Power device and plastic package mold

By setting metal bosses and through holes on the substrate to extract signal terminals, the problem of chips being away from signal terminals in the existing power module packaging structure is solved, the current stability and heat dissipation ability are improved, and the substrate area is fully utilized.

CN222653958UActive Publication Date: 2025-03-21JIGUANG SEMICON (SHAOXING) CO LTD
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Patent Information

Application Number
CN202421428516.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-20
Publication Date
2025-03-21
Estimated Expiration
2034-06-20

AI Technical Summary

Technical Problem

The packaging structure of the existing power module causes the chip to stay away from the signal terminals, affecting the effective inductance, and the substrate structure wastes effective area, affecting the chip's arrangement and heat dissipation ability.

Method used

A patterned metal layer is provided on one side surface of the substrate, and a metal boss is provided thereon. The chip assembly is adjacent to the metal boss. The plastic seal body is provided with a through hole to expose the top of the metal boss, so that a signal terminal is drawn through the through hole.

Benefits of technology

By guiding the signal terminals to the vicinity of the metal boss, the product performance of the power device is improved, the impurity is reduced, the stability of the circuit current is improved, and the area of ​​the substrate structure is fully utilized, which improves the heat dissipation ability of the chip.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model provides a power device and a plastic package mold. The power device comprises a substrate, wherein a graphical metal layer is arranged on the surface of one side of the substrate; the bottom of the metal boss is connected to the metal layer; the chip assembly is arranged on the substrate and is adjacent to the metal boss, and the chip assembly is electrically connected with the metal layer; the power terminal is electrically connected with the metal layer; and the plastic package body wraps the substrate, the chip assembly, part of the power terminals and part of the metal bosses, the plastic package body is provided with through holes corresponding to the metal bosses, and the through holes are exposed out of the tops of the metal bosses. According to the power device provided by the embodiment of the utility model, stray inductance can be effectively reduced, so that the current stability of the device is improved.
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