[0005] The purpose of the utility model is to propose a constant temperature positioning detection device for a semiconductor refrigeration piece, effectively reduce the interference of human factors on the resistance detection result of the semiconductor refrigeration piece, solve the technical problem of high misjudgment rate caused by poor contact between the semiconductor refrigeration piece and the resistance tester in the existing process of manually detecting the semiconductor refrigeration piece, so as to overcome the shortcomings of the prior art.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A constant temperature positioning detection device for a semiconductor refrigeration chip, comprising a mounting platform, a moving mechanism, a positioning mechanism and a detection mechanism, wherein the moving mechanism and the detection mechanism are respectively mounted on the top of the mounting platform, the positioning mechanism is mounted on the top of the moving mechanism, and the positioning mechanism moves horizontally relative to the detection mechanism through the moving mechanism; the positioning mechanism is used to mount the semiconductor refrigeration chip to be detected, the detection mechanism is provided with a detection member for detecting the resistance value of the semiconductor refrigeration chip, and the detection member faces the top of the positioning mechanism;

[0008] The positioning mechanism includes a positioning base, a constant temperature platform, a magnetic heat conductive plate and a containing tool which are stacked in sequence from bottom to top, the positioning base is installed on the top of the output end of the moving mechanism, the magnetic heat conductive plate is detachably installed on the top of the constant temperature platform by magnetic attraction, and the containing tool is detachably installed on the top of the magnetic heat conductive plate by magnetic attraction; the containing tool is provided with a plurality of positioning holes, and the positioning holes are used for positioning and installing the semiconductor refrigeration plate to be tested.

[0009] Preferably, a positioning groove is provided on the top of the magnetic heat conductive plate, and the containing tool is matched and installed inside the positioning groove.

[0010] Preferably, a mounting slot hole is further provided on the top of the magnetic heat conductive plate, the mounting slot hole is located at the edge of the positioning slot, and the positioning slot and the mounting slot hole are interconnected; the depth of the mounting slot hole is greater than the depth of the positioning slot.

[0011] Preferably, at least two mounting slots are provided, and the two mounting slots are respectively located on two opposite sides of the positioning slot.

[0012] Preferably, the magnetic heat-conducting plate comprises a heat-conducting plate body, a first magnetic block and a second magnetic block, and the heat-conducting plate body is provided with the positioning groove and the mounting slot hole;

[0013] The first magnetic block is installed at the bottom of the positioning groove, and the containing tool is installed inside the positioning groove through the first magnetic block;

[0014] The second magnetic block is installed on the bottom surface of the heat conducting plate body, and the heat conducting plate body is installed on the top of the constant temperature platform through the second magnetic block.

[0015] Preferably, at least four first magnetic blocks are provided, and the four first magnetic blocks are evenly distributed on the bottom edge of the positioning groove;

[0016] At least four second magnetic blocks are provided, and the four second magnetic blocks are evenly distributed on the bottom edge of the heat conducting plate body.

[0017] Preferably, the positioning mechanism further comprises a positioning block, and the positioning block is fixedly mounted on the top of the positioning base;

[0018] The edge of the positioning block is provided with a first positioning notch and a second positioning notch which are interconnected, and the first positioning notch is located at the top of the second positioning notch; the corner position of the constant temperature platform is matched and installed inside the second positioning notch, and the corner position of the magnetic heat conductive plate is matched and installed inside the first positioning notch.

[0019] Preferably, the detection mechanism includes a detection seat and a lifting plate, the detection seat is fixedly mounted on the top of the mounting platform, and the detection seat is located on the rear side of the moving mechanism; the lifting plate is mounted on the front side wall of the detection seat, and the lifting plate moves up and down relative to the detection seat, and the detection component is mounted on the bottom of the lifting plate.

[0020] Preferably, the detection member comprises a mounting bracket, a positive electrode detection end and a negative electrode detection end, the mounting bracket is mounted on the bottom of the lifting plate, the positive electrode detection end and the negative electrode detection end both pass through the mounting bracket, and the ends of the positive electrode detection end and the negative electrode detection end both protrude from the bottom of the mounting bracket;

[0021] The positive electrode detection end and the negative electrode detection end are both provided with at least two detection probes, and the two detection probes located at the positive electrode detection end are connected in parallel with each other, and the two detection probes located at the negative electrode detection end are connected in parallel with each other.

[0022] Preferably, the moving mechanism includes a first guide rail and a second guide rail, the first guide rail is installed on the top of the mounting platform so as to extend along the front-to-back direction, and the first guide rail is located on the front side of the detection mechanism; the second guide rail is installed on the top of the first guide rail so as to be movable forward and backward, and the first guide rail and the second guide rail are perpendicular to each other; the positioning base is installed on the top of the second guide rail so as to be movable left and right.

[0023] The technical solution provided by the embodiment of the utility model may have the following beneficial effects:

[0024] 1. The holding fixture used for positioning and installing the semiconductor cooling chip can be detachably installed on the constant temperature platform by means of a magnetic heat conduction plate, which facilitates the rapid detection process and avoids the displacement of the semiconductor cooling chip during the detection process, thereby improving the detection efficiency.

[0025] 2. By setting up a constant temperature platform to reduce the impact of ambient temperature on the test results, the detection accuracy of the detection equipment can be improved.

[0026] 3. The structural member for realizing magnetic fixation is preferably a heat-conducting plate with magnetic attraction function, which has a certain thermal conductivity coefficient, so that the detection environment temperature of the semiconductor refrigeration plate can be effectively adjusted under the premise of realizing magnetic fixation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The utility model is a structural schematic diagram of a constant temperature positioning detection device for a semiconductor refrigeration sheet.

[0028] Figure 2 yes Figure 1 Enlarged view of point A in the middle.

[0029] Figure 3 The utility model is a partial structural schematic diagram of a constant temperature positioning detection device for a semiconductor refrigeration plate.

[0030] Among them: installation platform 1, moving mechanism 2, first guide rail 21, second guide rail 22, positioning mechanism 3, positioning base 31, constant temperature platform 32, magnetic heat conductive plate 33, positioning groove 331, installation slot hole 332, holding tool 34, positioning hole 341, positioning block 35, detection mechanism 4, detection seat 41, lifting plate 42, detection part 43, mounting bracket 431, positive detection terminal 432, negative detection terminal 433, semiconductor refrigeration sheet 5. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] The present technical solution provides a constant temperature positioning detection device for a semiconductor refrigeration sheet, comprising an installation platform 1, a moving mechanism 2, a positioning mechanism 3 and a detection mechanism 4, wherein the moving mechanism 2 and the detection mechanism 4 are respectively installed on the top of the installation platform 1, the positioning mechanism 3 is installed on the top of the moving mechanism 2, and the positioning mechanism 3 moves horizontally relative to the detection mechanism 4 through the moving mechanism 2; the positioning mechanism 3 is used to install the semiconductor refrigeration sheet 5 to be detected, and the detection mechanism 4 is provided with a detection member 43 for detecting the resistance value of the semiconductor refrigeration sheet 5, and the detection member 43 faces the top of the positioning mechanism 3;

[0033] The positioning mechanism 3 includes a positioning base 31, a constant temperature platform 32, a magnetic heat conductive plate 33 and a containing tool 34 which are stacked in sequence from bottom to top, the positioning base 31 is installed on the top of the output end of the moving mechanism 2, the magnetic heat conductive plate 33 is detachably installed on the top of the constant temperature platform 32 by magnetic attraction, and the containing tool 34 is detachably installed on the top of the magnetic heat conductive plate 33 by magnetic attraction; the containing tool 34 is provided with a plurality of positioning holes 341, and the positioning holes 341 are used to position and install the semiconductor refrigeration plate 5 to be detected.

[0034] In order to reduce the interference of human factors on the resistance detection result of the semiconductor refrigeration sheet 5, the present technical solution proposes a constant temperature positioning detection device for achieving effective contact between the semiconductor refrigeration sheet 5 and the detection mechanism 4, such as Figure 1-3 As shown, it includes a moving mechanism 2 for realizing the horizontal movement of the semiconductor refrigeration plate 5, a positioning mechanism 3 for fixing and installing the semiconductor refrigeration plate 5 to be detected, and a detection mechanism 4 for detecting the resistance value of the semiconductor refrigeration plate 5.

[0035] Specifically, the positioning mechanism 3 for fixing and installing the semiconductor refrigeration plate 5 to be tested in this solution includes a positioning base 31, a constant temperature platform 32, a magnetic heat conductive plate 33 and a holding fixture 34 which are stacked in sequence from bottom to top. Among them, the holding fixture 34 for positioning and installing the semiconductor refrigeration plate 5 is detachably mounted on the constant temperature platform 32 by means of a magnetic heat conductive plate 33, which facilitates the rapid detection process and avoids displacement of the semiconductor refrigeration plate 5 during the detection process, thereby improving the detection efficiency. Furthermore, since the temperature of the detection environment will affect the detection accuracy of the resistance value of the semiconductor refrigeration plate 5, in order to improve the detection accuracy of the detection equipment, this solution sets a constant temperature platform 32 to reduce the influence of the ambient temperature on the detection results, with a simple structure and reliable performance. Furthermore, since a structural member for realizing magnetic fixation is provided between the constant temperature platform 32 and the containing tooling 34, in order to ensure that the constant temperature platform 32 can effectively adjust the detection environment temperature of the semiconductor refrigeration plate 5, the present scheme preferably uses the structural member for realizing magnetic fixation as a heat conducting plate 33 with a magnetic function, which has a certain thermal conductivity coefficient, so that the detection environment temperature of the semiconductor refrigeration plate 5 can be effectively adjusted under the premise of realizing magnetic fixation.

[0036] In some embodiments, a cavity is provided inside the constant temperature platform 32, and the cavity is used to store liquid medium, such as coolant, hot water, etc., so that the constant temperature platform 32 maintains a certain temperature, and adjusts the detection environment temperature of the semiconductor refrigeration sheet 5. Furthermore, the cavity can be connected to an external circulation device through a pipeline to ensure that the temperature of the liquid medium in the cavity is constant, so as to achieve the purpose of constant temperature.

[0037] It should be noted that the material of the magnetic heat conductive plate 33 in this solution can be a magnetic material with good thermal conductivity, such as a neodymium iron boron magnet, etc., which is not limited here.

[0038] Further, a positioning groove 331 is provided on the top of the magnetic heat conductive plate 33, and the containing tool 34 is matched and installed inside the positioning groove 331. In this way, it is convenient for the containing tool 34 to be quickly positioned and installed on the top of the magnetic heat conductive plate 33.

[0039] Further, a mounting slot 332 is provided on the top of the magnetic heat conductive plate 33 , and the mounting slot 332 is located at the edge of the positioning slot 331 , and the positioning slot 331 and the mounting slot 332 are interconnected; the depth of the mounting slot 332 is greater than the depth of the positioning slot 331 .

[0040] In a preferred embodiment of the present technical solution, in order to facilitate batch unloading of semiconductor cooling sheets 5 in the testing equipment, the present solution further provides a mounting slot 332 with a depth greater than the positioning slot 331 on the top of the magnetic heat conductive plate 33. When batch unloading of the semiconductor cooling sheets 5 after the inspection is performed, the inspector can insert his finger into the mounting slot 332 to quickly remove the holding tool 34 from the upper surface of the magnetic heat conductive plate 33, so as to facilitate the rapid unloading.

[0041] Further, at least two mounting slots 332 are provided, and the two mounting slots 332 are respectively located on two opposite sides of the positioning slot 331. In this way, it is more convenient to quickly remove the tooling 34.

[0042] Further, the magnetic heat conducting plate 33 includes a heat conducting plate body, a first magnetic block and a second magnetic block, and the heat conducting plate body is provided with the positioning groove 331 and the mounting slot hole 332;

[0043] The first magnetic block is installed at the bottom of the positioning groove 331, and the containing tool 34 is installed inside the positioning groove 331 through the first magnetic block;

[0044] The second magnetic block is installed on the bottom surface of the heat conducting plate body, and the heat conducting plate body is installed on the top of the constant temperature platform 32 through the second magnetic block.

[0045] In another preferred embodiment of the present technical solution, the magnetic heat-conducting plate 33 is composed of a heat-conducting plate body with good thermal conductivity and a magnetic block, which is conducive to reducing the structural cost under the premise of realizing magnetic fixation. Specifically, the first magnetic block (not shown in the figure) is installed inside the positioning groove 331, thereby forming a top magnetic attraction point for the installation of the tooling 34 in the positioning groove 331; the second magnetic block (not shown in the figure) is installed on the bottom surface of the heat-conducting plate body, thereby forming a bottom magnetic attraction point for the installation of the magnetic heat-conducting plate 33 on the top of the constant temperature platform 32.

[0046] It should be noted that the first magnetic block and the second magnetic block in this solution can be magnets.

[0047] Further, at least four first magnetic blocks are provided, and the four first magnetic blocks are evenly distributed on the bottom edge of the positioning groove 331;

[0048] At least four second magnetic blocks are provided, and the four second magnetic blocks are evenly distributed on the bottom edge of the heat conducting plate body.

[0049] Further, the positioning mechanism 3 further includes a positioning block 35, and the positioning block 35 is fixedly installed on the top of the positioning base 31;

[0050] The edge of the positioning block 35 is provided with a first positioning notch and a second positioning notch which are interconnected, and the first positioning notch is located at the top of the second positioning notch; the corner position of the constant temperature platform 32 is matched and installed inside the second positioning notch, and the corner position of the magnetic heat conductive plate 33 is matched and installed inside the first positioning notch.

[0051] In addition, the present solution further adds a positioning block 35 in the positioning mechanism 3, and the edge of the positioning block 35 is provided with a first positioning notch (not shown in the figure) and a second positioning notch (not shown in the figure) that are interconnected. When the constant temperature platform 32 and the magnetic heat conductive plate 33 are installed on the positioning base 31, the two can be quickly positioned and installed on the top of the positioning base 31, which is conducive to the rapid progress of the detection preparation process.

[0052] Further explained, the detection mechanism 4 includes a detection seat 41 and a lifting plate 42, the detection seat 41 is fixedly installed on the top of the mounting platform 1, and the detection seat 41 is located on the rear side of the moving mechanism 2; the lifting plate 42 is installed on the front side wall of the detection seat 41, and the lifting plate 42 moves up and down relative to the detection seat 41, and the detection member 43 is installed at the bottom of the lifting plate 42.

[0053] The detection mechanism 4 of the present solution includes a detection seat 41 and a lifting plate 42 that can move up and down relative to the detection seat 41. Since the detection member 43 is installed at the bottom of the lifting plate 42, the detection member 43 can be adjusted in height in the vertical direction to adapt to the contact with semiconductor cooling sheets 5 of different sizes, thereby improving the versatility of the detection equipment.

[0054] Further, the detection member 43 includes a mounting bracket 431, a positive detection terminal 432 and a negative detection terminal 433, the mounting bracket 431 is mounted on the bottom of the lifting plate 42, the positive detection terminal 432 and the negative detection terminal 433 both pass through the mounting bracket 431, and the ends of the positive detection terminal 432 and the negative detection terminal 433 both protrude from the bottom of the mounting bracket 431;

[0055] The positive electrode detection end 432 and the negative electrode detection end 433 are each provided with at least two detection probes, and the two detection probes located at the positive electrode detection end 432 are connected in parallel with each other, and the two detection probes located at the negative electrode detection end 433 are connected in parallel with each other.

[0056] As a preferred solution of the above embodiment, both the positive electrode detection terminal 432 and the negative electrode detection terminal 433 are provided with at least two detection probes connected in parallel (not shown in the figure), which can effectively reduce the contact resistance of the wires connected thereto and further ensure the accuracy of the detection.

[0057] It should be noted that in the present embodiment, the top ends of the positive detection terminal 432 and the negative detection terminal 433 are respectively connected to the positive and negative electrodes of an existing resistance detector, so that when the detection probe contacts the corresponding pin of the semiconductor refrigeration sheet 5 to be detected, the corresponding resistance value of the semiconductor refrigeration sheet 5 can be read from the resistance detector.

[0058] Further explained, the moving mechanism 2 includes a first guide rail 21 and a second guide rail 22, the first guide rail 21 is installed on the top of the mounting platform 1 extending along the front-to-back direction, and the first guide rail 21 is located on the front side of the detection mechanism 4; the second guide rail 22 is installed on the top of the first guide rail 21 so as to be movable forward and backward, and the first guide rail 21 and the second guide rail 22 are perpendicular to each other; the positioning base 31 is installed on the top of the second guide rail 22 so as to be movable left and right.

[0059] In one embodiment of the present technical solution, the moving mechanism 2 includes a first guide rail 21 extending in the front-to-back direction and a second guide rail 22 extending in the left-to-right direction, so that the positioning mechanism 3 used to install the semiconductor refrigeration plate 5 to be tested can achieve arbitrary movement in the horizontal direction, thereby improving the controllability during the detection process.

[0060] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0061] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0062] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0063] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0064] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0065] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0066] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A constant temperature positioning detection device for a semiconductor refrigeration chip, characterized in that: The device comprises a mounting platform, a moving mechanism, a positioning mechanism and a detection mechanism, wherein the moving mechanism and the detection mechanism are respectively mounted on the top of the mounting platform, the positioning mechanism is mounted on the top of the moving mechanism, and the positioning mechanism moves horizontally relative to the detection mechanism through the moving mechanism; the positioning mechanism is used to mount the semiconductor refrigeration sheet to be detected, and the detection mechanism is provided with a detection member for detecting the resistance value of the semiconductor refrigeration sheet, and the detection member faces the top of the positioning mechanism; The positioning mechanism includes a positioning base, a constant temperature platform, a magnetic heat conductive plate and a containing tool which are stacked in sequence from bottom to top, the positioning base is installed on the top of the output end of the moving mechanism, the magnetic heat conductive plate is detachably installed on the top of the constant temperature platform by magnetic attraction, and the containing tool is detachably installed on the top of the magnetic heat conductive plate by magnetic attraction; the containing tool is provided with a plurality of positioning holes, and the positioning holes are used for positioning and installing the semiconductor refrigeration plate to be tested.

2. The constant temperature positioning detection device for a semiconductor refrigeration sheet according to claim 1, characterized in that: A positioning groove is provided on the top of the magnetic heat-conducting plate, and the containing tool is matched and installed inside the positioning groove.

3. The constant temperature positioning detection device for a semiconductor refrigeration sheet according to claim 2, characterized in that: A mounting slot hole is also provided on the top of the magnetic heat conductive plate. The mounting slot hole is located at the edge of the positioning slot, and the positioning slot and the mounting slot hole are connected to each other; the depth of the mounting slot hole is greater than the depth of the positioning slot.

4. The constant temperature positioning detection device for a semiconductor refrigeration sheet according to claim 3, characterized in that: At least two mounting slots are provided, and the two mounting slots are respectively located on two opposite sides of the positioning slot.

5. The constant temperature positioning detection device for a semiconductor refrigeration sheet according to claim 3, characterized in that: The magnetic heat-conducting plate comprises a heat-conducting plate body, a first magnetic attraction block and a second magnetic attraction block, and the heat-conducting plate body is provided with the positioning groove and the mounting slot hole; The first magnetic block is installed at the bottom of the positioning groove, and the containing tool is installed inside the positioning groove through the first magnetic block; The second magnetic block is installed on the bottom surface of the heat conducting plate body, and the heat conducting plate body is installed on the top of the constant temperature platform through the second magnetic block.

6. The constant temperature positioning detection device for a semiconductor refrigeration sheet according to claim 5, characterized in that: At least four first magnetic blocks are provided, and the four first magnetic blocks are evenly distributed on the bottom edge of the positioning groove; At least four second magnetic blocks are provided, and the four second magnetic blocks are evenly distributed on the bottom edge of the heat conducting plate body.

7. The constant temperature positioning detection device for a semiconductor refrigeration chip according to claim 1, characterized in that: The positioning mechanism also includes a positioning block, which is fixedly mounted on the top of the positioning base; The edge of the positioning block is provided with a first positioning notch and a second positioning notch which are interconnected, and the first positioning notch is located at the top of the second positioning notch; the corner position of the constant temperature platform is matched and installed inside the second positioning notch, and the corner position of the magnetic heat conductive plate is matched and installed inside the first positioning notch.

8. The constant temperature positioning detection device for a semiconductor refrigeration sheet according to claim 1, characterized in that: The detection mechanism includes a detection seat and a lifting plate, the detection seat is fixedly installed on the top of the installation platform, and the detection seat is located on the rear side of the moving mechanism; the lifting plate is installed on the front side wall of the detection seat, and the lifting plate moves up and down relative to the detection seat, and the detection component is installed on the bottom of the lifting plate.

9. The constant temperature positioning detection device for a semiconductor refrigeration sheet according to claim 8, characterized in that: The detection member comprises a mounting bracket, a positive electrode detection end and a negative electrode detection end, wherein the mounting bracket is mounted on the bottom of the lifting plate, the positive electrode detection end and the negative electrode detection end both pass through the mounting bracket, and the ends of the positive electrode detection end and the negative electrode detection end both protrude from the bottom of the mounting bracket; The positive electrode detection end and the negative electrode detection end are both provided with at least two detection probes, and the two detection probes located at the positive electrode detection end are connected in parallel with each other, and the two detection probes located at the negative electrode detection end are connected in parallel with each other.

10. The constant temperature positioning detection device for a semiconductor refrigeration chip according to claim 1, characterized in that: The moving mechanism includes a first guide rail and a second guide rail, the first guide rail is installed on the top of the mounting platform extending in the front-to-back direction, and the first guide rail is located at the front side of the detection mechanism; the second guide rail is installed on the top of the first guide rail so as to be movable forward and backward, and the first guide rail and the second guide rail are perpendicular to each other; the positioning base is installed on the top of the second guide rail so as to be movable left and right.

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