Packaging device with multi-faceted heat dissipation function
By introducing a multi-faceted liquid cooling structure into the packaged device, the problem of insufficient chip heat dissipation is solved, achieving efficient heat dissipation and stable operation, and reducing manufacturing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JCET GROUP CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-23
AI Technical Summary
The heat dissipation performance of existing packaged devices is insufficient, which makes the chip prone to overheating and burning under high power consumption, affecting the stable operation of the chip.
The multi-faceted liquid cooling structure includes an upper cover, a lower support, and heat dissipation channels, forming heat dissipation channels distributed on the top and sides of the chip. It utilizes coolant for heat dissipation, increases the heat dissipation area, shortens the distance between the coolant and the chip, and simplifies the manufacturing process.
It improves the chip's heat dissipation performance, avoids burnout caused by overheating, simplifies the manufacturing process, and reduces manufacturing costs.
Smart Images
Figure CN224402097U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a packaged device with multi-faceted heat dissipation function. Background Technology
[0002] Chips are crucial components in electronic devices, significantly impacting their performance. As electronic devices become increasingly functional, the demands on chip performance rise, leading to increased power consumption. This increased power consumption exacerbates the problem of chip overheating, which can cause chip burnout. Therefore, heat dissipation has become one of the bottlenecks restricting chip development.
[0003] When a chip doesn't reach 100% efficiency, power consumption is transferred as heat. The purpose of heat dissipation design in packaged devices is to ensure the chip has a low thermal resistance, increasing heat flow and maintaining the chip's operating temperature within an appropriate range to prevent burnout. Currently, heat in packaged devices is mainly generated at the interface, transferred upwards via the molding compound to the chip surface, and finally dissipated into the air through the heat sink. However, as chip functionality increases, the heat generated during operation also increases. Relying solely on heat sinks to dissipate heat is insufficient to effectively remove the heat generated by the chip, thus still affecting chip performance and, in severe cases, even causing burnout.
[0004] Therefore, improving the heat dissipation performance of chips in packaged devices, maintaining stable operation of chips within packaged devices, and preventing chips from burning out due to excessive temperature are urgent technical problems that need to be solved. Summary of the Invention
[0005] This invention provides a packaged device with multi-faceted heat dissipation function, which is used to improve the heat dissipation performance of the chip in the packaged device, maintain the stable operation of the chip in the packaged device, and avoid the chip burning out due to excessive temperature.
[0006] According to some embodiments, this utility model provides a packaged device with multi-faceted heat dissipation function, comprising:
[0007] The substrate includes a front side and a back side that are distributed opposite to each other along a first direction;
[0008] A chip is mounted on the front side of the substrate, the chip including a first surface facing the substrate and a second surface opposite to the first surface along the first direction;
[0009] A multi-faceted liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The upper cover is located above the chip along the first direction. The lower support is located at least on the side of the chip and is perpendicularly connected to the end of the upper cover. The upper cover, the lower support, and the chip enclose the heat dissipation channel, which is used to contain coolant.
[0010] In some embodiments, the upper cover is a metal cover, and the lower support is a metal support.
[0011] In some embodiments, the multi-faceted liquid cooling structure further includes an inlet and an outlet formed by the upper cover and the lower support, and the heat dissipation channel is connected to both the inlet and the outlet.
[0012] In some embodiments, the heat dissipation channel includes:
[0013] A top heat dissipation channel is located above the chip, and the top heat dissipation channel is formed by at least the chip and the top cover;
[0014] Side heat dissipation channels are distributed around the side of the chip and communicate with the top heat dissipation channel. The side heat dissipation channels are formed by the lower support member and the chip.
[0015] In some embodiments, the surface of the top cover facing the chip has a central cavity and two end cavities distributed at opposite ends of the central cavity along a second direction, the central cavity communicating with the end cavities, and the second direction being parallel to the front side of the substrate;
[0016] The central cavity and the chip enclose each other to form the top heat dissipation channel, and the two end cavities enclose each other with the lower support to form the liquid inlet and the liquid outlet, respectively.
[0017] In some embodiments, the width of the end cavity is smaller than the width of the middle cavity.
[0018] In some embodiments, the coolant is deionized water.
[0019] In some embodiments, it also includes:
[0020] A first barrier layer is applied to the second surface of the chip to prevent the coolant from penetrating the chip.
[0021] In some embodiments, the first barrier layer is a metal material layer.
[0022] In some embodiments, the lower support is located only on the side of the chip, and the side heat dissipation channel extends along the first direction to the front surface of the substrate; the packaged device with multi-faceted heat dissipation function further includes:
[0023] The second barrier layer is attached to the substrate and located at the bottom of the side heat dissipation channel. The second barrier layer is used to prevent the coolant from overflowing from the side heat dissipation channel.
[0024] In some embodiments, the second barrier layer is a waterproof adhesive layer.
[0025] In some embodiments, the second surface of the chip has at least one first groove, which communicates with the top heat dissipation channel.
[0026] In some embodiments, the cross-sectional shape of the first groove is an arc, a rectangle, or a triangle.
[0027] In some embodiments, it also includes:
[0028] The first adhesive layer is bonded at one end to the front side of the substrate and at the other end to the bottom surface of the lower support member.
[0029] The second adhesive layer is bonded at one end to the top surface of the lower support and at the other end to the upper cover.
[0030] In some embodiments, the multi-faceted liquid cooling structure further includes:
[0031] An extension protrudes and connects to the side of the lower support member, and the extension and the chip are located on opposite sides of the lower support member. The first adhesive layer continuously covers the bottom surface of the lower support member and the bottom surface of the extension.
[0032] In some embodiments, the multi-faceted liquid cooling structure further includes:
[0033] A protrusion is provided on the side of the lower support facing the chip, and the edge region of the first surface of the chip is attached to the protrusion.
[0034] In some embodiments, it also includes:
[0035] An underfill adhesive is located between the chip and the front side of the substrate, and the protrusions are distributed around the outer periphery of the underfill adhesive.
[0036] This utility model provides a packaged device with multi-faceted heat dissipation function. By mounting a chip on the front side of a substrate and a multi-faceted liquid cooling structure, the multi-faceted liquid cooling structure includes an upper cover, a lower support, and heat dissipation channels. The upper cover is located above the chip along a first direction. The lower support is located at least on the side of the chip and is perpendicularly connected to the end of the upper cover. The upper cover, the lower support, and the chip together form the heat dissipation channels, which are distributed on the top and side surfaces of the chip. These channels contain coolant, allowing the coolant within the channels to dissipate heat from the top and side surfaces of the chip. This multi-faceted liquid cooling increases the chip's heat dissipation area, enhances its heat dissipation performance, maintains stable operation of the chip within the packaged device, and prevents the chip from burning out due to overheating. Moreover, the heat dissipation channel is formed by the upper cover, the chip, and the lower support, which not only shortens the distance between the coolant and the chip, but also eliminates the need for through-hole etching in the upper cover and the lower support, thereby simplifying the manufacturing process of the packaged device with multi-faceted heat dissipation function and reducing the manufacturing cost of the packaged device with multi-faceted heat dissipation function. Attached Figure Description
[0037] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0038] Figure 1 This is a first cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model;
[0039] Figure 2 This is a schematic diagram of the structure of the upper cover facing the substrate in a specific embodiment of this utility model;
[0040] Figure 3 This is a second cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model;
[0041] Figure 4 yes Figure 3 An exploded view of a packaged device with multi-faceted heat dissipation capabilities;
[0042] Figure 5 This is a third cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model;
[0043] Figure 6This is a fourth cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model;
[0044] Figure 7 This is a fifth cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model;
[0045] Figure 8 This is a sixth cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model;
[0046] Figure 9 This is the seventh cross-sectional schematic diagram of the packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model;
[0047] Figure 10 This is the eighth cross-sectional schematic diagram of the packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. Detailed Implementation
[0048] The following detailed description, in conjunction with the accompanying drawings, describes the specific implementation of the packaging device with multi-faceted heat dissipation function provided by this utility model.
[0049] This specific embodiment provides a packaged device with multi-faceted heat dissipation function. Figure 1 This is a first cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. For example... Figure 1 As shown, the packaged device with multi-faceted heat dissipation function includes:
[0050] The substrate 10 includes a front side 101 and a back side 102 that are relatively distributed along a first direction D1;
[0051] Chip 11 is mounted on the front side 101 of the substrate 10. Chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1.
[0052] A multi-faceted liquid cooling structure includes an upper cover 12, a lower support 13, and a heat dissipation channel 17. The upper cover 12 is located above the chip 11 along the first direction D1. The lower support 13 is located at least on the side of the chip 11 and is perpendicularly connected to the end of the upper cover 12. The upper cover 12, the lower support 13, and the chip 11 enclose and form the heat dissipation channel 17, which is used to contain coolant.
[0053] For example, the substrate 10 may be, but is not limited to, a PCB circuit board. The substrate 10 includes a front side 101 and a back side 102 that are distributed opposite to each other along the first direction D1, and the substrate 10 has a high-density wiring layer inside. The chip 11 is mounted on the front side 101 of the substrate 10, and the chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1. In one example, the first surface of the chip 11 is the functional surface of the chip 11, that is, the chip 11 is flip-chip mounted on the front side 101 of the substrate 10. The first surface of the chip 11 has a plurality of conductive bumps 15, and one end of the conductive bumps 15 is electrically connected to the chip 11, and the other end is electrically connected to the high-density wiring layer in the substrate 10. A plurality of solder balls 16 are spaced apart on the back surface 102 of the substrate. The solder balls 16 are electrically connected to the high-density wiring layer inside the substrate 10, thereby enabling the transmission of control signals to the chip 11 or the extraction of signals from the chip 11 through the solder balls 16 and the conductive bumps 15. An underfill adhesive 14 is also filled between the chip 11 and the substrate 10 to enhance the connection strength between the chip 11 and the substrate 10.
[0054] The multi-faceted liquid cooling structure is disposed on the front surface 101 of the substrate 10. The top end of the lower support member 13 in the multi-faceted liquid cooling structure is connected to the end of the upper cover 12, and the bottom end is connected to the front surface 101 of the substrate 10, thereby allowing the upper cover 12 and the lower support member 13 to together form a receiving cavity. The chip 11 is located within the receiving cavity, and the lower support member 13 is located on the side of the chip 11, with a gap between the lower support member 13 and the side of the chip 11, meaning the lower support member 13 does not directly contact the side of the chip 11. The upper cover 12, the lower support 13, and the side of the chip 11 enclose a sealed space, which serves as the heat dissipation channel 17. The heat dissipation channel 17 is distributed on the top surface and side surface of the chip 11, and it accommodates coolant. This allows the coolant within the channel to dissipate heat from the top and side surfaces of the chip 11, achieving multi-faceted liquid cooling. This increases the heat dissipation area of the chip 11, enhances its heat dissipation performance, maintains stable operation of the chip within the packaged device, and prevents the chip from burning out due to overheating. Furthermore, the heat dissipation channel 17, formed by the upper cover 12, the chip 11, and the lower support 13, not only shortens the distance between the coolant and the chip 11 but also eliminates the need for through-hole etching in the upper cover 12 and the lower support 13. This simplifies the manufacturing process of the packaged device with multi-faceted heat dissipation and reduces its manufacturing cost.
[0055] In some embodiments, the upper cover 12 is a metal cover, and the lower support 13 is a metal support.
[0056] Specifically, due to the good thermal conductivity of metal materials, using the metal cover as the upper cover 12 and the metal support as the lower support 13 can further improve the heat exchange efficiency between the inside of the packaged device and the external environment, thereby further improving the heat dissipation effect of the packaged device with multi-faceted heat dissipation function. In one example, the metal cover is a copper cover, and the metal support is a copper support.
[0057] In some embodiments, the multi-faceted liquid cooling structure further includes an inlet 18 and an outlet 19 formed by the upper cover 12 and the lower support 13, and the heat dissipation channel 17 is connected to both the inlet 18 and the outlet 19.
[0058] In some embodiments, the heat dissipation channel 17 includes:
[0059] A top heat dissipation channel 171 is located above the chip 11, and the top heat dissipation channel 171 is formed by at least the chip 11 and the upper cover 12.
[0060] Side heat dissipation channels 172 are distributed around the side of the chip 11 and communicate with the top heat dissipation channel 171. The side heat dissipation channels 172 are formed by the lower support member 13 and the chip 11.
[0061] Figure 2 This is a schematic diagram of the structure of the upper cover facing the substrate in a specific embodiment of this utility model. For example... Figure 1 and Figure 2 As shown, in some embodiments, the surface of the top cover 12 facing the chip 11 has a central cavity 30 and two end cavities 31 distributed at opposite ends of the central cavity 30 along a second direction D2. The central cavity 30 communicates with the end cavities 31, and the second direction D2 is parallel to the front surface 101 of the substrate 10.
[0062] The central cavity 30 and the chip 11 enclose the top heat dissipation channel 171, and the two end cavities 31 enclose the lower support member 13 to form the liquid inlet 18 and the liquid outlet 19, respectively.
[0063] For example, such as Figure 1 and Figure 2As shown, the upper cover 12 includes a lower surface facing the chip 11 and an upper surface opposite to the lower surface along the first direction D1. The upper cover 12 also includes a cavity extending from the lower surface along the first direction D1 into the interior of the upper cover 12. The cavity penetrates the upper cover 12 along the second direction D2, and the cavity includes a central cavity 30 and two end cavities 31 communicating with the central cavity 30. The central cavity 30 is located at the middle of the lower surface of the upper cover 12, and the two end cavities 31 are distributed at opposite ends of the central cavity 30 along the second direction D2. The central cavity 30 and the second surface of the chip 11 enclose the top heat dissipation channel 171, and the lower support member 13 and the side surface of the chip 11 enclose the side heat dissipation channel 172, and the top heat dissipation channel 171 communicates with the side heat dissipation channel 172. The side heat dissipation channels 172 are distributed around the outer periphery of the chip 11, thereby enabling uniform heat dissipation across the entire side of the chip 11. This improves both the heat dissipation efficiency and the uniformity of heat dissipation, preventing localized overheating. One of the two end cavities 31, together with the lower support member 13, forms the liquid inlet 18, and the other end cavity 31, together with the lower support member 13, forms the liquid outlet 19. The liquid inlet 18 and the liquid outlet 19 are distributed along the second direction D2 at opposite ends of the heat dissipation channel 17. By providing the inlet 18 and outlet 19 connected to the heat dissipation channel 17, on the one hand, the coolant in the heat dissipation channel 17 can be kept flowing continuously through the inlet 18 and outlet 19, thereby removing the heat generated by the chip 11 during operation more quickly and further improving the heat dissipation performance of the chip 11; on the other hand, the type and volume of the coolant in the heat dissipation channel 17 can be flexibly adjusted through the inlet 18 and outlet 19, thereby improving the flexibility of heat dissipation of the chip 11.
[0064] In some embodiments, the width of the end cavity 31 is smaller than the width of the middle cavity 30. This facilitates the circulation of the coolant within the heat dissipation channel 17 and increases the contact area between the coolant and the chip 11, thereby further improving the heat dissipation effect of the chip. The width of the end cavity 31 can be the width of the end cavity 31 along the third direction D3, and the width of the middle cavity 30 can be the width of the middle cavity 30 along the third direction D3. The third direction D3 is parallel to the front surface of the substrate 10 and intersects the second direction D2 perpendicularly.
[0065] In some embodiments, the projection of the top heat dissipation channel 171 on the front surface 101 of the substrate 10 at least completely covers the projection of the second surface of the chip 11 on the front surface 101 of the substrate 10, so as to achieve uniform liquid cooling heat dissipation on the second surface of the chip 11 and avoid uneven heat dissipation of the chip 11.
[0066] In some embodiments, the coolant is deionized water.
[0067] Specifically, since the top heat dissipation channel 171 is formed by the upper cover 12 and the second surface of the chip 11, and the side heat dissipation channel 172 is formed by the lower support 13 and the side surface of the chip 11, the coolant in both the top heat dissipation channel 171 and the side heat dissipation channel 172 is in direct contact with the surface of the chip 11 (i.e., the second surface of the chip 11 and the side surface of the chip 11). The resistance of the deionized water is less than 10 ohms. -10 This ensures that even if the deionized water comes into contact with the surface of the chip 11, it will not cause an electrical short circuit in the chip 11, thus ensuring the normal operation of the chip 11.
[0068] In some embodiments, the packaged device with multi-faceted heat dissipation function further includes:
[0069] A first barrier layer is applied to the second surface of the chip 11 to prevent the coolant from penetrating the chip 11.
[0070] In some embodiments, the first barrier layer is a metal material layer.
[0071] Specifically, by covering the entire second surface of the chip 11 with the first barrier layer, the first barrier layer can prevent the coolant from penetrating to the chip 11, thereby further avoiding the impact of the coolant on the performance of the chip 11. The first barrier layer being a metallic material layer means that the material of the barrier layer is a metallic material. Using this metallic material to make the first barrier layer allows it to not only prevent the coolant (e.g., deionized water) from penetrating but also prevent oxygen penetration. Furthermore, the metallic material has good thermal conductivity, thereby further contributing to improving the heat dissipation effect of the chip 11. In one example, the material of the first barrier layer is titanium.
[0072] Figure 3 This is a second cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. Figure 4 yes Figure 3An exploded view of a packaged device with multi-faceted heat dissipation function. In some embodiments, the lower support 13 is located only on the side of the chip 11, and the side heat dissipation channel 172 extends along the first direction D1 to the front surface 101 of the substrate 10; the packaged device with multi-faceted heat dissipation function further includes:
[0073] The second barrier layer 22 is attached to the substrate 10 and located at the bottom of the side heat dissipation channel 172. The second barrier layer 22 is used to prevent the coolant from overflowing from the side heat dissipation channel 172.
[0074] In some embodiments, the second barrier layer 22 is a waterproof adhesive layer.
[0075] For example, such as Figure 3 and Figure 4 As shown, the lower support 13 is located only on the side of the chip 11, with one end of the lower support 13 attached to the front surface 101 of the substrate 10 and the other end connected to the upper cover 12, thereby extending the side heat dissipation channel 172 to the front surface 101 of the substrate 10. Since there are tiny holes on the front surface 101 of the substrate 10 or inside the substrate 10, when the side heat dissipation channel 172 is filled with coolant, the coolant may overflow along the holes in the substrate 10, causing coolant leakage. By attaching the second barrier layer 22 to the substrate 10, so that the second barrier layer 22 is located at the bottom of the side heat dissipation channel 172, the side heat dissipation channel 172 is prevented from entering the holes in the substrate 10, thus avoiding coolant leakage. In one example, the front side 101 of the substrate 10 has a receiving groove that is aligned with the side heat dissipation channel 172, and the second barrier layer 22 is filled in the receiving groove such that the surface of the second barrier layer 22 is flush with the front side 101 of the substrate 10.
[0076] Figure 8 This is a sixth cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. In some embodiments, such as Figure 1 and Figure 8 As shown, the packaged device with multi-faceted heat dissipation function further includes:
[0077] The first adhesive layer 21 is bonded at one end to the front surface 101 of the substrate 10 and at the other end to the bottom surface of the lower support member 13.
[0078] The second adhesive layer 80 is bonded at one end to the top surface of the lower support member 13 and at the other end to the upper cover 12.
[0079] In some embodiments, such as Figure 1 As shown, the multi-faceted liquid cooling structure further includes:
[0080] The extension 20 protrudes and connects to the side of the lower support member 13, and the extension 20 and the chip 11 are located on opposite sides of the lower support member 13. The first adhesive layer 21 continuously covers the bottom surface of the lower support member 13 and the bottom surface of the extension 20.
[0081] For example, such as Figure 1 and Figure 8 As shown, the upper cover 12 and the lower support member 13 are both manufactured separately. First, the lower support member 13 is adhered to the front surface 101 of the substrate 10 using the first adhesive layer 21. Then, the upper cover 12 is adhered to the top surface of the lower support member 13 (i.e., the surface of the lower support member 13 facing away from the substrate 10) using the second adhesive layer 80. In one example, the lower surface of the upper cover 12 has a cavity including the central cavity 30 and the end cavity 31, and the cavity penetrates the upper cover 12 along the second direction D2; the second adhesive layer 80 is distributed at least on opposite sides of the cavity along a third direction D3, which is parallel to the front surface 101 of the substrate 10 and intersects the second direction D2 perpendicularly. By providing the extension 20 protruding from the side of the lower support member 13, and by having the first adhesive layer 21 continuously cover the bottom surface of the lower support member 13 (i.e., the surface of the lower support member 13 facing the substrate 10) and the bottom surface of the extension 20 (i.e., the surface of the extension 20 facing the substrate 10), the contact area between the multi-faceted liquid cooling structure and the substrate 10 can be increased, thereby enhancing the bonding strength between the multi-faceted liquid cooling structure and the substrate 10. In one example, both the first adhesive layer 21 and the second adhesive layer 80 are waterproof adhesive layers.
[0082] Figure 5 This is a third cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. In other embodiments, such as... Figure 5 As shown, the extension 20 may not be provided, and the first adhesive layer 21 may be located only between the lower support member 13 and the substrate 10, so as to reduce the size of the multi-faceted liquid cooling structure and avoid occupying too much area on the substrate 10.
[0083] Figure 6This is a fourth cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. In some embodiments, the second surface of the chip 11 has at least one first groove 60, and the first groove 60 communicates with the top heat dissipation channel 171.
[0084] In some embodiments, the cross-sectional shape of the first groove 60 is an arc, a rectangle, or a triangle.
[0085] For example, by etching the second surface of the chip 11, the first groove 60 is formed on the second surface of the chip 11, and the first groove 60 communicates with the top heat dissipation channel 171. The provision of the first groove 60 can further increase the contact area between the chip 11 and the coolant, that is, increase the heat dissipation area of the chip 11, thereby further improving the heat dissipation effect of the chip 11. In one example, the second surface of the chip 11 has a plurality of first grooves 60 arranged at intervals along the second direction D2, and all the first grooves 60 communicate with the top heat dissipation channel 171.
[0086] Figure 7 This is a fifth cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. In other embodiments, such as... Figure 7 As shown, the central cavity 30 has a second groove 70 on its inner wall facing the chip 11, and the second groove 70 is in communication with the central cavity 30.
[0087] For example, such as Figure 7 As shown, the central cavity 30 has a second groove 70 on its bottom wall facing the chip 11 along the first direction D1, and the second groove 70 communicates with the central cavity 30. This allows the coolant to enter the second groove 70 from the top heat dissipation channel 171, thereby increasing the amount of coolant that the packaged device with multi-faceted heat dissipation function can hold, and further improving the heat dissipation effect. Moreover, after absorbing the heat generated by the chip 11 during operation, the coolant can be transferred upwards to the outside through the top cover 12. The setting of the second groove 70 is equivalent to increasing the heat dissipation area of the chip 11 for upward heat dissipation, thereby further improving the heat dissipation effect of the chip 11. In one example, the central cavity 30 has a plurality of second grooves 70 arranged at intervals along the second direction D2 on its inner wall facing the chip 11, and all the second grooves 70 communicate with the central cavity 30. The cross-sectional shape of the second groove 70 is arc-shaped, rectangular, or triangular.
[0088] Figure 9This is a seventh cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. In some embodiments, the multi-faceted liquid cooling heat dissipation structure further includes:
[0089] A protrusion 90 is provided on the side of the lower support 13 facing the chip 11, and the first surface of the chip 11 is attached to the protrusion 90.
[0090] In some embodiments, the packaged device with multi-faceted heat dissipation function further includes:
[0091] The bottom filler 14 is located between the chip 11 and the front side 101 of the substrate 10, and the protrusions 90 are distributed around the outer periphery of the bottom filler 14.
[0092] For example, such as Figure 9 As shown, the protrusion 90 is horizontally connected to the side of the lower support 13 facing the chip 11. The protrusion 90 is tightly fitted to the edge region of the first surface of the chip 11. The side heat dissipation channel 172 formed by the lower support 13 and the chip 11 is located on the side of the chip 11, and the protrusion 90 is distributed around the outer periphery of the bottom filler 14, thereby preventing the coolant in the side heat dissipation channel 172 from overflowing onto the conductive bump 15 below the chip 11 (the conductive bump 15 is embedded in the bottom filler 14), thereby avoiding affecting the electrical connection performance between the chip 11 and the substrate 10.
[0093] Figure 10 This is the eighth cross-sectional schematic diagram of a packaged device with multi-faceted heat dissipation function in a specific embodiment of this utility model. In other embodiments, such as... Figure 10 The length of the protrusion 90 can be shortened so that the protrusion 90 only covers the side of the bottom filler 14, and the side of the protrusion 90 is flush with the side of the chip 11. This also limits the side heat dissipation channel 172 formed by the lower support 13 and the chip 11 to the side of the chip 11, preventing the coolant in the side heat dissipation channel 172 from overflowing onto the conductive bump 15 below the chip 11.
[0094] The packaged device with multi-faceted heat dissipation function provided in this specific embodiment mounts a chip and a multi-faceted liquid cooling structure on the front side of a substrate. The multi-faceted liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The upper cover is located above the chip along the first direction. The lower support is located at least on the side of the chip and is perpendicularly connected to the end of the upper cover. The upper cover, the lower support, and the chip enclose each other to form the heat dissipation channel, which is distributed on the top surface and the side surface of the chip. The heat dissipation channel is used to contain coolant, thereby enabling the coolant located in the heat dissipation channel to dissipate heat from the top surface and the side surface of the chip. This achieves multi-faceted liquid cooling of the chip, increases the heat dissipation area of the chip, enhances the heat dissipation performance of the chip, maintains stable operation of the chip within the packaged device, and prevents the chip from burning out due to excessive temperature. Moreover, the heat dissipation channel is formed by the upper cover, the chip, and the lower support, which not only shortens the distance between the coolant and the chip, but also eliminates the need for through-hole etching in the upper cover and the lower support, thereby simplifying the manufacturing process of the packaged device with multi-faceted heat dissipation function and reducing the manufacturing cost of the packaged device with multi-faceted heat dissipation function.
[0095] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on the differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.
[0096] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A packaged device with multi-faceted heat dissipation function, characterized in that, include: The substrate includes a front side and a back side that are distributed opposite to each other along a first direction; A chip is mounted on the front side of the substrate, the chip including a first surface facing the substrate and a second surface opposite to the first surface along the first direction; A multi-faceted liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The upper cover is located above the chip along the first direction. The lower support is located at least on the side of the chip and is perpendicularly connected to the end of the upper cover. The upper cover, the lower support, and the chip enclose the heat dissipation channel, which is used to contain coolant.
2. The packaged device with multi-faceted heat dissipation function according to claim 1, characterized in that, The upper cover is a metal cover, and the lower support is a metal support.
3. The packaged device with multi-faceted heat dissipation function according to claim 1, characterized in that, The multi-faceted liquid cooling structure also includes an inlet and an outlet formed by the upper cover and the lower support, and the heat dissipation channel is connected to both the inlet and the outlet.
4. The packaged device with multi-faceted heat dissipation function according to claim 3, characterized in that, The heat dissipation channel includes: A top heat dissipation channel is located above the chip, and the top heat dissipation channel is formed by at least the chip and the top cover; Side heat dissipation channels are distributed around the side of the chip and communicate with the top heat dissipation channel. The side heat dissipation channels are formed by the lower support member and the chip.
5. The packaged device with multi-faceted heat dissipation function according to claim 4, characterized in that, The surface of the top cover facing the chip has a central cavity and two end cavities distributed at opposite ends of the central cavity along a second direction. The central cavity is in communication with the end cavities, and the second direction is parallel to the front side of the substrate. The central cavity and the chip enclose each other to form the top heat dissipation channel, and the two end cavities enclose each other with the lower support to form the liquid inlet and the liquid outlet, respectively.
6. The packaged device with multi-faceted heat dissipation function according to claim 5, characterized in that, The width of the end cavity is smaller than the width of the middle cavity.
7. The packaged device with multi-faceted heat dissipation function according to claim 1, characterized in that, The coolant is deionized water.
8. The packaged device with multi-faceted heat dissipation function according to claim 1, characterized in that, Also includes: A first barrier layer is applied to the second surface of the chip to prevent the coolant from penetrating the chip.
9. The packaged device with multi-faceted heat dissipation function according to claim 8, characterized in that, The first barrier layer is a metal material layer.
10. The packaged device with multi-faceted heat dissipation function according to claim 4, characterized in that, The lower support is located only on the side of the chip, and the side heat dissipation channel extends along the first direction to the front surface of the substrate; the packaged device with multi-faceted heat dissipation function further includes: a second barrier layer, which is attached to the substrate and located at the bottom of the side heat dissipation channel, and the second barrier layer is used to prevent the coolant from overflowing from the side heat dissipation channel.
11. The packaged device with multi-faceted heat dissipation function according to claim 10, characterized in that, The second barrier layer is a waterproof adhesive layer.
12. The packaged device with multi-faceted heat dissipation function according to claim 4, characterized in that, The second surface of the chip has at least one first groove, which communicates with the top heat dissipation channel.
13. The packaged device with multi-faceted heat dissipation function according to claim 12, characterized in that, The cross-sectional shape of the first groove is an arc, a rectangle, or a triangle.
14. The packaged device with multi-faceted heat dissipation function according to claim 1, characterized in that, Also includes: The first adhesive layer is bonded at one end to the front side of the substrate and at the other end to the bottom surface of the lower support member. The second adhesive layer is bonded at one end to the top surface of the lower support and at the other end to the upper cover.
15. The packaged device with multi-faceted heat dissipation function according to claim 14, characterized in that, The multi-faceted liquid cooling structure also includes: An extension protrudes and connects to the side of the lower support member, and the extension and the chip are located on opposite sides of the lower support member. The first adhesive layer continuously covers the bottom surface of the lower support member and the bottom surface of the extension.
16. The packaged device with multi-faceted heat dissipation function according to claim 1, characterized in that, The multi-faceted liquid cooling structure also includes: A protrusion is provided on the side of the lower support facing the chip, and the first surface edge region of the chip is attached to the protrusion.
17. The packaged device with multi-faceted heat dissipation function according to claim 16, characterized in that, Also includes: An underfill adhesive is located between the chip and the front side of the substrate, and the protrusions are distributed around the outer periphery of the underfill adhesive.