Light spot testing equipment

Abstract

The utility model relates to the technical field of laser chip detection, and provides a light spot test device, which comprises a material platform, a displacement platform, an optical fiber clamp, a test assembly and a dispensing assembly, and is characterized in that the material platform is provided with a mounting position, and the mounting position is used for fixing a laser chip; the displacement platform and the material platform are oppositely arranged, the displacement platform comprises a first movable part, and the first movable part can move relative to the material platform; and the optical fiber clamp is fixed on the first movable part and is used for clamping an optical fiber and enabling the optical fiber to be in butt joint with the laser chip through the first movable part. According to the light spot testing equipment, the optical fiber clamp and the displacement platform are arranged, so that the optical fiber can be directly butted with the chip before being fixed with the chip, the testing step is set before gluing, the situation that in the prior art, if collimation is not qualified, the optical fiber needs to be disassembled, light spot collimation is carried out again, and then the testing process is repeated is avoided, and the testing efficiency is improved. Therefore, the testing and production efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser chip detection, in particular to a light spot testing device. Background Art

[0002] The spot test system is mainly used to collimate or adjust the spot after installing the optical fiber on the packaged chip, COS and other products, and confirm the spot size effect after collimation. For example, the spot quality test system with the authorization announcement number CN216695516U can detect the laser beam shaped by the beam shaping system.

[0003] The commonly used spot test equipment can only test the spot size and spot shape. If the electro-optical parameters after collimation need to be quantitatively analyzed, a dedicated test machine is required to quantitatively test the electro-optical performance parameters. If the performance parameters do not meet the requirements, the optical fiber needs to be removed and reworked to collimate the spot again, and then the test process is repeated until the requirements are met, which causes great inconvenience to production and R&D. Utility Model Content

[0004] In view of this, the utility model proposes a light spot testing device, which connects the optical fiber and detects the light spot before installing it on the laser chip. After passing the test, the optical fiber and the laser chip are fixed to avoid repeated testing and rework.

[0005] The technical solution of the utility model is implemented as follows: The utility model provides a spot test device, including a material platform, a displacement platform, an optical fiber fixture, a test component and a dispensing component, wherein:

[0006] A mounting position is provided on the material platform, and the mounting position is used to fix the laser chip;

[0007] The displacement platform is arranged opposite to the material platform, and the displacement platform includes a first movable part, and the first movable part can move relative to the material platform;

[0008] The optical fiber clamp is fixed on the first movable part, and is used to clamp the optical fiber and connect the optical fiber to the laser chip through the first movable part;

[0009] The test component is arranged opposite to the material platform, and the test component is used to detect the light spot emitted after the optical fiber and the laser chip are connected;

[0010] The glue dispensing component is arranged opposite to the material platform, and the glue dispensing component is used to bond and fix the optical fiber and the laser chip after being tested by the test component.

[0011] On the basis of the above technical solution, preferably, the dispensing assembly includes a dispensing machine and a curing device, wherein:

[0012] The glue dispensing machine is arranged opposite to the material platform, and is used to dispense glue at one end of the optical fiber connected to the laser chip;

[0013] The curing device is arranged opposite to the material platform and can move relative to the material platform. The curing device is used to cure the glue at the connection between the optical fiber and the laser chip.

[0014] Further preferably, the displacement platform further comprises a second movable portion, and the curing device is fixed on the second movable portion so that the curing device can be moved to the outside of the connection between the optical fiber and the laser chip.

[0015] On the basis of the above technical solution, preferably, the test component includes a light spot morphology detection device and a light spot information detection device, wherein:

[0016] The light spot shape detection device is arranged opposite to the material platform, and the light spot shape detection device is used to detect the size and shape of the light spot emitted after the optical fiber and the laser chip are connected;

[0017] The light spot information detection device is arranged opposite to the material platform, and is used to detect the optical power and spectrum of the laser emitted after the optical fiber is connected to the laser chip.

[0018] Further preferably, the test component also includes a spectrometer, which is arranged opposite to the material platform, and is used to split the laser emitted after the optical fiber and the laser chip are connected into two beams, and transmit them to the spot morphology detection device and the spot information detection device respectively.

[0019] Further preferably, the light spot morphology detection device comprises a light beam analyzer, and the light beam analyzer is arranged on the test component.

[0020] Further preferably, the light spot information detection device includes an integrating sphere and a spectrometer, wherein:

[0021] The integrating sphere is arranged on the test assembly, and is used to collect the laser light emitted after the optical fiber is docked with the laser chip;

[0022] The spectrometer is arranged on the test component, and is used to test the laser power and spectrum collected by the integrating sphere.

[0023] On the basis of the above technical solution, preferably, it also includes a power supply device, which is arranged opposite to the material platform and is used to output continuous current or pulse current to power the laser chip on the installation position.

[0024] On the basis of the above technical solution, preferably, it further comprises a computer, wherein the computer is electrically connected to the test component, and the computer is used to receive and display the detection information of the test component on the laser.

[0025] On the basis of the above technical solution, preferably, the material platform includes a temperature controller, and the temperature controller is used to dissipate heat for the laser chip on the installation position.

[0026] Compared with the prior art, the light spot testing device of the utility model has the following beneficial effects:

[0027] (1) By setting up the optical fiber clamp and the displacement platform, the optical fiber can be directly docked with the chip before being fixed to the chip, so that the test step is set before gluing, avoiding the situation in the prior art where the optical fiber needs to be removed if the alignment is unqualified, and the spot alignment needs to be reworked and then the test process needs to be repeated, thereby effectively improving the test and production efficiency;

[0028] (2) A spectrometer is provided, and a light spot shape detection device and a light spot information detection device are provided. The laser is divided into two beams by the spectrometer and respectively emitted into the light spot shape detection device and the light spot information detection device, so as to simultaneously detect information such as the light spot size, light spot shape, light output power and spectrum, so that there is no need to replace the test equipment during the detection process, the test process is shortened, and the test efficiency is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a structural schematic diagram of the light spot testing device of the utility model. DETAILED DESCRIPTION

[0031] The following will be combined with the implementation of the utility model to clearly and completely describe the technical solutions in the implementation of the utility model. Obviously, the described implementation is only a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] like Figure 1 As shown, the light spot testing device of the present invention comprises a material platform 1, a displacement platform 2, an optical fiber clamp 3, a testing component 4 and a glue dispensing component 5.

[0033] An installation position is provided on the material platform 1, and the installation position is used to fix the laser chip. Specifically, a retractable spring is installed on the installation position of the material platform 1, and the laser chip is pressed by the spring. At the same time, a power supply sheet is provided on the material platform 1. When the spring is pressed against the laser chip, the power supply sheet can form an electrical connection with the laser chip, thereby directly supplying power to the laser chip through the material platform 1. It should be noted that the retractable spring is compatible with chips or COS products of different sizes.

[0034] The displacement platform 2 is arranged opposite to the material platform 1, and the displacement platform 2 includes a first movable part, which can move relative to the material platform 1. The displacement platform 2 can be selected as a three-axis motion module, and the first movable part is the free end of the three-axis motion module.

[0035] The optical fiber clamp 3 is fixed on the first movable part. The optical fiber clamp 3 is used to clamp the optical fiber and dock the optical fiber with the laser chip through the first movable part. During the test, the optical fiber clamp 3 can clamp the optical fiber and move through the first movable part of the displacement platform 2 to dock the optical fiber with the laser chip.

[0036] The test component 4 is arranged opposite to the material platform 1. The test component 4 is used to detect the light spot emitted after the optical fiber and the laser chip are connected. The specific detection parameters include information such as the spot size, the spot shape, the light output power and the spectrum. The spot size and the spot shape can determine whether the light spot is collimated, and the light output power and the spectrum are used for quantitative testing of the electro-optical performance parameters of the laser.

[0037] The glue dispensing component 5 is arranged opposite to the material platform 1. The glue dispensing component 5 is used to glue and fix the optical fiber and the laser chip after being tested by the test component 4. After being tested by the test component 4, if there is no problem with various test data, the optical fiber and the laser chip can be glued and fixed by the glue dispensing component 5.

[0038] In a specific test process, the chip is first installed on the installation position of the material platform 1, and the optical fiber of appropriate length is placed on the optical fiber clamp 3, and the optical fiber is fixed by the optical fiber clamp 3. After completing this step, the optical fiber can be moved by the displacement platform 2 so that one end of it is docked with the chip. It should be noted that at this time, the docked chip and optical fiber are not yet bonded and fixed. After docking, the chip emits a laser and transmits it to the test component 4 through the optical fiber for detection. If the detection fails, the reason for the failure is found. If it is qualified, the chip and optical fiber can be directly fixed by the glue dispensing component 5, and after the chip and optical fiber are completely fixed, they are removed by the optical fiber clamp 3.

[0039] In this embodiment, in order to improve the bonding efficiency between the chip and the optical fiber, the glue dispensing component 5 includes a glue dispensing machine 51 and a curing device 52. The glue dispensing machine 51 is arranged relative to the material platform 1. The glue dispensing machine 51 is used to dispense glue at one end of the optical fiber connected to the laser chip. The curing device 52 is arranged relative to the material platform 1 and can be moved relative to the material platform 1. The curing device 52 is used to cure the glue at the connection between the optical fiber and the laser chip.

[0040] After the laser detection is qualified, the optical fiber is clamped by the optical fiber clamp 3, and the end of the optical fiber is moved to the outside of the glue dispenser 51, and the glue dispenser 51 is used to dispense glue on the end of the optical fiber, and then the glued end of the optical fiber is connected to the chip to complete the bonding. After bonding, the curing device 52 accelerates the curing of the glue to improve the fixing efficiency. The curing device 52 can use UV curing equipment.

[0041] In this embodiment, the displacement platform 2 further includes a second movable portion, and the curing device 52 is fixed on the second movable portion so that the curing device 52 can be moved to the outside of the connection between the optical fiber and the laser chip.

[0042] By moving the curing device 52 to the connection between the optical fiber and the laser chip, the glue at the connection is irradiated and cured, thereby accelerating the connection and fixation between the optical fiber and the laser chip.

[0043] In this embodiment, the test component 4 includes a spot shape detection device 41 and a spot information detection device 42. The spot shape detection device 41 is arranged relative to the material platform 1, and the spot shape detection device 41 is used to detect the size and shape of the spot emitted after the optical fiber and the laser chip are connected. The spot information detection device 42 is arranged relative to the material platform 1, and the spot information detection device 42 is used to detect the optical power and spectrum of the laser emitted after the optical fiber and the laser chip are connected.

[0044] By setting up a light spot morphology detection device 41, the laser emitted after the optical fiber and the laser chip are connected is received, and the light spot size and shape can be determined by observation, so as to judge whether it is collimated. By setting up a light spot information detection device 42, the laser emitted after the optical fiber and the laser chip are connected is received, and information such as optical power and spectrum is output, so as to quantitatively test the electro-optical performance parameters of the emitted laser.

[0045] Specifically, in order to avoid replacing the detection equipment for multiple tests, the test component 4 also includes a spectrometer 43, which is arranged opposite to the material platform 1. The spectrometer 43 is used to divide the laser emitted after the optical fiber and the laser chip are connected into two beams, and transmit them to the spot shape detection device 41 and the spot information detection device 42 respectively.

[0046] The laser is divided into two beams by the spectrometer 43 and transmitted to the spot shape detection device 41 and the spot information detection device 42 respectively, and the spot size, spot shape, light output power, spectrum and other information are detected at the same time, so that the need to replace the test equipment for detection of the spot size, spot shape, light output power and spectrum can be avoided, which can effectively improve the test efficiency.

[0047] In this embodiment, the light spot morphology detection device 41 includes a beam analyzer, which is arranged on the test assembly 4. The beam analyzer is an instrument for testing and analyzing the spatial parameter characteristics of the laser beam. These parameter characteristics include the relative power of the beam cross section, spatial distribution, beam diameter, transverse mode, beam divergence, etc., that is, the size and shape of the light spot.

[0048] In this embodiment, the light spot information detection device 42 includes an integrating sphere 421 and a spectrometer 422. The integrating sphere 421 is arranged on the test component 4, and the integrating sphere 421 is used to collect the laser emitted after the optical fiber is docked with the laser chip. The spectrometer 422 is arranged on the test component 4, and the spectrometer 422 is used to test the laser power and spectrum collected by the integrating sphere 421.

[0049] Integrating sphere 421 is a hollow sphere with an inner wall coated with white diffuse reflective material, also known as photometric sphere, light flux sphere, etc. One or more windows are opened on the sphere wall, which are used as light inlet holes and receiving holes for placing light receiving devices. Integrating sphere 421 is a high-efficiency device used to collect the scattering or emission of light by a sample that is inside the sphere or outside the sphere and close to a window. The light beam collected by integrating sphere 421 will be emitted into spectrometer 422. Spectrometer 422 is also called a spectrometer. It is a device that uses photomultiplier tubes and other light detectors to measure the intensity of spectral lines at different wavelength positions. It is mainly composed of an incident slit, a dispersion system, an imaging system and one or more exit slits. The dispersion element is used to separate the electromagnetic radiation of the radiation source into the required wavelength or wavelength region, and the intensity is measured at the selected wavelength or by scanning a certain band.

[0050] In this embodiment, a power supply device 6 is also provided. The power supply device 6 is arranged opposite to the material platform 1. The power supply device 6 is used to output continuous current or pulse current to power the laser chip on the mounting position. For some different chips or tests, the power supply device 6 can make the chip emit a continuous or pulse light beam to complete the test.

[0051] In this embodiment, a computer 7 is also provided, and the computer 7 is electrically connected to the test component 4. The computer 7 is used to receive and display the detection information of the laser by the test component 4. By receiving and displaying the laser detection information by the computer 7, it is convenient for the operator to judge whether the test is completed and whether the optical fiber and the chip can be fixed, thereby improving the test efficiency.

[0052] Since the chip generates a lot of heat when generating laser, causing the laser to heat up, in order to avoid the chip burning during the test, a temperature controller 11 is also provided on the material platform 1. The temperature controller 11 is used to dissipate the heat of the laser chip on the installation position. Specifically, the temperature controller 11 performs heat exchange through circulating water to dissipate the heat at the bottom of the chip.

[0053] In addition, the length of the optical fiber used for spot collimation is longer than that actually used. During the production process, the optical fiber needs to be cut to match the COS size. Since two surfaces of the optical fiber are coated, the coated surface is used for spot collimation for the best effect. When the optical fiber falls randomly during cutting, it is difficult to distinguish the coated surface, which causes difficulties in actual production. In this embodiment, a diamond blade can be set on the optical fiber clamp 3. During the production process, the entire optical fiber can be placed on the optical fiber clamp 3. After the collimation process is completed, it is cut with the diamond blade on the clamp to avoid the situation where the coated surface cannot be distinguished.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A light spot testing device, characterized in that: It comprises a material platform (1), a displacement platform (2), an optical fiber clamp (3), a test component (4) and a dispensing component (5), wherein: A mounting position is provided on the material platform (1), and the mounting position is used to fix the laser chip; The displacement platform (2) is arranged opposite to the material platform (1), and the displacement platform (2) comprises a first movable part, and the first movable part can move relative to the material platform (1); The optical fiber clamp (3) is fixed on the first movable part, and the optical fiber clamp (3) is used to clamp the optical fiber and connect the optical fiber to the laser chip through the first movable part; The test component (4) is arranged opposite to the material platform (1), and the test component (4) is used to detect the light spot emitted after the optical fiber and the laser chip are connected; The glue dispensing component (5) is arranged opposite to the material platform (1), and the glue dispensing component (5) is used to glue and fix the optical fiber and the laser chip after being tested by the test component (4).

2. The light spot testing device according to claim 1, characterized in that: The glue dispensing assembly (5) comprises a glue dispensing machine (51) and a curing device (52), wherein: The glue dispensing machine (51) is arranged opposite to the material platform (1), and the glue dispensing machine (51) is used to dispense glue at one end of the optical fiber connected to the laser chip; The curing device (52) is arranged opposite to the material platform (1) and can move relative to the material platform (1), and the curing device (52) is used to cure the glue at the connection between the optical fiber and the laser chip.

3. The light spot testing device according to claim 2, characterized in that: The displacement platform (2) further comprises a second movable part, and the curing device (52) is fixed on the second movable part so that the curing device (52) can be moved to the outside of the connection between the optical fiber and the laser chip.

4. The light spot testing device according to claim 1, characterized in that: The test component (4) comprises a light spot morphology detection device (41) and a light spot information detection device (42), wherein: The light spot shape detection device (41) is arranged opposite to the material platform (1), and the light spot shape detection device (41) is used to detect the size and shape of the light spot emitted after the optical fiber and the laser chip are connected; The light spot information detection device (42) is arranged opposite to the material platform (1), and the light spot information detection device (42) is used to detect the optical power and spectrum of the laser emitted after the optical fiber and the laser chip are connected.

5. The light spot testing device according to claim 4, characterized in that: The test assembly (4) further comprises a spectrometer (43), which is arranged opposite to the material platform (1), and is used to split the laser light emitted after the optical fiber and the laser chip are connected into two beams, and transmit the beams to the light spot morphology detection device (41) and the light spot information detection device (42), respectively.

6. The light spot testing device according to claim 4, characterized in that: The light spot morphology detection device (41) comprises a light beam analyzer, and the light beam analyzer is arranged on the test component (4).

7. The light spot testing device according to claim 4, characterized in that: The light spot information detection device (42) comprises an integrating sphere (421) and a spectrometer (422), wherein: The integrating sphere (421) is arranged on the test component (4), and the integrating sphere (421) is used to collect laser light emitted after the optical fiber is docked with the laser chip; The spectrometer (422) is arranged on the testing component (4), and the spectrometer (422) is used to test the laser power and spectrum collected by the integrating sphere (421).

8. The light spot testing device according to claim 1, characterized in that: It also comprises a power supply device (6), which is arranged opposite to the material platform (1), and is used to output a continuous current or a pulse current, thereby supplying power to the laser chip on the installation position.

9. The light spot testing device according to claim 1, characterized in that: It also comprises a computer (7), the computer (7) being electrically connected to the test component (4), and the computer (7) being used to receive and display the detection information of the test component (4) on the laser.

10. The light spot testing device according to claim 1, characterized in that: The material platform (1) comprises a temperature controller (11), and the temperature controller (11) is used to dissipate heat for the laser chip on the installation position.

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