A heat dissipation assembly based on an integrated air duct
By using the V-shaped base, heat-conducting plate, and multi-layer fin channel design of the integrated air duct heat dissipation component, the problem of insufficient heat dissipation of traditional heat dissipation components under high heat load is solved, achieving more efficient heat dissipation and air convection, which is suitable for electronic devices with limited space.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN WINASIA ELECTRONIC METALS LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-06-26
AI Technical Summary
Traditional heat dissipation components are ineffective under high heat load conditions, have limited heat dissipation area, and are difficult to effectively disperse heat.
It adopts an integrated airflow-type heat dissipation component, including a V-shaped heat dissipation base, heat conduction plate, multi-layer heat dissipation fins and through heat dissipation channel, combined with multi-faceted heat dissipation structure and multi-directional fin design, to increase the heat dissipation area and air convection effect.
It improves heat dissipation efficiency, ensures smooth airflow, reduces air resistance, and significantly enhances heat dissipation, making it particularly suitable for space-constrained electronic devices.
Smart Images
Figure CN224417261U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radiator technology, and in particular to a heat dissipation component based on an integrated air duct. Background Technology
[0002] In modern electronic devices, heat dissipation is a crucial factor affecting device performance and lifespan. As the integration of electronic components continues to increase, so does the heat generated. Therefore, efficient heat dissipation technology has become key to ensuring the stable operation of electronic devices.
[0003] Traditional heat dissipation components typically have heat dissipation fins on only one side of the heat dissipation base. While this structure can provide some heat dissipation, the limited heat dissipation area results in less than ideal cooling performance, especially under high heat load conditions. Utility Model Content
[0004] Therefore, the purpose of this utility model is to provide a heat dissipation component with good heat dissipation effect based on an integrated air duct.
[0005] The present invention adopts the following technical solution:
[0006] A heat dissipation component based on an integrated air duct includes a heat dissipation base, a first heat dissipation fin disposed on the heat dissipation base, a second heat dissipation fin and a third heat dissipation fin respectively disposed on both sides of the heat dissipation base, and a heat-conducting plate mounted on the heat dissipation base; a mounting groove is formed on the side of the heat dissipation base away from the first heat dissipation fin, and the heat-conducting plate is mounted on the mounting groove; the cross-sectional shape of the heat dissipation base is V-shaped; the heat dissipation component based on an integrated air duct also includes a heat dissipation channel disposed through the heat dissipation base.
[0007] Furthermore, the heat dissipation base also includes a first substrate, a second substrate connected to one side of the first substrate for mounting the second heat dissipation fin, and a third substrate connected to the other side of the first substrate for mounting the third heat dissipation fin; the first heat dissipation fin is respectively mounted on the first substrate, the second substrate, and the third substrate.
[0008] Furthermore, the second heat dissipation fin is mounted on the second substrate on the side opposite to the first heat dissipation fin; the third heat dissipation fin is mounted on the third substrate on the side opposite to the first heat dissipation fin.
[0009] Furthermore, the heat dissipation base also includes a first side plate connected to the second substrate and a first side fin mounted on the first side plate; the first side plate is disposed on the side close to the first substrate; the first side fin is mounted on the first side plate on the side opposite to the second heat dissipation fin.
[0010] Furthermore, the heat dissipation base also includes a second side plate connected to the third substrate and a second side fin mounted on the second side plate; the second side plate is disposed on the side close to the first substrate; the second side fin is mounted on the side of the second side plate opposite to the third heat dissipation fin.
[0011] Furthermore, the heat dissipation base also includes a fixing plate connected to the free ends of the first side plate and the second side plate respectively, and a connecting hole through the fixing plate for connecting with the workpiece.
[0012] Furthermore, the heat dissipation channel includes a connection channel disposed on the first substrate, a first channel disposed on the second substrate, and a second channel disposed on the third substrate; the first channel and the second channel are connected through the connection channel.
[0013] Furthermore, the first channel is disposed on the second substrate between the first heat dissipation fin and the second heat dissipation fin; the second channel is disposed on the third substrate between the first heat dissipation fin and the third heat dissipation fin.
[0014] Furthermore, the first channel on the side opposite to the connecting channel is through-connected; the second channel on the side opposite to the connecting channel is through-connected.
[0015] The beneficial effects of this utility model are as follows:
[0016] The heat dissipation component based on an integrated air duct in this utility model has a V-shaped cross-section of the heat dissipation base, which increases the heat dissipation area and improves the heat dispersion effect, helping to conduct heat away from the heat source more quickly. The first heat dissipation fin, the second heat dissipation fin, and the third heat dissipation fin are respectively arranged at different positions on the heat dissipation base, increasing the heat dissipation surface area, so that heat can be quickly dissipated into the surrounding environment through air convection. Attached Figure Description
[0017] Figure 1 This is a three-dimensional schematic diagram of a heat dissipation component based on an integrated air duct according to an embodiment of the present invention;
[0018] Figure 2 for Figure 1 A front view of a heat dissipation component based on an integrated airflow design;
[0019] Figure 3 for Figure 1 A front cross-sectional view of a heat dissipation component based on an integrated air duct;
[0020] Figure 4 for Figure 1 An exploded view of a heat dissipation component based on an integrated airflow design.
[0021] Reference numerals: 10, heat dissipation base; 20, first heat dissipation fin; 30, second heat dissipation fin; 40, third heat dissipation fin; 50, heat-conducting plate; 11, mounting groove; 60, heat dissipation channel; 12, first substrate; 13, second substrate; 14, third substrate; 15, first side plate; 16, first side fin; 17, second side plate; 18, second side fin; 19, fixing plate; 190, connecting hole; 61, connecting channel; 62, first channel; 63, second channel. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] In the description of this utility model, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0025] Please see Figures 1 to 4This invention provides a heat dissipation component based on an integrated air duct, comprising a heat dissipation base 10, a first heat dissipation fin 20 disposed on the heat dissipation base 10, a second heat dissipation fin 30 and a third heat dissipation fin 40 respectively disposed on both sides of the heat dissipation base 10, and a heat-conducting plate 50 mounted on the heat dissipation base 10; an installation groove 11 is formed on the side of the heat dissipation base 10 away from the first heat dissipation fin, and the heat-conducting plate 50 is mounted on the installation groove 11; the cross-sectional shape of the heat dissipation base 10 is V-shaped; the heat dissipation component based on an integrated air duct further includes a heat dissipation channel 60 that runs through the heat dissipation base 10.
[0026] The working principle of this utility model's integrated air duct-based heat dissipation component is as follows: The heat-conducting plate 50 is in direct contact with the workpiece, rapidly transferring heat generated by the heat source to the heat-conducting plate 50; the heat-conducting plate 50 transfers heat to the heat dissipation base 10; due to the V-shaped cross-section of the heat dissipation base 10, it helps increase the heat dissipation area and improve heat dispersion; the heat dissipation channel 60 inside the heat dissipation base 10 allows airflow, further accelerating heat conduction and dispersion; the first heat dissipation fin 20, the second heat dissipation fin 30, and the third heat dissipation fin 40 are respectively disposed at different positions on the heat dissipation base 10; the heat dissipation fins increase the heat dissipation surface area, enabling heat to be rapidly dissipated through air convection. The heat dissipates quickly into the surrounding environment; ensuring smooth airflow through the heat dissipation base 10 and its internal heat dissipation channel 60; placing the second heat dissipation fin 30 and the third heat dissipation fin 40 on both sides of the heat dissipation base 10 can further improve the space utilization of the heat dissipation base 10 and enhance its heat dissipation effect; the heat-conducting plate 50 is fixed to the heat dissipation base 10 through the mounting groove 11, ensuring good contact and efficient heat conduction; the structure of the mounting groove 11 can also provide additional structural support to ensure the stability and reliability of the heat dissipation component; in this embodiment, the heat dissipation channel 60 can be structured in various forms, such as straight-through or tortuous, to optimize the airflow path and heat dissipation effect. In this embodiment, the heat dissipation component based on the integrated air duct type is an aluminum structure formed by processing aluminum alloy.
[0027] Compared to existing technologies, the heat dissipation component based on an integrated air duct in this invention has a heat-conducting plate 50 in direct contact with the workpiece, ensuring efficient heat conduction and rapidly transferring the heat generated by the heat source to the heat dissipation base 10. The V-shaped cross-section of the heat dissipation base 10 increases the heat dissipation area and improves the heat dispersion effect, helping to conduct heat away from the heat source more quickly. The heat dissipation channel 60 inside the heat dissipation base 10 allows airflow, further accelerating heat conduction and dispersion. This not only improves heat dissipation efficiency but also ensures smooth airflow and reduces air resistance. The first heat dissipation fin 20, the second heat dissipation fin 30, and the third heat dissipation fin 40 are respectively located at different positions on the heat dissipation base 10, increasing the heat dissipation surface area and allowing heat to be quickly dissipated into the surrounding environment through air convection. This multi-directional heat dissipation structure further improves the heat dissipation effect.
[0028] Please refer to Figure 1 and Figure 2 The heat dissipation base 10 further includes a first substrate 12, a second substrate 13 connected to one side of the first substrate 12 for mounting the second heat dissipation fin 30, and a third substrate 14 connected to the other side of the first substrate 12 for mounting the third heat dissipation fin 40; the first heat dissipation fin 20 is respectively mounted on the first substrate 12, the second substrate 13, and the third substrate 14. By dividing the heat dissipation base 10 into a first substrate 12, a second substrate 13, and a third substrate 14, heat dissipation fins can be installed on each substrate, thereby significantly increasing the heat dissipation area and more effectively dispersing heat, thus improving heat dissipation efficiency. The first heat dissipation fins 20 are respectively installed on the first substrate 12, the second substrate 13, and the third substrate 14, forming a multi-faceted heat dissipation structure. This multi-faceted heat dissipation structure can ensure that heat is quickly dissipated from multiple directions, further improving the heat dissipation effect. The second substrate 13 and the third substrate 14 are respectively connected to both sides of the first substrate 12, making the overall structure of the heat dissipation base 10 more compact and making better use of limited space, especially suitable for use in space-constrained applications. The connection structure of the first substrate 12, the second substrate 13, and the third substrate 14 can enhance the overall structural stability of the heat dissipation base 10. This helps to reduce structural deformation caused by thermal expansion and vibration, ensuring the reliability and stability of the heat dissipation component.
[0029] The second heat dissipation fin 30 is mounted on a second substrate 13 on the side opposite to the first heat dissipation fin 20; the third heat dissipation fin 40 is mounted on a third substrate 14 on the side opposite to the first heat dissipation fin 20. By mounting the second substrate 13 and the third substrate 14 on both sides of the heat dissipation base 10 respectively, and setting the second heat dissipation fin 30 and the third heat dissipation fin 40 on these substrates, the heat dissipation area can be significantly increased. This helps to more effectively disperse and dissipate heat, improving the overall heat dissipation efficiency; the structure of the second substrate 13 and the third substrate 14 allows the heat dissipation fins to be distributed in different directions, forming multiple airflow paths; this ensures that airflow can pass through the heat dissipation component from multiple directions, further improving the uniformity of airflow and the heat dissipation effect; it makes full use of the space on both sides of the heat dissipation base 10, making the structure of the heat dissipation component more compact and reasonable; it not only improves the space utilization rate, but also makes the heat dissipation component more suitable for installation in space-constrained electronic devices; by setting heat dissipation fins on different substrates, multi-point heat conduction can be achieved. This not only improves the heat transfer efficiency from the heat dissipation base 10 to the heat dissipation fins, but also reduces the problem of local heat accumulation.
[0030] The heat dissipation base 10 also includes a first side plate 15 connected to the second substrate 13 and a first side fin 16 mounted on the first side plate 15. The first side plate 15 is disposed on the side closer to the first substrate 12. The first side fin 16 is mounted on the side of the first side plate 15 opposite to the second heat dissipation fin 30. By setting the first side fin 16 on the first side plate 15, heat dissipation is no longer limited to a plane but extended to three-dimensional space. This multi-directional heat dissipation structure can more effectively dissipate heat into the surrounding environment, improving the overall heat dissipation efficiency. The addition of the first side plate 15 and the first side fin 16 significantly increases the surface area of the heat dissipation component. The larger heat dissipation area helps to dissipate heat more quickly through air convection, improving the heat dissipation effect. The structure of the first side plate 15 and the first side fin 16 can form additional airflow paths, allowing airflow to pass through the heat dissipation component from multiple directions. This not only improves the uniformity and flow of airflow but also helps to reduce airflow resistance, further improving heat dissipation efficiency. This structure makes full use of the space on the side of the heat dissipation base 10, making the overall structure of the heat dissipation component more compact and reasonable. This helps achieve efficient heat dissipation in limited spaces, making it particularly suitable for space-constrained electronic devices.
[0031] The heat dissipation base 10 also includes a second side plate 17 connected to the third substrate 14 and a second side fin 18 mounted on the second side plate 17; the second side plate 17 is disposed on the side closer to the first substrate 12; the second side fin 18 is mounted on the side of the second side plate 17 opposite to the third heat dissipation fin 40. By providing the second side fin 18 on the second side plate 17, heat dissipation is no longer limited to a plane, but extends to multiple directions. This multi-directional heat dissipation structure can dissipate heat to the surrounding environment more comprehensively, improving the overall heat dissipation efficiency; the addition of the second side plate 17 and the second side fin 18 significantly increases the surface area of the heat dissipation component; the larger heat dissipation area helps to dissipate heat more quickly through air convection, improving the heat dissipation effect; the structure of the second side plate 17 and the second side fin 18 can form more airflow paths, allowing airflow to pass through the heat dissipation component from multiple directions. This not only improves the uniformity and flow of airflow, but also helps to reduce airflow resistance and further improve heat dissipation efficiency. This structure makes full use of all the side space of the heat dissipation base 10, making the overall structure of the heat dissipation component more compact and reasonable. It helps to achieve efficient heat dissipation in a limited space, and is especially suitable for space-constrained electronic devices.
[0032] The heat dissipation base 10 also includes a fixing plate 19 connected to the free ends of the first side plate 15 and the second side plate 17 respectively, and a connecting hole 190 through the fixing plate 19 for connecting with the workpiece. In this embodiment, the connecting hole 190 is a threaded hole. The use of the fixing plate 19 can connect the first side plate 15 and the second side plate 17 together to form a more stable structure; it helps to improve the overall structural strength of the heat dissipation assembly and ensures that it will not deform or loosen under high heat load and high vibration environment; the connecting hole 190 on the fixing plate 19 makes it easier for the heat dissipation assembly to be connected with the workpiece; this structure simplifies the installation process, reduces installation time and cost, and is particularly suitable for mass production and rapid assembly; the setting of the fixing plate 19 and the connecting hole 190 can ensure that the contact between the heat dissipation assembly and the workpiece is more stable and reliable. This helps improve heat transfer efficiency, ensuring that heat can be quickly transferred from the workpiece to the heat dissipation base 10; the structure of the fixing plate 19 can ensure that all parts of the heat dissipation base 10 (including the side plate and side fins) are in a stable state, thereby improving the uniformity and heat dissipation effect of the entire heat dissipation assembly; it helps to avoid local overheating and improve the overall heat dissipation performance.
[0033] Please refer to Figure 3 and Figure 4The heat dissipation channel 60 includes a connecting channel 61 disposed on the first substrate 12, a first channel 62 disposed on the second substrate 13, and a second channel 63 disposed on the third substrate 14; the first channel 62 and the second channel 63 are connected through the connecting channel 61. By setting heat dissipation channels 60 on different substrates and connecting these channels through the connecting channel 61, multi-path heat dissipation can be formed; this helps to evenly distribute and transfer heat from different directions, improving overall heat dissipation efficiency; the multi-channel structure can reduce thermal resistance and improve heat conduction efficiency; the presence of the connecting channel 61 ensures that heat can be quickly transferred between different substrates, avoiding the formation of local hot spots, making the entire heat dissipation system more efficient; the multi-channel structure can form multiple airflow paths, allowing airflow to pass through the heat dissipation component from multiple directions; this not only improves the uniformity and flowability of airflow, but also helps to reduce airflow resistance, further improving the heat dissipation effect; the use of the connecting channel 61 can enhance the connection between different substrates, making the structure of the entire heat dissipation base 10 more stable; and it helps to maintain the reliability of the heat dissipation component under high heat load and high vibration environments.
[0034] The first channel 62 is disposed on the second substrate 13 between the first and second heat dissipation fins; the second channel 63 is disposed on the third substrate 14 between the first and third heat dissipation fins. By providing the first channel 62 between the first and second heat dissipation fins and the second channel 63 between the first and third heat dissipation fins, multiple heat dissipation paths can be formed. This helps to evenly distribute and transfer heat from multiple directions, improving overall heat dissipation efficiency; it can reduce thermal resistance and improve heat conduction efficiency; the presence of the first channel 62 and the second channel 63 ensures that heat can be quickly transferred from the heat source to the heat dissipation fins, avoiding the formation of local hot spots, making the entire heat dissipation system more efficient; the multi-channel structure can form multiple airflow paths, allowing airflow to pass through the heat dissipation component from multiple directions; it not only improves the uniformity and flow of airflow, but also helps to reduce airflow resistance, further improving the heat dissipation effect; the channel arrangement can enhance the connection between different substrates and fins, making the structure of the entire heat dissipation base 10 more stable; it helps to maintain the reliability of the heat dissipation component under high heat load and high vibration environments.
[0035] A first channel 62 and a second channel 63, both located opposite to the connecting channel 61, are connected. The connected first and second channels 62 and 63 create a smoother airflow path, improving air circulation efficiency and accelerating heat convection, thus enhancing overall heat dissipation. The connected channels reduce airflow obstruction, allowing air to pass more smoothly through the heat dissipation base 10. This not only improves airflow uniformity and flow but also reduces the decrease in heat dissipation efficiency caused by airflow resistance. The connected channel structure facilitates uniform heat distribution within the heat dissipation base 10, preventing localized overheating and resulting in a more uniform temperature distribution throughout the base, improving heat dissipation efficiency and equipment reliability. Furthermore, the connected channel structure increases the heat dissipation surface area of the heat dissipation base 10. A larger heat dissipation area helps to dissipate heat more quickly through air convection, improving the heat dissipation effect.
[0036] The above description merely illustrates the preferred technical solution of this utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.
Claims
1. A heat dissipation component based on an integrated air duct, characterized in that, The device includes a heat dissipation base, a first heat dissipation fin disposed on the heat dissipation base, a second heat dissipation fin and a third heat dissipation fin disposed on both sides of the heat dissipation base, and a heat-conducting plate mounted on the heat dissipation base; an installation groove is formed on the side of the heat dissipation base away from the first heat dissipation fin, and the heat-conducting plate is mounted on the installation groove; the cross-sectional shape of the heat dissipation base is V-shaped; the heat dissipation component based on an integrated air duct also includes a heat dissipation channel disposed through the heat dissipation base.
2. The heat dissipation assembly based on an integrated air duct as described in claim 1, characterized in that, The heat dissipation base further includes a first substrate, a second substrate connected to one side of the first substrate for mounting the second heat dissipation fin, and a third substrate connected to the other side of the first substrate for mounting the third heat dissipation fin; the first heat dissipation fin is respectively mounted on the first substrate, the second substrate, and the third substrate.
3. The heat dissipation component based on an integrated air duct as described in claim 2, characterized in that, The second heat dissipation fin is mounted on the second substrate on the side opposite to the first heat dissipation fin; the third heat dissipation fin is mounted on the third substrate on the side opposite to the first heat dissipation fin.
4. The heat dissipation component based on an integrated air duct as described in claim 3, characterized in that, The heat dissipation base further includes a first side plate connected to the second substrate and a first side fin mounted on the first side plate; the first side plate is disposed on the side close to the first substrate; the first side fin is mounted on the first side plate on the side opposite to the second heat dissipation fin.
5. The heat dissipation component based on an integrated air duct as described in claim 4, characterized in that, The heat dissipation base further includes a second side plate connected to the third substrate and a second side fin mounted on the second side plate; the second side plate is disposed on the side close to the first substrate; the second side fin is mounted on the second side plate on the side opposite to the third heat dissipation fin.
6. The heat dissipation component based on an integrated air duct as described in claim 5, characterized in that, The heat dissipation base also includes a fixing plate connected to the free ends of the first side plate and the second side plate respectively, and a connecting hole through the fixing plate for connecting with the workpiece.
7. The heat dissipation component based on an integrated air duct as described in claim 2, characterized in that, The heat dissipation channel includes a connection channel disposed on the first substrate, a first channel disposed on the second substrate, and a second channel disposed on the third substrate; the first channel and the second channel are connected through the connection channel.
8. The heat dissipation component based on an integrated air duct as described in claim 7, characterized in that, The first channel is disposed on the second substrate between the first heat dissipation fin and the second heat dissipation fin; the second channel is disposed on the third substrate between the first heat dissipation fin and the third heat dissipation fin.
9. The heat dissipation component based on an integrated air duct as described in claim 8, characterized in that, The first channel is arranged through the side opposite to the connecting channel; the second channel is arranged through the side opposite to the connecting channel.