Circuit board insulation packaging body

Abstract

The utility model discloses a circuit board insulation packaging body which comprises a semi-closed metal shell and a metal heat dissipation body, two sides of the metal shell are provided with fixing lugs, two ends of the metal shell are both provided with installation pieces, the metal shell is provided with an accommodating cavity, the accommodating cavity can accommodate a circuit board, and the metal heat dissipation body and the circuit board are fixedly assembled through bolts. The metal heat dissipation body abuts against one side of the circuit board, an electrical insulation spacer is arranged between the other side of the circuit board and the metal shell, heat conduction insulation colloid is filled among the circuit board, the metal heat dissipation body, the electrical insulation spacer and the containing cavity in a sealed mode, and the fixing lugs can bend towards the heat conduction insulation colloid. And the fixing lugs can be inserted into the heat-conducting insulating rubber body until the fixing lugs can abut against the heat-conducting insulating rubber body or the fixing lugs can be inserted into the heat-conducting insulating rubber body, so that a mutual limiting trend is formed. The circuit board is prevented from being damaged due to shaking and impact, the circuit board is prevented from breaking down due to moisture of attached water drops, and the heat dissipation effect of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board packaging, in particular to an insulating packaging body of a driving circuit board for lighting and installed on a lamp. Background Art

[0002] With the development of science and technology, the improvement of economic level, people's demand for spiritual culture is constantly increasing, and the diversification and multi-colorization of LED lamps are also emerging in more and more occasions. LED lamps are not only an inseparable tool for people's daily life, but also appear in front of the people as a form of urban lighting beautification products, giving people more spiritual enjoyment and visual impact.

[0003] Existing LED lamps can adjust different lighting modes according to different usage scenarios. For example, if a warm atmosphere is needed, it can be adjusted to a low color temperature mode. When the user needs to concentrate on work, it can be adjusted to a high color temperature. The realization of the above lamp functions is inseparable from the LED decoding control driver circuit board.

[0004] However, for LED lamps used in outdoor architectural floodlighting, they are required to be small in size and compact in structure, so the LED decoding control driver circuit board needs to be installed inside the housing of the LED lamp. Since the LED decoding control driver circuit board is a charged body with high power, it has a high temperature when working, and it cannot dissipate heat effectively in time during the switching process between the non-working state and the working state. The water vapor in the housing is easily liquefied into water droplets and attached to the driver circuit board, which will be damaged due to moisture leakage and short circuit.

[0005] In addition, LED lamp manufacturers have also found during production, operation, sales and transportation that some LED lamps are damaged when they arrive at the site due to bumpy roads and loose assembly between the driver circuit board and the circuit board housing, which brings inconvenience to on-site construction.

[0006] Therefore, there is an urgent need to provide a circuit board insulation package that overcomes the above problems. Utility Model Content

[0007] In view of the problems existing in the prior art, the utility model provides a circuit board insulation package. After adopting the circuit board insulation package, on the one hand, through the design of sealing and filling heat-conducting insulating colloid between the circuit board, the metal heat sink, the insulating gasket and the accommodating cavity, the circuit board is physically isolated from the air in the metal shell, and the water vapor in the metal shell is prevented from liquefying into water droplets and adhering to the circuit board, and the electrical conductive insulation effect is achieved. In addition, the circuit board, the metal heat sink, the insulating gasket and the accommodating cavity can form a relatively stable structure by sealing and filling the heat-conducting insulating colloid, and the collision caused by the shaking of the structure can be avoided.

[0008] On the other hand, the metal heat sink and the circuit board are fixedly assembled by bolts, so that the structure between the metal heat sink and the circuit board is relatively stable, and the metal heat sink is in contact with one side of the circuit board, and an electrical insulation gasket is provided between the other side of the circuit board and the metal shell, so that the metal shell and the circuit board achieve an electrical conductive insulation effect, and the heat on the circuit board can be efficiently conducted and dissipated into the metal shell through the metal heat sink, thereby improving the heat dissipation effect of the circuit board;

[0009] In addition, fixing ears are designed on both sides of the metal shell, and the fixing ears can be bent toward the side of the heat-conducting insulating colloid until the fixing ears can abut against the heat-conducting insulating colloid, or until the fixing ears can be inserted into the heat-conducting insulating colloid. Either of the two options can make the fixing ears and the heat-conducting insulating colloid form a card connection or mutual limiting tendency, thereby solving the problem of the heat-conducting insulating colloid falling off or loosening from the semi-enclosed metal shell due to vibration during the transportation of the LED lamp, and avoiding the problem of the circuit board hitting the metal shell in the accommodating cavity of the metal shell.

[0010] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0011] The present application proposes a circuit board insulation package, comprising a semi-enclosed metal shell and a metal heat sink;

[0012] Along the width direction of the metal shell, fixing ears are provided on both sides of the metal shell;

[0013] Along the length direction of the metal shell, both ends of the metal shell are provided with mounting parts;

[0014] The metal shell is provided with a receiving cavity, the receiving cavity can receive the circuit board, the metal heat sink is fixedly assembled with the circuit board by bolts, the metal heat sink is in contact with one side of the circuit board, and an electrical insulating gasket is provided between the other side of the circuit board and the metal shell;

[0015] The circuit board, the metal heat sink, the electrical insulation gasket and the accommodating cavity are all sealed and filled with a heat-conducting insulating colloid;

[0016] The fixing ear can be bent toward the heat-conducting insulating colloid until the fixing ear can abut against the heat-conducting insulating colloid; or, until the fixing ear can be inserted into the heat-conducting insulating colloid, so that the fixing ear and the heat-conducting insulating colloid form a mutual limiting tendency;

[0017] The design of the above technical solution, on the one hand, through the design of sealing and filling the heat-conducting insulating colloid between the circuit board, the metal heat sink, the electrical insulating gasket and the accommodating cavity, not only physically isolates the circuit board from the air in the metal shell, prevents the water vapor in the metal shell from liquefying into water droplets and adhering to the circuit board, and achieves the effect of electrical conductive insulation, but also can achieve the effect of forming a relatively stable structure between the circuit board, the metal heat sink, the electrical insulating gasket and the accommodating cavity by sealing and filling the heat-conducting insulating colloid, and avoids the impact caused by the shaking of the structure;

[0018] On the other hand, the metal heat sink and the circuit board are fixedly assembled by bolts, so that the structure between the metal heat sink and the circuit board is relatively stable, and the metal heat sink is in contact with one side of the circuit board, and an electrical insulation gasket is provided between the other side of the circuit board and the metal shell, so that the metal shell and the circuit board achieve an electrical conductive insulation effect, and the heat on the circuit board can be efficiently conducted and dissipated into the metal shell through the metal heat sink, thereby improving the heat dissipation effect of the circuit board;

[0019] In addition, fixing ears are designed on both sides of the metal shell along the width direction of the metal shell, and the fixing ears can be bent toward the side of the heat-conducting insulating colloid until the fixing ears can abut against the heat-conducting insulating colloid, or until the fixing ears can be inserted into the heat-conducting insulating colloid. Either of the two options can make the fixing ears and the heat-conducting insulating colloid form a card connection or mutual limiting tendency, thereby solving the problem of the heat-conducting insulating colloid falling off or loosening from the semi-enclosed metal shell due to vibration during the transportation of the LED lamp, and avoiding the problem of the circuit board hitting the metal shell in the accommodating cavity of the metal shell.

[0020] In order to solve the technical problem, the further technical solution adopted by the utility model is:

[0021] Optionally, in the above-mentioned circuit board insulation package, the fixing ear is not in contact with the metal heat sink;

[0022] In the design of the above technical solution, since the metal heat sink has electrical properties, it is electrically connected to the negative output pole of the power supply, and the electrical property of the fixing ear is to connect to the metal shell, and the metal shell is connected to the ground. Once the fixing ear contacts the metal heat sink, leakage occurs in the fixing ear or the metal shell, posing a hidden danger to the safety of the operators.

[0023] Optionally, in the above-mentioned circuit board insulation package, the circuit board is connected with an internal thread stud, the metal heat sink is provided with a slot at a position corresponding to the internal thread stud, and the circuit board and the metal heat sink are assembled and fixed with the cooperation of the internal thread stud, the slot and the bolt;

[0024] The design of the above technical solution adopts the structural design of internal thread studs, slots and bolts to realize the fixed assembly of the circuit board and the metal heat sink, which makes the production and manufacturing implementation easier and the structure is stable and firm.

[0025] Further optionally, in the above-mentioned circuit board insulation package, the electronic components on the circuit board are abutted against the outer bottom surface of the metal heat sink through thermally conductive silica gel;

[0026] The design of the above technical solution uses thermally conductive silicone to facilitate the heat transfer from the electronic components of the circuit board to the metal heat sink for heat dissipation, and can form an electrical insulation effect with the metal heat sink. The thermally conductive silicone has more complete contact and adhesion with the bottom surface of the metal heat sink, thereby improving the structural stability.

[0027] Optionally, in the above-mentioned circuit board insulation package, movable grooves are provided on both sides of the metal shell along the width direction of the metal shell, and the fixing ears are connected in the movable grooves;

[0028] The design of the above technical solution, through the sinking structure design of the fixing ear arranged in the movable groove, makes it easier for the fixing ear to bend to abut or insert the thermally conductive insulating colloid, thereby reducing the structural interference of the fixing ear during the bending process.

[0029] Optionally, in the above-mentioned circuit board insulation package, the side of the thermally conductive insulating colloid away from the inner bottom surface of the metal shell does not expose the outer bottom surface of the metal heat sink;

[0030] In the design of the above technical solution, since the functions of the thermally conductive insulating colloid are thermal conductivity, electrical insulation and sealing, it is in contact with the outer bottom surface of the metal heat sink, and can transfer the heat on the circuit board to the metal heat sink for efficient heat dissipation. However, once the thermally conductive insulating colloid is exposed from the outer bottom surface of the metal heat sink and contacts or wraps with other parts of the metal heat sink, the overall thermal conductivity and heat dissipation effect of the metal heat sink will be reduced. It should be noted here that the thermal conductivity effect of the thermally conductive insulating colloid is inferior to that of the metal heat sink.

[0031] Optionally, in the above-mentioned circuit board insulation package, along the width direction of the metal shell, at least two fixing ears are provided on one side of the metal shell, and at least one fixing ear is provided on the other side of the metal shell;

[0032] In the design of the above technical solution, fixing ears are provided on both sides of the metal shell, which can at least form a triangular structure, so that the thermally conductive insulating colloid in the metal shell can be inserted or abutted by the fixing ears on both sides, thereby achieving structural stability between the thermally conductive insulating colloid, circuit board, metal shell and other components.

[0033] Further optionally, in the above-mentioned circuit board insulation package, a spacing is provided between two or more fixing ears located on the same side of the metal shell;

[0034] The design of the above technical solution can increase the abutment and limiting range of the thermally conductive insulating colloid and improve the abutment or limiting effect by designing the physical distance between the fixing ears.

[0035] Further optionally, in the above-mentioned circuit board insulation package, the end of the fixing ear is a convex arc-shaped structure;

[0036] The design of the above technical solution, through the design of the convex arc structure of the end of the fixing ear, ensures that the fixing ear will not scratch the worker's hands or limbs, nor puncture and damage the electronic components on the circuit board during the process of bending to abut against the thermally conductive insulating colloid or inserting the thermally conductive insulating colloid.

[0037] Optionally, in the above-mentioned circuit board insulation package, the mounting member is provided with a mounting hole;

[0038] The design of the above technical solution, by designing the mounting holes on the mounting parts, enables the metal shell to be fixed on the internal platform of the lamp shell by external bolts.

[0039] Compared with the prior art, this application has at least the following technical effects:

[0040] On the one hand, the present application adopts the design of sealing and filling the heat-conducting insulating colloid between the circuit board, the metal heat sink, the electrical insulating gasket and the accommodating cavity, so that the circuit board is physically isolated from the air in the metal shell, and the water vapor in the metal shell is prevented from liquefying into water droplets and adhering to the circuit board, and the electrical conductive insulation effect is achieved. In addition, the circuit board, the metal heat sink, the electrical insulating gasket and the accommodating cavity can form a relatively stable structure by sealing and filling the heat-conducting insulating colloid, so as to avoid the structure shaking and causing collision.

[0041] On the other hand, the present application fixes and assembles the metal heat sink and the circuit board with bolts, so that the structure between the metal heat sink and the circuit board is relatively stable, and the metal heat sink abuts against one side of the circuit board, and an electrical insulation gasket is provided between the other side of the circuit board and the metal shell, so that the metal shell and the circuit board achieve an electrical conductive insulation effect, and the heat on the circuit board can be efficiently conducted and dissipated into the metal shell through the metal heat sink, thereby improving the heat dissipation effect of the circuit board;

[0042] In addition, the present application designs fixing ears on both sides of the metal shell along the width direction of the metal shell, and the fixing ears can be bent toward the side of the heat-conducting insulating colloid until the fixing ears can abut against the heat-conducting insulating colloid, or until the fixing ears can be inserted into the heat-conducting insulating colloid. Either of the two options can make the fixing ears and the heat-conducting insulating colloid form a card connection or mutual limiting tendency, thereby solving the problem of the heat-conducting insulating colloid falling off or loosening from the semi-enclosed metal shell due to vibration during the transportation of the LED lamp, and avoiding the problem of the circuit board hitting the metal shell in the accommodating cavity of the metal shell.

[0043] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is an exploded schematic diagram of the three-dimensional structure of a preferred embodiment of the present application (fixing ears are not bent);

[0045] Figure 2 This is a three-dimensional assembly schematic diagram of a preferred embodiment of the present application (fixing ears are not bent);

[0046] Figure 3 2. It is a three-dimensional assembly schematic diagram of another preferred embodiment of the present application (the fixing ear is bent toward the heat-conducting insulating colloid, the bending angle is 90°, and the fixing ear is in contact with the heat-conducting insulating colloid);

[0047] Figure 4 It is a three-dimensional assembly schematic diagram of another preferred embodiment of the present application (the fixing ear is bent toward the heat-conducting insulating colloid side, the bending angle is 135°, and the fixing ear is inserted into the heat-conducting insulating colloid);

[0048] The parts in the accompanying drawings are marked as follows:

[0049] Metal shell 1, fixing ear 11, mounting part 12, mounting hole 121, accommodating cavity 13, movable groove 14, metal heat sink 2, slot hole 21, circuit board 3, bolt 31, internal thread stud 32, electrical insulation gasket 4, thermal conductive insulating colloid 5 and thermal conductive silicone 6. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0051] Example

[0052] like Figures 1 to 4 As shown, in one embodiment of the present application, a circuit board insulation package is provided, comprising a semi-enclosed metal shell 1 and a metal heat sink 2;

[0053] Along the width direction of the metal shell 1, fixing ears 11 are provided on both sides of the metal shell 1;

[0054] Along the length direction of the metal shell 1, both ends of the metal shell 1 are provided with mounting parts 12;

[0055] The metal housing 1 is provided with a receiving cavity 13, which can receive the circuit board 3. The metal heat sink 2 and the circuit board 3 are fixedly assembled by bolts 31. The metal heat sink 2 abuts against one side of the circuit board 3, and an electrical insulating gasket 4 is provided between the other side of the circuit board 3 and the metal housing 1.

[0056] The circuit board 3, the metal heat sink 2, the electrical insulation gasket 4 and the accommodating cavity 13 are all sealed and filled with a heat-conducting insulating colloid 5;

[0057] The fixing ear 11 can be bent at an angle of 90° to 180° toward the side of the heat-conducting insulating colloid 5 until the fixing ear 11 can abut against the heat-conducting insulating colloid 5; or until the fixing ear 11 can be inserted into the heat-conducting insulating colloid 5, so that the fixing ear 11 and the heat-conducting insulating colloid 5 form a mutual limiting tendency;

[0058] On one hand, the present embodiment adopts the design of sealing and filling the heat-conducting insulating colloid between the circuit board, the metal heat sink, the electrical insulating gasket and the accommodating cavity, so that the circuit board is physically isolated from the air in the metal shell, so that the water vapor in the metal shell is prevented from liquefying into water droplets and adhering to the circuit board, and the electrical conductive insulation effect is achieved. In addition, the circuit board, the metal heat sink, the electrical insulating gasket and the accommodating cavity can form a relatively stable structure by sealing and filling the heat-conducting insulating colloid, so as to avoid the structure shaking and causing collision.

[0059] On the other hand, the metal heat sink and the circuit board are fixedly assembled by bolts, so that the structure between the metal heat sink and the circuit board is relatively stable, and the metal heat sink is in contact with one side of the circuit board, and an electrical insulation gasket is provided between the other side of the circuit board and the metal shell, so that the metal shell and the circuit board achieve an electrical conductive insulation effect, and the heat on the circuit board can be efficiently conducted and dissipated into the metal shell through the metal heat sink, thereby improving the heat dissipation effect of the circuit board;

[0060] In addition, fixing ears are designed on both sides of the metal shell along the width direction of the metal shell. The fixing ears can be bent toward the side of the heat-conducting insulating colloid at a preferred amplitude of 90°, 135° or 150° until the fixing ears can abut against the heat-conducting insulating colloid, or until the fixing ears can be inserted into the heat-conducting insulating colloid. Either of the two options can enable the fixing ears and the heat-conducting insulating colloid to form a better card connection or mutual limiting effect, thereby solving the problem of the heat-conducting insulating colloid falling off or loosening from the semi-enclosed metal shell due to vibration during the transportation of the LED lamp, and avoiding the problem of the circuit board hitting the metal shell in the accommodating cavity of the metal shell.

[0061] like Figures 2 to 4 As shown, in the above embodiment, preferably, the fixing ear 11 is not in contact with the metal heat sink 2;

[0062] In this embodiment, since the metal heat sink has electrical properties, it is electrically connected to the negative output pole of the power supply, and the electrical property of the fixing ear is to be connected to the metal shell, and the metal shell is connected to the ground. Once the fixing ear contacts the metal heat sink, leakage occurs in the fixing ear or the metal shell, posing a hidden danger to the safety of the operators.

[0063] like Figure 1 As shown, in the above embodiment, preferably, the circuit board 3 is connected with an internal thread stud 32, the metal heat sink 2 is provided with a slot 21 at a position corresponding to the internal thread stud 32, and the circuit board 3 and the metal heat sink 2 are assembled and fixed with the cooperation of the internal thread stud 32, the slot 21 and the bolt 31;

[0064] In this embodiment, the structural design of internal threaded studs, slotted holes and bolts is adopted to realize the fixed assembly of the circuit board and the metal heat sink, which makes the production and manufacturing implementation easier and the structure is stable and firm.

[0065] like Figure 1 As shown, in the above embodiment, it is further preferred that the electronic components on the circuit board 3 are in contact with the outer bottom surface of the metal heat sink 2 through the thermal conductive silicone 6;

[0066] In this embodiment, the use of thermally conductive silicone facilitates the heat on the electronic components of the circuit board to be transferred to the metal heat sink for heat dissipation, and can form an electrical insulation effect with the metal heat sink. The thermally conductive silicone is more fully in contact and bonded to the bottom surface of the metal heat sink, thereby improving structural stability.

[0067] like Figures 1 to 4 As shown, in the above embodiment, preferably, along the width direction of the metal shell 1 , both sides of the metal shell 1 are provided with movable grooves 14 , and the fixing ears 11 are connected in the movable grooves 14 .

[0068] In this embodiment, the fixing ear is arranged in a sunken structure design in the movable groove, so that the fixing ear is easier to bend to abut against or insert the thermally conductive insulating colloid, thereby reducing structural interference of the fixing ear during the bending process.

[0069] like Figures 2 to 4 As shown, in the above embodiment, preferably, the side of the thermally conductive insulating colloid 5 away from the inner bottom surface of the metal shell 1 does not expose the outer bottom surface of the metal heat sink 2, or only exposes 0.5 to 1 mm of the outer bottom surface of the metal heat sink 2, which is the allowable filling thickness error range;

[0070] In this embodiment, since the thermally conductive insulating colloid has the functions of thermal conductivity, electrical insulation and sealing, it is in contact with the outer bottom surface of the metal heat sink, and can transfer the heat on the circuit board to the metal heat sink for efficient heat dissipation. Once the thermally conductive insulating colloid is exposed to the outer bottom surface of the metal heat sink and contacts or wraps with other parts of the metal heat sink, the overall thermal conductivity and heat dissipation effect of the metal heat sink will be reduced. It should be noted here that the thermal conductivity of the thermally conductive insulating colloid is inferior to that of the metal heat sink. However, in order to improve the rapid filling efficiency of the thermally conductive insulating colloid during the manufacturing process, the error of the filled thermally conductive insulating colloid exposed to the outer bottom surface of the metal heat sink is allowed to be 0.5 to 1 mm, which has little impact on the overall thermal conductivity and heat dissipation effect of the metal heat sink, and the advantages outweigh the disadvantages.

[0071] like Figures 2 to 4 As shown, in the above embodiment, preferably, along the width direction of the metal shell 1, at least two fixing ears 11 are provided on one side of the metal shell 1, and at least one fixing ear 11 is provided on the other side of the metal shell 1;

[0072] In this embodiment, fixing ears are provided on both sides of the metal shell, which can at least form a triangular structure, so that the heat-conducting insulating colloid in the metal shell can be inserted or abutted by the fixing ears on both sides, thereby achieving structural stability between the heat-conducting insulating colloid, the circuit board, the metal shell and other components;

[0073] It should be noted here that the fixing ears on both sides of the metal shell can all be in contact with or inserted into the thermally conductive insulating colloid, or a part of the fixing ears can be in contact with the thermally conductive insulating colloid and the other part of the fixing ears can be inserted into the thermally conductive insulating colloid. This can be implemented selectively according to actual needs and no excessive restrictions are made here.

[0074] like Figures 2 to 4 As shown, in the above embodiment, preferably, a spacing is provided between two or more fixing ears 11 located on the same side of the metal shell 1;

[0075] In this embodiment, by designing a physical distance between the fixing ears, the abutment and limiting range of the heat-conductive insulating colloid can be increased, thereby improving the abutment or limiting effect.

[0076] like Figures 2 to 4 As shown, in the above embodiment, it is further preferred that the end of the fixing ear 11 is an outwardly convex arc-shaped structure;

[0077] In this embodiment, the convex arc-shaped structure design of the end of the fixing ear ensures that the fixing ear will not scratch the worker's hands or limbs, nor puncture and damage the electronic components on the circuit board during the process of bending to abut against the thermally conductive insulating colloid or inserting into the thermally conductive insulating colloid.

[0078] like Figures 2 to 4 As shown, in the above embodiment, preferably, the mounting member 12 is provided with a mounting hole 121;

[0079] In this embodiment, by designing a mounting hole on the mounting piece, the metal shell can be fixed on the internal platform of the lamp housing by external bolts.

[0080] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure made using the contents of the specification and drawings of the present invention, or directly or indirectly used in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A circuit board insulation package, characterized in that: It comprises a semi-enclosed metal shell (1) and a metal heat sink (2); Along the width direction of the metal shell (1), fixing ears (11) are provided on both sides of the metal shell (1); Along the length direction of the metal shell (1), both ends of the metal shell (1) are provided with mounting parts (12); The metal shell (1) is provided with a receiving cavity (13), the receiving cavity (13) being capable of receiving a circuit board (3), the metal heat sink (2) and the circuit board (3) being fixedly assembled by means of bolts (31), the metal heat sink (2) being in contact with one side of the circuit board (3), and an electrical insulating gasket (4) being provided between the other side of the circuit board (3) and the metal shell (1); The circuit board (3), the metal heat sink (2), the electrical insulation gasket (4) and the accommodating cavity (13) are all sealed and filled with a heat-conducting insulating colloid (5); The fixing ear (11) can be bent toward the side of the heat-conducting insulating colloid (5) until the fixing ear (11) can abut against the heat-conducting insulating colloid (5); or, until the fixing ear (11) can be inserted into the heat-conducting insulating colloid (5), so that the fixing ear (11) and the heat-conducting insulating colloid (5) form a mutual limiting tendency.

2. The circuit board insulation package according to claim 1, characterized in that: The fixing ear (11) is not in contact with the metal heat sink (2).

3. The circuit board insulation package according to claim 1, characterized in that: The circuit board (3) is connected to an internal thread stud (32), the metal heat sink (2) is provided with a slot (21) at a position corresponding to the internal thread stud (32), and the circuit board (3) and the metal heat sink (2) are assembled and fixed in cooperation with the internal thread stud (32), the slot (21) and the bolt (31).

4. The circuit board insulation package according to claim 3, characterized in that: The electronic components on the circuit board (3) are in contact with the outer bottom surface of the metal heat sink (2) via the heat-conducting silica gel (6).

5. The circuit board insulation package according to claim 1, characterized in that: Along the width direction of the metal shell (1), both sides of the metal shell (1) are provided with movable grooves (14), and the fixing ears (11) are connected in the movable grooves (14).

6. The circuit board insulation package according to claim 1, characterized in that: The side of the heat-conductive insulating colloid (5) away from the inner bottom surface of the metal shell (1) does not expose the outer bottom surface of the metal heat sink (2).

7. The circuit board insulation package according to claim 1, characterized in that: Along the width direction of the metal shell (1), at least two fixing ears (11) are provided on one side of the metal shell (1), and at least one fixing ear (11) is provided on the other side of the metal shell (1).

8. The circuit board insulation package according to claim 7, characterized in that: A spacing is provided between two or more fixing ears (11) located on the same side of the metal shell (1).

9. The circuit board insulation package according to claim 7, characterized in that: The end of the fixing ear (11) is an outwardly convex arc-shaped structure.

10. The circuit board insulation package according to claim 1, characterized in that: The mounting piece (12) is provided with a mounting hole (121).

Images