An embedded computer heat dissipation device

Abstract

The utility model discloses an embedded computer heat abstractor relates to heat abstractor field, including fan shell, turbofan and turbofan blade, the turbofan movable mounting is in the inside of fan shell, and turbofan blade fixed mounting is in the outside of turbofan blade, the both sides integration of first fin and second fin has in the outside of fan shell, and first fin is located one side at second fin, the top of fan shell is provided with fin slot. The utility model air is driven under the turbofan blade and penetrates fin, realizes forced convection heat dissipation, and the heat dissipation efficiency is greatly promoted, and the fin slot with the heat dissipation fin of annular design allows heat conduction ring and heat conduction copper pipe to install at any angle, adapts to the narrow or irregular space layout of embedded computer, and the compatibility of promoting device is compatible, and the heat conduction ring is detachable connection through the installation buckle and fan shell, and the heat dissipation assembly part can be independently disassembled, and is convenient for maintenance or replacement.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation devices, and in particular to an embedded computer heat dissipation device. Background Technology

[0002] Embedded computer cooling devices are devices that are embedded in the heat source of a computer to dissipate heat and cool it down. With the rapid development of embedded computer technology, its processing power and integration have been continuously improved, and the heat generated has also increased dramatically. However, the application environment of embedded systems usually has strict space size restrictions, which makes traditional heat dissipation solutions face huge challenges.

[0003] When using the device, it is very difficult to increase the heat dissipation area in a very limited space. Ordinary heat sinks have fixed fin arrangements and limited airflow channels, making it difficult to make full use of forced air cooling for efficient heat exchange, resulting in low heat dissipation efficiency and easy to cause the device to overheat, reduce frequency or malfunction. At the same time, embedded devices have diverse internal structures, and the heat-generating components may be located in small, remote or irregular areas. Traditional integrated fixed heat dissipation structures are difficult to adjust the angle or direction flexibly, cannot effectively contact the heat source or avoid spatial obstacles, and have poor compatibility. Furthermore, embedded devices are usually highly integrated and complex to disassemble and assemble. Once the heat dissipation module experiences performance degradation or damage, traditional solutions often require complete disassembly or even replacement of the entire heat dissipation system, resulting in long maintenance cycles, high difficulty and high cost. Summary of the Invention

[0004] The main objective of this invention is to provide an embedded computer heat dissipation device that can effectively solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] An embedded computer heat dissipation device includes a fan housing, a turbofan fan, and turbofan blades. The turbofan fan is movably installed inside the fan housing, and the turbofan blades are fixedly installed outside the turbofan fan. The outer sides of the fan housing are integrally formed with a first fin and a second fin, with the first fin located on one side of the second fin. A fin through-slot is formed on the top surface of the fan housing. A heat-conducting ring is provided at the upper end of the fan housing, and a heat dissipation fin is integrally formed at the lower end of the heat-conducting ring. A heat-conducting copper pipe is fixedly installed on the outer side of the heat-conducting ring, and a heat-conducting fin structure is provided at the end of the heat-conducting copper pipe away from the heat-conducting ring.

[0007] As a further embodiment of this utility model, both the first fin and the second fin are connected to the inside of the fan housing, and the turbofan fan and turbofan blades penetrate the top surface of the fan housing.

[0008] As a further embodiment of this utility model, the top of the heat-conducting ring is fitted with multiple mounting clips, which are fixedly connected to the upper end of the fan housing by screws.

[0009] As a further embodiment of this utility model, both the fin slots and the heat dissipation fins are arranged in a circular shape, with the heat dissipation fins passing through the fin slots to the inside of the fan housing, and the heat dissipation fins located on the outside of the turbine blades.

[0010] As a further embodiment of this utility model, the heat-conducting sheet structure includes a bonding plate, a fixing frame, and connecting rivets. The bonding plate is installed at the bottom of the heat-conducting copper tube, the fixing frame is fixedly installed at the top of the bonding plate, and the connecting rivets are fixedly installed at the four corners of the bonding plate.

[0011] As a further embodiment of this utility model, the heat-conducting copper tube is embedded into the top surface of the bonding plate and welded and fixed, the fixing frame is sleeved on the outside of the heat-conducting copper tube, and a heat-conducting patch is embedded in the ground of the bonding plate, and the heat-conducting patch is fixedly connected to the heat-conducting copper tube.

[0012] Compared with the prior art, this utility model has the following beneficial effects: By using the first and second fins integrally formed on both sides of the fan housing, combined with the airflow channel of the internal turbofan fan, the heat dissipation surface area is significantly increased. Air passes through the fins under the drive of the turbofan blades, realizing forced convection heat dissipation and greatly improving heat dissipation efficiency. The annular fin slots and heat dissipation fins allow the heat conduction ring and heat conduction copper pipe to be installed at any angle, adapting to the narrow or irregular space layout of embedded computers and improving device compatibility. At the same time, the heat conduction ring is detachably connected to the fan housing through the mounting buckle, and the heat dissipation components can be independently disassembled and installed, which is convenient for maintenance or replacement and reduces operation and maintenance costs. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of an embedded computer heat dissipation device according to the present invention.

[0014] Figure 2 This is an exploded view of an embedded computer heat dissipation device according to the present invention;

[0015] Figure 3 This is a bottom view of the heat-conducting ring in an embedded computer heat dissipation device according to this utility model.

[0016] In the diagram: 1. Fan housing; 2. First fin; 3. Second fin; 4. Turbine fan; 5. Turbine fan blade; 6. Fin slot; 7. Heat-conducting ring; 8. Heat dissipation fin; 9. Mounting clip; 10. Heat-conducting copper pipe; 11. Heat-conducting plate structure; 12. Adhesive plate; 13. Fixing frame; 14. Connecting rivet; 15. Heat-conducting patch. Detailed Implementation

[0017] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0018] like Figures 1-3 As shown, an embedded computer heat dissipation device is described; please refer to it carefully. Figures 1-3 The fan housing includes a fan casing 1, a turbofan fan 4, and turbofan blades 5. The turbofan fan 4 is movably installed inside the fan casing 1, and the turbofan blades 5 are fixedly installed outside the turbofan fan 4. The outer sides of the fan casing 1 are integrally formed with a first fin 2 and a second fin 3, with the first fin 2 located on one side of the second fin 3. The top surface of the fan casing 1 is provided with a fin through groove 6. A heat-conducting ring 7 is provided at the upper end of the fan casing 1, and a heat dissipation fin 8 is integrally formed at the lower end of the heat-conducting ring 7. A heat-conducting copper pipe 10 is fixedly installed on the outer side of the heat-conducting ring 7, and a heat-conducting plate structure 11 is provided at the end of the heat-conducting copper pipe 10 away from the heat-conducting ring 7.

[0019] Please refer to this carefully. Figure 1 and Figure 2 The first fin 2 and the second fin 3 are both connected to the inside of the fan housing 1, and the turbofan fan 4 and the turbofan blades 5 penetrate the top surface of the fan housing 1.

[0020] Specifically, when the turbofan fan 4 and the turbofan blades 5 are running and rotating, air is drawn in. The air passes through the fan housing 1 and is discharged from the first fin 2 and the second fin 3. At the same time, the air passes through the heat dissipation fins 8 to dissipate heat.

[0021] Please refer to this carefully. Figure 2 and Figure 3 The top of the heat-conducting ring 7 is fitted with multiple mounting clips 9, which are fixedly connected to the upper end of the fan housing 1 by screws.

[0022] Specifically, the heat-conducting ring 7 is fixedly installed on the upper end of the fan housing 1 by the mounting clip 9, while the heat dissipation fins 8 pass through the fin grooves 6 to the inside of the fan housing 1.

[0023] Please refer to this carefully. Figure 2 and Figure 3 Both the fin slot 6 and the heat dissipation fin 8 are arranged in a circular shape. The heat dissipation fin 8 passes through the fin slot 6 to the inside of the fan housing 1. The heat dissipation fin 8 is located on the outside of the turbine blade 5.

[0024] Specifically, the fin slot 6 and the heat dissipation fin 8 are arranged in a ring shape, allowing the heat dissipation fin 8 to pass through the fin slot 6 at any angle for connection, thereby enabling the heat conduction ring 7 and the heat conduction copper pipe 10 to be installed at any angle.

[0025] Please refer to this carefully. Figure 1 and Figure 3The heat-conducting plate structure 11 includes a bonding plate 12, a fixing frame 13, and connecting rivets 14. The bonding plate 12 is installed at the bottom of the heat-conducting copper pipe 10, the fixing frame 13 is fixedly installed at the upper end of the bonding plate 12, and the connecting rivets 14 are fixedly installed at the four corners of the bonding plate 12.

[0026] Please refer to this carefully. Figures 1-3 The heat-conducting copper pipe 10 is embedded into the top surface of the bonding plate 12 and welded and fixed. The fixing frame 13 is sleeved on the outside of the heat-conducting copper pipe 10. The heat-conducting patch 15 is embedded in the ground of the bonding plate 12 and is fixedly connected to the heat-conducting copper pipe 10.

[0027] Specifically, the bonding plate 12 is attached to the heat-generating end of the computer, and heat is transferred from the thermal pad 15 to the thermal copper pipe 10, and then the thermal copper pipe 10 transfers the heat to the thermal ring 7 and the heat dissipation fins 8.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An embedded computer heat dissipation device, comprising a fan housing (1), a turbofan fan (4), and turbofan blades (5), wherein the turbofan fan (4) is movably installed on the inner side of the fan housing (1), and the turbofan blades (5) are fixedly installed on the outer side of the turbofan fan (4), characterized in that: The outer sides of the fan housing (1) are integrally formed with a first fin (2) and a second fin (3), and the first fin (2) is located on one side of the second fin (3). The top surface of the fan housing (1) is provided with a fin through groove (6). A heat-conducting ring (7) is provided at the upper end of the fan housing (1). A heat dissipation fin (8) is integrally formed at the lower end of the heat-conducting ring (7). A heat-conducting copper pipe (10) is fixedly installed on the outer side of the heat-conducting ring (7). A heat-conducting plate structure (11) is provided at the end of the heat-conducting copper pipe (10) away from the heat-conducting ring (7).

2. The embedded computer heat dissipation device according to claim 1, characterized in that: The first fin (2) and the second fin (3) are both connected to the inside of the fan housing (1), and the turbofan fan (4) and the turbofan blades (5) penetrate the top surface of the fan housing (1).

3. The embedded computer heat dissipation device according to claim 1, characterized in that: The top of the heat-conducting ring (7) is fitted with multiple mounting clips (9), which are fixedly connected to the upper end of the fan housing (1) by screws.

4. The embedded computer heat dissipation device according to claim 1, characterized in that: The fin slots (6) and heat dissipation fins (8) are both arranged in a circular shape. The heat dissipation fins (8) pass through the fin slots (6) to the inside of the fan housing (1). The heat dissipation fins (8) are located on the outside of the turbine blades (5).

5. An embedded computer heat dissipation device according to claim 1, characterized in that: The heat-conducting sheet structure (11) includes a bonding plate (12), a fixing frame (13), and connecting rivets (14). The bonding plate (12) is installed at the bottom of the heat-conducting copper tube (10), the fixing frame (13) is fixedly installed at the upper end of the bonding plate (12), and the connecting rivets (14) are fixedly installed at the four corners of the bonding plate (12).

6. An embedded computer heat dissipation device according to claim 5, characterized in that: The heat-conducting copper tube (10) is embedded into the top surface of the bonding plate (12) and welded and fixed. The fixing frame (13) is sleeved on the outside of the heat-conducting copper tube (10). A heat-conducting patch (15) is embedded in the ground of the bonding plate (12). The heat-conducting patch (15) is fixedly connected to the heat-conducting copper tube (10).

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