Laminated busbar packaging module with pins at top

Abstract

The utility model relates to a laminated busbar packaging module with pins at the top, which is characterized in that on the basis of division of a power area and a non-power area of a wiring layer on a substrate (1), copper bars with pins at the top are applied to the power area to form power pins, and an independent copper bar structure and a laminated copper bar structure are specifically designed; according to the laminated busbar packaging module, the Pins (5) with the top pins are applied in the non-power area to form all the signal pins, the designed laminated busbar packaging module has the advantages of being low in parasitism, higher in efficiency and higher in current capacity, and in practical application, heat dissipation is better, reliability is better, and assembling is easier.

Description

Technical Field

[0001] The utility model relates to a top-pinned laminated busbar packaging module, belonging to the technical field of chip packaging. Background Art

[0002] The high-power power module technology continues to evolve, resulting in many interconnection methods, which can be roughly divided into external interconnection and internal interconnection. There are two main methods of external interconnection: the top pinout is as follows: Figure 1 As shown, the side foot is as Figure 2 As shown; the internal interconnection mainly includes wire bonding such as Figure 3 As shown and copper sheet bonded as Figure 4 shown.

[0003] like Figure 1 The module with top pins shown in the figure is generally a fixed hole array shell + silicone gel + PIN needle. The current path is short, the design is flexible, and no additional plastic mold is required. However, when the current is large, the direct interconnection between the PIN needle and the PCB will occupy a relatively large area, and the parasitic parameters will be slightly larger. Figure 2 The modules with side pins shown in the figure generally adopt the method of plastic packaging + Pin + copper busbar. The current path is long and is limited by the plastic packaging mold, so the design is slightly more complicated. Figure 3 and Figure 4 As for the internal interconnection shown, wire bonding is low-cost and flexible in design, but has large parasitics and poor adaptability to large currents. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a laminated busbar packaging module with pins protruding from the top, which adopts a laminated copper busbar to protrude from the top and combines the internal layout to achieve the optimization of performance and reliability.

[0005] In order to solve the above technical problems, the utility model adopts the following technical scheme: the utility model designs a top-out laminated busbar packaging module, comprising a first copper bar, a second copper bar, various chips, various Pin needles, and a substrate with a wiring layer arranged on the upper surface, wherein the wiring layer on the substrate is divided into a power zone and a non-power zone, and each chip is arranged and connected to the power zone of the wiring layer on the substrate; the power zone of the wiring layer is further divided into a power input zone and a power output zone based on the wiring layer, and the first copper bar and the second copper bar correspond to the power input zone and the power output zone in sequence, the first copper bar is connected to the power input zone corresponding to the wiring layer on the substrate in a posture perpendicular to the surface of the substrate, the second copper bar is connected to the power output zone corresponding to the wiring layer on the substrate in a posture perpendicular to the surface of the substrate, and each power pin is formed by the first copper bar and the second copper bar; each Pin needle is connected to each corresponding connection point of the non-power zone of the wiring layer on the substrate in a posture perpendicular to the surface of the substrate, and each Pin needle forms each signal pin.

[0006] As a preferred technical solution of the utility model: the first copper bar includes a first sub-copper bar and a second sub-copper bar, the first sub-copper bar and the second sub-copper bar correspond to the power positive input area and the power negative input area of ​​the wiring layer power input area on the substrate one by one, the first sub-copper bar is connected to the power positive input area in a posture perpendicular to the surface of the substrate, the second sub-copper bar is connected to the power negative input area in a posture perpendicular to the surface of the substrate, and the first sub-copper bar is insulated from the second sub-copper bar.

[0007] As a preferred technical solution of the utility model: it also includes an insulating sheet, and a shell covering the substrate wiring layer and each chip by plastic sealing or potting, the first sub-copper bar, the second sub-copper bar, the second copper bar, and each Pin needle protrudes from the upper surface of the shell by a preset height greater than 0, the insulating sheet is placed between the first sub-copper bar and the second sub-copper bar, and the bottom end of the insulating sheet extends into the shell to a preset depth, and in a direction perpendicular to the surface of the insulating sheet, the projection of the first sub-copper bar and the projection of the second sub-copper bar are both located within the surface of the insulating sheet.

[0008] As a preferred technical solution of the utility model: the first sub-copper bar, the second sub-copper bar, the second copper bar, and the tops of each Pin needle are respectively provided with through holes penetrating both sides thereof, the through holes on the top of the first sub-copper bar and the through holes on the top of the second sub-copper bar are of the same size and are positioned opposite to each other, a through hole is provided on the insulating sheet at a position corresponding to the through hole on the top of the first sub-copper bar, and the size of the through hole on the insulating sheet is smaller than the size of the through hole on the top of the first sub-copper bar, and in a direction perpendicular to the surface of the insulating sheet, the projection of the through hole on the insulating sheet is located within the projection of the through hole on the top of the first sub-copper bar.

[0009] As a preferred technical solution of the utility model: the first sub-copper bar is parallel to the second sub-copper bar, and the first sub-copper bar and the second sub-copper bar are respectively arranged on two sides of the insulating sheet.

[0010] As a preferred technical solution of the present utility model: each pin of each chip is connected to each corresponding position of the power area of ​​the wiring layer on the substrate through a copper Clip, and the first sub-copper bar, the second sub-copper bar, the second copper bar are insulated from each copper Clip, the other end of the copper Clip to which each pin on each chip provided in the positive power input area of ​​the wiring layer on the substrate is connected is connected to each corresponding position of the power output area of ​​the wiring layer, and the other end of the copper Clip to which each pin on each chip provided in the power output area of ​​the wiring layer is connected is connected to each corresponding position of the negative power input area of ​​the wiring layer.

[0011] As a preferred technical solution of the utility model: at least two copper bending parts are respectively arranged at the bottom end of the first sub-copper bar, the bottom end of the second sub-copper bar, and the bottom end of the second copper bar, and each copper bending part is used to connect the corresponding position of the wiring layer on the substrate, wherein each copper bending part at the bottom end of the first sub-copper bar and each copper bending part at the bottom end of the second sub-copper bar are respectively folded to the outside of the first sub-copper bar and the second sub-copper bar, and each copper bending part at the bottom end of the second copper bar is folded to both sides of the second copper bar.

[0012] As a preferred technical solution of the utility model: the chips and the copper clips connected thereto in the power positive input area of ​​the wiring layer on the substrate are arranged alternately with the chips and the copper clips connected thereto in the power output area.

[0013] As a preferred technical solution of the utility model: the substrate is a ceramic substrate.

[0014] The utility model discloses a top-out pinned laminated busbar packaging module, which adopts the above technical solution and has the following technical effects compared with the prior art:

[0015] The utility model designs a stacked busbar packaging module with top pins, which is based on the division of the power zone and the non-power zone of the wiring layer on the substrate, applies the copper busbar with top pins to the power zone to form each power pin, and specifically designs an independent copper busbar structure and a stacked copper busbar structure, applies the Pin needles with top pins to the non-power zone to form each signal pin, thereby realizing the designed stacked busbar packaging module, which has the advantages of low parasitics, higher efficiency and stronger current capacity, and in actual applications, has better heat dissipation, better reliability and easier assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the design of the top foot module in the prior art;

[0017] Figure 2It is a schematic diagram of the design of the side foot module in the prior art;

[0018] Figure 3 It is a schematic diagram of wire bonding design in the prior art;

[0019] Figure 4 It is a schematic diagram of the copper clip (Cu Clip) binding design in the prior art;

[0020] Figure 5 , Figure 6 It is a 3D schematic diagram of the laminated busbar packaging module with top pins designed by the utility model;

[0021] Figure 7 This is a schematic diagram of the top view area division of the laminated busbar packaging module with top pins designed in the utility model;

[0022] Figure 8 It is a side view schematic diagram of a laminated busbar packaging module with top pins designed in the utility model;

[0023] Figures 9 and 10 The utility model is a schematic diagram of the bottom structure of the copper busbar in the stacked busbar packaging module with top pins.

[0024] Among them, 1. substrate, 2. chip, 3. first copper bar, 3-1. first sub-copper bar, 3-2. second sub-copper bar, 4. second copper bar, 5. pin, 6. insulating sheet, 7. shell, 8. copper clip, 9. copper bent part. DETAILED DESCRIPTION

[0025] The specific implementation of the utility model is further described in detail below in conjunction with the accompanying drawings.

[0026] The utility model designs a stacked busbar packaging module with top pins. In practical applications, such as Figure 5 and Figure 6 As shown, the specific design includes a first copper bus 3, a second copper bus 4, each chip 2, each Pin 5, and a substrate 1 on which a wiring layer is arranged on the upper surface of a ceramic substrate. The wiring layer on the substrate 1 is divided into a power area and a non-power area. Each chip 2 is arranged in the power area connected to the wiring layer on the substrate 1, as shown in FIG. Figure 7As shown, the power area based on the wiring layer is further divided into a power input area and a power output area. The first copper busbar 3 and the second copper busbar 4 correspond to the power input area and the power output area respectively. The first copper busbar 3 is connected to the power input area corresponding to the wiring layer on the substrate 1 in a posture perpendicular to the surface of the substrate 1. The second copper busbar 4 is connected to the power output area corresponding to the wiring layer on the substrate 1 in a posture perpendicular to the surface of the substrate 1. The first copper busbar 3 and the second copper busbar 4 constitute each power pin; each Pin needle 5 is respectively connected to each corresponding connection point of the non-power area of ​​the wiring layer on the substrate 1 in a posture perpendicular to the surface of the substrate 1, and each Pin needle 5 constitutes each signal pin.

[0027] For the above-designed laminated busbar package module structure, in further practical applications, specific designs are carried out on each part, such as Figure 5 , Figure 6 , Figure 8 As shown, the first copper bar 3 is a laminated copper bar structure, and the first copper bar 3 is specifically designed to include a first sub-copper bar 3-1 and a second sub-copper bar 3-2. The first sub-copper bar 3-1 and the second sub-copper bar 3-2 correspond to the power positive input area and the power negative input area of ​​the wiring layer power input area on the substrate 1 one by one. The first sub-copper bar 3-1 is connected to the power positive input area in a posture perpendicular to the surface of the substrate 1, and the second sub-copper bar 3-2 is connected to the power negative input area in a posture perpendicular to the surface of the substrate 1. The first sub-copper bar 3-1 is insulated from the second sub-copper bar 3-2.

[0028] In practical applications, the insulation design between the first copper sub-bar 3-1 and the second copper sub-bar 3-2 is as follows: Figure 5 , Figure 6 , Figure 8 As shown, the specific design adds an insulating sheet 6, and cooperates with adding a shell 7 that covers the wiring layer of the substrate 1 and each chip 2 by plastic sealing or potting. The first sub-copper bar 3-1, the second sub-copper bar 3-2, the second copper bar 4, and each Pin needle 5 all protrude from the upper surface of the shell 7 by a preset height greater than 0, the insulating sheet 6 is placed between the first sub-copper bar 3-1 and the second sub-copper bar 3-2, and the bottom end of the insulating sheet 6 extends into the shell 7 to a preset depth, and in a direction perpendicular to the surface of the insulating sheet 6, the projection of the first sub-copper bar 3-1 and the projection of the second sub-copper bar 3-2 are both located within the surface of the insulating sheet 6; in the actual implementation process, the specific design is that the first sub-copper bar 3-1 is parallel to the second sub-copper bar 3-2, and the first sub-copper bar 3-1 and the second sub-copper bar 3-2 are respectively arranged on both sides of the insulating sheet 6.

[0029] In actual implementation, further structural design is carried out for each copper busbar, such as Figure 5 , Figure 6As shown, through holes are respectively set on the tops of the first copper bar 3-1, the second copper bar 3-2, the second copper bar 4, and each pin 5, which penetrate both sides thereof. The through hole on the top of the first copper bar 3-1 and the through hole on the top of the second copper bar 3-2 are of the same size and are opposite to each other. A through hole is set on the insulating sheet 6 at a position corresponding to the through hole on the top of the first copper bar 3-1, and the size of the through hole on the insulating sheet 6 is smaller than the size of the through hole on the top of the first copper bar 3-1. In the direction perpendicular to the surface of the insulating sheet 6, the projection of the through hole on the insulating sheet 6 is located within the projection of the through hole on the top of the first copper bar 3-1.

[0030] Regarding the internal structure of the laminated busbar package module designed in this patent application document, in actual application, such as Figure 5 , Figure 6 As shown, the specific design is that each pin of each chip 2 is connected to the corresponding position of the wiring layer power area on the substrate 1 through the copper Clip 8, and the first sub-copper bar 3-1, the second sub-copper bar 3-2, the second copper bar 4 are insulated from each copper Clip 8, the other end of the copper Clip 8 to which each pin on each chip 2 provided in the wiring layer positive power input area on the substrate 1 is connected is connected to the corresponding position of the wiring layer power output area, and the other end of the copper Clip 8 to which each pin on each chip 2 provided in the wiring layer power output area is connected is connected to the corresponding position of the wiring layer negative power input area.

[0031] And in the connection design structure between the copper bus and the wiring layer of the substrate 1, such as Fig. 9 and Fig.10 As shown, the bottom end of the first sub-copper bar 3-1, the bottom end of the second sub-copper bar 3-2, and the bottom end of the second copper bar 4 are specifically designed to be provided with at least two copper bending parts 9, and each copper bending part 9 is used to connect the corresponding position of the wiring layer on the substrate 1, wherein each copper bending part 9 at the bottom end of the first sub-copper bar 3-1 and each copper bending part 9 at the bottom end of the second sub-copper bar 3-2 are respectively folded to the outside of the first sub-copper bar 3-1 and the second sub-copper bar 3-2, and each copper bending part 9 at the bottom end of the second copper bar 4 is folded to both sides of the second copper bar 4.

[0032] In practical applications, the layout design of each device in the positive power input area of ​​the routing layer, and the layout design of each device in each chip 2 and each copper Clip 8 connected thereto in the power output area are as follows: Figure 7 As shown, the chips 2 and the copper Clips 8 connected thereto in the positive power input area of ​​the wiring layer on the substrate 1 are specifically designed to be arranged alternately with the chips 2 and the copper Clips 8 connected thereto in the power output area.

[0033] The above technical scheme designs a top-out laminated busbar packaging module, which is based on the division of the power zone and the non-power zone of the wiring layer on the substrate 1. The copper busbar with the top out is used in the power zone to form each power pin, and an independent copper busbar structure and a laminated copper busbar structure are specifically designed. The Pin 5 with the top out is used in the non-power zone to form each signal pin, thereby realizing the designed laminated busbar packaging module, which has the advantages of low parasitics, higher efficiency and stronger current capacity, and in actual applications, it has better heat dissipation, better reliability and easier assembly.

[0034] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A top-out laminated busbar package module, characterized in that: The invention comprises a first copper busbar (3), a second copper busbar (4), each chip (2), each pin (5), and a substrate (1) with a wiring layer arranged on the upper surface, wherein the wiring layer on the substrate (1) is divided into a power area and a non-power area, and each chip (2) is arranged in the power area connected to the wiring layer on the substrate (1); the power area of ​​the wiring layer is further divided into a power input area and a power output area, and the first copper busbar (3) and the second copper busbar (4) correspond to the power input area and the power output area in sequence. 3) connected to a power input area corresponding to the wiring layer on the substrate (1) in a posture perpendicular to the surface of the substrate (1); the second copper busbar (4) connected to a power output area corresponding to the wiring layer on the substrate (1) in a posture perpendicular to the surface of the substrate (1); the first copper busbar (3) and the second copper busbar (4) constitute each power pin; each pin (5) is connected to each corresponding connection point in the non-power area of ​​the wiring layer on the substrate (1) in a posture perpendicular to the surface of the substrate (1); each pin (5) constitutes each signal pin.

2. A top-out laminated busbar package module according to claim 1, characterized in that: The first copper bar (3) comprises a first sub-copper bar (3-1) and a second sub-copper bar (3-2); the first sub-copper bar (3-1) and the second sub-copper bar (3-2) correspond one by one to a power positive input area and a power negative input area of ​​a wiring layer power input area on the substrate (1); the first sub-copper bar (3-1) is connected to the power positive input area in a posture perpendicular to the surface of the substrate (1); the second sub-copper bar (3-2) is connected to the power negative input area in a posture perpendicular to the surface of the substrate (1); and the first sub-copper bar (3-1) and the second sub-copper bar (3-2) are insulated from each other.

3. A top-out laminated busbar package module according to claim 2, characterized in that: It also comprises an insulating sheet (6) and a shell (7) that covers the wiring layer of the substrate (1) and each chip (2) by means of plastic encapsulation or potting, wherein the first sub-copper bar (3-1), the second sub-copper bar (3-2), the second copper bar (4), and each pin (5) protrude from the upper surface of the shell (7) by a preset height greater than 0, the insulating sheet (6) is placed between the first sub-copper bar (3-1) and the second sub-copper bar (3-2), and the bottom end of the insulating sheet (6) extends into the shell (7) by a preset depth, and in a direction perpendicular to the surface of the insulating sheet (6), the projection of the first sub-copper bar (3-1) and the projection of the second sub-copper bar (3-2) are both located within the surface of the insulating sheet (6).

4. A top-out laminated busbar package module according to claim 3, characterized in that: The tops of the first copper bar (3-1), the second copper bar (3-2), the second copper bar (4), and each pin (5) are respectively provided with through holes penetrating both sides thereof; the through hole on the top of the first copper bar (3-1) and the through hole on the top of the second copper bar (3-2) are of the same size and are positioned opposite to each other; a through hole is provided on the insulating sheet (6) at a position corresponding to the through hole on the top of the first copper bar (3-1); the size of the through hole on the insulating sheet (6) is smaller than the size of the through hole on the top of the first copper bar (3-1); and in a direction perpendicular to the surface of the insulating sheet (6), the projection of the through hole on the insulating sheet (6) is located within the projection of the through hole on the top of the first copper bar (3-1).

5. A top-out laminated busbar packaging module according to claim 3 or 4, characterized in that: The first sub-copper bar (3-1) is parallel to the second sub-copper bar (3-2), and the first sub-copper bar (3-1) and the second sub-copper bar (3-2) are respectively arranged on two surfaces of the insulating sheet (6).

6. A top-out pin-stacked busbar packaging module according to any one of claims 2 to 4, characterized in that: Each pin of each chip (2) is connected to each corresponding position of the wiring layer power area on the substrate (1) through a copper clip (8), and the first sub-copper busbar (3-1), the second sub-copper busbar (3-2), the second copper busbar (4) and each copper clip (8) are insulated, and the other end of the copper clip (8) to which each pin of each chip (2) provided in the wiring layer power positive input area on the substrate (1) is connected is connected to each corresponding position of the wiring layer power output area, and the other end of the copper clip (8) to which each pin of each chip (2) provided in the wiring layer power output area is connected is connected to each corresponding position of the wiring layer power negative input area.

7. A top-out pinned laminated busbar packaging module according to any one of claims 2 to 4, characterized in that: At least two copper bends (9) are respectively arranged at the bottom end of the first copper bar (3-1), the bottom end of the second copper bar (3-2), and the bottom end of the second copper bar (4), and each copper bend (9) is used to connect the corresponding position of the wiring layer on the substrate (1), wherein each copper bend (9) at the bottom end of the first copper bar (3-1) and each copper bend (9) at the bottom end of the second copper bar (3-2) are respectively folded toward the outside of the first copper bar (3-1) and the second copper bar (3-2), and each copper bend (9) at the bottom end of the second copper bar (4) are folded toward both sides of the second copper bar (4).

8. The top-outlet laminated busbar packaging module according to claim 6, characterized in that: The chips (2) and the copper clips (8) connected thereto provided in the power positive input area of ​​the wiring layer on the substrate (1) are arranged alternately with the chips (2) and the copper clips (8) connected thereto provided in the power output area.

9. The top-outlet laminated busbar packaging module according to claim 1, characterized in that: The substrate (1) is a ceramic substrate.

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