Touch chip module structure

Abstract

The utility model discloses a touch chip module structure. The touch chip module structure comprises a first chip pad array and a second chip pad array, the first chip pad array and the second chip pad array are arranged front and back according to a first slope to form a first inclined array; the first chip pads in the first chip pad arrangement and the second chip pads in the second chip pad arrangement are arranged in a staggered manner and incline towards a first direction, and the first direction is perpendicular to the first slope. The chip pads in the first inclined array and the second inclined array are respectively inclined towards the first direction and the second direction and are vertical to respective slopes, and the front chip pad and the rear chip pad are arranged in a staggered manner, so that during wiring, the chip pads can be directly and vertically led out from a connecting end without winding, the design time is shortened, the wiring resistance is also reduced, and the charging efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of display panels, and in particular to a touch chip module structure. Background Art

[0002] Flat panel display devices have many advantages such as thin body, power saving, and no radiation, and have been widely used. Existing flat panel display devices mainly include liquid crystal display devices (LCD) and organic light emitting display devices (OLED). Thin film transistors (TFT) are an important component of flat panel display devices.

[0003] With the development of panel technology, narrow-border display panels that pursue a larger screen-to-body ratio have gradually become mainstream, and are moving towards borderless display. Currently, the borderless display panels on the market have a narrow black outer border on the periphery, under which the display driver circuit such as GIP (Gate Driver In Panel) is distributed.

[0004] In order to meet users' requirements for narrow bezels of display panels, technicians have specially designed the chip Pad from the perspective of the chip. The chip Pad is not in a straight line. This inclined Pad can reduce the lower bezel of the display panel to a certain extent. However, the existing inclined Pad wiring is unreasonable and time-consuming, causing a lot of time waste for display panel designers. At the same time, the wiring resistance is large, which reduces the charging efficiency of the display panel. Utility Model Content

[0005] The inclined pad wiring of the chip of the existing display panel is unreasonable, the design time is long, and the wiring resistance is large, which reduces the charging efficiency of the display panel.

[0006] In view of the above problems, a touch chip module structure is proposed, in which the chip pads in the first inclined array and the second inclined array are tilted in the first direction and the second direction respectively, perpendicular to their respective slopes, and the front and rear chip pads are arranged alternately. In this way, when routing, the wires can be directly led out vertically from the connection end without winding, which shortens the design time, reduces the routing resistance, and improves the charging efficiency.

[0007] In a first aspect, a touch chip module structure includes:

[0008] First chip pad arrangement;

[0009] The second chip pad arrangement;

[0010] The first chip pad arrangement and the second chip pad arrangement are arranged in front and behind with a first slope to form a first inclined array; the first chip pad in the first chip pad arrangement and the second chip pad in the second chip pad arrangement are staggered and inclined in a first direction, and the first direction is perpendicular to the first slope.

[0011] In combination with the touch chip module structure of the present invention, in a first possible implementation manner, the touch chip module structure further includes:

[0012] First routing arrangement;

[0013] The second routing arrangement;

[0014] The first wiring arrangement is respectively led out vertically from the connection end of the first chip pad in the first chip pad arrangement;

[0015] The second wiring arrangement is respectively led out vertically from the connection end of the second chip pad in the second chip pad arrangement;

[0016] Furthermore, the first wiring arrangement and the second wiring arrangement are arranged alternately.

[0017] In combination with the first possible implementation of the present invention, in a second possible implementation, the touch chip module structure further includes:

[0018] The third chip pad arrangement;

[0019] Fourth chip pad arrangement;

[0020] The third chip pad arrangement and the fourth chip pad arrangement are arranged front to back at a horizontal angle to form a first horizontal array; the third chip pad of the third chip pad arrangement and the fourth chip pad of the fourth chip pad arrangement are arranged front to back.

[0021] In combination with the second possible implementation manner of the present utility model, in a third possible implementation manner, the touch chip module structure further includes:

[0022] The third routing arrangement;

[0023] Fourth routing arrangement;

[0024] The third wiring arrangement is respectively led out vertically from the connection end of the third chip pad in the third chip pad arrangement;

[0025] The fourth wiring arrangement is respectively led out from the connection ends of the fourth chip pads in the fourth chip pad arrangement.

[0026] In combination with the third possible implementation manner of the utility model, in a fourth possible implementation manner, the touch chip module structure further includes:

[0027] Fifth chip pad arrangement;

[0028] The sixth chip pad arrangement;

[0029] The fifth chip pad arrangement and the sixth chip pad arrangement are arranged in front and behind with a second slope to form a second inclined array; the fifth chip pad of the fifth chip pad arrangement and the sixth chip pad of the sixth chip pad arrangement are staggered and inclined in a second direction, and the second direction is perpendicular to the second slope.

[0030] In combination with the fourth possible implementation manner of the present utility model, in a fifth possible implementation manner, the touch chip module structure further includes:

[0031] Fifth routing arrangement;

[0032] The sixth routing arrangement;

[0033] The fifth wiring arrangement is respectively led out vertically from the connection end of the fifth chip pad in the fifth chip pad arrangement;

[0034] The sixth wiring arrangement is respectively led out vertically from the connection end of the sixth chip pad in the sixth chip pad arrangement;

[0035] Furthermore, the fifth routing arrangement and the sixth routing arrangement are arranged in a staggered manner.

[0036] In combination with the fifth possible implementation manner of the utility model, in a sixth possible implementation manner, the first inclined array and the second inclined array are arranged adjacent to the first horizontal array, and the angles between the first slope and the second slope and the horizontal are equal.

[0037] In combination with the sixth possible implementation manner of the utility model, in a seventh possible implementation manner, the first slope and the second slope are inclined toward the upper left corner and the upper right corner of the first horizontal array respectively.

[0038] In combination with the touch chip module structure described in the present invention, in an eighth possible implementation manner, the first chip pad, the second chip pad, the third chip pad, the fourth chip pad, the fifth chip pad, and the sixth chip pad are touch input chip pads.

[0039] The touch chip module structure described in the utility model is implemented by tilting the chip pads in the first tilted array and the second tilted array respectively in the first direction and the second direction, perpendicular to their respective slopes, and staggering the front and rear chip pads. In this way, when routing, the wiring can be directly led out vertically from the connection end without winding, which shortens the design time, reduces the routing resistance, and improves the charging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 It is a schematic diagram of the structure of a touch chip module in the prior art;

[0042] Figure 2 This is a schematic diagram of the structure of the touch chip module in the utility model. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the utility model to clearly and completely describe the technical solution in the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the utility model.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0045] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] like Figure 1 , Figure 1 It is a schematic diagram of the structure of the touch chip module in the prior art; the inclined Pad wiring of the chip of the existing display panel is unreasonable, the design time is long, and its wiring resistance is large, which reduces the charging efficiency of the display panel.

[0049] In view of the above problems, a touch chip module structure is proposed.

[0050] First, as Figure 2 , Figure 2 It is a schematic diagram of the touch chip module structure in the utility model. A touch chip module structure includes a first chip pad110 arrangement and a second chip pad120 arrangement; the first chip pad110 arrangement and the second chip pad120 arrangement are arranged front and back with a first slope to form a first inclined array 100; the first chip pad110 in the first chip pad110 arrangement and the second chip pad120 in the second chip pad120 arrangement are staggered and tilted in a first direction, and the first direction is perpendicular to the first slope. By tilting the chip pads in the first tilted array 100 and the second tilted array 300 respectively in the first direction and the second direction, perpendicular to their respective slopes, and staggering the front and rear chip pads, when routing, they can be directly led out vertically from the connection end without winding, which shortens the design time, reduces the routing resistance, and improves the charging efficiency.

[0051] Furthermore, the touch chip module structure also includes a first routing arrangement and a second routing arrangement; the first routing arrangement is vertically led out from the connection end of the first chip pad110 in the first chip pad110 arrangement; the second routing arrangement is vertically led out from the connection end of the second chip pad120 in the second chip pad120 arrangement; and the first routing arrangement and the second routing arrangement are arranged in an alternating manner.

[0052] Furthermore, the touch chip module structure also includes a third chip pad arrangement and a fourth chip pad arrangement; the third chip pad arrangement and the fourth chip pad arrangement are arranged front and back at a horizontal angle to form a first horizontal array 200; the third chip pad of the third chip pad arrangement and the fourth chip pad of the fourth chip pad arrangement are arranged front and back.

[0053] Furthermore, the touch chip module structure also includes a third routing arrangement and a fourth routing arrangement; the third routing arrangement is vertically led out from the connection end of the third chip pad in the third chip pad arrangement; the fourth routing arrangement is led out from the connection end of the fourth chip pad in the fourth chip pad arrangement.

[0054] Furthermore, the touch chip module structure also includes a fifth chip pad310 arrangement and a sixth chip pad320 arrangement; the fifth chip pad310 arrangement and the sixth chip pad320 arrangement are arranged back and forth with a second slope to form a second inclined array 300; the fifth chip pad310 in the fifth chip pad310 arrangement and the sixth chip pad320 in the sixth chip pad320 arrangement are staggered and inclined in the second direction, and the second direction is perpendicular to the second slope.

[0055] Furthermore, the touch chip module structure also includes a fifth routing arrangement and a sixth routing arrangement; the fifth routing arrangement is vertically led out from the connection end of the fifth chip pad310 in the fifth chip pad310 arrangement; the sixth routing arrangement is vertically led out from the connection end of the sixth chip pad320 in the sixth chip pad320 arrangement; the fifth routing arrangement and the sixth routing arrangement are arranged in an alternating manner.

[0056] Furthermore, the first inclined array 100 and the second inclined array 300 are arranged adjacent to the first horizontal array 200, and the angles between the first slope and the second slope and the horizontal are equal.

[0057] Preferably, the first slope and the second slope are inclined toward the upper left corner and the upper right corner of the first horizontal array 200 respectively.

[0058] Preferably, the first chip pad 110 , the second chip pad 120 , the third chip pad 111 , the fourth chip pad 112 , the fifth chip pad 310 , and the sixth chip pad 320 are touch input chip pads.

[0059] The touch chip module structure of the present invention is implemented by tilting the chip pads in the first tilted array 100 and the second tilted array 300 in the first direction and the second direction respectively, perpendicular to their respective slopes, and staggering the front and rear chip pads. In this way, when routing, the wiring can be directly led out vertically from the connection end without winding, which shortens the design time, reduces the routing resistance, and improves the charging efficiency.

[0060] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A touch chip module structure, characterized in that: include: First chip pad arrangement; The second chip pad arrangement; The first chip pad arrangement and the second chip pad arrangement are arranged in front and behind with a first slope to form a first inclined array; the first chip pad in the first chip pad arrangement and the second chip pad in the second chip pad arrangement are staggered and inclined in a first direction, and the first direction is perpendicular to the first slope.

2. The touch chip module structure according to claim 1, characterized in that: The touch chip module structure also includes: First routing arrangement; Second routing arrangement; The first wiring arrangement is respectively led out vertically from the connection end of the first chip pad in the first chip pad arrangement; The second wiring arrangement is respectively led out vertically from the connection end of the second chip pad in the second chip pad arrangement; Furthermore, the first wiring arrangement and the second wiring arrangement are arranged alternately.

3. The touch chip module structure according to claim 2, characterized in that: The touch chip module structure also includes: The third chip pad arrangement; Fourth chip pad arrangement; The third chip pad arrangement and the fourth chip pad arrangement are arranged front to back at a horizontal angle to form a first horizontal array; the third chip pad of the third chip pad arrangement and the fourth chip pad of the fourth chip pad arrangement are arranged front to back.

4. The touch chip module structure according to claim 3, characterized in that: The touch chip module structure also includes: The third routing arrangement; Fourth routing arrangement; The third wiring arrangement is respectively led out vertically from the connection end of the third chip pad in the third chip pad arrangement; The fourth wiring arrangement is respectively led out from the connection ends of the fourth chip pads in the fourth chip pad arrangement.

5. The touch chip module structure according to claim 4, characterized in that: The touch chip module structure also includes: Fifth chip pad arrangement; The sixth chip pad arrangement; The fifth chip pad arrangement and the sixth chip pad arrangement are arranged in front and behind with a second slope to form a second inclined array; the fifth chip pad of the fifth chip pad arrangement and the sixth chip pad of the sixth chip pad arrangement are staggered and inclined in a second direction, and the second direction is perpendicular to the second slope.

6. The touch chip module structure according to claim 5, characterized in that: The touch chip module structure also includes: Fifth routing arrangement; The sixth routing arrangement; The fifth wiring arrangement is respectively led out vertically from the connection end of the fifth chip pad in the fifth chip pad arrangement; The sixth wiring arrangement is respectively led out vertically from the connection end of the sixth chip pad in the sixth chip pad arrangement; Furthermore, the fifth routing arrangement and the sixth routing arrangement are arranged alternately.

7. The touch chip module structure according to claim 6, characterized in that: The first inclined array and the second inclined array are arranged adjacent to the first horizontal array, and the first slope and the second slope have the same angle with the horizontal.

8. The touch chip module structure according to claim 7, characterized in that: The first slope and the second slope are inclined toward the upper left corner and the upper right corner of the first horizontal array respectively.

9. The touch chip module structure according to claim 8, characterized in that: The first chip pad, the second chip pad, the third chip pad, the fourth chip pad, the fifth chip pad, and the sixth chip pad are touch input chip pads.

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