Automatic SMT (Surface Mount Technology) welding and cleaning device

Abstract

The utility model relates to an automatic SMT patch welding and cleaning device, which comprises a portal frame, conveying chain rings and a water collecting tank, a pair of conveying chain rings which are symmetrical front and back is arranged below the portal frame, the two conveying chain rings are respectively driven by a stepping motor to synchronously and intermittently rotate, a plurality of slide glass assemblies are uniformly arranged between the two conveying chain rings, and the slide glass assemblies are connected with the portal frame. The head end and the tail end of the conveying chain serve as a discharging position and a discharging position respectively, the slide glass assemblies have opportunities to stop at the discharging position and the discharging position, the portal frame is sequentially provided with a cleaning assembly and a drying assembly in the feeding direction of the conveying chain ring, the portal frame is further provided with a top plate assembly, and the top plate assembly is used for jacking a movable plate of the slide glass assembly to rotate upwards. The water outlet of the cleaning assembly and the air outlet of the drying assembly face the movable plate rotating upwards, a water collecting tank is arranged below the portal frame, a filter screen plate is arranged on an opening in the upper portion of the water collecting tank, and the cleaning assembly pumps cleaning water from the water collecting tank. The cleaning device has the advantages of being high in cleaning efficiency, good in cleaning effect and capable of saving water.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT patches, in particular to an automatic SMT patch welding cleaning device. Background Art

[0002] SMT patch refers to the abbreviation of a series of process flows based on printed circuit boards, which is called surface mounting or surface mounting technology. Generally, after the welding process, a lot of dust is easily adhered to the surface of SMT patches, which needs to be cleaned with a special cleaning device.

[0003] Traditional cleaning devices can only handle a small number of patches at a time, and the device needs to be paused when the patches are installed and removed. When the number of patches is large, multiple shutdowns are required to complete the loading and unloading of the patches, which affects the cleaning efficiency. The patches are often kept on a horizontal surface during cleaning, and a small amount of cleaning liquid is likely to remain on the surface after cleaning, which increases the difficulty of drying the patches. Impurities in the cleaning liquid will remain on the patches after the cleaning liquid is dried, reducing the cleaning effect. In addition, the cleaning liquid used can generally only be used once, resulting in a large amount of cleaning liquid used, which increases the cleaning cost. Utility Model Content

[0004] The utility model aims to provide an automatic SMT patch welding cleaning device, which has the advantages of high cleaning efficiency, good cleaning effect and water saving.

[0005] The technical solution of the utility model is as follows:

[0006] An automatic SMT patch welding cleaning device comprises a gantry, a conveyor chain and a water collecting tank, wherein a pair of front-to-back symmetrical conveyor chain rings are arranged below the gantry, the two conveyor chain rings are respectively driven by a stepper motor to intermittently rotate synchronously, a plurality of wafer carrier assemblies are evenly arranged between the two conveyor chain rings, the head and tail ends of the conveyor chain are respectively used as a material discharge place and a material discharge place, the wafer carrier assemblies have the opportunity to stop at the material discharge place and the material discharge place, the wafer carrier assemblies comprise a movable plate which can be rotated upward from a horizontal plane, the movable plate is used to place the patch to be cleaned, the upper edge of the gantry conveyor chain is used to rotate the wafer carrier assembly, and the movable plate is used to place the patch to be cleaned. A cleaning component and a drying component are sequentially arranged in the feeding direction of the chain feeder ring, and the gantry is also provided with top plate components corresponding to the cleaning component and the drying component respectively, and the top plate component is used to lift the movable plate of the carrier component to rotate it upward to a certain angle, and the water outlet of the cleaning component and the air outlet of the drying component face the movable plate surface after the upward rotation, and a water collecting tank with an open top is arranged under the gantry, and the upper opening of the water collecting tank is located below the cleaning component and the drying component, and the upper opening of the water collecting tank is detachably connected to a filter screen plate, and the cleaning component draws cleaning water from the water collecting tank.

[0007] Preferably, the wafer carrier assembly also includes a connecting plate, a rotating rod and a limit plate, a plurality of connecting plates are evenly arranged on the inner side of the conveying chain ring, a rotating rod is rotatably connected between the tail ends of the front and rear connecting plates opposite to each other, a torsion spring is connected between the rotating rod and the connecting plate, a limit plate is arranged at the head end of the connecting plate, a pair of movable plates are symmetrically arranged on the rotating rod, the torsion spring drives the rotating rod to rotate until the bottom of the movable plate is against the limit plate, and at this time the movable plate is in a horizontal plane, a soft pad and a suction cup are arranged on the top of the movable plate, an air flow channel connected to the suction cup is arranged inside the movable plate, and an air pump and an air valve connected to the air flow channel are arranged at the bottom of the movable plate.

[0008] Preferably, the top plate assembly includes rollers, a rotating seat, a telescopic rod and a cross plate. A cross plate is provided between the gantries. The cross plate passes horizontally between the conveying chain rings. A telescopic rod along the vertical direction is provided on the cross plate. A rotating seat is provided on the top of the movable end of the telescopic rod. A roller is rotatably connected to the rotating seat. When the rotating seat is raised under the action of the telescopic rod, the roller can roll and abut against the movable plate above and lift it up.

[0009] Preferably, the cleaning component and the drying component both include a mounting pipe and a spray box, a mounting pipe is provided between the gantries, a spray box is provided on the mounting pipe, the cross-sectional shape of the spray box is an inverted T-shape, the upper part of the spray box is connected to the mounting pipe, and the lower end surface of the spray box is evenly provided with nozzles, and the lower end surface of the spray box faces the movable plate that is rotated upward.

[0010] Preferably, the cleaning component further comprises a water pump, the water inlet of the water pump is connected to the bottom of the water collecting tank, and the water outlet of the water pump is connected to the installation pipe through a water pipe.

[0011] Preferably, the drying component also includes an exhaust fan and a hot air box, the air inlet of the exhaust fan is provided with a filter head, the air outlet of the exhaust fan is connected to the air inlet of the hot air box, and the air outlet of the hot air box is connected to the installation pipe through an air pipe.

[0012] The utility model has the following beneficial technical effects:

[0013] 1. The conveyor chain ring is driven by a stepper motor to rotate intermittently. When the wafer carrier assembly is assembling and disassembling the patches at the unloading and unloading locations, the patches on the wafer carrier assembly at the cleaning and drying locations can still be cleaned and dried, thereby improving the cleaning efficiency.

[0014] 2. Through the coordination of the rotatable movable plate and the top plate assembly for lifting the movable plate, the patches mounted on the movable plate are kept at an angle to the horizontal plane during cleaning and drying, so that the residual water droplets on the patches can flow off the patches as much as possible, thereby reducing the amount of residual water on the patches and improving the cleaning effect.

[0015] 3. The used cleaning water falls into the water collection tank, and is reused by the cleaning components after the impurities are blocked by the filter plate, thereby reducing the cleaning cost by recycling water. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution of the utility model will be further described below in conjunction with the accompanying drawings.

[0017] Attached Figure 1 It is a cross-sectional view from the main perspective of the utility model.

[0018] Attached Figure 2 It is a top view of the utility model.

[0019] Attached Figure 3 This is a cross-sectional view from the main perspective of the wafer carrier assembly and the top plate assembly in the utility model.

[0020] Attached Figure 4 It is a top view of the wafer carrier assembly and the top plate assembly in the utility model.

[0021] Attached Figure 5 It is a left view of the wafer carrier assembly and the top plate assembly in the utility model.

[0022] In the figure: 1-gantry, 2-conveying chain link, 3-water collecting tank, 4-carrier assembly, 5-discharging place, 6-unloading place, 7-movable plate, 8-patch, 9-cleaning assembly, 10-drying assembly, 11-top plate assembly, 12-filter screen plate, 13-connecting plate, 14-rotating rod, 15-limiting plate, 16-cushion, 17-suction cup, 18-air flow channel, 19-vacuum pump, 20-air valve, 21-roller, 22-rotating seat, 23-telescopic rod, 24-cross plate, 25-mounting pipe, 26-spray box, 27-nozzle, 28-water pump, 29-water pipe, 30-vacuum fan, 31-hot air box, 32-air pipe. DETAILED DESCRIPTION

[0023] The utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] Example:

[0025] like Figures 1 to 5As shown, this embodiment provides an automatic SMT patch welding cleaning device, including a gantry 1, a conveyor chain ring 2 and a water collecting tank 3. A pair of front-to-back symmetrical conveyor chain rings 2 are arranged below the gantry 1. The two conveyor chain rings 2 are respectively driven by a stepper motor to intermittently rotate synchronously. A number of wafer carrier components 4 are evenly arranged between the two conveyor chain rings 2. The head and tail ends of the conveyor chain are respectively used as a discharge point 5 and a discharge point 6. The wafer carrier components 4 have the opportunity to stop at the discharge point 5 and the discharge point 6. The wafer carrier components 4 include a movable plate 7 that can be rotated upward from a horizontal plane. The movable plate 7 is used to place the patch 8 to be cleaned. The upper conveyor chain of the gantry 1 is A cleaning component 9 and a drying component 10 are arranged in sequence in the feeding direction of the ring 2. A top plate component 11 corresponding to the cleaning component 9 and the drying component 10 is also arranged on the gantry 1. The top plate component 11 is used to lift the movable plate 7 of the carrier component 4 and rotate it upward to a certain angle. The water outlet of the cleaning component 9 and the air outlet of the drying component 10 face the surface of the movable plate 7 after the upward rotation. A water collecting tank 3 with an open top is arranged under the gantry 1. The upper opening of the water collecting tank 3 is located below the cleaning component 9 and the drying component 10. The upper opening of the water collecting tank 3 is detachably connected to a filter screen plate 12, and the cleaning component 9 draws cleaning water from the water collecting tank 3.

[0026] The conveyor chain ring 2 is driven by a stepper motor to rotate intermittently. When the wafer carrier assembly 4 is assembling and disassembling the patch 8 at the discharge point 5 and the unloading point 6, the patch 8 on the wafer carrier assembly 4 at the cleaning assembly 9 and the drying assembly 10 can still be cleaned and dried, thereby improving the cleaning efficiency. The rotatable movable plate 7 and the top plate assembly 11 used to lift the movable plate 7 are matched to keep the patch 8 mounted on the movable plate 7 at an angle with the horizontal plane when being cleaned and dried, so that the residual water droplets on the patch 8 flow down the patch 8 as much as possible, reduce the residual water on the patch 8, and improve the cleaning effect. The used cleaning water falls into the water collecting tank 3, is reused by the cleaning assembly 9 after the impurities are blocked by the filter screen plate 12, and the cleaning cost is reduced by recycling water.

[0027] Furthermore, the wafer carrier assembly 4 also includes a connecting plate 13, a rotating rod 14 and a limit plate 15. A plurality of connecting plates 13 are evenly arranged on the inner side of the conveying chain ring 2. A rotating rod 14 is rotatably connected between the tail ends of the front and rear connecting plates 13 that are opposite to each other. A torsion spring is connected between the rotating rod 14 and the connecting plate 13. A limit plate 15 is arranged at the head end of the connecting plate 13. A pair of movable plates 7 are symmetrically arranged on the rotating rod 14. The torsion spring drives the rotating rod 14 to rotate until the bottom of the movable plate 7 is against the limit plate 15. At this time, the movable plate 7 is in a horizontal plane. A soft pad 16 and a suction cup 17 are arranged on the top of the movable plate 7. An air flow channel 18 connected to the suction cup 17 is arranged inside the movable plate 7. An air pump 19 and an air valve 20 connected to the air flow channel 18 are arranged at the bottom of the movable plate 7.

[0028] When the movable plate 7 is not acted upon by the top plate assembly 11, the movable plate 7 is maintained on a horizontal plane by the cooperation of the torsion spring and the limit plate 15, so that the patch 8 can be placed on the movable plate 7. A pair of symmetrical movable plates 7 provide support points for the patch 8. When the patch 8 is placed on the movable plate 7, the cushion 16 and the suction cup 17 abut against the bottom surface of the patch 8. The cushion 16 can reduce the wear of the bottom surface of the patch, and the suction cup 17 is used to fix the connection between the movable plate 7 and the patch 8. When the patch 8 is installed at the discharge location 5, after the suction cup 17 abuts against the bottom surface of the patch 8, the air pump 19 extracts the air in the suction cup 17 through the air flow channel 18, so that the suction cup 17 can absorb the patch 8. When the patch 8 is removed from the discharge location 5, after the air valve 20 is opened, the outside world supplies air to the suction cup 17 through the air flow channel 18, so that the suction cup 17 can be separated from the patch 8.

[0029] Furthermore, the top plate assembly 11 includes a roller 21, a rotating seat 22, a telescopic rod 23 and a cross plate 24. A cross plate 24 is provided between the gantries 1. The cross plate 24 passes horizontally between the conveying chain rings 2. A telescopic rod 23 is provided in the cross plate 24 along the vertical direction. A rotating seat 22 is provided at the top of the movable end of the telescopic rod 23. The rotating seat 22 is rotatably connected to the roller 21. When the rotating seat 22 is raised under the action of the telescopic rod 23, the roller 21 can roll and abut against the upper movable plate 7 to lift it.

[0030] The top plate assembly 11 contacts the movable plate 7 via the roller 21 , and the contact point between the roller 21 and the movable plate 7 can change with the change of the angle of the movable plate 7 , so that the top plate can stably control the rotation of the movable plate 7 .

[0031] Furthermore, the cleaning component 9 and the drying component 10 both include a mounting tube 25 and a spray box 26. The mounting tube 25 is provided between the gantry 1, and the spray box 26 is provided on the mounting tube 25. The cross-sectional shape of the spray box 26 is an inverted T shape. The upper part of the spray box 26 is connected to the mounting tube 25, and the lower end surface of the spray box 26 is evenly provided with nozzles 27. The lower end surface of the spray box 26 faces the movable plate 7 after being rotated upward.

[0032] The installation pipe 25 and the spray box 26 form a conveying channel for cleaning water and drying hot air, and each nozzle 27 on the lower end surface of the spray box 26 serves as an air outlet and a water outlet.

[0033] Furthermore, the cleaning assembly 9 further includes a water pump 28, the water inlet of the water pump 28 is connected to the bottom of the water collecting tank 3, and the water outlet of the water pump 28 is connected to the installation pipe 25 through the water delivery pipe 29. The clean water in the water collecting tank 3 is driven by the water pump 28 to flow into the cleaning assembly 9, and the water flow rushing onto the patch 8 is re-created.

[0034] Furthermore, the drying assembly 10 further includes an air extractor 30 and a hot air box 31. The air inlet of the air extractor 30 is provided with a filter head, the air outlet of the air extractor 30 is connected with the air inlet of the hot air box 31, and the air outlet of the hot air box 31 is connected with the installation pipe 25 through the air delivery pipe 32. The air extractor 30 delivers cold air from the outside into the hot air box 31, and the hot air box 31 heats the cold air into hot air and then delivers it into the drying assembly 10 along the air delivery pipe 32.

[0035] The working principle and use process of this utility model:

[0036] After starting the cleaning operation of the patch 8, the staff starts the stepper motor to drive the conveyor chain 2 to rotate intermittently. When the wafer carrier assembly 4 stops at the discharge position 5, the patch 8 is placed on the movable plate 7, and the vacuum pump 19 starts to pump air to allow the suction cup 17 to absorb the patch 8. Then the wafer carrier assembly 4 and the patch 8 pass through the cleaning assembly 9 and the drying assembly 10 in turn to complete the cleaning and drying processes. Finally, the wafer carrier assembly 4 stops at the discharge position 6, the air valve 20 opens, and the outside world supplies air to the suction cup 17, so that the suction cup 17 releases the patch 8 and removes the patch 8 from the wafer carrier assembly 4.

[0037] The above are only specific application examples of the utility model, and do not constitute any limitation on the protection scope of the utility model. Any technical solution formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the utility model.

Claims

1. An automatic SMT patch welding cleaning device, characterized by: It includes a gantry, a conveyor chain ring and a water collecting tank. A pair of front-to-back symmetrical conveyor chain rings are arranged under the gantry. The two conveyor chain rings are respectively driven by a stepper motor to intermittently rotate synchronously. A number of wafer carrier assemblies are evenly arranged between the two conveyor chain rings. The head and tail ends of the conveyor chain are used as discharge locations and unloading locations respectively. The wafer carrier assemblies have the opportunity to stop at the discharge location and the unloading location. The wafer carrier assembly includes a movable plate that can be rotated upward from a horizontal plane. The movable plate is used to place the patch to be cleaned. The gantry is along the feeding direction of the conveyor chain ring. A cleaning component and a drying component are provided in sequence, and the gantry is also provided with a top plate component corresponding to the cleaning component and the drying component respectively, the top plate component is used to lift the movable plate of the carrier component to rotate it upward to a certain angle, the water outlet of the cleaning component and the air outlet of the drying component face the movable plate surface after the upward rotation, and a water collecting tank with an open top is provided under the gantry, the upper opening of the water collecting tank is located below the cleaning component and the drying component, the upper opening of the water collecting tank is detachably connected to a filter screen plate, and the cleaning component draws cleaning water from the water collecting tank.

2. The automatic SMT patch welding cleaning device according to claim 1 is characterized in that: The wafer carrier assembly also includes a connecting plate, a rotating rod and a limit plate. A plurality of connecting plates are evenly arranged on the inner side of the conveying chain ring. A rotating rod is rotatably connected between the tail ends of the front and rear connecting plates that are opposite to each other. A torsion spring is connected between the rotating rod and the connecting plate. A limit plate is arranged at the head end of the connecting plate. A pair of movable plates are symmetrically arranged on the rotating rod. The torsion spring drives the rotating rod to rotate until the bottom of the movable plate is against the limit plate. At this time, the movable plate is in a horizontal plane. A soft pad and a suction cup are arranged on the top of the movable plate. An air flow channel connected to the suction cup is arranged inside the movable plate. An air pump and an air valve connected to the air flow channel are arranged at the bottom of the movable plate.

3. The automatic SMT patch welding cleaning device according to claim 1 is characterized in that: The top plate assembly includes rollers, a rotating seat, a telescopic rod and a cross plate. A cross plate is provided between the gantries. The cross plate passes horizontally between the conveying chain rings. A telescopic rod is provided in the vertical direction on the cross plate. A rotating seat is provided on the top of the movable end of the telescopic rod. A roller is rotatably connected to the rotating seat. When the rotating seat is raised under the action of the telescopic rod, the roller can roll and abut against the movable plate above and lift it up.

4. The automatic SMT patch welding cleaning device according to claim 1 is characterized in that: The cleaning component and the drying component both include a mounting pipe and a spray box. A mounting pipe is provided between the gantries, and a spray box is provided on the mounting pipe. The cross-sectional shape of the spray box is an inverted T shape. The upper part of the spray box is connected to the mounting pipe, and nozzles are evenly provided on the lower end surface of the spray box. The lower end surface of the spray box faces the movable plate that is rotated upward.

5. The automatic SMT patch welding cleaning device according to claim 4 is characterized in that: The cleaning component also includes a water pump, the water inlet of the water pump is connected to the bottom of the water collecting tank, and the water outlet of the water pump is connected to the installation pipe through a water pipe.

6. The automatic SMT patch welding cleaning device according to claim 4 is characterized in that: The drying assembly also includes an air extractor and a hot air box. The air inlet of the air extractor is provided with a filter head, the air outlet of the air extractor is connected to the air inlet of the hot air box, and the air outlet of the hot air box is connected to the installation pipe through an air supply pipe.

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